CN1820560A - 具有烧结槽状结构吸液芯的塔式散热器 - Google Patents

具有烧结槽状结构吸液芯的塔式散热器 Download PDF

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CN1820560A
CN1820560A CNA2004800195447A CN200480019544A CN1820560A CN 1820560 A CN1820560 A CN 1820560A CN A2004800195447 A CNA2004800195447 A CN A2004800195447A CN 200480019544 A CN200480019544 A CN 200480019544A CN 1820560 A CN1820560 A CN 1820560A
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wick
heat pipe
piston ring
groove
stratum granulosum
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斯科特·D·加纳
詹姆斯·E·林德穆斯
热罗姆·E·托特
约翰·H·罗森菲尔德
肯尼思·G·明纳利
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Aavid Thermal Corp
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Thermal Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

本发明提供了一种热管，其具有带有一内表面的管状外壳、一置于所述外壳中工作流体和至少一个自所述管的外表面径向向外伸出的鳍状物。所述管状外壳在一端用一底座密封，所述底座在其至少一部分向内的表面设置有烧结的凹槽吸液芯。所述烧结的凹槽吸液芯包括均获得有一平均颗粒直径的多个独立颗粒。所述烧结的凹槽吸液芯包括至少两个临近的槽脊，所述槽脊通过至少所述两槽脊之间设置的颗粒层以液体互相联系，其中所述颗粒层包括至少一个不超过约六倍平均颗粒直径的维数。

Description

具有烧结槽状结构吸液芯的塔式散热器
技术领域
本发明主要涉及对电子系统产生的热能的处理，特别是涉及用于有效和高成本效率地发送和控制由电子系统的各种元件产生热能的与热管相关的塔式散热器。
背景技术
半导体在尺寸上不断减小，与这种尺寸减小相应的是半导体功率密度的增加，这又引起必须要解决的散热问题，因为过热会导致半导体性能下降。在本领域中已知用热管来转移和扩散电子系统产生的热量。
热管利用工作流体的连续蒸发和冷凝将热能从热源输送到散热器。热管能够在汽化的工作流体中输送非常大的热量，因为多数工作流体具有高蒸发热。另外，热量能够在热源和散热器间的温差相当小时被输送。热管一般利用多孔的吸液芯产生的毛细力返回冷凝的工作流体，从热管冷凝器部分(这在里输送的热能在散热器释放)到蒸发器部分(在这里要被输送的热能从热源被吸收)。
热管吸液芯典型地是这样制成的，围绕圆柱形心轴缠绕金属毡的金属网，将心轴和缠绕的吸液芯插入一热管容器中，然后移除心轴。吸液芯也可以通过在热管的内表面沉积金属粉末，再烧结该粉末以产生非常大量的间质性毛细管而形成。典型的热管吸液芯特别是在通过毛细作用返回到蒸发器部分的液体冷凝物不断汽化，并且阻碍或堵塞液体移动的地方易于产生过热点。热散布器热管能够帮助增强集成电路的排热能力。热散布器是一薄基层，能够吸收如半导体设备产生的热能，并且在一散热器的大表面散布。
理想地，吸液芯结构应该足够薄，以使导热率delta-T足够小来阻止沸腾起始。但是，薄吸液芯被认为不具有足够的截面积来输送大量的用来消散大量能量的液体。例如，G.Y.Eastman的美国专利4,274,479涉及一种热管毛细吸液芯结构，该结构是由烧结的金属制成的，并在其内表面构成纵向凹槽。Eastman吸液芯凹槽提供纵向毛细泵而烧结吸液芯提供高毛细压力来填充凹槽并且保证有效地将热转移液体环绕分布。Eastman描述的槽状结构一般具有“槽脊”和“凹槽或通道”，该槽脊是凹槽或通道之间的物质。槽脊的侧面限定了凹槽的宽度，因此，槽脊的高度也就是槽状的深度。Eastman还指出由凹槽结构组成的现有产品中，槽脊是固体材料，与壳壁为一体结构，该凹槽通过各种机械加工、化学蚀刻或挤压工艺制成。
重要的是，Eastman建议，为了优化热管的性能，他的槽脊和槽状必须具有足够的尺寸在一相对厚的连接槽脊和槽状的烧结粉末带维持一连续的液体层，以便在每个槽状的底部存在工作流体的储存层。由此，Eastman要求他的凹槽各端被堵塞以保证凹槽内的毛细泵压力由汽液界面的最小宽度所决定。也就是说，Eastman暗示这些吸液芯不具有足够的截面积来输送相对大量的要求用来消散大量热能的工作流体。
发明内容
本发明涉及一种塔式热管，由一内表面至少部分覆盖有吸液芯的套管组成，工作流体置于套管内，并且至少一突出的放射状鳍状物从套管的外表面伸出。套管一端通过底部密封，该底部至少在一部分内表面处理成烧结吸液芯的凹槽。开凹槽的烧结的吸液芯由多个直径均一的单个颗粒组成。凹槽吸液芯包括至少两个槽脊，其中两个槽脊在液体中通过设置在至少两个槽脊之间颗粒层互相联系，所述槽脊小于6倍的平均颗粒直径。
附图说明
本发明的这些和其它特点和优点将通过以下对本发明优选实施例具体说明，连同附图得到更全面的揭示和详尽的描述，附图中同一标号指的是同一部件，此外其中：
图1是根据本发明形成的一塔式热管的前视图；
图2是图1所示塔式热管的透视截面图；
图3是图1和图2所示塔式热管的前视截面图；
图4是图2和图3所示塔式热管底部吸液芯局部放大示意图；
图5是图1-3所示热管底部设置的凹槽吸液芯局部特别放大示意图，显示在各槽脊之间是极薄的吸液芯结构；
图6是本发明形成的底部吸液芯及底部的端部示意图；
图7是本发明用于形成底部吸液芯的典型轴心的透视图。
具体实施方式
优选实施方式的说明应配合附图阅读，附图也被认为是本发明整个书面的说明书的一部分。附图并不必要成比例，而且本发明中的一些特征可能在比例上或一些示意形式上出于清楚和简要的目的而有些夸大。在本说明书中，相关词汇如“水平的”，“垂直的”，“上”，“下”，“顶”和“底”及其派生词汇(如：“水平地”，“向下地”，“向上地”等等)应参照随后的说明和进行讨论的附图所示的方向而解释。这些相关词汇是为了方便说明，通常并不一定要求精确的方向。包括“内部地”对应“外部地”，“纵向的”对应“横向的”，以及类似的表达，在被适当地解释为相对于彼此，或相对于一延长轴，或旋转中心或旋转轴。有关附设、接合和类似关系，诸如“连接”和“互相连接”，除非用其它方式表达，否则所指为一种关系，该关系中的结构是彼此之间直接或通过中间结构间接紧固或附设的，以及两个可移动或刚性的附设或关系。词汇“有效地连接”是如此一种附设、接合或连接，允许相关结构依靠这种关系而如所预期的那样运转。在权利要求书中，装置+功能从句用于涵盖书面说明书或附图所说明、暗示或明确显示的结构以实施书面所陈述的功能，不仅包括结构等同物，还包括等同结构。
参见图1和图2，本发明包括一塔式热管传散热器2，其被制成可传输由至少一个热能来源产生的热能的尺寸和形状，例如一半导体装置4的热能作为热能来源与塔式热管2的一部分热接合。热管2包括一主体6，一主体吸液芯8，一底部10，一底部吸液芯12，和鳍状物16。特别是主体6为一由高热导金属如铜或其合金，镍或其合金(铜镍组成的铜-镍合金)制成的圆柱管，并形成一整体结构，在设计及制作方法没有显著变化。蒸汽域由沿主体6纵轴方向延伸的中央通路18限定，主体6包括底端22和顶端25，底端22被密封为底部10的内表面23。顶端25是夹紧的或在构建过程中给液管26密封。鳍状物16可由任何传热材料制作，如铜，铝，或其它合金。
参见图2，主体吸液芯8优选由烧结的铜粉末或类似物构成，其分布于主体6的整个内表面限定中央通路18。尽管非首选，主体吸液芯8也可以包括毗邻的屏蔽层或烧结粉末结构，这些粉末颗粒之间有缝隙，平均厚度约0.1mm到1.0mm。另外，尤其在仅靠重力作用具体实施例中，中央通路18可以缺少部分或全部主体吸液芯。
参见图2-6，底部吸液芯12位于底部10的内表面23上面，通常在一成型的心轴32周围烧结的金属粉末30构成(图7)，并形成一烧结的凹槽结构。心轴32的槽脊35构成完整的底部吸液芯12的凹槽37，心轴32的凹槽40构成底部吸液芯12的槽脊42。每一槽脊42形成倒转的“V”字形或突出的金字塔形，并具有两倾斜侧壁44a，44b，并与临近的脊空间分开。凹槽37将槽脊42分开，平行排列成排在内表面23的一部分上延伸。凹槽37末端部分43接近主体6的底端22内表面，或与主体6以空间相隔。
有利的是，相对薄的烧结粉末层30沉积在底部10的内表面23上，以在每一凹槽37的底部和空间上隔开的槽脊42之间形成凹槽吸液芯45。当底部吸液芯12相对于主体6的底端22以内表面空间隔开的方式排列时，凹槽吸液芯45在凹槽37的末端部分43和主体6的内表面之间延伸。烧结粉末30可以从任何高热导材料中选择，适宜制作成多孔结构，如碳，钨，铜，铝，镁，镍，金，银，氧化铝，氧化铍，或其类似物，可以是球体，任意或规则多边形，或不同横截面细丝状的颗粒。例如，烧结铜粉末30沉积在槽脊42(并且在部分底部10上覆盖底部吸液芯12)，凹槽吸液芯45由平均厚度约为1到6倍平均铜颗粒直径构成(约0.005mm到0.5mm，优选范围0.05mm到0.25mm)，在底部10的内表面23及在底部槽脊42的两斜侧壁44a，44b之间的空间充分沉积。当然，其它吸液芯材料如铝-硅-碳化物或铜-硅-碳化物也可以产生相同效果。
重要的是，凹槽吸液芯45是足够薄，delta-T足够小，在内表面23和烧结粉末形成的吸液芯上足以阻止起始沸腾。凹槽吸液芯45是极薄的吸液芯结构通过槽脊42将空间隔开，该槽脊42为其提供横截面来维持工作流体高效流动。在脊42之间的凹槽吸液芯45的横截面具有最大可能(受毛细管限制条件限制)平面面积时，是其最优设计。该区域应该有一定厚度，如1至6个铜粉末直径。较薄的凹槽吸液芯45在实际制造的限制下就可以获得更好的性能，只要内表面23的表面至少有一层铜颗粒即可。这一薄吸液芯区域利用加强的蒸发表面的凹槽吸液芯层来限定凹槽吸液芯45厚度不能超过几个粉末颗粒。该结构已被发现超越了与现有技术相关的热传导限制。
应当理解，本发明不仅仅限于在此揭示和显示在附图中的具体构造，而且还包括在权利要求的范围内的任何改变和等同物。

Claims (11)

1、一种塔式热管，其包括：
一管，其具有至少部分覆盖有吸液芯的内表面、所述管内设置的工作流体、密封的第一端部和至少一个自所述管的外表面径向向外伸出的鳍状物；
一底部，其密封固定在所述管的第二端部，并且至少一部分内表面设置烧结的凹槽吸液芯；
所述烧结的凹槽吸液芯包括均获得有一平均颗粒直径的多个独立颗粒，并且包括至少两个槽脊，所述槽脊通过所述至少两个槽脊之间设置的颗粒层以液体互相联系，其中所述颗粒层包括至少一个不超过约六倍平均颗粒直径的维数。
2、根据权利要求1所述的塔式热管，其中所述的颗粒层包含约为三个平均颗粒直径的厚度。
3、根据权利要求1所述的塔式热管，其中所述的颗粒主要由铜构成。
4、根据权利要求1所述的塔式热管，其中所述的六倍平均颗粒直径是在从约0.05毫米至约0.25毫米的范围内。
5、一热管，其包括：
一管状外壳，其具有覆盖有一吸液芯并且第一端部密封的内表面；
一底部，其密封固定在所述管状外壳的第二端部，由此在所述外壳内形成一内表面；
一置于所述管状外壳内的工作流体；
至少一个鳍状物从所述管状外壳外表面径向向外伸出；以及
一烧结的凹槽吸液芯，其置于由所述底部形成所述内表面上，该烧结的凹槽吸液芯包括均获得有一平均颗粒直径的多个独立颗粒，并且包括至少两个槽脊，所述槽脊通过所述至少两个槽脊之间设置的颗粒层以液体互相联系，其中所述颗粒层包括至少一个不超过约六倍平均颗粒直径的维数。
6、根据权利要求5所述的热管，其中所述的颗粒层包含约小于三倍平均颗粒直径的厚度。
7、根据权利要求5所述的热管，其中所述的颗粒主要由铜构成。
8、根据权利要求5所述的热管，其中所述的六倍平均颗粒直径是在从约0.005毫米至约0.5毫米的范围内。
9、根据权利要求5所述的热管，其中所述的颗粒层在所述内表面上所述槽脊的一终端部分和所述外壳的临近部分之间伸展。
10、根据权利要求5所述的热管，其中所述的颗粒层是从包含碳，钨，铜，铝，镁，镍，金，银，氧化铝和氧化铍材料组中选出的一种来构成的。
11、一种塔式热管，其包括：
一管，其具有一内表面、一置于所述管中的工作流体，一密封的第一端部和至少一个自所述管的外表面径向向外伸出的鳍状物；
一底部，其密封固定在所述管的第二端部，并且至少一部分所述内表面设置烧结的凹槽吸液芯；
所述烧结的凹槽吸液芯包括均获得有一平均颗粒直径的多个独立颗粒，并且包括至少两个槽脊，所述槽脊通过所述至少两个槽脊之间设置的颗粒层以液体互相联系，其中所述颗粒层包括至少一个不超过约六倍平均颗粒直径的维数。
CNA2004800195447A 2003-07-14 2004-06-04 具有烧结槽状结构吸液芯的塔式散热器 Pending CN1820560A (zh)

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