CN1832212A - 具有增强热耗散的led安装 - Google Patents

具有增强热耗散的led安装 Download PDF

Info

Publication number
CN1832212A
CN1832212A CNA2005101150717A CN200510115071A CN1832212A CN 1832212 A CN1832212 A CN 1832212A CN A2005101150717 A CNA2005101150717 A CN A2005101150717A CN 200510115071 A CN200510115071 A CN 200510115071A CN 1832212 A CN1832212 A CN 1832212A
Authority
CN
China
Prior art keywords
led
substrate
heat
array
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2005101150717A
Other languages
English (en)
Other versions
CN1832212B (zh
Inventor
莫瑟林
谭思可
恩释文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Annwa hi tech GeneralIP (Singapore) Pte. Ltd.
Intellectual Discovery Co Ltd
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of CN1832212A publication Critical patent/CN1832212A/zh
Application granted granted Critical
Publication of CN1832212B publication Critical patent/CN1832212B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J43/00—Implements for preparing or holding food, not provided for in other groups of this subclass
    • A47J43/28—Other culinary hand implements, e.g. spatulas, pincers, forks or like food holders, ladles, skimming ladles, cooking spoons; Spoon-holders attached to cooking pots
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J45/00—Devices for fastening or gripping kitchen utensils or crockery
    • A47J45/06—Handles for hollow-ware articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Abstract

本发明公开了一种用于提高LED显示器的热耗散的系统和方法，其通过使用安装到LCD面板支撑结构的现有PCB封装从而排除了对金属核PCB的需求。在一个实施例中，使用具有热耗散垫的反向安装LED来优化到金属层的热传输，该金属层接着放置为与LCD支撑结构相接触。

Description

具有增强热耗散的LED安装
技术领域
本发明涉及用于提高LED显示器的热耗散的系统和方法。
背景技术
对于具有高功率(增强亮度)的LED的需求在增长。随着功率提高，对热耗散的需求也在增加，因为如果不有效地耗散由LED结产生的热，将减小LED的亮度。
目前，以安装到铝金属核PCB的表面安装LED封装的形式生产LED。金属核PCB用作将热从LED散走的直接散热器。由于用于金属核PCB的材料成本较高，所以使用金属核PCB相对昂贵。
发明内容
本发明公开了一种用于提高LED显示器的热耗散的系统和方法，其通过使用安装到LCD面板支撑结构的现有PCB封装从而排除了对金属核PCB的需求。在一个实施例中，使用具有热耗散垫的反向安装LED来优化到金属层的热传输，该金属层放置为与LCD支撑结构相接触。
附图说明
为更全面地理解本发明，结合附图对以下说明进行参考，附图中：
图1示出了单个LED和顶罩封装的一个实施例的立体图；
图2示出了移除LED的图1的LED封装的一个实施例；
图3A和图3B示出了沿着图2的截面线3A-3A所取的图1的单个LED封装的侧视图的实施例；
图4和图5分别示出了多个LED封装的俯视图和侧视图；
图6和图7示出了使用根据本公开的教导构造的LED条的显示器；
图8示出了使用光源的器件的一个可选实施例；
图9A示出了在器件的顶部和底部处具有其电连接的竖直结构光源的视图；和
图9B示出了在器件的顶部处具有其两个电连接的水平结构光源的视图。
具体实施方式
图1示出了包括配合到散热垫25的PCB衬底22的单个LED封装10的一个实施例的立体图。通过模制或其他方法在表面11之上构造光学顶罩12，表面11接着配合到衬底22。接触条23和24构造在衬底22的表面上并被如下将更详细讨论地使用。
图2示出了移除LED和光学顶罩12的封装10。LED芯片(或其他发光源)将通过端导接合剂或通过其他紧固装置在反射杯21内物理地附装到散热垫25。LED将接着分别被导线接合连接到接触条23和24的垫23-1和24-1，其用于随后连接到外部电路。源自LED的热路径通过可以是例如铜的散热垫25。注意，源自LED的热路径是垫25并与电路分离以优化从管芯到支持结构的热耗散。使用导热(但不导电)粘接电介质将LED安装到垫25。因为垫具有更广的表面面积，所以热耗散优于现有技术中的金属核PCB。
反射杯21构造为具有用于将LED侧光反射到封装顶部的优化角。使用例如浅色不透明材料形成反射杯。一旦LED与垫25配合，围绕LED浇注透明材料以密封LED和接合导线来形成完整的LED封装10。
光学顶罩12(图1)构造为将来自LED源的光导向在所期望的方向上。简单地通过重新设计顶罩形状可以如所期望地对于应用改变LED的光输出。
图3A示出了沿着图2的截面线3A-3A所取的LED封装10的截面剖视侧视图，其具有诸如LED 31之类的通过接合材料302物理地接合到热耗散垫25的光源。接合导线32将LED 31的一个端子连接到接触条24的接触垫24-1(图1)。LED 31的第二电端子通过路径33连接到接触垫23-1。可以使用任何电接触系统将LED 31连接到顶罩12外部的各个触头。在所示的该实施例中，有两个这样的引线，但如果需要可以有三个或更多。
图3B以剖视图示出了外部电能如何经由触头52和53连接到接触区域23-2和24-2。图2中示出了接触区域23-1、23-2、24-1、和24-2的位置。注意，这些触头可以是沿着接触条23、24的任何位置，只要其不干扰到LED的导线结合。图4示出了具有多个LED封装10-1至10-N的显示器40，其LED封装每个分别具有LED 12-1至12-N。围绕每个LED封装的是开口，例如在结构42中形成的开口42-1至42-N来允许来自各个LED的光传递通过。
图5是沿着图4的线5-5所取的显示器40的横截面，其示出了安装到安装板61的三个LED 12-1、12-2、12-3。(将参考图6更完全地描述安装板61。)图5所示的是形成在结构41的表面之下用于将控制和电能提供给各个LED的目的的触头52和53。这因而允许接触表面为了更好的电和热分离而在LED器件的顶侧上并远离热垫25。
图6示出了具有安装到热耗散棒63的多个LED条40的系统60，其热耗散棒63又接着连接到支持安装板61。如果需要，可以添加封盖62。封盖62可以具有透明的区域用于允许从外部看见LED光。
图7示出了沿着图6的截面线7-7所取的结构60的横截面。在图7中示出用于使光漫射或者以其他方式控制光的光漫射器和其他元件72、73。如果需要，这种控制可以是在个别的基础上。
图8示出了使用光源92的器件的一个可选实施例80，光源92在光源顶部上具有两条接合导线。由于如图9B所示的光源92的水平结构，这是可能的。在此实施例中粘接剂(或其他接合剂)802可以是兼有导热性和导电性两者。这因而允许使用焊接剂作为接合剂，其在一些情况下可以比仅有导热性更有效。
图9A示出了在器件的顶部和底部处具有其电连接的竖直结构光源91的视图。
图9B示出了在器件的顶部处具有其两个电连接的水平结构光源92的视图。注意，虽然所示只有两个电连接，但如果需要，可以使用任何数量，且此处讨论的概念可以用来自器件侧部的导体来起作用。
虽然已经详细讨论了本发明及其优点，应该理解的是此处可以进行各种变化、置换和改造而不偏离由所附权利要求界定的本发明的精神和范围。此外，本应用的范围不意味着限制于说明书中描述的处理、机器、制造、物质成分、手段、方法和步骤的特定实施例。正如本领域的普通技术人员将容易地从本发明的公开了解到，根据本发明可以利用现存的或将开发的与此处描述的对应实施例执行基本相同功能或实现基本相同结果的处理、机器、制造、物质成分、手段、方法或步骤。因此，所附权利要求意图将这些处理、机器、制造、物质成分、手段、方法或步骤包括在其范围内。

Claims (20)

1.一种LED组件，包括：
衬底，所述衬底具有形成其底部的散热垫；
LED，所述LED至少部分地安装在所述衬底上并使得所述LED的一部分与所述散热垫接触；和
在所述衬底的顶表面上的导线接合垫，所述导线接合垫电连接到所述LED。
2.如权利要求1所述的组件，还包括：
构造在所述衬底内的反射杯，所述LED定位在所述反射杯内。
3.如权利要求2所述的组件，其中所述LED的与所述散热垫接触的所述部分是设计为用于耗散来自所述LED的热的部分。
4.如权利要求2所述的组件，还包括：
覆盖所述LED和所述反射杯的光学顶罩。
5.如权利要求4所述的组件，其中所述光学顶罩是定位以覆盖所述顶表面的衬底的一部分。
6.如权利要求3所述组件，还包括：
定位在所述衬底之上的分离衬底，所述分离衬底具有用于与所述导线接合垫的至少一部分进行电接触的电触头；且
其中所述分离衬底在其中构造用于允许来自所述LED的光对观察者可见的装置。
7.如权利要求6所述的组件，还包括：
连接到所述散热垫的支撑结构。
8.如权利要求7所述的组件，其中PCB衬底包含全部与散热器接触的多个所述LED，且其中所述散热器与所述支撑结构接触。
9.如权利要求8所述的组件，其中所述分离衬底在其中构造用于允许来自所述多个LED的光对观察者可见的装置。
10.一种LED阵列，所述阵列包括：
具有构造在其中的反射杯的第一衬底，所述反射杯用于在其中安装所述LED；所述第一衬底具有附装到其的与所述LED中被安装的LED的第一表面相接触的导热层；所述第一衬底包括：
用于连接到所述LED中被安装的LED的电垫，定位所述电垫以连通来自配合衬底的电控制信号，所述配合衬底具有构造在其中的用于控制所述LED的控制电路；
所述LED阵列还包括：
与所述导热层电绝缘接触的导热支撑结构以传走从所述LED中被安装的LED的运行所产生的热。
11.如权利要求10所述的阵列，其中所述配合衬底包括：
用于允许来自所述LED中被安装的LED的光从所述配合衬底射离的多个光学顶罩，所述光从所述LED的第二表面放射。
12.如权利要求10所述的阵列，其中所述导热层是金属层。
13.如权利要求10所述的阵列，其中所述导热支撑结构是金属结构。
14.如权利要求10所述的阵列，其中所述导热支撑结构用导热电绝缘电介质配合到所述导热层。
15.构造LED阵列的方法，所述方法包括：
在第一衬底中构造用于在其中安装LED的反射区域，所述反射区域包含与所述第一衬底相接触的传热材料；和
在所述第一衬底的顶表面上构造用于与安装的LED的电触头相连接的接触垫，所述接触垫还具有用于与第二衬底上的电触头进行电接触的区域，所述第二衬底与所述第一衬底的所述顶表面接触。
16.如权利要求15所述的方法，还包括：
在所述反射区域内定位LED，使得所述LED的底表面与所述传热材料处于传热关系。
17.如权利要求16所述的方法，还包括：
在所述反射区域之上定位光顶罩以散射来自安装的LED的光。
18.如权利要求17所述的方法，还包括：
构造所述第一衬底的多个所述反射区域。
19.如权利要求18所述的方法，还包括：
安装多个所述第一衬底，每个具有在支撑结构上的多个反射区域以形成LED的矩阵阵列。
20.如权利要求17所述的方法，还包括：
在支撑结构上安装多个所述第一衬底以形成LED的阵列，从所述第二衬底控制所述阵列。
CN2005101150717A 2005-03-08 2005-11-25 Led组件及构造led组件的方法 Expired - Fee Related CN1832212B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/075,094 US7262438B2 (en) 2005-03-08 2005-03-08 LED mounting having increased heat dissipation
US11/075,094 2005-03-08

Publications (2)

Publication Number Publication Date
CN1832212A true CN1832212A (zh) 2006-09-13
CN1832212B CN1832212B (zh) 2010-05-05

Family

ID=36241161

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005101150717A Expired - Fee Related CN1832212B (zh) 2005-03-08 2005-11-25 Led组件及构造led组件的方法

Country Status (7)

Country Link
US (1) US7262438B2 (zh)
JP (1) JP2006253689A (zh)
KR (1) KR20060096948A (zh)
CN (1) CN1832212B (zh)
DE (1) DE102005057447A1 (zh)
GB (1) GB2424124B (zh)
TW (1) TW200632443A (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102197501A (zh) * 2008-10-21 2011-09-21 K.M.W.株式会社 多芯片led封装
CN101728370B (zh) * 2008-10-29 2011-12-21 展晶科技(深圳)有限公司 化合物半导体元件的封装模块结构及其制造方法
TWI420695B (zh) * 2008-10-21 2013-12-21 Advanced Optoelectronic Tech 化合物半導體元件之封裝模組結構及其製造方法
CN103557464A (zh) * 2013-11-15 2014-02-05 东莞市驰明电子科技有限公司 可多面贴装式贴片led支架及led灯、led灯具
CN103780847A (zh) * 2012-10-24 2014-05-07 霍尼韦尔国际公司 基于板上芯片的高度集成的成像器
CN104838508A (zh) * 2012-12-10 2015-08-12 勒克斯维科技公司 发光器件反射隔堤结构
CN106887426A (zh) * 2011-06-29 2017-06-23 Lg伊诺特有限公司 发光器件封装件及包括其的光单元
US10789435B2 (en) 2014-03-07 2020-09-29 Hand Held Products, Inc. Indicia reader for size-limited applications

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
CN100517738C (zh) * 2005-07-15 2009-07-22 鸿富锦精密工业（深圳）有限公司 影像感测芯片的封装结构
US7910943B2 (en) * 2005-11-01 2011-03-22 Nexxus Lighting, Inc. Light emitting diode fixture and heat sink
TWI333571B (en) * 2005-11-11 2010-11-21 Coretronic Corp Backlight module
KR101237788B1 (ko) * 2005-12-29 2013-02-28 엘지디스플레이 주식회사 엘이디 발광유닛 및 엘이디 백라이트어셈블리와액정표시장치모듈
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
TW200742113A (en) * 2006-04-20 2007-11-01 San-Bao Lin Package structure of light-emitting device
US20070295969A1 (en) * 2006-06-26 2007-12-27 Tong-Fatt Chew LED device having a top surface heat dissipator
DE102006048230B4 (de) * 2006-10-11 2012-11-08 Osram Ag Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung
KR100836488B1 (ko) 2006-11-09 2008-06-09 삼성에스디아이 주식회사 휴대용 표시장치
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
TWI344708B (en) * 2007-04-30 2011-07-01 Jin Chyuan Biar Package structure of lighting element and lighting device thereof
CN201228949Y (zh) * 2007-07-18 2009-04-29 胡凯 一种led灯散热灯体
KR101320514B1 (ko) * 2007-08-21 2013-10-22 삼성전자주식회사 칩-온-보드 방식에 의한 ｌｅｄ 패키지
US20090073700A1 (en) * 2007-09-13 2009-03-19 Cruickshank William T Light Emitting Diode Package Assembly
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
WO2009065106A2 (en) * 2007-11-15 2009-05-22 Starkey Carl R Light system and method to thermally manage an led lighting system
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US8143631B2 (en) * 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
US8410720B2 (en) 2008-04-07 2013-04-02 Metrospec Technology, LLC. Solid state lighting circuit and controls
KR100989516B1 (ko) 2008-07-01 2010-10-25 주식회사 디에스엘시디 발광다이오드 패키지 및 이를 이용하는 백라이트 유닛
DE102008039364A1 (de) * 2008-08-22 2010-03-04 Osram Gesellschaft mit beschränkter Haftung Halbleiter-Leuchtvorrichtung
CA2647428A1 (en) * 2008-12-17 2010-05-27 Eagle Eye Lighting Ltd. Heat dissipating led street light
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8096671B1 (en) 2009-04-06 2012-01-17 Nmera, Llc Light emitting diode illumination system
US20100321282A1 (en) * 2009-06-18 2010-12-23 Himax Display, Inc. Display module
CN102062320A (zh) * 2010-12-16 2011-05-18 西安炬光科技有限公司 一种带光学整形的led光源模块及其制备方法
US9339146B2 (en) 2011-04-14 2016-05-17 Prince Castle LLC Universal food holding cabinet with buttoned-in escutcheons
CN102364684B (zh) * 2011-06-17 2017-02-08 杭州华普永明光电股份有限公司 一种led模组及其制造工艺
TWI464868B (zh) * 2011-09-14 2014-12-11 Lextar Electronics Corp 固態光源模組及固態光源陣列
US9029880B2 (en) 2012-12-10 2015-05-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines
US9159700B2 (en) 2012-12-10 2015-10-13 LuxVue Technology Corporation Active matrix emissive micro LED display
US20160329173A1 (en) 2013-06-12 2016-11-10 Rohinni, LLC Keyboard backlighting with deposited light-generating sources
US9111464B2 (en) 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
US9464781B1 (en) 2015-04-08 2016-10-11 Haier Us Appliance Solutions, Inc. User interface assembly for an appliance
WO2017124109A1 (en) 2016-01-15 2017-07-20 Rohinni, LLC Apparatus and method of backlighting through a cover on the apparatus
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211374A (ja) 1992-01-06 1993-08-20 Nec Corp 光半導体装置の製造方法
US6633120B2 (en) * 1998-11-19 2003-10-14 Unisplay S.A. LED lamps
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
JP2002043632A (ja) 2000-07-21 2002-02-08 Citizen Electronics Co Ltd 発光ダイオード
US6509941B2 (en) 2001-03-22 2003-01-21 Eastman Kodak Company Light-producing display having high aperture ratio pixels
US6874910B2 (en) * 2001-04-12 2005-04-05 Matsushita Electric Works, Ltd. Light source device using LED, and method of producing same
JP4045781B2 (ja) * 2001-08-28 2008-02-13 松下電工株式会社 発光装置
US6480389B1 (en) * 2002-01-04 2002-11-12 Opto Tech Corporation Heat dissipation structure for solid-state light emitting device package
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
JP4360858B2 (ja) * 2003-07-29 2009-11-11 シチズン電子株式会社 表面実装型ｌｅｄ及びそれを用いた発光装置
US20050077616A1 (en) 2003-10-09 2005-04-14 Ng Kee Yean High power light emitting diode device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420695B (zh) * 2008-10-21 2013-12-21 Advanced Optoelectronic Tech 化合物半導體元件之封裝模組結構及其製造方法
CN102197501A (zh) * 2008-10-21 2011-09-21 K.M.W.株式会社 多芯片led封装
CN101728370B (zh) * 2008-10-29 2011-12-21 展晶科技(深圳)有限公司 化合物半导体元件的封装模块结构及其制造方法
US10147857B2 (en) 2011-06-29 2018-12-04 Lg Innotek Co., Ltd. Light emitting device package and light unit including the same
US10559734B2 (en) 2011-06-29 2020-02-11 Lg Innotek Co., Ltd. Light emitting device package and light unit including the same
CN106887426B (zh) * 2011-06-29 2019-12-10 Lg伊诺特有限公司 发光器件封装件及包括其的光单元
CN106887426A (zh) * 2011-06-29 2017-06-23 Lg伊诺特有限公司 发光器件封装件及包括其的光单元
CN103780847A (zh) * 2012-10-24 2014-05-07 霍尼韦尔国际公司 基于板上芯片的高度集成的成像器
US10769393B2 (en) 2012-10-24 2020-09-08 Honeywell International Inc. Chip on board based highly integrated imager
US10043784B2 (en) 2012-12-10 2018-08-07 Apple Inc. Light emitting device reflective bank structure
CN104838508A (zh) * 2012-12-10 2015-08-12 勒克斯维科技公司 发光器件反射隔堤结构
US10784236B2 (en) 2012-12-10 2020-09-22 Apple Inc. Light emitting device reflective bank structure
US11373986B2 (en) 2012-12-10 2022-06-28 Apple Inc. Light emitting device reflective bank structure
US11916048B2 (en) 2012-12-10 2024-02-27 Apple Inc. Light emitting device reflective bank structure
CN103557464A (zh) * 2013-11-15 2014-02-05 东莞市驰明电子科技有限公司 可多面贴装式贴片led支架及led灯、led灯具
US10789435B2 (en) 2014-03-07 2020-09-29 Hand Held Products, Inc. Indicia reader for size-limited applications
US11531825B2 (en) 2014-03-07 2022-12-20 Hand Held Products, Inc. Indicia reader for size-limited applications

Also Published As

Publication number Publication date
GB2424124B (en) 2010-10-27
TW200632443A (en) 2006-09-16
KR20060096948A (ko) 2006-09-13
CN1832212B (zh) 2010-05-05
US7262438B2 (en) 2007-08-28
GB2424124A (en) 2006-09-13
DE102005057447A1 (de) 2006-09-14
GB0604614D0 (en) 2006-04-19
JP2006253689A (ja) 2006-09-21
US20060202210A1 (en) 2006-09-14

Similar Documents

Publication Publication Date Title
CN1832212A (zh) 具有增强热耗散的led安装
RU2518198C2 (ru) Светоизлучающее устройство
CN105720181B (zh) 用于通用光照的led导线框架阵列
US8075152B2 (en) Hermetic light-emitting device
CN201187696Y (zh) Led照明阵列的柔性线路板
US7538356B2 (en) Combination assembly of LED and liquid-vapor thermally dissipating device
US8998463B2 (en) Light-emitting apparatus and automotive headlamps
CN103119357A (zh) 电路模块、发光模块及车辆用灯具
CN101963336A (zh) 用于辐射发光二极管的热量的装置及使用其的液晶显示器
JP5842145B2 (ja) 構造体および構造体を備える照明装置
JP2008294438A (ja) 発光ダイオードパッケージ
KR102556681B1 (ko) 고휘도 발광 디바이스들을 위한 주변 히트 싱크 배열
CN202182365U (zh) 一种led灯条、侧光式背光模组及显示器
CN101251969A (zh) 二极管点距阵/数码管的高导热反射盖及其封装结构
CN103430339A (zh) 基板、发光装置以及照明装置
CN101737672A (zh) 发光模块以及照明装置
JP2011159447A (ja) 照明装置
CN201149869Y (zh) 一种led封装结构
CN201688160U (zh) 一种基于金属芯pcb基板的led光源模块
CN100352072C (zh) 发光二极管光源组件
KR20100127623A (ko) 발광 다이오드 패키지 및 백라이트 유닛
CN100527455C (zh) 发光体封装装置
JP2006147214A (ja) 照明装置
CN212113750U (zh) 半导体发光器件
CN2831425Y (zh) 一种半导体封装结构

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20061124

Address after: Singapore Singapore

Applicant after: ANHUA HIGH TECHNOLOGY ECBUIP (SINGAPORE) PRIVATE Ltd.

Address before: Singapore Singapore

Applicant before: Avago Technologies General IP (Singapore) Pte. Ltd.

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: YINGDI CO., LTD.

Effective date: 20130619

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20130619

Address after: Seoul, South Kerean

Patentee after: INTELLECTUAL DISCOVERY Co.,Ltd.

Address before: Singapore Singapore

Patentee before: Annwa hi tech GeneralIP (Singapore) Pte. Ltd.

Effective date of registration: 20130619

Address after: Singapore Singapore

Patentee after: Annwa hi tech GeneralIP (Singapore) Pte. Ltd.

Address before: Singapore Singapore

Patentee before: ANHUA HIGH TECHNOLOGY ECBUIP (SINGAPORE) PRIVATE Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100505

Termination date: 20191125

CF01 Termination of patent right due to non-payment of annual fee