CN1771769A - 将具有焊接盘的电子组件焊接到衬底上的方法 - Google Patents

将具有焊接盘的电子组件焊接到衬底上的方法 Download PDF

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CN1771769A
CN1771769A CNA2005800002504A CN200580000250A CN1771769A CN 1771769 A CN1771769 A CN 1771769A CN A2005800002504 A CNA2005800002504 A CN A2005800002504A CN 200580000250 A CN200580000250 A CN 200580000250A CN 1771769 A CN1771769 A CN 1771769A
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metal
welded disc
substrate
metal dust
solder
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CN100479636C (zh
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境忠彦
前田宪
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

一种将具有在其上形成的焊接盘(7)的电子组件(6)焊接到衬底(12)上的方法，其中将焊接盘(7)压向其上薄膜由包含对焊料具有较好可湿性的金属粉末(16)的焊剂(10)形成的焊剂传送台，从而使金属粉末(16)穿过氧化膜(7a)并嵌入焊接盘(7)的底部的表面中，并且将该状态下的焊接盘(7)定位并安装到衬底(12)上的电极(12a)上。然后，对衬底(12)进行加热以使焊接盘(7)熔化，并允许熔化焊料沿金属粉末(16)的表面向电极(12a)流动和扩散。因此，该方法可以提供高质量的焊接接合部分，而不会有任何焊接缺陷和绝缘特性的恶化。

Description

将具有焊接盘的电子组件焊接到衬底上的方法
技术领域
本发明涉及一种将具有焊接盘的电子组件焊接到衬底上的焊接方法。
背景技术
当将电子组件安装到衬底上时，焊接方法广泛地用作接合手段。已知的一种这样的传统焊接手段在于：在电子组件上利用焊料形成金属盘以充当接合电极。由于近年来电子组件的尺寸减小且紧凑的安装上的进步而引起的用于焊接接合的盘尺寸的微型化，不可避免地，即使在同一电子组件上形成的焊接盘中，焊接盘也会发生尺寸变化。因此，非常可能地，如果某些焊接盘的尺寸小于其他焊接盘，则当将电子组件置于衬底上时，焊接盘与衬底上的电路电极之间会存在间隙。
当加热焊接盘进行焊接，而以上述方式间隙保持开的状态时，在所有焊接盘与电路电极的表面相接触之前，处于液体状态下的熔化的焊接盘可能冷却并固化，从而引起了焊料的不完全接合。存在已知来防止这样的焊接缺陷的焊接接合方法，其中当利用焊接盘来进行焊接接合时，向焊接接合部分提供包含金属粉末的金属胶体，诸如其熔点高于构成焊接盘的焊料的熔点的银。例如，在日本专利待审公开No.2000-114301中公开了这样的焊接接合方法。
根据该方法，焊接盘的熔化焊料流到并扩散到金属粉末的表面上，该金属粉末在焊接盘加热过程中熔化的时刻下保持为固态，从而使熔化焊料到达电路电极的表面，即使存在如以上所讨论的间隙时，从而提供了防止由于焊接盘和电路电极之间的间隙而引起的焊接缺陷的优点。
然而，在以上所讨论的传统焊接方法中，金属胶体需要包含活性剂以去除焊接盘的表面上的氧化膜，并且确保焊接盘的可湿性(wetability)，以便允许焊接盘的熔化焊料流过金属粉末。然而，当使用强活化效应的焊剂时，会出现以下的问题。
近年来，考虑到环境保护和工作过程的简化，免清洁方法已经变为主流，该方法省略了去除和清洁用于焊接的焊剂的清洁过程、或者以前所采用的在焊接接合过程之后利用清洁剂完成的工作。在该免清洁方法中，在焊接期间所提供的焊剂完整地保留在焊接接合部分上。如果在该过程中留下的焊剂是非常活性的，则趋向于可能由于残余焊剂所引起的衬底上的电路电极的腐蚀，促使绝缘特性的恶化。如所述的，传统的焊接方法具有引起诸如焊接缺陷和绝缘特性恶化等麻烦的问题。
发明内容
本发明涉及一种将具有焊接盘的电子组件焊接到衬底上的电极上的方法，并且所述方法包括步骤：将包含金属粉末的焊剂扩散为具有平滑平面的平台上的膜状形式；将焊接盘压向由膜状形式的焊剂覆盖的平滑平面的一部分以使金属粉末嵌入焊接盘的表面；在将焊接盘与电极对准的同时，将嵌入有金属粉末的焊接盘设置在衬底上；以及加热衬底以使焊接盘熔化，并且通过使熔化的焊料沿金属粉末的表面流动且扩散，将熔化的焊料引导到衬底上的电极上。
根据本发明，将嵌入有金属粉末的焊接盘与电极对齐地设置在衬底上，并且使通过加热衬底而熔化的焊接盘通过嵌入在焊接盘中的金属粉末的表面流到并扩散到衬底上的电极上，由此，本发明可以提供高质量的焊接接合部分，而不会引起焊接缺陷和绝缘特性的恶化。
附图说明
图1是适合于根据本发明第一典型实施例的焊接方法的电子组件安装设备的正视图；
图2A和图2B是示出了根据本发明第一典型实施例的焊接方法的说明图；
图3A和图3B是也示出了根据同一典型实施例的焊接方法的说明图；
图4是示出了在同一焊接方法中的焊剂传送过程的说明图；
图5是示出了在同一焊接方法中的焊接接合过程的说明图；
图6A、图6B和图6C是根据同一焊接方法、与焊剂混合的金属粉末的截面图；以及
图7是适合于根据本发明第二典型实施例的焊接方法的电子组件安装设备的正视图。
附图中的参考符号的含义：
2：焊剂传送单元
4：组件传送机构
6：电极组件
7：焊接盘
7a：氧化膜
8：传送台
8a：传送表面
8b：粗糙物
9：橡皮刷
10：焊剂
10a：薄焊剂膜
12：衬底
12a：电极
13：运动台
14：垂直压缩机构
15：组件保持头
16、160：金属粉末
16a：芯金属
16b：表面金属
16c：氧化膜
41：第一组件传送机构
42：第二组件传送机构
131：第一运动台
132：第二运动台
141：第一垂直压缩机构
142：第二垂直压缩机构
151：第一组件保持头
152：第二组件保持头
具体实施方式
下面将参考附图来提供对本发明典型实施例的描述。
第一典型实施例
图1是适合于根据本发明第一典型实施例的焊接方法的电子组件安装设备的正视图；图2A和图2B是示出了根据本发明第一典型实施例的焊接方法的说明图；图3A和图3B是也示出了同一焊接方法的说明图；图4是示出了在同一焊接方法中的焊剂传送过程的说明图；图5是示出了在同一焊接方法中的焊接接合过程的说明图；以及图6A、图6B和图6C是在同一焊接方法中、与焊剂混合的金属粉末的截面图。
参考图1，对适合于根据本发明第一典型实施例的焊接方法的电子组件安装设备的结构进行描述。该电子组件安装设备具有将具有焊接盘的电子组件安装到衬底上的功能。该设备具有以下结构，包括：组件进给单元1、串行设置的焊剂传送单元2和衬底保持单元3、以及设置这些单元之上的组件传送机构4。
组件进给单元1(feeder unit)设置有组件托盘5。组件托盘承载多个电子组件6，每一个具有焊接盘7、或者在其下表面上形成的凸起电极(此后简称为“焊接盘7”)。焊接盘7由精细特定焊料球形成，利用焊料接合到电极上以进行电子组件6的外部连接。当形成其时，由于焊料球的尺寸变化等原因，焊接盘7的尺寸是不均匀的，因此，各个焊接盘7到其底端的高度会发生变化。这里，由于其暴露于空气中，因此焊接盘7处于其整个表面上被氧化的状况下(参考图2A、图2B、图3A和图3B所示的氧化膜7a)。
与组件进给单元1相邻地设置的焊剂传送单元2设置有传送台8，该传送台8具有定义了传送表面8a的平滑板。还按照以下方式设置了置于传送表面8a之上的橡皮刷(squeegee)9：其可以通过橡皮刷移动机构(在图中未示出)沿传送表面8a水平移动。在将焊剂10提供给传送表面8a的同时，由移动橡皮刷9沿与传送台8平行的方向来执行薄膜形成过程，以便将焊剂10扩散为传送表面8a上的膜状形式且形成薄焊剂膜10a。
下面将描述焊剂10的构成。在图2A中，焊剂10是作为添加剂混合到由树脂材料(诸如溶解到溶剂中的松脂)制成的高粘度的液体基体中的活性剂和金属粉末16的混合物。为了去除在焊接盘7的衬底上形成的氧化膜7a而添加该活性剂，并且通常将有机酸和类似物质用作去除这样的氧化膜的用途。在这里的该实施例中，将低活性的物质用作活性剂以避免在焊接之后进行清洁的需要。
需要的是，用于金属粉末16的材料具有诸如熔点高于用于焊接盘7的焊料的熔点的特性，在空气环境下，其不会在金属粉末16的表面上产生氧化膜，并且对构成焊接盘7的焊料而言具有较好的可湿性，从而允许熔化的焊接盘7处于焊料的流动状态以流到并容易地扩散到金属粉末16的表面上。
更具体地，使金属粉末16包含金、银和钯中的至少一个，每一个具有90％或更高的纯度。换句话说，金属粉末16包含90％或更高纯度的金、银或钯中的单一元素。可选地，金属粉末16可以包含金、银和钯中的两种元素的任意组合，每一个均具有90％或更高的纯度。或者，金属粉末16可以包含金、银和钯所有这三种元素，每一个均具有90％或更高的纯度。
对这些金属进行处理以便形成金属箔的鳞状(片状)碎片，并且将其混合到焊剂10的基体中。这里所需要的是，金属粉末16的大部分尺寸处于0.05μm和20μm内，并且混合率处于基体容积的1％到20％的范围内。
当将焊剂10传送到焊接盘7的底部时，将焊接盘7压向覆盖有包含金属粉末16的焊剂膜10a的传送表面8a，如图2B所示。同时，具有其适当调整后的压缩力的图1所示的垂直压缩机构14执行变平过程，通过利用压缩力部分地压扁焊接盘7的底部，形成具有均匀高度的多个焊接盘7。因此，金属粉末16的固体碎片通过变平过程中的压缩力部分地侵入覆盖焊接盘7的表面的氧化膜7a，并且嵌入焊接盘7的焊接材料。
在这里的该实施例中，在传送台8上的传送表面8a并非极佳的平滑平面，而是以预定粗糙度形成，在整个表面上具有细微粗糙物8b，如图4所示，图4示出了图2B所示的部分“A”的放大图。在焊接盘7的压缩过程中，通过粗糙物8b将金属粉末16的片断压向焊接盘7。因此，这些粗糙物8b帮助金属粉末16的片状碎片嵌入到焊接盘7中，否则，其氧化膜7a不容易透过。这样穿透了氧化膜7a且嵌入到焊接盘7的底部中的金属粉末16的存在能够改进下一回流(reflow)过程所进行的焊接中的接合质量，以便将熔化的焊接盘7结合到衬底12的电极12a上。
在以上结构中，焊剂传送单元2配置有具有平滑平面的传送表面8a的传送台8和橡皮刷9，从而其构成了薄膜形成机构，通过将橡皮刷9沿与平滑平面平行的方向移动，将包含金属粉末16的焊剂10扩散为平滑平面上的膜状形式。此外，设置有垂直压缩机构14的组件传送机构4构成了加压机构，用于将焊接盘7压向其上形成了薄焊剂膜10a的传送表面8a的一部分，并且使金属粉末16嵌入焊接盘7的表面中。
在图1中，与焊剂传送单元2相邻设置的衬底保持单元3设置有衬底保持台11。衬底保持台11在其上保持衬底12，在衬底12上表面上形成有电极12a。组件传送机构4具有可沿运动台13按水平方向移动的垂直压缩机构14。垂直压缩机构14设置有安装在其下端的组件保持头15，并且该组件保持头15具有通过将其吸附到底面上来保持电子组件6的功能。在将组件保持头15定位在组件进给单元1之上的同时，驱动垂直压缩机构14以向组件托盘5垂直移动组件保持头15，以便吸附和拾取电子组件6。
随后，将保持电子组件6的组件保持头15移动到焊剂传送单元2的位置，并且驱动垂直压缩机构14以便将组件保持头15向下移动到在传送表面8a上形成的薄焊剂膜10a，并且将焊接盘7压向传送表面8a。该运动将焊剂10传送到焊接盘7的底部，并且使金属粉末16侵入焊接盘7。在通过压缩力变平的同时，还压扁该焊接盘7的底部，从而使多个焊接盘7高度变得均匀。
在传送该焊剂之后，将保持电子组件6的组件保持头15移动到衬底保持单元3之上的位置，并且向衬底12垂直移动，以便与衬底12的电极12a对齐地、利用焊接盘7将电子组件6安装在衬底12上。因此，组件传送机构4充当安装机构，用于与衬底12上的电极12a对齐地定位嵌入有金属粉末16的焊接盘之后，安装电子组件6。组件传送机构4还同时充当先前所提到的压缩机构。
接下来将参考图2A到图5，更详细地描述将配置有焊接盘7的电子组件6焊接到衬底12上的焊接方法。在该焊接方法中，通过在将焊剂传送到焊接盘7之后使安装在衬底12上的电子组件6受到回流处理，使焊接盘7熔化并焊接到衬底12的电极12a上。这里，图4和图5分别示出了图2B所示的部分“A”和图3B所示的部分“B”的放大图。
在图2A中，将包含金属粉末16的焊剂10扩散为具有平滑传送表面8a的传送级台8上的膜状形式，以形成薄焊剂膜10a(即，薄膜形成步骤)。接着，将保持图1所示的电子组件6的组件保持头15移动到传送台8上，并且将焊接盘7压向传送表面8a上形成了薄焊剂膜10a的部分，以便将金属粉末16的碎片嵌入到焊接盘7的表面中(即，金属粉末嵌入步骤)。
在金属粉末嵌入步骤中，在传送表面8a上形成的粗糙物8b用来帮助金属粉末16的片状碎片穿过氧化膜7a并嵌入焊接盘7，如图4中的部分“A”的详细视图所示。然而，如果金属粉末16具有能够容易地穿透氧化膜7a的诸如球状颗粒的形状，则传送表面8a不必设置粗糙物8b。
之后，从传送台8使图1所示的组件保持头15升高以完成变平过程，其中，部分地压扁焊接盘7的底部，并且同时将焊剂10传送到焊接盘7，如图3A所示。这里，焊接盘7将金属粉末16的嵌入碎片承载在其底部上，从而使这些碎片以及被传送的焊剂10中的金属粉末16的其他碎片与焊接盘7一起在接下来描述的安装步骤中到达电极12a。
在传送并扩散该焊剂之后，将电子组件6安装在衬底12上。首先，将在承载嵌入金属粉末16的焊接盘7与电极12a对齐地定位在衬底12上的同时，安装电子组件6，如图3B所示(即，安装步骤)。在安装之后，在回流炉中对衬底12进行加热以使焊接盘7熔化并扩散到嵌入焊接盘7且传送到电极12a的金属粉末16的表面上(即焊接熔化步骤)。
参考图5中的部分“B”的详细视图，将进一步描述该焊接熔化步骤。图5示出了就在开始焊接接合之前、在电极12a和焊接盘7的表面之间的界面周围的截面。由于在焊剂传送步骤中使焊接盘7变平，所有焊接盘7的底部通常与电极12a的表面均匀地接触。
存在以下情况：当焊剂10具有较小的活性效应程度时，氧化膜7a保留在焊接盘7的衬底上，而没有完全被去除。如果情况如此，则焊接盘7不与电极12a的表面直接接触，而是仅通过表面上的氧化膜7a来接触。另一方面，穿过氧化膜7a且嵌入焊接盘7的底部的金属粉末16的碎片与电极12a的表面直接接触，或者通过包含在焊剂10中的金属粉末16的其他碎片来接触。或者，即使金属粉末16的嵌入碎片并未与电极12a接触，由于变平为焊接盘7提供了与电极12a的均匀接触，其紧密地以可忽略的公差与电极12a的表面相邻。
当焊接盘7在该条件下熔化时，熔化的焊料流入并向下沿通过氧化膜7a在焊接盘7和电极12a的表面之间接触的金属粉末16的表面扩散。焊接盘7的熔化焊料直接到达电极12a的表面，或通过在氧化膜7a和电极12a之间的空间中的金属粉末16的其他碎片的表面到达，然后，其在电极12a的表面上水平扩散。因此，焊接盘7的熔化焊料开始覆盖电极12a的整个接合表面。随后，当其冷却并固化时，熔化焊料完成焊接盘7到电极12a的焊接接合。
在该焊接接合过程中，焊剂10中包括的活性剂用于提供从焊接盘7中去除氧化膜7a的效果。然而，由于以上所讨论的方法通过允许熔化焊料流到并扩散过超越氧化膜7a的金属粉末16的碎片而确保了较好质量的焊接接合，这里所包括的活性剂不必非常有活性，即使氧化膜7a并未完全去除。
换句话说，由于使用金属粉末16来预先穿透氧化膜7a，该方法允许使用具有较小活性效应的低活性焊剂。为此，在电路电极中，由于该活性成分，仅存在较小的腐蚀度(如果存在)，即使在焊接接合之后保留了焊剂的情况下。因此，本发明可以提供高质量的焊接接合部分，这不会导致接合缺陷或促使绝缘特性的恶化，即使是采用其中在焊接之后省略了去除焊剂的清洁过程的无清洁方法。
混合到焊剂10中的金属粉末可以为诸如图6A所示的金属粉末160的材料，包括表示内核的芯金属16a、以及覆盖芯金属16a的外部的表面金属16b，而不使用单一金属元素的材料。在该粉末结构中，从锡(Sn)、锌(Zn)、铅(Pb)和铟(In)中选择金属材料，作为用于芯金属16a的元素，由其形成金属箔的鳞状(片状)碎片。然后，通过诸如电镀等方式，利用对焊料具有较好可湿性的金(Au)或银(Ag)的薄膜来覆盖芯金属16a的外部表面，以形成表面金属16b。
对这里用于芯金属16a和表面金属16b的金属元素的组合进行选择，从而实现以下扩散特性：在回流过程期间的加热容易使表面金属16b扩散到外部芯金属16a(图6B的箭头所示)，并且几乎所有量的表面金属16b进入芯金属16a，并且在回流过程结束时，表面金属16b的扩散完成。即，在该成分中的表面金属16b由对焊料具有较好可湿性的金属形成，而芯金属16a由溶解表面金属16b且利用回流过程的加热来吸入该表面金属16b的特性的另一金属构成。
通过采用这样的成分的金属粉末160作为混合到焊剂10中的材料，本发明可以提供与稍后所述的相同的效果。首先，当在以上所讨论的焊接熔化步骤中对焊接盘7进行熔化时，金属粉末160的表面金属16b实现了以下作用：允许熔化焊料与其表面接触以使焊料沿表面变湿、扩散和导向。这里，金属粉末160设计为使用诸如昂贵的金和银等贵重金属作为表面金属16b来覆盖由便宜材料制成的芯金属16a的表面。因此，与使用纯粹状态的昂贵贵重金属作为焊剂中混合的金属粉末的传统方法相比，金属粉末160能够获得实质上的成本减少。
当在焊接熔化步骤中继续加热时，通过扩散使表面金属16b逐渐进入芯金属16a，如图6B中的箭头所示。存在表面金属16b扩散到液相的芯金属16a中的情况，并且存在表面金属16b扩散到固相的芯金属16a的另一情况，这取决于用于芯金属16a的金属种类和加热温度。然而，不管在哪种情况下，表面金属16b都逐渐进入芯金属16a。当表面金属16b已经完全扩散从而使芯金属16a的表面暴露时，由于加热使芯金属16a氧化，在金属粉末160的表面上形成了氧化膜16c，如图6C所示。该氧化膜16c提供了改进在焊接接合之后的绝缘特性的优点。
在焊接接合步骤之后省略了去除焊剂的清洁过程的免清洁方法中，在焊接胶体中所包含的金属粉末完全保持为焊接接合部分周围的焊剂残余。当使用纯粹状态的诸如金和银等金属作为金属粉末时(如在传统方式中已经这样做的)，存在发生渐进性迁移的风险，危险的大小取决于残余量，这引起了衬底的电路电极之间的电腐蚀，并且恶化了绝缘特性。因此，过去，考虑到保持绝缘特性，需要将金属粉末的混合比保持为较低。结果，存在金属粉末不会令人满意地实现扩散熔化焊料的效果。
另一方面，根据本发明的该典型实施例，使用以上成分的金属粉末160防止了迁移的危险且确保了较好的绝缘特性，这是由于金属粉末160的表面覆盖有稳定的氧化膜16c，即使在焊接接合步骤之后，相当大量的金属粉末160保留在焊接接合部分附近的情况下。因此，使用以上成分的金属粉末160能够将足够量的金属粉末混合到焊接胶体中，以通过在焊接接合之后的绝缘特性，提高焊接接合的质量、以及安装可靠性。
第二典型实施例
图7是适合于根据本发明第二典型实施例的焊接方法的电子组件安装设备的正视图。按照以下方式对该第二典型实施例的设备进行构造：由专门准备的分立组件传送机构来执行电子组件6的焊剂传送操作和电子组件6到衬底12上的安装操作，而非在第一典型实施例中所使用的单个单元的组件传送机构4。
在图7中，组件进给单元1、焊剂传送单元2和衬底保持单元3类似于图1所示的第一典型实施例的相应单元。然而，在该第二典型实施例中，存在设置在组件进给单元1和焊剂传送单元2之上的第一组件传送机构41、以及设置在焊剂传送单元2和衬底保持单元3之上的第二组件传送机构42。
第一组件传送机构41具有可沿第一运动台131按水平方向移动的第一垂直压缩机构141。第二组件传送机构42具有可沿第二运动台132也按水平方向移动的第二垂直压缩机构142。
第一垂直压缩机构141设置有安装到其下端的第一组件保持头151，并且该组件保持头151具有通过将其吸附到底面上来保持电子组件6的功能。第二垂直压缩机构142设置有安装到其下端的第二组件保持头152，并且该组件保持头152也具有通过将其吸附到底面上来保持电子组件6的功能。
在将第一组件保持头151定位在组件进给单元1上方的同时，驱动第一垂直压缩机构141以便将第一组件保持头151向组件托架5垂直移动，用于吸附和拾取电子组件6。随后，保持电子组件6的第一组件保持头151移动到焊剂传送单元2的位置，并且驱动第一垂直压缩机构141以便将第一组件保持头151向下移动到在传送表面8a上形成的薄焊剂膜10a。
该运动将焊剂传送到焊接盘，使金属粉末侵入焊接盘，并且按照与第一典型实施例的设备相同的方式使焊接盘变平。换句话说，第一组件传送机构41构成了加压机构，用于将焊接盘压向传送表面8a上形成了薄焊剂膜10a的部分，并且使金属粉末嵌入焊接盘的表面。
第二组件保持头152保持向其传送焊料的电子组件6，并且移动到衬底保持单元3的位置。这里，驱动第二垂直压缩机构142以便将电子组件6垂直移动到衬底12并将电子组件6安装在衬底12上。因此，第二组件传送机构42充当在与衬底12上的电极12a对齐地定位嵌入有金属粉末的焊接盘之后安装电子组件6的安装机构。
如所述的，所述设备设置有：具有通过将其压向传送表面8a将金属粉末嵌入焊接盘的功能的第一组件传送机构41、具有在传送焊剂之后将电子组件6安装到衬底12上的功能的第二组件传送机构42，其彼此独立，由此，根据其各自所需的功能，这些机构可以设置有适当的操作特性。
换句话说，第一垂直压缩机构141和第一组件保持头151设置有重负载结构，能够利用大量的焊接盘来处理大尺寸组件的工作，这需要大量的压缩力来使金属粉末嵌入到焊接盘中并适当地执行变平过程。另一方面，第二垂直压缩机构142和第二组件保持头152设置有高精度的结构，能够较好地处理特定种类的衬底，例如薄柔性衬底，这需要较大的定位精度和对安装操作的精确加载控制。
工业应用性
本发明非常有助于用作适配到用于将由焊接盘形成的电子组件安装到衬底上的电子组件安装设备的焊接方法，并且所发明的方法能够提供高质量的焊接接合部分，而不会导致任何焊接缺陷和绝缘特性的恶化。

Claims (7)

1、一种将具有焊接盘的电子组件焊接到衬底上的电极上的方法，所述方法包括步骤：
将包含金属粉末的焊剂扩散为具有平滑平面的平台上的膜状形式；
将焊接盘压向由膜状形式的焊剂覆盖的平滑平面的一部分以使金属粉末嵌入焊接盘的表面；
将嵌入有金属粉末的焊接盘与电极对齐地设置在具有焊接盘的衬底上；以及
加热衬底以使焊接盘熔化，并且通过使熔化的焊料沿金属粉末的表面流动且扩散，将熔化的焊料引导到衬底上的电极上。
2、根据权利要求1所述的焊接方法，其特征在于所述金属粉末包含金属箔的片状形式。
3、根据权利要求1所述的焊接方法，其特征在于所述金属粉末包含金、银和钯中的至少一个，每一个具有90％或更高的纯度。
4、根据权利要求1所述的焊接方法，其特征在于所述金属粉末包括芯金属和覆盖芯金属的外部的表面金属。
5、根据权利要求4所述的焊接方法，其特征在于所述表面金属包括对焊料具有较好可湿性的金属，并且所述芯金属包括当被加热时具有将表面金属熔接和吸入其中的特性的金属。
6、根据权利要求4所述的焊接方法，其特征在于所述表面金属包括金和银之一，而所述芯金属包含锡、芯、铅和铟中的任一个。
7、根据权利要求5所述的焊接方法，其特征在于所述表面金属包含金和银之一，而所述芯金属包含锡、芯、铅和铟中的任一个。
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