CN1608326A - 发光二极管及其发光二极管灯 - Google Patents

发光二极管及其发光二极管灯 Download PDF

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CN1608326A
CN1608326A CNA028261275A CN02826127A CN1608326A CN 1608326 A CN1608326 A CN 1608326A CN A028261275 A CNA028261275 A CN A028261275A CN 02826127 A CN02826127 A CN 02826127A CN 1608326 A CN1608326 A CN 1608326A
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light
emitting diode
led
lamp
radiator
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CN100373638C (zh
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葛世潮
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Zhejiang Manelux Lighting Co Ltd
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HANGZHOU FUYANG NOVEL ELECTRONICS CO Ltd
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Priority claimed from CNB011457333A external-priority patent/CN100468609C/zh
Priority claimed from CN02203989U external-priority patent/CN2517112Y/zh
Priority claimed from CN02207287U external-priority patent/CN2526981Y/zh
Priority claimed from CN02236692U external-priority patent/CN2540685Y/zh
Priority claimed from CN02251586U external-priority patent/CN2585273Y/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/06—Optical design with parabolic curvature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H—ELECTRICITY
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    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

本发明涉及一种发光二极管及其发光二极管灯。该发光二极管包括：至少一个安装在高热导率的底座上的发光二极管芯片，该发光二极管芯片通过一电路板与电源电连接，发光二极管芯片上方有透光介质；所述的底座上表面为光反射面或底座四周安装有光反射面，其特征在于，在底座的上方或四周安装电路板。所述的发光二极管，其特征在于，还包括一通过所述的底座下表面上的螺旋或螺旋孔直接机械连接的散热器。上述发光二极管通过其引出线与一个驱动电路电连接，该驱动电路再通过其外壳与电连接器电连接后，套装上透光泡壳便可制成发光二极管灯。该发光二极管效率高、功率大、寿命长，还可用于制造发光二极管交通灯和发光二极管平面光源等。

Description

发光二极管及其发光二极管灯
技术领域
本发明涉及一种发光二极管和发光二极管灯，特别是涉及一种用于照明、交通灯和信息显示等器件的大功率、高效率、长寿命的发光二极管和发光二极管灯。
背景技术
发光二极管已被广泛用于信号指示、大屏幕显示等领域，它具有寿命长、颜色好、牢固等优点。目前只能制造小功率发光二极管，典型的发光二极管仅约20mA×4V＝80mW，因为增加工作电流将导致发光二极管芯片的温度迅速升高，而发光二极管芯片的发光效率几乎随芯片温度的上升而直线下降。如何将发光二极管产生的大量的热有效地散发掉，使发光二极管在较低的温度下工作，已成为制造发光二极管和发光二极管灯的关键。
现有典型的大功率发光二极管，如图1所示，发光二极管芯片101安装在金属底座103的反射面102上，金属底座103用环氧树脂111粘贴于电路板106上，电路板106再用胶112与散热器113相连；发光二极管芯片101的电极经引线104和管脚105与电路板106上的导电层107相连，该芯片上有光学胶108及透镜109，110为固定装置。
可见，发光二极管芯片要经金属底座103(热阻为RB)、环氧树脂层111(热阻为RE)、电路板(热阻为RP)和粘合胶112(热阻为RA)后才与散热器113相连，其总的热阻∑R＝RB+RE+RP+RA很大，故芯片温度很容易上升，使发光效率迅速下降；同时，安装芯片的金属底座用胶粘于电路板上，由于电路板和金属底座的热膨胀系数不同，升温速度不同，时冷时热，时胀时缩，长时间工作很容易导致环氧树脂胶裂开，而使热阻RE大增，从而导致发光二极管过热而烧毁。总之，现有技术无法制成功率大、发光效率高、使用寿命长的发光二极管。
发明内容
本发明的目的在于：克服现有发光二极管与散热器之间的热阻很大，芯片温度很容易升高及其导致的发光效率迅速下降的缺点；以及金属底座与电路板之间的胶因电路板和金属底座的热膨胀系数不同，长时间工作很容易使胶裂开，导致发光二极管与散热器之间的热阻大增，发光二极管过热而烧毁的缺点；从而提供一种大功率、高效率、长寿命发光二极管和发光二极管灯。
本发明的目的是这样实现的：本发明提供的一种发光二极管，包括：至少一个安装在高热导率的底座上的发光二极管芯片，该发光二极管芯片通过一电路板与电源电连接，发光二极管芯片上方有透光介质；所述的底座上表面为光反射面或底座四周安装有光反射面，其特征在于，在底座的上方或四周安装有电路板。
所述的发光二极管，其特征在于，还包括一通过所述的底座下方有至少一个螺旋或螺旋孔，用于直接机械连接的散热器。
所述的发光二极管芯片前方有一光反射器。
所述的透光介质为光学胶和透镜。
所述的发光二极管芯片为多个发相同光色的芯片或发不同光色的芯片，芯片之间串联、并联或串、并联连接。
所述的底座为金属底座、超热导率管或在金属底座下方设置一超热导率管组成。
所述的光反射器有光学反射面，其光反射面与发光二极管轴之间的安装角度为10-70度。
所述的光学胶内或光学胶与透镜之间有光转换材料。
一种用上述发光二极管制作的发光二极管灯，其特征在于：包括至少一个上述发光二极管，该发光二极管通过其底座上的螺丝或螺丝孔与一个散热器直接机械接触，该发光二极管的引出线与一个驱动电路电连接，驱动电路通过其外壳与电连接器电连接，在所述发光二极管上套装一透光泡壳。
所述的电连接器为双脚、多脚直插的灯头或螺旋灯头。
所述的透光泡壳为玻璃或塑料制成的透明的、着色的或漫射的泡壳。
所述的透光泡壳内壁上有光转换材料层。
所述的散热器为带有散热翅片的散热器。
所述的散热翅片为带有单个或多个螺旋的螺旋形散热翅片。
所述的散热翅片的内表面为光反射面。
所述的内表面呈锥形或抛物面。
一种用上述发光二极管灯制作的交通灯，其特征在于，所述的发光二极管的光出射角为5-60度，被安装在原有交通灯抛物面光反射器的焦点附近，各发光二极管中一部分发光二极管所发出的光直接由原交通灯透光窗出射，另一部分则经原交通灯抛物面光反射器反射后射出，从而可得到所需聚焦和均匀分布的出射光。
一个用上述发光二极管制作的发光二极管平面光源，其特征在于，所述的至少一个发光二极管被安装在一个由平面散热板做的散热器上，所述散热板位于平面光源或液晶显示用背照明光源的导光板的背面和四周，所述发光二极管的二侧或四周设置有光反射器。
所述的发光二极管为多个发相同光色的发光二极管或发不同光色的发光二极管。
本发明的优点在于：
(1)散热器和底座的直接紧密热连接，使芯片与散热器之间的热阻几乎等于零，从而使芯片产生的热有效地散发掉，另外，金属底座与散热器用金属螺丝连接，热连接十分可靠，长期工作不会变，所以，可制成功率大、效率高、寿命长的发光二极管；
(2)电路板安置于金属底座的上方或四周，在不会增加芯片和散热器之间的热阻的同时，又方便了与芯片之间的连接，便于高密度安装。
(3)可制成大功率的发光二极管灯和平面光源。
总之，本发明的发光二极管不仅克服了现有发光二极管热阻大以及胶易于开裂的难题，而且其体积比现有发光二极管小得多，适于高密度安装。
附图说明
图1为现有技术的发光二极管的结构示意图
图2为本发明发光二极管的结构示意图
图3为本发明发光二极管的下引线实施例结构示意图
图4为本发明发光二极管安装有光反射器的实施例结构示意图
图5为本发明发光二极管安装有光反射器的另一实施例结构示意图
图6为本发明发光二极管灯的结构示意图
图7A为本发明发光二极管灯安装有抛物面形散热器的实施例结构示意图
图7B为本发明发光二极管灯安装有锥形散热器的又一实施例结构示意图
图8为本发明发光二极管灯安装有超热导管的实施例结构示意图
图9为本发明发光二极管灯安装有灯泡状散热器实施例结构示意图
图10为本发明发光二极管制成的交通灯的结构示意图
图11为本发明发光二极管制成的平面光源的结构示意图
附图标示：
发光二极管芯片101     金属底座103         反射面102
电路板106             胶112               散热器113
引线104               管脚105             导电层107
光学胶108             透镜109             固定装置110
螺丝204               导热胶206           引出线209
光转换材料213         绝缘层303           光反射器406
混色剂409             螺丝孔408           散热翅片404
芯片间的连线410       导热层407           驱动电路603
驱动电路的外壳604     输入引线607         电连接器605
光转换材料层609       透光泡壳608         发光二极管701
超热导管801           吸热端803           第二透光泡壳908
透光窗1008            散热板1103          导光板1104
光学板1107                电路板1106
具体实施方式
实施例1
制作一本发明的发光二极管，如图2所示，至少一个发光二极管芯片101，例如为发黄光的发光二极管，所述芯片安装在金属底座103的反射面102上，当用2个以上发光二极管芯片101时，可取发相同光色的发光二极管芯片101；金属底座103通过至少一个螺丝204和散热器113紧密地热和机械连接；为了得到更好的热接触，二者之间还可有导热胶206，电路板106安置在金属底座103上方，其上表面有导电层107连接引出线209，引出线209与金属底座103、散热器113电绝缘，电路板106和发光二极管芯片101之间经引线104电连接，引出线209用于连接外电源；发光二极管芯片101上有光学胶108及透镜109，光学胶108与透镜109之间有光转换材料213将芯片发出的光转变成其它色的光；金属底座103由热阻很小的铜制成，因此，发光二极管芯片101所产生的热很容易经散热器113散发掉，从而使发光二极管芯片101工作于较低温度的高发光效率的状态。
实施例2
制作一本发明采用下引线的发光二极管，如图3所示，至少一个发光二极管芯片101例如有2个发光二极管芯片101安装在金属底座103的反射面102上，所述发光二极管芯片101取发不相同光色的发光二极管芯片；金属底座103有至少一个螺丝204，用于和散热器113紧密地热和机械连接，电路板106安置在金属底座103四周，其上表面有导电层107连接引出线209，引出线209穿过绝缘层303垂直向下连接外电源，发光二极管芯片101上有透光介质，该透光介质为光学胶108，其顶面109可按输出光的光分布的要求设计成球面或椭球面，金属底座103由热阻很小的铝或铝合金制成，其余同实施例1。
实施例3
制作一本发明带有光反射器的发光二极管，如图4所示，其特征在于，至少一个发光二极管芯片101上方增加一光反射器406，使原本向发光二极管侧面发射的光402反射回发光二极管芯片101或反射面102后，再向发光二极管前方出射，以提高光的有效利用率；当2个以上的发光二极芯片为发不同光色发光二极管芯片时，为了提高光的混色效果，反射器406和发光二极管芯片101之间可有混色剂409，发光二极管芯片101的一个电极与金属底座103相连后，再从至少一个螺丝孔408和螺丝204中引出，发光二极管芯片的另一个电极经引线104连接引出线209，穿过绝缘层303引出后连接外电源，410为发光二极管芯片之间的连线；散热器113带有散热翅片404，导热层407为导热绝缘层，其它同实施例2。
实施例4
制作一本发明安装有光反射器的发光二极管，如图5所示，其特征在于，发光二极管芯片101上方增加一光反射器406，把发光二极管芯片101原本向侧面发射的光503直接反射向前方，以提高光的利用率；光转换材料213设置在发光二极管芯片101的表面上；电路板106的至少2路引出线209穿过金属底座103垂直向下连接外电源，其它同实施例3。
实施例5
制作一用本发明发光二极管做成的发光二极管灯，如图6所示，至少一个发光二极管芯片101安装在一个散热器113上；该发光二极管的引出线209与一驱动电路603电连接，驱动电路603及其外壳604通过输入引线607与一电连接器605电连接，该电连接器605为螺旋型灯头。驱动电路603将输入的外电压转变成适合发光二极管工作的电压，以点亮发光二极管，一个由玻璃制成的内表面有光转换材料层609的透光泡壳608套装在该发光二极管上，将其所发的光转换成所需色的光。
实施例6
制作一本发明安装有散热器的发光二极管灯，如图7A所示，发光二极管701安装在抛物面形散热器113中，或如图7B所示，发光二极管701安装在锥形散热器113中，散热器113上可有散热翅片404，散热器113的内表面为反射面702，图7A中和外电源连接的电连接器605为双脚直插灯头，图7B中和外电源连接的电连接器605为三脚直插灯头，驱动电路的外壳604内装有驱动电路603，其它同实施例1。
实施例7
制作一本发明安装有超热导管的发光二极管灯，如图8所示，其特征在于，至少一个发光二极管芯片101安装在一超热导管801(简称热管)的吸热端803上，热管的另一端与散热器113连接；因热管具有比紫铜高约1500倍的高热导率，其热阻几乎等于零，发光二极管芯片101所产生的热经热管801迅速传到散热器并散发掉，其它同实施例5。
实施例8
制作一本发明安装有超热导管并带有灯泡状散热器的发光二极管灯，如图9所示，该发光二极管灯中，至少一个发光二极管芯片101或发光二极管701安装在超热导管801顶端上的一个由热阻很小的合金制成的金属底座103上，该热管的另一端与一带有单个或多个螺旋的呈灯泡状的螺旋形翅片的散热器113连接，该散热器的螺旋型翅片可加速翅片间的空气流动，提高散热器的散热效果；金属底座103的四周装有反射面102，反射面102位于散热器113上方，内有一层光转换材料213的透光泡壳608安装在该发光二极管上方，其外可再装一个第二透光泡壳908，其它同实施例5。
实施例9
制作一用本发明发光二极管灯制成的交通灯，如图10所示，至少一个发光二极管701安装在一个良好导热的金属底座103上，金属底座103与散热装置113连接，所述的发光二极管的光出射角为3-60度，被安装在原有交通灯抛物面光反射器的焦点附近的散热器113上，所述发光二极管中一部分发光二极管所发出的光直接由原交通灯透光窗1008出射，另一部分则经原交通灯抛物面光反射器406反射后射出，从而可得到所需聚焦和均匀分布的出射光1009。该发光二极管交通灯可直接替换现有钨丝交通灯，其余同实施例5。
实施例10
制作一用本发明发光二极管制成的平面光源，如图11所示，发光二极管701安装在一有大面积的平面散热板1103制成的散热器113上，该散热板位于平面光源、背照明光源的导光板1104的背面和四周，其外侧可有用于发光二极管701之间与电源之间连接的电路板1106，散热板1103还可带有散热翅片404，光反射器406位于发光二极管701的二侧或四周，使发光二极管所发的光可直接有效地耦合入射导光板，所述的光源上方有光学板1107，所述的光学板为液晶显示板、光增强板、漫射板或带有图形文字的透光板等；所述的至少一个发光二极管701是发相同光色的或发不同光色的发光二极管，通过控制各发不同光色的发光二极管的亮度、可得不同色温的白光或彩色、变色的平面光源和背照明光源。

Claims (19)

1、一种发光二极管，该发光二极管包括：至少一个安装在高热导率的底座上的发光二极管芯片，该发光二极管芯片通过一电路板与电源电连接，发光二极管芯片上方有透光介质；所述的底座上表面为光反射面或底座四周安装有光反射面，其特征在于，在底座的上方或四周安装有电路板。
2、按权利要求1所述的发光二极管，其特征在于，还包括至少一个在所述的底座下方的螺旋或螺旋孔直接与散热器机械连接。
3、按权利要求1所述的发光二极管，其特征在于，还包括在所述的发光二极管芯片前方有一光反射器。
4、按权利要求1所述的发光二极管，其特征在于，所述的透光介质为光学胶和透镜。
5、按权利要求1所述的发光二极管，其特征在于，所述的发光二极管芯片为多个发相同光色的芯片或发不同光色的芯片，芯片之间串联、并联或串、并联连接。
6、按权利要求1所述的发光二极管，其特征在于，所述的底座为金属底座、超热导率管或在金属底座下方设置一超热导率管组成。
7、按权利要求3所述的发光二极管，其特征在于，所述的光反射器的光反射面与发光二极管轴之间的安装角度为10-70度。
8、按权利要求4所述的发光二极管，其特征在于，还包括在所述的光学胶内或光学胶与透镜之间有光转换材料。
9、一种按权利要求1所述的发光二极管制作的发光二极管灯，其特征在于：包括至少一个上述发光二极管，该发光二极管通过其底座上的螺丝或螺丝孔与一个散热器直接机械接触，该发光二极管的引出线与一个驱动电路电连接，驱动电路通过其外壳与电连接器电连接，在所述发光二极管上套装一透光泡壳。一个驱动电路及其外壳、一个电连接器和一个透光泡壳；其中，发光二极管经引出线与驱动电路电连接，驱动电路与电连接器电连接，发光二极管上方安装透光泡壳。
10、按权利要求9所述的发光二极管灯，其特征在于，所述的电连接器为双脚、多脚直插的灯头或螺旋灯头。
11、按权利要求9所述的发光二极管灯，其特征在于，所述的透光泡壳为玻璃或塑料制成的透明的、着色的或漫射的泡壳。
12、按权利要求9所述的发光二极管灯，其特征在于，所述的透光泡壳内壁上有光转换材料层。
13、按权利要求9所述的发光二极管灯，其特征在于，所述的散热器为带有散热翅片的散热器。
14、按权利要求13所述的发光二极管灯，其特征在于，所述的散热翅片为带有单个或多个螺旋的螺旋形散热翅片。
15、按权利要求13所述的发光二极管灯，其特征在于，所述的散热翅片的内表面为光反射面。
16、按权利要求15所述的发光二极管灯，其特征在于，所述的内表面呈锥形或抛物面。
17、一种发光二极管交通灯，其特征在于，所述的至少一个发光二极管被安装在原有交通灯抛物面光反射器的焦点附近的散热器上，所述的发光二极管的光出射角为3-60度，所述发光二极管中一部分发光二极管所发出的光直接由原交通灯透光窗出射，另一部分则经原交通灯抛物面光反射器反射后射出，以得到所需聚焦和均匀分布的出射光。
18、一个发光二极管平面光源，其特征在于，所述的至少一个发光二极管被安装在一个带有平面散热板制成的散热器上，所述散热板位于平面光源或液晶显示用背照明光源的导光板的背面和四周，所述发光二极管的二侧或四周设置有光反射器。
19、按权利要求18所述的发光二极管平面光源，其特征在于，所述的发光二极管为多个发相同光色的发光二极管或发不同光色的发光二极管。
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JP2005513815A (ja) 2005-05-12
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WO2003056636A1 (en) 2003-07-10
KR20090115810A (ko) 2009-11-06

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