CN1774961A - 用于高频调谐电气装置的方法和适合于该方法的印刷电路板 - Google Patents

用于高频调谐电气装置的方法和适合于该方法的印刷电路板 Download PDF

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CN1774961A
CN1774961A CNA2004800067237A CN200480006723A CN1774961A CN 1774961 A CN1774961 A CN 1774961A CN A2004800067237 A CNA2004800067237 A CN A2004800067237A CN 200480006723 A CN200480006723 A CN 200480006723A CN 1774961 A CN1774961 A CN 1774961A
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CN100534258C (zh
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P·布勒谢
U·赫策尔
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6464Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
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    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
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Abstract

本发明涉及一种用于高频调谐包括印刷电路板(3)的高频接插接连接器(1)的方法,该印刷电路板具有用于高频接触件的接触点(21-28)以及用于绝缘偏移接触件的接触点(31-38)。用于高频接触件的每个接触点(21-28)被连接到用于绝缘偏移接触件的各个接触点(31-38)。造成近端串扰的电容性耦合出现在高频接触件之间。只在一个面上被连接到电接触件的接触点(26)的至少一个第一导体路径(46)被放置在印刷电路板(3)上,它连同被放置在印刷电路板(3)上和/或在印刷电路板中的至少一个第二导体路径(44)一起形成电容器(C46)。装置的至少一个频率相关的参数被测量,以及把这个频率相关的参数与设定的参数相比较,以及按照二者之间的差值,把在一个面上被连接的导体路径(46)部分地去除或完全分离开。

Description

用于高频调谐电气装置的方法和适合于该方法的印刷电路板
本发明涉及用于射频(RF)匹配电气装置的方法,以及涉及适用于这一目的的印刷电路板。
EP 0 525 703 A1公开一种用于国内范围的计算机网络的插接连接,包括阳连接器部分和阴连接器部分,用于串扰补偿的装置被安排在插接连接器中,藉助于该插接连接器可以增加在发送导体环与接收导体环之间的串扰衰减。为此,印刷电路板被安排在用于插入式电缆的连接与用于联线的连接之间的插接连接器的阳连接器部分或阴连接器部分,用于发送导体环和接收导体环的导体路由在印刷电路板上在物理上很大地分隔开。用于串扰补偿的装置例如是诸如电容或线圈那样的可调节的分立式元件。已知的插接连接器具有缺点:分立式元件是相对较昂贵的和体积大的。
DE 100 51 097 A1公开一种电接插接连接器,包括接插接连接器外壳、具有两组接触元件的印刷电路板,第一组接触元件被安排在印刷电路板的正面以及插入到插接连接器外壳中的开孔,以及第二组接触元件被安排在印刷电路板的背面以及第二组中的接触元件具有绝缘偏移接触件(insulation displacement contact)的形式,接插接连接器具有电缆管理器,它具有穿过它的开孔,以及在它的正面配备有导体导引件,它们用来与绝缘偏移接触件进行接触,导引件被形成在绝缘偏移接触件的区域,带有用于绝缘偏移接触件的刻有凹槽的保持器,以及在这种情形下,电缆管理器可以与接插接连接器外壳相匹配。
由于在电信和信息技术中用于数据传输的增加的带宽,导体、接触件和导体轨迹不得不被设计成使得它们相对于彼此被高度地限定,以便遵循对于串扰衰减所需要的数值。这需要极其严格的公差,该公差是在自动化制造过程期间要遵守是困难的。
因此本发明是基于这样的技术问题:提供用于匹配具有至少一个印刷电路板的RF接插接连接器(特别是RJ-45阴连接器)的方法,该印刷电路板具有用于RF接触件的接触点和用于绝缘偏移接触件的接触点,以及用于RF接触件的一个接触点在每种情形下被连接到用于绝缘偏移接触件的各个接触点;以及提供适用于这个目的的印刷电路板,通过该电路板可以在窄的容许频带内调节RF特性。
该技术问题是通过具有专利权利要求1和11的特性的主题而被解决的。本发明的另外的有利的改进措施在附属权利要求中描述。
为此,仅仅在一个面上被连接到电接触件的接触点的至少一个第一导体轨迹被安排在印刷电路板上,它连同被安排在印刷电路板上的至少一个第二导体轨迹一起形成电容器,该装置的至少一个频率相关的参数被测量,该频率相关的参数与标称参数进行比较,作为差值的函数,在一个面上与其进行接触的导体轨迹被部分去除或切割。这使得有可能通过使用简单的和花费经济的装置形成可匹配的电容器,以及藉助于它可以匹配该装置的RF响应。在这种情形下,导体轨迹优选地被连接到RF接触件的接触点,因为这意味着匹配电容更接近于串扰的源的位置。然而,在原理上,它们也可以被连接到绝缘偏移接触件的接触点,这些接触点被电连接到RF接触件的接触点。应当指出,在原理上,为了改变电容值,切割或去除电容器的一个导体轨迹是足够的。
电容器的相反的电极优选地同样由在一个面上被连接到接触点的导体轨迹形成。
在另一个优选实施例中,至少一个另外的第二导体轨迹被安排在印刷电路板的内层,以及被电连接到印刷电路板上的导体轨迹。这代表被并联的电容值,所以总的电容值被相加,因此允许在相当小的面积上形成足够大的电容值。
在另一个优选实施例中,至少两个独立的由导体轨迹形成的电容器被安排在印刷电路板上,以便相对于地进行对称的调整。
在另一个优选实施例中,频率相关的参数在未组装的印刷电路板上被确定和被调节。这是基于这样的认识,特别是在RF接插接连接器的情形下,印刷电路板本身是大多数的RF公差主要原因。这些公差通常是诸如导体轨迹那样的布局元件的几何公差,以及印刷电路板的材料的介电常数的公差。在未组装的印刷电路板上的自动测量比起在组装的印刷电路板上,或甚至在被安装在外壳中的印刷电路板上的测量容易得多。整个装置因此甚至在生产印刷电路板的过程的早期阶段就被匹配。在这种情形下,馈电和测量优选地被集中提供在接触点的焊接孔。
在另一个优选实施例中,在第一步骤仅仅实行所必须的估计的导体轨迹的一部分的缩短。然后再一次测量频率相关的参数。测量的改变量然后被使用来确定仍旧要被去除或切割的剩余的导体轨迹长度。这也考虑在匹配过程中与导体轨迹有关的公差。在这种情形下,导体轨迹缩短还可以被再划分成两个以上的步骤。
在另一个优选实施例中,在导体轨迹切割期间的最后的切割以比起第一次切割更宽的方式实行。这种更宽的切割使得导体轨迹的切割部分的电容性影响最小化。
在另一个优选实施例中,近区串扰被确定为频率相关的参数,因此使得匹配过程更容易,因为要被直接最佳化的参数被确定为以使得不需要例如通过纯电容测量,而任何进一步估计参数对于近区串扰的影响,因为情况就是这样。
导体轨迹优选地藉助于激光,更优选地藉助于波长短于600nm的短波长激光进行切割。用于切割导体轨迹的激光的使用是极其快速的,以及可以容易地自动化。在原理上,导体轨迹也可以例如藉助于铣削被机械地切割或去除,或通过使用过量电流来烧蚀它而电气地切割或去除。
在另一个优选实施例中,激光器具有相关的光学定位系统。这导致导体轨迹以更确定的方式被切割,而不损坏紧密靠近的导体轨迹以及不会造成要被切割的导体轨迹不完全的切割。
在去除或切割导体轨迹期间,有可能把铜粒子沉积在印刷电路板上,以及这些转而又降低抗过压性能。导体轨迹的切割或去除因此优选地后面跟随去除铜粒子和/或任何其它污染的清洗步骤。
在下面的正文中参照优选的示例性实施例更详细地说明本发明。在图上:
图1显示用于传输RF数据的接插接连接器的分解图(现有技术),
图2显示在如图1所示的接插接连接器中使用的印刷电路板,
图3显示用于印刷电路板的示意性等效电路,
图4显示对于近区串扰的示意性频率响应,以及
图5显示作为要被去除的导体轨迹的长度的函数的近区串扰的衰减D的曲线族。
图1显示接插接连接器1的分解图。该接插接连接器1具有接插接连接器外壳2、印刷电路板3、向下保持装置4和电缆管理器5。接插接连接器外壳2在说明性例子中具有阴连接器外壳的形式,带有各种不同的锁闭和插入装置。接插接连接器外壳2在它的侧面上具有屏蔽板6。印刷电路板3在它的正面与第一组接触件7适配,以及在它的背面与第二组绝缘偏移接触件8适配。第一组中的一个接触件7被连接到第二组中相应的接触件8。印刷电路板3然后被插入到接插接连接器外壳2中。在该过程中,接插接连接器外壳2的圆柱形销9穿过印刷电路板3的开孔,这样,接插接连接器外壳2和印刷电路板3被调节和彼此相对地固定。第一组中的接触件7(具有RF接触件的形式)然后伸入到可从接插接连接器外壳的正面接入的开孔中。向下保持装置4然后向下压第二组的接触件8,以及被锁闭到接插接连接器外壳2。为此,向下保持装置4在它的端面上具有锁闭接片10以及具有穿过它的、用于绝缘偏移接触件8的开孔11。而且,向下保持装置4具有两个锁闭钩12,它们被使用来锁闭到电缆管理器5。
图2显示未组装的印刷电路板3。该印刷电路板3具有用于RF接触件的八个接触点21-28和接触孔,以及用于绝缘偏移接触件的八个接触点31-38。印刷电路板3还具有镀通孔40,用于连接在印刷电路板的正面和背面以及内层的导体轨迹,镀通孔40被显示为小圆圈。印刷电路板3上的孔41在本例中被显示为小方形。把接触点21-28连接到它们的各个相关的接触点31-38导体轨迹未示出,例外的是接触点24和35的两个部件,因为它们被安排在印刷电路板的背面和/在内层。除了分别在两个接触点21-28和31-38之间的电连接的导体轨迹以外,还有四个导体轨迹43-46,它们在一个面上被分别连接到接触点23-26。在本例中,两个导体轨迹44和46形成在接触点24和26之间的电容器。相应地,两个导体轨迹43和45形成在接触点23和25之间的电容器。另一个导体轨迹优选地被安排在内层,被电连接到导体轨迹44,以及位于导体轨迹46的下面。对于电路来说,接触点21、22;23、26;24、25和27、28以及它们的各个相关的接触件形成接触件对。在本例中,两个外部接触件对21、22和27、28对于近区串扰是比较不太重要的。另一方面,两个内部的和交错的接触件对23、26和24、25是未决定的。在本例中造成扰动的电容位于23和24之间以及25和26之间,因为其它耦合由于在它们之间的较大的距离是可忽略的。
图3显示最后的等效电路,包括示意性测试电路布局。在本例中,电容器C46和C35基本上代表分别由导体轨迹44和46以及43和45形成的电容,而相反,电容器C34和C56分别由相邻的接触点23、33以及相关的导体轨迹;24、34与导体轨迹;以及25、35与导体轨迹;和26、36与导体轨迹形成。这个电桥电路现在可以调整,以迫使近区串扰低于需要的数值。在调整处理过程之前,首先通过确定一个接触件对的近区串扰作为频率相关的参数而确定非对称性。在本例中,确定在接触件对23、33和26、36与接触件对24、34;25、35之间的串扰。由于优选地在未组装的印刷电路板上进行测量,接触点33-36以正确的阻抗终结。然后测量对于接触点25、24的近区串扰,RF信号藉助于网络分析仪被注入到接触点23、26,在图3上该网络分析仪由频率发生器50和测量设备51表示。RF信号的馈送和测量在本例中是藉助于在接触点23-26的焊接孔的中心接触提供的。
图4示意地显示近区串扰NEXT的频率响应,以曲线a代表标称近区串扰,以及曲线b代表对于测量的印刷电路板的测量的实际的近区串扰。标称近区串扰例如是藉助于最好的设备被确定的。在本例中,测量的近区串扰比起标称值高一个量ΔNEXT,所以,这必须通过缩短导体轨迹(因此减小电容值)来补偿。多少毫米的导体轨迹相应于多少电容值,以及因此相应于近区串扰衰减值D的测量,取决于印刷电路板的公差,诸如介电常数或在导体轨迹之间的距离。所以如图5上示意地显示的不是单个直线,而是整个曲线族。由于公差是未知的,所以首先必须确定哪条曲线可应用于要被匹配的印刷电路板。为此,首先去除或切割一段导体轨迹,然后再一次进行测量。找到的衰减值的减小可被使用来确定相关的曲线。另一方面,如果希望的衰减大于通过最陡的曲线可得到的衰减,则可以去除或切割整个导体轨迹,而不用中间步骤。该方法然后对于其它电容器重复进行。
导体轨迹优选地藉助于短波激光器进行切割,它的功率和聚焦匹配于要被切割的铜轨迹,尽可能地使这是去除的全部。激光器的优点在于它的具有高速度的优良的再现性,这样,匹配处理过程可以易于自动化。
部件列表
1 插接连接器
2 插接连接器外壳
3 印刷电路板
4 向下保持装置
5 电缆管理器
6 屏蔽板
7 接触件
8 接触件
9 圆柱销
10 锁闭接片
11 开孔
12 锁闭钩
21 接触点(用于RF接触件)
22 接触点(用于RF接触件)
23 接触点(用于RF接触件)
24 接触点(用于RF接触件)
25 接触点(用于RF接触件)
26 接触点(用于RF接触件)
27 接触点(用于RF接触件)
28 接触点(用于RF接触件)
31 接触点(用于绝缘偏移接触件)
32 接触点(用于绝缘偏移接触件)
33 接触点(用于绝缘偏移接触件)
34 接触点(用于绝缘偏移接触件)
35 接触点(用于绝缘偏移接触件)
36 接触点(用于绝缘偏移接触件)
37 接触点(用于绝缘偏移接触件)
38 接触点(用于绝缘偏移接触件)
40 镀通孔
41 孔
43 导体轨迹
44 导体轨迹
45 导体轨迹
46 导体轨迹
50 频率发生器
51 测量设备

Claims (15)

1.一种用于具有印刷电路板(3)的射频接插接连接器(1)的射频匹配的方法,该印刷电路板具有用于射频接触件的接触点(21-28)和用于绝缘偏移接触件的接触点(31-38),用于射频接触件的一个接触点(21-28)在每种情形下被连接到用于绝缘偏移接触件的各个接触点(31-38),以及造成近端串扰的电容性耦合出现在射频接触件之间,
其特征在于,
仅仅在一个面上被连接到电接触件的接触点(26)的至少一个第一导体轨迹(46)被安排在印刷电路板(3)上,以及它连同被安排在印刷电路板(3)上和/或在印刷电路板中的至少一个第二导体轨迹(44)一起形成电容器(C46),该装置的至少一个频率相关的参数被测量,该频率相关的参数与额定参数相比较,以及通过其在一个面上进行接触的导体轨迹(46)作为差值的函数被局部地去除或切割。
2.如权利要求1所述的方法,其特征在于,第二导体轨迹(44)具有通过其在一个面上进行接触的导体轨迹(46)的形式。
3.如权利要求1或2所述的方法,其特征在于,至少一个另外的第二导体轨迹被安排在印刷电路板(3)的内层,以及被连接到被安排在印刷电路板(3)上的第二导体轨迹(44)。
4.如前述权利要求之一所述的方法,其特征在于,至少两个可匹配的电容器(C46,C35)被安排在印刷电路板(3)上。
5.如前述权利要求之一所述的方法,其特征在于,频率相关的参数在未组装印刷电路板(3)上被确定。
6.如前述权利要求之一所述的方法,其特征在于,在第一步骤,只进行必须的估计的导体轨迹的一部分的缩短(L),在一次测量频率相关的参数,由此确定仍要去除或切去的剩余导体轨迹。
7.如权利要求6所述的方法,其特征在于,在最后的步骤,导体轨迹(46,45)以比起第一步骤更加宽的方式被切割。
8.如前述权利要求之一所述的方法,其特征在于,近区串扰(NEXT)作为频率相关的参数被确定。
9.如前述权利要求之一所述的方法,其特征在于,导体轨迹(46,45)是藉助于激光器进行切割的。
10.如前述权利要求之一所述的方法,其特征在于,藉助于光学系统辅助控制激光器的处理过程。
11.一种用于支持用于射频接插接连接器的射频接触件和绝缘偏移接触件的印刷电路板,该印刷电路板具有用于射频接触的八个接触点(21-28)和用于绝缘偏移接触件的八个接触点(31-38),用于射频接触的一个接触点(21-28)在每种情形下被连接到用于绝缘偏移接触件的各个接触点(31-38),以及造成近端串扰的电容性耦合出现在射频接触件之间,
其特征在于,
只在一个面上被连接到电接触件的接触点(26)的至少一个第一导体轨迹(46)被安排在印刷电路板(3)上,以及它连同被安排在印刷电路板(3)上和/或在印刷电路板中的至少一个第二导体轨迹(44)一起形成电容器(C46)。
12.如权利要求11所述的印刷电路板,其特征在于,第二导体轨迹(44)是和在一个面上被连接到接触点(24)的导体轨迹(46)同样的。
13.如权利要求11或12所述的方法,其特征在于,至少一个另外的第二导体轨迹被安排在印刷电路板(3)的内层,以及被连接到被安排在印刷电路板(3)上的另外的导体轨迹(44)。
14.如权利要求11到13之一所述的方法,其特征在于,至少两个可匹配的电容器(C46,C35)被安排在印刷电路板(3)上。
15.如权利要求11到14之一所述的方法,其特征在于,第一电容器(C46)被安排在接触点(24和26)之间,以及第二电容器(C35)被安排在接触点(23和25)之间。
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NO20054626L (no) 2005-11-29
BRPI0408208A (pt) 2006-02-14
CL2004000485A1 (es) 2005-05-27
US20060264106A1 (en) 2006-11-23
US20080166919A1 (en) 2008-07-10
HRP20050785B1 (en) 2011-12-31
HK1090245A1 (en) 2006-12-15
TWI244246B (en) 2005-11-21
KR100806090B1 (ko) 2008-02-21
DE10310434A1 (de) 2004-09-30
NO20054626D0 (no) 2005-10-07
WO2004082343A1 (de) 2004-09-23
PL205021B1 (pl) 2010-03-31
KR20050109980A (ko) 2005-11-22
US8413323B2 (en) 2013-04-09

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