CN1703718A - 具有在一个表面上可见的元件的电子组件及这种组件的制造方法 - Google Patents
具有在一个表面上可见的元件的电子组件及这种组件的制造方法 Download PDFInfo
- Publication number
- CN1703718A CN1703718A CNA2003801012877A CN200380101287A CN1703718A CN 1703718 A CN1703718 A CN 1703718A CN A2003801012877 A CNA2003801012877 A CN A2003801012877A CN 200380101287 A CN200380101287 A CN 200380101287A CN 1703718 A CN1703718 A CN 1703718A
- Authority
- CN
- China
- Prior art keywords
- insulating trip
- window
- assembly
- electronic circuit
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 239000000470 constituent Substances 0.000 claims description 13
- 238000003475 lamination Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 8
- 238000005253 cladding Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims 1
- 238000011010 flushing procedure Methods 0.000 claims 1
- 230000008595 infiltration Effects 0.000 abstract description 3
- 238000001764 infiltration Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 239000002313 adhesive film Substances 0.000 abstract 1
- 238000005056 compaction Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009422 external insulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009290 primary effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000035900 sweating Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/0023—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality around holes, apertures or channels present in at least one layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
- B32B2305/342—Chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
- B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
- B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Abstract
Description
Claims (22)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH16902002 | 2002-10-11 | ||
CH20021690/02 | 2002-10-11 | ||
CH1690/02 | 2002-10-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1703718A true CN1703718A (zh) | 2005-11-30 |
CN100481121C CN100481121C (zh) | 2009-04-22 |
Family
ID=32075147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003801012877A Expired - Fee Related CN100481121C (zh) | 2002-10-11 | 2003-10-10 | 具有在一个表面上可见的元件的电子组件及这种组件的制造方法 |
Country Status (19)
Country | Link |
---|---|
US (1) | US7710732B2 (zh) |
EP (1) | EP1559068B1 (zh) |
JP (1) | JP4347218B2 (zh) |
KR (1) | KR100988971B1 (zh) |
CN (1) | CN100481121C (zh) |
AR (1) | AR041581A1 (zh) |
AT (1) | ATE397255T1 (zh) |
AU (1) | AU2003264824B2 (zh) |
BR (1) | BR0314472A (zh) |
CA (1) | CA2501777C (zh) |
DE (1) | DE60321373D1 (zh) |
ES (1) | ES2308033T3 (zh) |
MX (1) | MXPA05003717A (zh) |
MY (1) | MY130783A (zh) |
PA (1) | PA8584401A1 (zh) |
PT (1) | PT1559068E (zh) |
RU (1) | RU2316817C2 (zh) |
TW (1) | TWI326844B (zh) |
WO (1) | WO2004034320A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102110241A (zh) * | 2009-12-28 | 2011-06-29 | 纳格雷德股份有限公司 | 制造电子卡的方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4860436B2 (ja) * | 2006-11-07 | 2012-01-25 | トッパン・フォームズ株式会社 | Icカードおよびその製造方法 |
WO2008082617A2 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Mailing apparatus for powered cards |
US7967214B2 (en) | 2006-12-29 | 2011-06-28 | Solicore, Inc. | Card configured to receive separate battery |
DE102008019571A1 (de) * | 2008-04-18 | 2009-10-22 | Giesecke & Devrient Gmbh | Chipkarte und Verfahren zu deren Herstellung |
DE102008053368A1 (de) * | 2008-10-27 | 2010-04-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines tragbaren Datenträgers und tragbarer Datenträger |
DE102010011517A1 (de) * | 2010-03-15 | 2011-09-15 | Smartrac Ip B.V. | Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung |
EP2390824A1 (fr) * | 2010-05-27 | 2011-11-30 | Gemalto SA | Procédé de réalisation d'un module multifonctionnel et dispositif le comprenant |
US8717186B2 (en) * | 2012-06-28 | 2014-05-06 | Xunwei Zhou | Detection of swelling in batteries |
EP3037248B1 (de) | 2014-12-22 | 2018-05-09 | Magna Steyr Fahrzeugtechnik AG & Co KG | Verfahren zur Herstellung eines Sandwichbauteils |
BR112017017273A2 (pt) * | 2015-02-20 | 2018-04-17 | Nid Sa | processo para fabricação de um dispositivo compreendendo pelo menos um elemento eletrônico associado a um substrato e a uma antena e produto obtido por meio deste processo |
US10984304B2 (en) | 2017-02-02 | 2021-04-20 | Jonny B. Vu | Methods for placing an EMV chip onto a metal card |
FR3063555B1 (fr) * | 2017-03-03 | 2021-07-09 | Linxens Holding | Carte a puce et procede de fabrication d’une carte a puce |
SE1750836A1 (en) * | 2017-06-28 | 2018-12-29 | Fingerprint Cards Ab | Fingerprint sensor module comprising antenna and method for manufacturing a fingerprint sensor module |
USD956760S1 (en) * | 2018-07-30 | 2022-07-05 | Lion Credit Card Inc. | Multi EMV chip card |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
JPS62290593A (ja) | 1986-06-11 | 1987-12-17 | 大日本印刷株式会社 | Icカード |
JPH0696357B2 (ja) * | 1986-12-11 | 1994-11-30 | 三菱電機株式会社 | Icカードの製造方法 |
JPH03114788A (ja) | 1989-09-29 | 1991-05-15 | Citizen Watch Co Ltd | Icカード構造 |
DE4122049A1 (de) * | 1991-07-03 | 1993-01-07 | Gao Ges Automation Org | Verfahren zum einbau eines traegerelements |
US5581065A (en) | 1993-08-02 | 1996-12-03 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
GB2309933B (en) * | 1996-02-12 | 2000-02-23 | Plessey Telecomm | Contact card |
FR2760113B1 (fr) * | 1997-02-24 | 1999-06-04 | Gemplus Card Int | Procede de fabrication de carte sans contact a antenne bobinee |
JPH1114494A (ja) | 1997-06-23 | 1999-01-22 | Nikka Densoku Kk | 密封容器の密封不良検出方法および装置 |
JP2001084347A (ja) | 1999-09-16 | 2001-03-30 | Toshiba Corp | カード型記憶装置及びその製造方法 |
TW200300990A (en) * | 2001-12-11 | 2003-06-16 | Nagra Id S A | Low cost electronic module and method for manufacturing such module |
-
2003
- 2003-10-03 PA PA20038584401A patent/PA8584401A1/es unknown
- 2003-10-06 TW TW092127696A patent/TWI326844B/zh not_active IP Right Cessation
- 2003-10-10 CN CNB2003801012877A patent/CN100481121C/zh not_active Expired - Fee Related
- 2003-10-10 PT PT03807950T patent/PT1559068E/pt unknown
- 2003-10-10 DE DE60321373T patent/DE60321373D1/de not_active Expired - Lifetime
- 2003-10-10 BR BR0314472-0A patent/BR0314472A/pt active Search and Examination
- 2003-10-10 AU AU2003264824A patent/AU2003264824B2/en not_active Ceased
- 2003-10-10 WO PCT/IB2003/004481 patent/WO2004034320A1/fr active IP Right Grant
- 2003-10-10 MX MXPA05003717A patent/MXPA05003717A/es active IP Right Grant
- 2003-10-10 EP EP03807950A patent/EP1559068B1/fr not_active Revoked
- 2003-10-10 RU RU2005110187/09A patent/RU2316817C2/ru not_active IP Right Cessation
- 2003-10-10 CA CA2501777A patent/CA2501777C/en not_active Expired - Fee Related
- 2003-10-10 ES ES03807950T patent/ES2308033T3/es not_active Expired - Lifetime
- 2003-10-10 KR KR1020057006075A patent/KR100988971B1/ko active IP Right Grant
- 2003-10-10 MY MYPI20033878A patent/MY130783A/en unknown
- 2003-10-10 JP JP2004542750A patent/JP4347218B2/ja not_active Expired - Fee Related
- 2003-10-10 AT AT03807950T patent/ATE397255T1/de active
- 2003-10-10 AR ARP030103698A patent/AR041581A1/es not_active Application Discontinuation
- 2003-10-10 US US10/529,774 patent/US7710732B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102110241A (zh) * | 2009-12-28 | 2011-06-29 | 纳格雷德股份有限公司 | 制造电子卡的方法 |
CN102110241B (zh) * | 2009-12-28 | 2014-10-22 | 纳格雷德股份有限公司 | 制造电子卡的方法 |
Also Published As
Publication number | Publication date |
---|---|
US7710732B2 (en) | 2010-05-04 |
PA8584401A1 (es) | 2005-02-04 |
CA2501777A1 (en) | 2004-04-22 |
JP2006503424A (ja) | 2006-01-26 |
EP1559068A1 (fr) | 2005-08-03 |
CN100481121C (zh) | 2009-04-22 |
RU2316817C2 (ru) | 2008-02-10 |
AU2003264824A1 (en) | 2004-05-04 |
EP1559068B1 (fr) | 2008-05-28 |
BR0314472A (pt) | 2005-07-26 |
MY130783A (en) | 2007-07-31 |
RU2005110187A (ru) | 2006-03-27 |
PT1559068E (pt) | 2008-08-06 |
KR100988971B1 (ko) | 2010-10-20 |
WO2004034320A1 (fr) | 2004-04-22 |
JP4347218B2 (ja) | 2009-10-21 |
US20060124350A1 (en) | 2006-06-15 |
MXPA05003717A (es) | 2005-06-17 |
TW200409039A (en) | 2004-06-01 |
KR20050067173A (ko) | 2005-06-30 |
ES2308033T3 (es) | 2008-12-01 |
AR041581A1 (es) | 2005-05-18 |
CA2501777C (en) | 2011-11-29 |
AU2003264824B2 (en) | 2009-06-11 |
ATE397255T1 (de) | 2008-06-15 |
DE60321373D1 (de) | 2008-07-10 |
TWI326844B (en) | 2010-07-01 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NAGRAVISION SA Free format text: FORMER OWNER: NAGRAID SA Effective date: 20150709 |
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TR01 | Transfer of patent right |
Effective date of registration: 20150709 Address after: geneva Patentee after: Nagravision SA Address before: Switzerland Le Diluokele Crete Patentee before: Nagraid SA |
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