CN1678525A - 二氧化硅分散液 - Google Patents
二氧化硅分散液 Download PDFInfo
- Publication number
- CN1678525A CN1678525A CNA038202778A CN03820277A CN1678525A CN 1678525 A CN1678525 A CN 1678525A CN A038202778 A CNA038202778 A CN A038202778A CN 03820277 A CN03820277 A CN 03820277A CN 1678525 A CN1678525 A CN 1678525A
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- Prior art keywords
- powder
- sio
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- water dispersion
- production
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 239000006185 dispersion Substances 0.000 claims abstract description 56
- 230000007062 hydrolysis Effects 0.000 claims abstract description 24
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000002253 acid Substances 0.000 claims abstract description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims abstract description 6
- 239000007864 aqueous solution Substances 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims description 65
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 49
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 239000000377 silicon dioxide Substances 0.000 claims description 18
- 229960001866 silicon dioxide Drugs 0.000 claims description 14
- 235000012239 silicon dioxide Nutrition 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- -1 Hydroxy Chemical group 0.000 claims description 5
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 5
- 239000011707 mineral Substances 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 230000035484 reaction time Effects 0.000 claims description 4
- 239000013543 active substance Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000001556 precipitation Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000007641 inkjet printing Methods 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 239000011541 reaction mixture Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 19
- 238000011049 filling Methods 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000010008 shearing Methods 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000011164 primary particle Substances 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- CUBCNYWQJHBXIY-UHFFFAOYSA-N benzoic acid;2-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1O CUBCNYWQJHBXIY-UHFFFAOYSA-N 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000002737 fuel gas Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000005049 silicon tetrachloride Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 229910002013 Aerosil® 90 Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 239000008398 formation water Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000012280 lithium aluminium hydride Substances 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004967 organic peroxy acids Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003019 stabilising effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- DOEHJNBEOVLHGL-UHFFFAOYSA-N trichloro(propyl)silane Chemical compound CCC[Si](Cl)(Cl)Cl DOEHJNBEOVLHGL-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/1415—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
- C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
- C01B33/183—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/50—Solid solutions
- C01P2002/52—Solid solutions containing elements as dopants
- C01P2002/54—Solid solutions containing elements as dopants one element only
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
- C01P2006/82—Compositional purity water content
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/90—Other properties not specified above
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Silicon Compounds (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Abstract
Description
实施例 | 原材料 | 处理 | 反应时间 | 温度 | BET | OH密度 | LOD |
[h] | [℃] | [m2/g] | [OH/nm2] | [wt.%] | |||
PA0 | OX 50 | 无 | - | 40 | 2.3 | 0.6 | |
PA1 | OX 50 | HCl/H2O | 18 | 100 | 40 | 4.6 | 0.51 |
PA2 | OX 50 | H2O | 18 | 100 | 41 | 4.7 | 0.58 |
PB0 | AE 90 | 无 | - | - | 84 | 2.4 | 0.8 |
PB1 | AE 90 | HCl/H2O | 18 | 100 | 80 | 4.7 | 1 |
PB2 | AE 90 | H2O | 18 | 100 | 85 | 5.4 | 0.9 |
PC0 | AE 200 | 无 | - | - | 198 | 2.1 | 0.9 |
PC1 | AE 200 | HCl/H2O | 18 | 100 | 197 | 3.7 | 0.8 |
PC2 | AE 200 | H2O | 18 | 100 | 200 | 3.8 | 2.2 |
PD0 | K/SiO2 (1) | 无 | - | - | 132 | 1.8 | 0.5 |
PD1 | K/SiO2 | 蒸汽 | 0.1 | 550 | 130 | 2.8 | 0.7 |
PE0 | Na/SiO2 | 无 | - | - | 89 | 1.9 | 0.6 |
PE1 | Na/SiO2 | 蒸汽 | 0.1 | 550 | 90 | 2.6 | 0.6 |
PF0 | Li/SiO2 | 无 | - | - | 88 | 2.1 | 0.5 |
PF1 | Li/SiO2 | 蒸汽 | 0.1 | 550 | 91 | 2.7 | 0.6 |
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10239144A DE10239144A1 (de) | 2002-08-27 | 2002-08-27 | Dispersion |
DE10239144.0 | 2002-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1678525A true CN1678525A (zh) | 2005-10-05 |
CN100381357C CN100381357C (zh) | 2008-04-16 |
Family
ID=31724107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038202778A Expired - Lifetime CN100381357C (zh) | 2002-08-27 | 2003-07-29 | 二氧化硅粉末、二氧化硅分散液及其制备方法 |
Country Status (9)
Country | Link |
---|---|
US (3) | US7824643B2 (zh) |
EP (1) | EP1539644B1 (zh) |
JP (1) | JP2005536435A (zh) |
KR (1) | KR100779813B1 (zh) |
CN (1) | CN100381357C (zh) |
AT (1) | ATE503724T1 (zh) |
AU (1) | AU2003260333A1 (zh) |
DE (2) | DE10239144A1 (zh) |
WO (1) | WO2004020334A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10360464A1 (de) * | 2003-12-22 | 2005-07-14 | Wacker-Chemie Gmbh | Dispersion die mindestens 2 Arten von Partikeln enthält |
DE102004031785A1 (de) * | 2004-07-01 | 2006-01-26 | Degussa Ag | Polyol enthaltende Siliciumdioxid-Dispersion |
DE102004054392A1 (de) * | 2004-08-28 | 2006-03-02 | Heraeus Quarzglas Gmbh & Co. Kg | Verfahren zum Verbinden von Bauteilen aus hochkieselsäurehaltigem Werkstoff, sowie aus derartigen Bauteilen zusammengefügter Bauteil-Verbund |
DE102007049742A1 (de) * | 2007-10-16 | 2009-04-23 | Evonik Degussa Gmbh | Verfahren zur Herstellung einer Titan-Silicium-Mischoxid enthaltenden Dispersion |
JP5653637B2 (ja) * | 2010-03-01 | 2015-01-14 | 古河電気工業株式会社 | 正極活物質材料、正極、2次電池及びこれらの製造方法 |
EP3467052B1 (de) | 2017-10-06 | 2022-04-13 | Evonik Operations GmbH | Wässrige dispersion enthaltend siliziumdioxid und trimethyl 1,6-hexamethylendiamin |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3777579D1 (de) * | 1986-12-23 | 1992-04-23 | Du Pont | Verfahren zur porositaetskontrolle und rehydroxylierung von kieselkoerpern. |
AU598665B2 (en) | 1987-05-15 | 1990-06-28 | W.R. Grace & Co.-Conn. | Adsorptive material and process for the removal of chlorophyll, color bodies and phospholipids from glyceride oils |
US5256386A (en) * | 1987-06-29 | 1993-10-26 | Eka Nobel Ab | Method for preparation of silica particles |
JP3214982B2 (ja) * | 1994-07-04 | 2001-10-02 | 株式会社トクヤマ | 無機組成物 |
DE19620942A1 (de) * | 1995-06-05 | 1996-12-12 | Gen Electric | Effizientes Verfahren zum Hydrophobieren von anorganischem Pulver |
JPH092812A (ja) * | 1995-06-15 | 1997-01-07 | Nippon Cambridge Filter Kk | フィルタテスト用シリカエアロゾル |
US5623028A (en) * | 1995-12-01 | 1997-04-22 | General Electric Company | Heat cured rubbers |
DE19650500A1 (de) * | 1996-12-05 | 1998-06-10 | Degussa | Dotierte, pyrogen hergestellte Oxide |
JPH10172935A (ja) * | 1996-12-05 | 1998-06-26 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
SG54606A1 (en) * | 1996-12-05 | 1998-11-16 | Fujimi Inc | Polishing composition |
KR20000006595A (ko) * | 1998-09-22 | 2000-02-07 | 유현식 | 반도체소자 cmp용 금속산화물 슬러리의 제조방법 |
DE19943057A1 (de) * | 1999-09-09 | 2001-03-15 | Degussa | Bakterizides, mit Silber dotiertes Siliciumdioxid |
RU2152903C1 (ru) * | 1999-09-17 | 2000-07-20 | Исангулов Кашфиль Исмагилович | Способ получения модифицированного дисперсного кремнезема |
DE19953029A1 (de) * | 1999-11-04 | 2001-05-17 | Degussa | Polyester |
AUPQ463799A0 (en) * | 1999-12-14 | 2000-01-13 | Novio Phenolic Foam Pty Ltd | Fire resistant compositions |
US6569908B2 (en) * | 2000-01-19 | 2003-05-27 | Oji Paper Co., Ltd. | Dispersion of silica particle agglomerates and process for producing the same |
JP3876610B2 (ja) * | 2000-01-19 | 2007-02-07 | 王子製紙株式会社 | シリカ微粒子分散液及びその製造方法 |
JP4094798B2 (ja) * | 2000-05-15 | 2008-06-04 | 信越化学工業株式会社 | ウエハレベルバーンイン装置用ウエハ支持台 |
JP4674936B2 (ja) * | 2000-07-17 | 2011-04-20 | チタン工業株式会社 | 疎水性微粒子及びその応用 |
JP4240796B2 (ja) * | 2000-10-11 | 2009-03-18 | 電気化学工業株式会社 | 真球状シリカ超微粉、その製造方法及び用途 |
DE10326049A1 (de) | 2003-06-10 | 2004-12-30 | Degussa Ag | Flammenhydrolytisch hergestelltes Siliciumdioxid, Verfahren zu seiner Herstellung und Verwendung |
-
2002
- 2002-08-27 DE DE10239144A patent/DE10239144A1/de not_active Ceased
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2003
- 2003-07-29 JP JP2004531828A patent/JP2005536435A/ja active Pending
- 2003-07-29 US US10/524,037 patent/US7824643B2/en active Active
- 2003-07-29 AT AT03790828T patent/ATE503724T1/de not_active IP Right Cessation
- 2003-07-29 EP EP03790828A patent/EP1539644B1/en not_active Expired - Lifetime
- 2003-07-29 WO PCT/EP2003/008332 patent/WO2004020334A1/en active Search and Examination
- 2003-07-29 KR KR1020057003206A patent/KR100779813B1/ko active IP Right Grant
- 2003-07-29 DE DE60336566T patent/DE60336566D1/de not_active Expired - Lifetime
- 2003-07-29 AU AU2003260333A patent/AU2003260333A1/en not_active Abandoned
- 2003-07-29 CN CNB038202778A patent/CN100381357C/zh not_active Expired - Lifetime
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2009
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Also Published As
Publication number | Publication date |
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KR20050059090A (ko) | 2005-06-17 |
US7824643B2 (en) | 2010-11-02 |
DE60336566D1 (de) | 2011-05-12 |
US20100071594A1 (en) | 2010-03-25 |
JP2005536435A (ja) | 2005-12-02 |
US20100037800A1 (en) | 2010-02-18 |
US7888396B2 (en) | 2011-02-15 |
US7892510B2 (en) | 2011-02-22 |
CN100381357C (zh) | 2008-04-16 |
ATE503724T1 (de) | 2011-04-15 |
AU2003260333A1 (en) | 2004-03-19 |
EP1539644A1 (en) | 2005-06-15 |
EP1539644B1 (en) | 2011-03-30 |
US20060093542A1 (en) | 2006-05-04 |
KR100779813B1 (ko) | 2007-11-28 |
WO2004020334A1 (en) | 2004-03-11 |
DE10239144A1 (de) | 2004-03-18 |
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