CN1849547A - 用于mems制造的薄膜先驱堆叠 - Google Patents

用于mems制造的薄膜先驱堆叠 Download PDF

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CN1849547A
CN1849547A CNA200480020729XA CN200480020729A CN1849547A CN 1849547 A CN1849547 A CN 1849547A CN A200480020729X A CNA200480020729X A CN A200480020729XA CN 200480020729 A CN200480020729 A CN 200480020729A CN 1849547 A CN1849547 A CN 1849547A
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CN100578287C (zh
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马克·W·迈尔斯
布莱恩·J·加利
克拉伦斯·徐
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Qualcomm MEMS Technologies Inc
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IDC LLC
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349Creating layers of material on a substrate
    • B81C1/0038Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/04Optical MEMS
    • B81B2201/047Optical MEMS not provided for in B81B2201/042 - B81B2201/045

Abstract

本发明提供一种用于产生MEMS(Micro-electromechanical systems)装置的先驱薄膜堆叠(precursorfilm stack)。所述先驱薄膜堆叠包含:一载体基板、一形成于所述载体基板上的第一层、一形成于所述第一层上的一绝缘体材料的第二层和一形成于所述第二层上的一牺牲材料的第三层。

Description

用于MEMS制造的薄膜先驱堆叠
技术领域
本发明大体上是关于微机电系统(MEMS)装置的制造方法,且更具体的是关于干涉测量调节器的制造。
背景技术
干涉测量调节器是MEMS(微机电系统)装置中的一种类别,其在各种专利中已有所描述和证明,所述专利包括:美国专利第5,835,255、5,986,796、6,040,937、6,055,090号;及申请中的美国专利申请案第09/966,843、09/974,544、10/082,397、10/084,893号和第10/878,282号,所述文献以引用的方式并入本文中。这些装置的关键特性之一为其是使用类似半导体的制造方法来加以整体制造的事实。具体而言,使用各种技术以结合薄膜沉积、光微影和蚀刻的步骤顺序来制造这些装置。更多关于这些方法的细节描述于2002年2月12日申请的专利申请案第10/074,562号中,且将所述文献以引入的方式并入本文中。
发明内容
附图说明
图1展示集成MEMS加工设备的方块图;
图2展示非集成MEMS加工设备的方块图;
图3展示可使用本发明的先驱堆叠来制造的MEMS装置的方块图;且
图4A至4F根据不同实施例展示本发明的先驱堆叠的方块图。
具体实施方式
在对本发明实施例的以下详细描述中,陈述了许多诸如特定材料、机器和方法的实例的具体细节以便提供对本发明的全面了解。然而,所属领域的技术人员应了解无需采用这些具体细节来实践本发明。在其它实例中,未详细描述熟知的材料、机器或方法以避免对本发明不必要的混淆。
制造MEMS装置的方法的共同特征为其始于薄膜堆叠的沉积,此对于所述装置的操作与随后的制造至关紧要。这些先驱薄膜适用于制造包括干涉测量调节器的广泛种类的MEMS装置,且其沉积可作为制造MEMS装置的大型加工的一部分而发生。在本发明的一实施例中,将薄膜分别沉积于一单机设备中以形成一先驱堆叠,接着将所述先驱堆叠送至完成加工的多机设备。主要益处是可将所述单机设备最优化以便以非常高的生产量生产这些薄膜或先驱堆叠,这是在集成工厂即实施沉积与后沉积加工的工厂中考虑到规模经济不可能实现的高生产量。此外,由于在单机设备方面的先驱堆叠技术发生发展,所以需要执行随后加工步骤的实体面临较低的进入技术障碍。
以引用的方式并入本文中的专利申请案第10/074,562号描述了建造干涉测量调节器的原型制造顺序。通常,干涉测量调节器制造顺序和顺序种类因为其简单性和成本效益而引人关注。这大部分是由于使用物理气相沉积(PVD)技术来沉积所有薄膜的事实,其中溅镀为优选和费用最低的方法。简单性部分源自一事实,即所有干涉测量调节器结构和实际上许多其它平面MEMS结构通过其需要低电极、防止短路的绝缘结构、牺牲材料和可驱动或可移动结构这一事实而密切联系。绝缘结构与薄膜的不同之处在于:其在形式上不连续,但是通过机械方式能够防止经由其主体的电接触。此事实呈现一机会,即这些薄膜子组,包含一个或一个以上低电极的先驱堆叠、绝缘结构、牺牲层和可选的可驱动结构可被分别制造且先于所述驱动结构。
附图中的图1提供集成MEMS制造设备102的方块图。先驱薄膜沉积工具100包含单一或系列沉积工具,其经配置以使用一种或一种以上沉积技术来沉积这些薄膜,例如溅镀。所述薄膜沉积于一合适的载体基板上,例如取决于应用所述基板可为玻璃或塑料,且随后将其输送至显微机械加工回路104。在此,且如前述专利申请案中所描述,执行诸如蚀刻、图案化和沉积的重复步骤顺序并用来界定MEMS装置的可驱动结构。
附图中的图2展示非集成MEMS加工设备。参看图2,先驱设备200仅含有一先驱薄膜沉积工具100,其等同于图1中所描述的先驱薄膜沉积工具,因此使用相同的参考数字。设备200能够提供不同的先驱薄膜类型和基板尺寸。在沉积之后,将基板用集装箱封装并装运以适合于由参考数字202所指示的一个或一个以上加工设备。接着这些设备执行如设计产生的特定MEMS产品所需的机械加工步骤。
图3展示可使用本发明的先驱堆叠来制造的一简单MEMS装置的示意性图。在此情况下,将可驱动隔膜304支承于柱306上。薄膜302包含至少提供低电极和绝缘结构的材料,但是可并入其它将加以论述的功能。整个装配位于基板300上。
附图中的图4A至4F展示根据本发明不同实施例的先驱堆叠的方块图。在图4A至4F中,已使用相同参考数字以识别相同或类似的部件/组件。
图4B展示包括导体堆叠或结构404、绝缘体层406和牺牲材料层408的通用化先驱堆叠400A的方块图。所有薄膜位于基板402上。导体堆叠404可包含:单一金属、导电氧化物或聚合物、氟化物、硅化物或这些材料的组合。导电堆叠的精确成分决定于待制造的MEMS装置的必需电极性质。绝缘体408可为各种绝缘材料中的任何一种或组合,所述绝缘材料包括(但不限于):氧化物、聚合物、氟化物、陶瓷和氮化物。牺牲材料408可包括(例如)均可通过XeF2蚀刻的诸如硅、钼或钨的单层材料,其中XeF2为已于先前专利中描述的加工蚀刻气体。其它可能材料受支配于蚀刻介质与必须保留的材料和结构的相容性。厚度根据最终装置的必需性能而改变。
图4B展示经设计以用于制造干涉测量调节器装置的先驱堆叠400B的方块图。堆叠400B包括导体堆叠404,其组成以上已描述。在目前情况下用于导体堆叠404的合适金属包括诸如铬、钨、钼或其合金的有光泽的金属。导体堆叠404可具有高达150埃的厚度。适用于导体堆叠404的透明导体包括氧化铟锡(ITO)、氧化锌(ZnO)和氮化钛(TIN)。所述透明导体的典型厚度在100到800埃的范围内变化。在一实施例中,导体堆叠404位于透明补偿氧化层410上。所述氧化层410可具有诸如氧化锆(ZrO2)或二氧化铪(HfO2)的金属氧化物,其具有可见区内的有限消光系数。所述补偿氧化层410为用于此专利申请案中所论述的所有设计的可选薄膜。氧化层410的典型厚度在100到800埃的范围内变化。应注意导体堆叠404与补偿氧化层410的位置是可互换的,对此仅在光学性能上有细微改变。然而,可将此设计认为是嵌入式光学薄膜设计,因为起到主要光学功能的金属位于相反于牺牲层408一侧的绝缘体层406侧面上。尽管其它厚度适用于不同干涉调节器操作模式,但是为了优良黑色状态,绝缘体层406可包含厚度为280到840埃的二氧化硅薄膜。其它氧化物或氧化物的组合同样可能。牺牲层408可包括(例如)均可通过XeF2蚀刻的诸如硅、钼、钨的单层材料,此加工蚀刻气体已于先前专利中描述。对于堆叠400B,层408的厚度可从1000到7000埃变化。
图4C展示根据另一实施例的先驱堆叠400C的方块图。在此情况下,导体堆叠404不执行任何光学功能。而是一独立光学薄膜412执行光学功能。光学薄膜412与导体堆叠404由绝缘体薄膜或结构414所隔开。此设计使得在驱动可驱动隔膜时达成高品质的白色状态。在此情况下,光学薄膜412不用作导体。透明导体堆叠404充当导体。在某些实施例中,图4C中未展示但是类似于图4B中的绝缘体层406的辅助绝缘体薄膜或结构可位于牺牲层408与光学薄膜412之间。对于此设计,绝缘体薄膜或结构的厚度可小于100埃。
图4D展示已知为埋入式光学薄膜设计的先驱堆叠的实施例400D。在此情况下,光学薄膜412位于光学补偿薄膜410之上,其位于绝缘体薄膜/结构406之下。透明导体薄膜或薄膜堆叠404跟随其后且以另外的氧化层416和牺牲薄膜层408覆盖。堆叠400D的一优势为其允许光学薄膜412与机械薄膜之间的有效光学距离较大,同时允许驱动电压保持较小。这是因为驱动电压显著决定于导体与可驱动隔膜之间的距离。
图4E展示包括代替单层牺牲薄膜而并入的多层蚀刻停止堆叠418的先驱堆叠400E。此418堆叠提供用于预先界定有待于随后微机械加工过程中界定的多个可驱动结构的高度的便利方式。在一实施例中,所述堆叠418包含至少两种材料,可使用相同释放蚀刻来蚀刻所述两种材料,但是能利用可选的和不同的蚀刻化学性质以使得一种材料可充当另一种材料的蚀刻停止剂。一实例将为均可于XeF2中蚀刻的钼与硅的组合。然而,可使用基于磷的湿式蚀刻剂蚀刻钼而不腐蚀硅;且可使用四甲基氢氧化铵(TMMA)蚀刻硅而不蚀刻钼。存在许多其它组合且可由所属领域的技术人员对其进行鉴定且加以开发利用。此外,应注意所述蚀刻停止堆叠可代替单一牺牲层应用于任何先前确定的先驱堆叠。
附图中的图4F展示先驱堆叠的实施例400F。所述先驱堆叠400F包括机械结构材料420。使用适当的微机械加工技术和顺序,可使用仅使用图案化和蚀刻的先驱堆叠400F来制造功能性MEM装置。为此,在先驱堆叠400F的后加工过程中无需沉积。此意谓诸如设备202(参看图2)的后加工设备不需要在沉积工具方面的资本投资。材料420可包含许多材料,包括(但不限于)金属、聚合物、氧化物和其组合,所述材料的应力可加以控制。

Claims (16)

1.一种制造一MEMS装置的方法,所述方法包含:
加工一预先制造的薄膜堆叠以界定所述MEMS装置。
2.根据权利要求1所述的方法,其中所述预先制造的薄膜堆叠至少包含:一导体材料的一第一层、一绝缘体材料的一第二层和一牺牲材料的一第三层。
3.根据权利要求1所述的方法,其中所述加工包含从蚀刻、图案化和沉积组成的群组中选出的操作。
4.一种用于产生MEMS装置的先驱薄膜堆叠,所述先驱薄膜堆叠包含:
一载体基板;
一形成于所述载体基板上的第一层;
一形成于所述第一层上的一绝缘体材料的第二层;和
一形成于所述第二层上的一牺牲材料的第三层。
5.根据权利要求4所述的堆叠,其中所述第一层、所述第二层和所述第三层是使用一沉积技术来形成。
6.根据权利要求4所述的堆叠,其中所述第一层具有一从单一金属、导电氧化物、氟化物、硅化物和导电聚合物组成的群组中选出的导电材料。
7.根据权利要求4所述的堆叠,其中所述绝缘体材料是从氧化物、聚合物、氟化物、陶瓷和氮化物组成的群组中选出。
8.根据权利要求4所述的堆叠,其中所述牺牲材料是可使用一二氟化氙气体来蚀刻的。
9.根据权利要求4所述的堆叠,其中所述牺牲材料是从硅、钼和钨组成的群组中选出。
10.根据权利要求4所述的堆叠,其进一步包含一沉积于所述第一层与所述载体基板之间的光学补偿层,所述光学补偿层包括一具有一有限消光系数的材料。
11.根据权利要求10所述的堆叠,其中所述光学补偿层包括从氧化锆、二氧化铪、氧化物、氮化物和氟化物组成的群组中选出的材料。
12.根据权利要求4所述的堆叠,其中所述第一层包含复数个子层,至少一些所述子层具有一导电材料。
13.根据权利要求12所述的堆叠,其中距离所述载体基板最远的子层是不导电的且界定一光学层。
14.根据权利要求4所述的堆叠,其进一步包含一沉积于所述第二层与所述第三层之间的光学层。
15.根据权利要求4所述的堆叠,其中所述第三层包含至少两个子层,每一子层与另一子层交替,其中每一子层可通过相同释放蚀刻剂来蚀刻,但是每一子层具有不同的蚀刻化学性质以使得所述子层界定彼此的蚀刻停止。
16.根据权利要求15所述的堆叠,其中所述第三层包括一与一硅子层交替的钼子层。
CN200480020729A 2003-06-24 2004-06-23 用于mems制造的薄膜先驱堆叠 Expired - Fee Related CN100578287C (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104098065A (zh) * 2013-04-12 2014-10-15 国际商业机器公司 微电子机械系统(mems)结构和设计结构

Families Citing this family (167)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6674562B1 (en) 1994-05-05 2004-01-06 Iridigm Display Corporation Interferometric modulation of radiation
US8014059B2 (en) * 1994-05-05 2011-09-06 Qualcomm Mems Technologies, Inc. System and method for charge control in a MEMS device
US7532377B2 (en) * 1998-04-08 2009-05-12 Idc, Llc Movable micro-electromechanical device
US8928967B2 (en) 1998-04-08 2015-01-06 Qualcomm Mems Technologies, Inc. Method and device for modulating light
KR100703140B1 (ko) 1998-04-08 2007-04-05 이리다임 디스플레이 코포레이션 간섭 변조기 및 그 제조 방법
US8023724B2 (en) * 1999-07-22 2011-09-20 Photon-X, Inc. Apparatus and method of information extraction from electromagnetic energy based upon multi-characteristic spatial geometry processing
WO2003007049A1 (en) 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
TW200413810A (en) * 2003-01-29 2004-08-01 Prime View Int Co Ltd Light interference display panel and its manufacturing method
US7417782B2 (en) 2005-02-23 2008-08-26 Pixtronix, Incorporated Methods and apparatus for spatial light modulation
TW570896B (en) 2003-05-26 2004-01-11 Prime View Int Co Ltd A method for fabricating an interference display cell
US7221495B2 (en) * 2003-06-24 2007-05-22 Idc Llc Thin film precursor stack for MEMS manufacturing
TW593126B (en) * 2003-09-30 2004-06-21 Prime View Int Co Ltd A structure of a micro electro mechanical system and manufacturing the same
US7161728B2 (en) * 2003-12-09 2007-01-09 Idc, Llc Area array modulation and lead reduction in interferometric modulators
US7706050B2 (en) 2004-03-05 2010-04-27 Qualcomm Mems Technologies, Inc. Integrated modulator illumination
US7476327B2 (en) 2004-05-04 2009-01-13 Idc, Llc Method of manufacture for microelectromechanical devices
US7164520B2 (en) 2004-05-12 2007-01-16 Idc, Llc Packaging for an interferometric modulator
WO2006014929A1 (en) * 2004-07-29 2006-02-09 Idc, Llc System and method for micro-electromechanical operating of an interferometric modulator
US7499208B2 (en) * 2004-08-27 2009-03-03 Udc, Llc Current mode display driver circuit realization feature
US7889163B2 (en) 2004-08-27 2011-02-15 Qualcomm Mems Technologies, Inc. Drive method for MEMS devices
US7843410B2 (en) 2004-09-27 2010-11-30 Qualcomm Mems Technologies, Inc. Method and device for electrically programmable display
US7532195B2 (en) 2004-09-27 2009-05-12 Idc, Llc Method and system for reducing power consumption in a display
US7136213B2 (en) 2004-09-27 2006-11-14 Idc, Llc Interferometric modulators having charge persistence
US20060065622A1 (en) * 2004-09-27 2006-03-30 Floyd Philip D Method and system for xenon fluoride etching with enhanced efficiency
US7355780B2 (en) 2004-09-27 2008-04-08 Idc, Llc System and method of illuminating interferometric modulators using backlighting
US7372613B2 (en) 2004-09-27 2008-05-13 Idc, Llc Method and device for multistate interferometric light modulation
US7893919B2 (en) 2004-09-27 2011-02-22 Qualcomm Mems Technologies, Inc. Display region architectures
US7130104B2 (en) 2004-09-27 2006-10-31 Idc, Llc Methods and devices for inhibiting tilting of a mirror in an interferometric modulator
US7302157B2 (en) * 2004-09-27 2007-11-27 Idc, Llc System and method for multi-level brightness in interferometric modulation
US7719500B2 (en) 2004-09-27 2010-05-18 Qualcomm Mems Technologies, Inc. Reflective display pixels arranged in non-rectangular arrays
US7612932B2 (en) * 2004-09-27 2009-11-03 Idc, Llc Microelectromechanical device with optical function separated from mechanical and electrical function
US8878825B2 (en) 2004-09-27 2014-11-04 Qualcomm Mems Technologies, Inc. System and method for providing a variable refresh rate of an interferometric modulator display
US7653371B2 (en) 2004-09-27 2010-01-26 Qualcomm Mems Technologies, Inc. Selectable capacitance circuit
US7527995B2 (en) 2004-09-27 2009-05-05 Qualcomm Mems Technologies, Inc. Method of making prestructure for MEMS systems
US7564612B2 (en) 2004-09-27 2009-07-21 Idc, Llc Photonic MEMS and structures
US7701631B2 (en) 2004-09-27 2010-04-20 Qualcomm Mems Technologies, Inc. Device having patterned spacers for backplates and method of making the same
US7630119B2 (en) 2004-09-27 2009-12-08 Qualcomm Mems Technologies, Inc. Apparatus and method for reducing slippage between structures in an interferometric modulator
US7289259B2 (en) 2004-09-27 2007-10-30 Idc, Llc Conductive bus structure for interferometric modulator array
US7808703B2 (en) 2004-09-27 2010-10-05 Qualcomm Mems Technologies, Inc. System and method for implementation of interferometric modulator displays
US8008736B2 (en) 2004-09-27 2011-08-30 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device
US7936497B2 (en) 2004-09-27 2011-05-03 Qualcomm Mems Technologies, Inc. MEMS device having deformable membrane characterized by mechanical persistence
US7710629B2 (en) 2004-09-27 2010-05-04 Qualcomm Mems Technologies, Inc. System and method for display device with reinforcing substance
US7668415B2 (en) 2004-09-27 2010-02-23 Qualcomm Mems Technologies, Inc. Method and device for providing electronic circuitry on a backplate
US8124434B2 (en) 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7583429B2 (en) 2004-09-27 2009-09-01 Idc, Llc Ornamental display device
US7813026B2 (en) 2004-09-27 2010-10-12 Qualcomm Mems Technologies, Inc. System and method of reducing color shift in a display
US7675669B2 (en) 2004-09-27 2010-03-09 Qualcomm Mems Technologies, Inc. Method and system for driving interferometric modulators
US7684104B2 (en) 2004-09-27 2010-03-23 Idc, Llc MEMS using filler material and method
US7304784B2 (en) 2004-09-27 2007-12-04 Idc, Llc Reflective display device having viewable display on both sides
US7920135B2 (en) 2004-09-27 2011-04-05 Qualcomm Mems Technologies, Inc. Method and system for driving a bi-stable display
US7916103B2 (en) 2004-09-27 2011-03-29 Qualcomm Mems Technologies, Inc. System and method for display device with end-of-life phenomena
US20060176241A1 (en) * 2004-09-27 2006-08-10 Sampsell Jeffrey B System and method of transmitting video data
US7424198B2 (en) 2004-09-27 2008-09-09 Idc, Llc Method and device for packaging a substrate
US7420725B2 (en) 2004-09-27 2008-09-02 Idc, Llc Device having a conductive light absorbing mask and method for fabricating same
US7724993B2 (en) 2004-09-27 2010-05-25 Qualcomm Mems Technologies, Inc. MEMS switches with deforming membranes
US8310441B2 (en) 2004-09-27 2012-11-13 Qualcomm Mems Technologies, Inc. Method and system for writing data to MEMS display elements
US7679627B2 (en) 2004-09-27 2010-03-16 Qualcomm Mems Technologies, Inc. Controller and driver features for bi-stable display
US7944599B2 (en) * 2004-09-27 2011-05-17 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
US7321456B2 (en) 2004-09-27 2008-01-22 Idc, Llc Method and device for corner interferometric modulation
US20060076634A1 (en) 2004-09-27 2006-04-13 Lauren Palmateer Method and system for packaging MEMS devices with incorporated getter
US7692839B2 (en) 2004-09-27 2010-04-06 Qualcomm Mems Technologies, Inc. System and method of providing MEMS device with anti-stiction coating
US9229222B2 (en) 2005-02-23 2016-01-05 Pixtronix, Inc. Alignment methods in fluid-filled MEMS displays
US7675665B2 (en) 2005-02-23 2010-03-09 Pixtronix, Incorporated Methods and apparatus for actuating displays
US9158106B2 (en) 2005-02-23 2015-10-13 Pixtronix, Inc. Display methods and apparatus
US8310442B2 (en) 2005-02-23 2012-11-13 Pixtronix, Inc. Circuits for controlling display apparatus
US7999994B2 (en) 2005-02-23 2011-08-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US20070205969A1 (en) 2005-02-23 2007-09-06 Pixtronix, Incorporated Direct-view MEMS display devices and methods for generating images thereon
US8159428B2 (en) 2005-02-23 2012-04-17 Pixtronix, Inc. Display methods and apparatus
US7746529B2 (en) 2005-02-23 2010-06-29 Pixtronix, Inc. MEMS display apparatus
US8519945B2 (en) 2006-01-06 2013-08-27 Pixtronix, Inc. Circuits for controlling display apparatus
US9261694B2 (en) 2005-02-23 2016-02-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US9082353B2 (en) 2010-01-05 2015-07-14 Pixtronix, Inc. Circuits for controlling display apparatus
US8482496B2 (en) 2006-01-06 2013-07-09 Pixtronix, Inc. Circuits for controlling MEMS display apparatus on a transparent substrate
US7755582B2 (en) 2005-02-23 2010-07-13 Pixtronix, Incorporated Display methods and apparatus
US7742016B2 (en) 2005-02-23 2010-06-22 Pixtronix, Incorporated Display methods and apparatus
US7288464B2 (en) * 2005-04-11 2007-10-30 Hewlett-Packard Development Company, L.P. MEMS packaging structure and methods
US20060234412A1 (en) * 2005-04-19 2006-10-19 Hewlett-Packard Development Company, L.P. Intellectual Property Administration MEMS release methods
US7920136B2 (en) 2005-05-05 2011-04-05 Qualcomm Mems Technologies, Inc. System and method of driving a MEMS display device
US7948457B2 (en) 2005-05-05 2011-05-24 Qualcomm Mems Technologies, Inc. Systems and methods of actuating MEMS display elements
WO2006121784A1 (en) 2005-05-05 2006-11-16 Qualcomm Incorporated, Inc. Dynamic driver ic and display panel configuration
US7884989B2 (en) 2005-05-27 2011-02-08 Qualcomm Mems Technologies, Inc. White interferometric modulators and methods for forming the same
KR101375337B1 (ko) 2005-07-22 2014-03-18 퀄컴 엠이엠에스 테크놀로지스, 인크. 지지 구조물들을 가지는 전자기계 장치들 및 그 제조방법들
CN101228091A (zh) 2005-07-22 2008-07-23 高通股份有限公司 用于mems装置的支撑结构及其方法
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
US7432184B2 (en) * 2005-08-26 2008-10-07 Applied Materials, Inc. Integrated PVD system using designated PVD chambers
US8391630B2 (en) 2005-12-22 2013-03-05 Qualcomm Mems Technologies, Inc. System and method for power reduction when decompressing video streams for interferometric modulator displays
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7916980B2 (en) 2006-01-13 2011-03-29 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US7382515B2 (en) 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US8194056B2 (en) 2006-02-09 2012-06-05 Qualcomm Mems Technologies Inc. Method and system for writing data to MEMS display elements
US7547568B2 (en) * 2006-02-22 2009-06-16 Qualcomm Mems Technologies, Inc. Electrical conditioning of MEMS device and insulating layer thereof
US8526096B2 (en) 2006-02-23 2013-09-03 Pixtronix, Inc. Mechanical light modulators with stressed beams
US7450295B2 (en) * 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
US7903047B2 (en) 2006-04-17 2011-03-08 Qualcomm Mems Technologies, Inc. Mode indicator for interferometric modulator displays
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
US8049713B2 (en) 2006-04-24 2011-11-01 Qualcomm Mems Technologies, Inc. Power consumption optimized display update
US7649671B2 (en) 2006-06-01 2010-01-19 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device with electrostatic actuation and release
US7321457B2 (en) 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts
US7876489B2 (en) 2006-06-05 2011-01-25 Pixtronix, Inc. Display apparatus with optical cavities
US7702192B2 (en) 2006-06-21 2010-04-20 Qualcomm Mems Technologies, Inc. Systems and methods for driving MEMS display
US7835061B2 (en) 2006-06-28 2010-11-16 Qualcomm Mems Technologies, Inc. Support structures for free-standing electromechanical devices
US7777715B2 (en) 2006-06-29 2010-08-17 Qualcomm Mems Technologies, Inc. Passive circuits for de-multiplexing display inputs
US7527998B2 (en) 2006-06-30 2009-05-05 Qualcomm Mems Technologies, Inc. Method of manufacturing MEMS devices providing air gap control
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
US7629197B2 (en) * 2006-10-18 2009-12-08 Qualcomm Mems Technologies, Inc. Spatial light modulator
EP2080045A1 (en) 2006-10-20 2009-07-22 Pixtronix Inc. Light guides and backlight systems incorporating light redirectors at varying densities
US7547569B2 (en) * 2006-11-22 2009-06-16 Applied Materials, Inc. Method for patterning Mo layer in a photovoltaic device comprising CIGS material using an etch process
US7706042B2 (en) * 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US7852546B2 (en) 2007-10-19 2010-12-14 Pixtronix, Inc. Spacers for maintaining display apparatus alignment
US9176318B2 (en) 2007-05-18 2015-11-03 Pixtronix, Inc. Methods for manufacturing fluid-filled MEMS displays
US8115987B2 (en) 2007-02-01 2012-02-14 Qualcomm Mems Technologies, Inc. Modulating the intensity of light from an interferometric reflector
WO2008103632A2 (en) * 2007-02-20 2008-08-28 Qualcomm Mems Technologies, Inc. Equipment and methods for etching of mems
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7742220B2 (en) * 2007-03-28 2010-06-22 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing conducting layers separated by stops
US7715085B2 (en) * 2007-05-09 2010-05-11 Qualcomm Mems Technologies, Inc. Electromechanical system having a dielectric movable membrane and a mirror
US7643202B2 (en) 2007-05-09 2010-01-05 Qualcomm Mems Technologies, Inc. Microelectromechanical system having a dielectric movable membrane and a mirror
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7643199B2 (en) * 2007-06-19 2010-01-05 Qualcomm Mems Technologies, Inc. High aperture-ratio top-reflective AM-iMod displays
US7782517B2 (en) 2007-06-21 2010-08-24 Qualcomm Mems Technologies, Inc. Infrared and dual mode displays
US7569488B2 (en) * 2007-06-22 2009-08-04 Qualcomm Mems Technologies, Inc. Methods of making a MEMS device by monitoring a process parameter
US7630121B2 (en) * 2007-07-02 2009-12-08 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
US8068268B2 (en) 2007-07-03 2011-11-29 Qualcomm Mems Technologies, Inc. MEMS devices having improved uniformity and methods for making them
CA2694044C (en) 2007-07-25 2017-02-28 Qualcomm Mems Technologies, Inc. Mems display devices and methods of fabricating the same
JP2010538306A (ja) 2007-07-31 2010-12-09 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド 干渉変調器の色ずれを高めるためのデバイス
US8072402B2 (en) 2007-08-29 2011-12-06 Qualcomm Mems Technologies, Inc. Interferometric optical modulator with broadband reflection characteristics
US7847999B2 (en) 2007-09-14 2010-12-07 Qualcomm Mems Technologies, Inc. Interferometric modulator display devices
US7773286B2 (en) 2007-09-14 2010-08-10 Qualcomm Mems Technologies, Inc. Periodic dimple array
US8058549B2 (en) 2007-10-19 2011-11-15 Qualcomm Mems Technologies, Inc. Photovoltaic devices with integrated color interferometric film stacks
EP2212926A2 (en) 2007-10-19 2010-08-04 QUALCOMM MEMS Technologies, Inc. Display with integrated photovoltaics
WO2009055393A1 (en) 2007-10-23 2009-04-30 Qualcomm Mems Technologies, Inc. Adjustably transmissive mems-based devices
US8941631B2 (en) 2007-11-16 2015-01-27 Qualcomm Mems Technologies, Inc. Simultaneous light collection and illumination on an active display
US7715079B2 (en) 2007-12-07 2010-05-11 Qualcomm Mems Technologies, Inc. MEMS devices requiring no mechanical support
US8164821B2 (en) 2008-02-22 2012-04-24 Qualcomm Mems Technologies, Inc. Microelectromechanical device with thermal expansion balancing layer or stiffening layer
US7944604B2 (en) 2008-03-07 2011-05-17 Qualcomm Mems Technologies, Inc. Interferometric modulator in transmission mode
US7612933B2 (en) 2008-03-27 2009-11-03 Qualcomm Mems Technologies, Inc. Microelectromechanical device with spacing layer
US7898723B2 (en) 2008-04-02 2011-03-01 Qualcomm Mems Technologies, Inc. Microelectromechanical systems display element with photovoltaic structure
US7969638B2 (en) 2008-04-10 2011-06-28 Qualcomm Mems Technologies, Inc. Device having thin black mask and method of fabricating the same
US8248560B2 (en) 2008-04-18 2012-08-21 Pixtronix, Inc. Light guides and backlight systems incorporating prismatic structures and light redirectors
US8023191B2 (en) * 2008-05-07 2011-09-20 Qualcomm Mems Technologies, Inc. Printable static interferometric images
US7851239B2 (en) * 2008-06-05 2010-12-14 Qualcomm Mems Technologies, Inc. Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
US7768690B2 (en) 2008-06-25 2010-08-03 Qualcomm Mems Technologies, Inc. Backlight displays
US7746539B2 (en) 2008-06-25 2010-06-29 Qualcomm Mems Technologies, Inc. Method for packing a display device and the device obtained thereof
US8023167B2 (en) 2008-06-25 2011-09-20 Qualcomm Mems Technologies, Inc. Backlight displays
US7859740B2 (en) 2008-07-11 2010-12-28 Qualcomm Mems Technologies, Inc. Stiction mitigation with integrated mech micro-cantilevers through vertical stress gradient control
US7855826B2 (en) 2008-08-12 2010-12-21 Qualcomm Mems Technologies, Inc. Method and apparatus to reduce or eliminate stiction and image retention in interferometric modulator devices
US8358266B2 (en) 2008-09-02 2013-01-22 Qualcomm Mems Technologies, Inc. Light turning device with prismatic light turning features
US8169679B2 (en) 2008-10-27 2012-05-01 Pixtronix, Inc. MEMS anchors
US8583807B2 (en) 2008-10-31 2013-11-12 Palm, Inc. Apparatus and methods for providing enhanced mobile messaging services
US8270056B2 (en) 2009-03-23 2012-09-18 Qualcomm Mems Technologies, Inc. Display device with openings between sub-pixels and method of making same
US7864403B2 (en) * 2009-03-27 2011-01-04 Qualcomm Mems Technologies, Inc. Post-release adjustment of interferometric modulator reflectivity
US8736590B2 (en) 2009-03-27 2014-05-27 Qualcomm Mems Technologies, Inc. Low voltage driver scheme for interferometric modulators
US8979349B2 (en) 2009-05-29 2015-03-17 Qualcomm Mems Technologies, Inc. Illumination devices and methods of fabrication thereof
US8270062B2 (en) 2009-09-17 2012-09-18 Qualcomm Mems Technologies, Inc. Display device with at least one movable stop element
US8488228B2 (en) 2009-09-28 2013-07-16 Qualcomm Mems Technologies, Inc. Interferometric display with interferometric reflector
JP2013519121A (ja) 2010-02-02 2013-05-23 ピクストロニックス・インコーポレーテッド 低温封孔流体充填ディスプレイ装置を製造するための方法
BR112012019383A2 (pt) 2010-02-02 2017-09-12 Pixtronix Inc Circuitos para controlar aparelho de exibição
KR20130100232A (ko) 2010-04-09 2013-09-10 퀄컴 엠이엠에스 테크놀로지스, 인크. 전기 기계 디바이스의 기계층 및 그 형성 방법
WO2011130715A2 (en) 2010-04-16 2011-10-20 Flex Lighting Ii, Llc Illumination device comprising a film-based lightguide
MX2012012034A (es) 2010-04-16 2013-05-30 Flex Lighting Ii Llc Dispositivo de iluminacion frontal que comprende una guia de luz a base de pelicula.
CN103109315A (zh) 2010-08-17 2013-05-15 高通Mems科技公司 对干涉式显示装置中的电荷中性电极的激活和校准
US9057872B2 (en) 2010-08-31 2015-06-16 Qualcomm Mems Technologies, Inc. Dielectric enhanced mirror for IMOD display
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
US8736939B2 (en) 2011-11-04 2014-05-27 Qualcomm Mems Technologies, Inc. Matching layer thin-films for an electromechanical systems reflective display device
CN103523738B (zh) * 2012-07-06 2016-07-06 无锡华润上华半导体有限公司 微机电系统薄片及其制备方法
US9134552B2 (en) 2013-03-13 2015-09-15 Pixtronix, Inc. Display apparatus with narrow gap electrostatic actuators

Family Cites Families (251)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2534846A (en) 1946-06-20 1950-12-19 Emi Ltd Color filter
DE1288651B (de) 1963-06-28 1969-02-06 Siemens Ag Anordnung elektrischer Dipole fuer Wellenlaengen unterhalb 1 mm und Verfahren zur Herstellung einer derartigen Anordnung
US3616312A (en) 1966-04-15 1971-10-26 Ionics Hydrazine manufacture
FR1603131A (zh) 1968-07-05 1971-03-22
US3813265A (en) 1970-02-16 1974-05-28 A Marks Electro-optical dipolar material
US3653741A (en) 1970-02-16 1972-04-04 Alvin M Marks Electro-optical dipolar material
US3725868A (en) 1970-10-19 1973-04-03 Burroughs Corp Small reconfigurable processor for a variety of data processing applications
DE2336930A1 (de) 1973-07-20 1975-02-06 Battelle Institut E V Infrarot-modulator (ii.)
US4198396A (en) 1974-07-03 1980-04-15 Warren-Teed Laboratories, Inc. Dissolution of gallstones
US4099854A (en) 1976-10-12 1978-07-11 The Unites States Of America As Represented By The Secretary Of The Navy Optical notch filter utilizing electric dipole resonance absorption
US4196396A (en) * 1976-10-15 1980-04-01 Bell Telephone Laboratories, Incorporated Interferometer apparatus using electro-optic material with feedback
US4389096A (en) 1977-12-27 1983-06-21 Matsushita Electric Industrial Co., Ltd. Image display apparatus of liquid crystal valve projection type
US4663083A (en) 1978-05-26 1987-05-05 Marks Alvin M Electro-optical dipole suspension with reflective-absorptive-transmissive characteristics
US4445050A (en) 1981-12-15 1984-04-24 Marks Alvin M Device for conversion of light power to electric power
US4228437A (en) 1979-06-26 1980-10-14 The United States Of America As Represented By The Secretary Of The Navy Wideband polarization-transforming electromagnetic mirror
NL8001281A (nl) 1980-03-04 1981-10-01 Philips Nv Weergeefinrichting.
DE3012253A1 (de) 1980-03-28 1981-10-15 Hoechst Ag, 6000 Frankfurt Verfahren zum sichtbarmaschen von ladungsbildern und eine hierfuer geeignete vorichtung
US4377324A (en) 1980-08-04 1983-03-22 Honeywell Inc. Graded index Fabry-Perot optical filter device
US4441791A (en) 1980-09-02 1984-04-10 Texas Instruments Incorporated Deformable mirror light modulator
FR2506026A1 (fr) 1981-05-18 1982-11-19 Radant Etudes Procede et dispositif pour l'analyse d'un faisceau de rayonnement d'ondes electromagnetiques hyperfrequence
NL8103377A (nl) 1981-07-16 1983-02-16 Philips Nv Weergeefinrichting.
US4571603A (en) 1981-11-03 1986-02-18 Texas Instruments Incorporated Deformable mirror electrostatic printer
NL8200354A (nl) 1982-02-01 1983-09-01 Philips Nv Passieve weergeefinrichting.
US4500171A (en) 1982-06-02 1985-02-19 Texas Instruments Incorporated Process for plastic LCD fill hole sealing
US4482213A (en) 1982-11-23 1984-11-13 Texas Instruments Incorporated Perimeter seal reinforcement holes for plastic LCDs
US4710732A (en) 1984-07-31 1987-12-01 Texas Instruments Incorporated Spatial light modulator and method
US4566935A (en) 1984-07-31 1986-01-28 Texas Instruments Incorporated Spatial light modulator and method
US5096279A (en) 1984-08-31 1992-03-17 Texas Instruments Incorporated Spatial light modulator and method
US5061049A (en) 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
US4662746A (en) 1985-10-30 1987-05-05 Texas Instruments Incorporated Spatial light modulator and method
US4596992A (en) 1984-08-31 1986-06-24 Texas Instruments Incorporated Linear spatial light modulator and printer
US4615595A (en) 1984-10-10 1986-10-07 Texas Instruments Incorporated Frame addressed spatial light modulator
US4617608A (en) 1984-12-28 1986-10-14 At&T Bell Laboratories Variable gap device and method of manufacture
US5172262A (en) 1985-10-30 1992-12-15 Texas Instruments Incorporated Spatial light modulator and method
GB2186708B (en) 1985-11-26 1990-07-11 Sharp Kk A variable interferometric device and a process for the production of the same
US5835255A (en) * 1986-04-23 1998-11-10 Etalon, Inc. Visible spectrum modulator arrays
GB8610129D0 (en) 1986-04-25 1986-05-29 Secr Defence Electro-optical device
US4748366A (en) 1986-09-02 1988-05-31 Taylor George W Novel uses of piezoelectric materials for creating optical effects
US4786128A (en) 1986-12-02 1988-11-22 Quantum Diagnostics, Ltd. Device for modulating and reflecting electromagnetic radiation employing electro-optic layer having a variable index of refraction
NL8701138A (nl) 1987-05-13 1988-12-01 Philips Nv Electroscopische beeldweergeefinrichting.
DE3716485C1 (de) 1987-05-16 1988-11-24 Heraeus Gmbh W C Xenon-Kurzbogen-Entladungslampe
US4900136A (en) 1987-08-11 1990-02-13 North American Philips Corporation Method of metallizing silica-containing gel and solid state light modulator incorporating the metallized gel
US4956619A (en) 1988-02-19 1990-09-11 Texas Instruments Incorporated Spatial light modulator
JPH0242761A (ja) * 1988-04-20 1990-02-13 Matsushita Electric Ind Co Ltd アクティブマトリクス基板の製造方法
US4856863A (en) 1988-06-22 1989-08-15 Texas Instruments Incorporated Optical fiber interconnection network including spatial light modulator
US5028939A (en) 1988-08-23 1991-07-02 Texas Instruments Incorporated Spatial light modulator system
JP2700903B2 (ja) * 1988-09-30 1998-01-21 シャープ株式会社 液晶表示装置
US4982184A (en) 1989-01-03 1991-01-01 General Electric Company Electrocrystallochromic display and element
US5272473A (en) 1989-02-27 1993-12-21 Texas Instruments Incorporated Reduced-speckle display system
US5287096A (en) 1989-02-27 1994-02-15 Texas Instruments Incorporated Variable luminosity display system
KR100202246B1 (ko) * 1989-02-27 1999-06-15 윌리엄 비. 켐플러 디지탈화 비디오 시스템을 위한 장치 및 방법
US5446479A (en) * 1989-02-27 1995-08-29 Texas Instruments Incorporated Multi-dimensional array video processor system
US5162787A (en) 1989-02-27 1992-11-10 Texas Instruments Incorporated Apparatus and method for digitized video system utilizing a moving display surface
US5214420A (en) 1989-02-27 1993-05-25 Texas Instruments Incorporated Spatial light modulator projection system with random polarity light
US5170156A (en) 1989-02-27 1992-12-08 Texas Instruments Incorporated Multi-frequency two dimensional display system
US5214419A (en) 1989-02-27 1993-05-25 Texas Instruments Incorporated Planarized true three dimensional display
US5206629A (en) 1989-02-27 1993-04-27 Texas Instruments Incorporated Spatial light modulator and memory for digitized video display
US5079544A (en) 1989-02-27 1992-01-07 Texas Instruments Incorporated Standard independent digitized video system
US5192946A (en) 1989-02-27 1993-03-09 Texas Instruments Incorporated Digitized color video display system
US4900395A (en) 1989-04-07 1990-02-13 Fsi International, Inc. HF gas etching of wafers in an acid processor
US5022745A (en) 1989-09-07 1991-06-11 Massachusetts Institute Of Technology Electrostatically deformable single crystal dielectrically coated mirror
US4954789A (en) 1989-09-28 1990-09-04 Texas Instruments Incorporated Spatial light modulator
US5381253A (en) 1991-11-14 1995-01-10 Board Of Regents Of University Of Colorado Chiral smectic liquid crystal optical modulators having variable retardation
US5124834A (en) 1989-11-16 1992-06-23 General Electric Company Transferrable, self-supporting pellicle for elastomer light valve displays and method for making the same
US5037173A (en) 1989-11-22 1991-08-06 Texas Instruments Incorporated Optical interconnection network
JP2910114B2 (ja) * 1990-01-20 1999-06-23 ソニー株式会社 電子機器
US5500635A (en) * 1990-02-20 1996-03-19 Mott; Jonathan C. Products incorporating piezoelectric material
CH682523A5 (fr) 1990-04-20 1993-09-30 Suisse Electronique Microtech Dispositif de modulation de lumière à adressage matriciel.
GB9012099D0 (en) 1990-05-31 1990-07-18 Kodak Ltd Optical article for multicolour imaging
US5083857A (en) * 1990-06-29 1992-01-28 Texas Instruments Incorporated Multi-level deformable mirror device
US5142405A (en) 1990-06-29 1992-08-25 Texas Instruments Incorporated Bistable dmd addressing circuit and method
US5216537A (en) 1990-06-29 1993-06-01 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
DE69113150T2 (de) 1990-06-29 1996-04-04 Texas Instruments Inc Deformierbare Spiegelvorrichtung mit aktualisiertem Raster.
US5018256A (en) 1990-06-29 1991-05-28 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5099353A (en) 1990-06-29 1992-03-24 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5153771A (en) 1990-07-18 1992-10-06 Northrop Corporation Coherent light modulation and detector
US5192395A (en) 1990-10-12 1993-03-09 Texas Instruments Incorporated Method of making a digital flexure beam accelerometer
US5044736A (en) 1990-11-06 1991-09-03 Motorola, Inc. Configurable optical filter or display
US5331454A (en) 1990-11-13 1994-07-19 Texas Instruments Incorporated Low reset voltage process for DMD
US5602671A (en) * 1990-11-13 1997-02-11 Texas Instruments Incorporated Low surface energy passivation layer for micromechanical devices
FR2669466B1 (fr) 1990-11-16 1997-11-07 Michel Haond Procede de gravure de couches de circuit integre a profondeur fixee et circuit integre correspondant.
US5233459A (en) 1991-03-06 1993-08-03 Massachusetts Institute Of Technology Electric display device
US5136669A (en) 1991-03-15 1992-08-04 Sperry Marine Inc. Variable ratio fiber optic coupler optical signal processing element
CA2063744C (en) 1991-04-01 2002-10-08 Paul M. Urbanus Digital micromirror device architecture and timing for use in a pulse-width modulated display system
US5142414A (en) 1991-04-22 1992-08-25 Koehler Dale R Electrically actuatable temporal tristimulus-color device
US5226099A (en) 1991-04-26 1993-07-06 Texas Instruments Incorporated Digital micromirror shutter device
FR2679057B1 (fr) 1991-07-11 1995-10-20 Morin Francois Structure d'ecran a cristal liquide, a matrice active et a haute definition.
US5179274A (en) 1991-07-12 1993-01-12 Texas Instruments Incorporated Method for controlling operation of optical systems and devices
US5287215A (en) 1991-07-17 1994-02-15 Optron Systems, Inc. Membrane light modulation systems
US5168406A (en) 1991-07-31 1992-12-01 Texas Instruments Incorporated Color deformable mirror device and method for manufacture
US5254980A (en) 1991-09-06 1993-10-19 Texas Instruments Incorporated DMD display system controller
US5358601A (en) * 1991-09-24 1994-10-25 Micron Technology, Inc. Process for isotropically etching semiconductor devices
US5233385A (en) 1991-12-18 1993-08-03 Texas Instruments Incorporated White light enhanced color field sequential projection
US5233456A (en) 1991-12-20 1993-08-03 Texas Instruments Incorporated Resonant mirror and method of manufacture
US5228013A (en) 1992-01-10 1993-07-13 Bik Russell J Clock-painting device and method for indicating the time-of-day with a non-traditional, now analog artistic panel of digital electronic visual displays
US5296950A (en) 1992-01-31 1994-03-22 Texas Instruments Incorporated Optical signal free-space conversion board
US5231532A (en) 1992-02-05 1993-07-27 Texas Instruments Incorporated Switchable resonant filter for optical radiation
US5212582A (en) 1992-03-04 1993-05-18 Texas Instruments Incorporated Electrostatically controlled beam steering device and method
DE69310974T2 (de) 1992-03-25 1997-11-06 Texas Instruments Inc Eingebautes optisches Eichsystem
US5312513A (en) * 1992-04-03 1994-05-17 Texas Instruments Incorporated Methods of forming multiple phase light modulators
WO1993021663A1 (en) 1992-04-08 1993-10-28 Georgia Tech Research Corporation Process for lift-off of thin film materials from a growth substrate
US5311360A (en) 1992-04-28 1994-05-10 The Board Of Trustees Of The Leland Stanford, Junior University Method and apparatus for modulating a light beam
TW245772B (zh) 1992-05-19 1995-04-21 Akzo Nv
JPH0651250A (ja) * 1992-05-20 1994-02-25 Texas Instr Inc <Ti> モノリシックな空間的光変調器およびメモリのパッケージ
JPH06214169A (ja) * 1992-06-08 1994-08-05 Texas Instr Inc <Ti> 制御可能な光学的周期的表面フィルタ
US5347377A (en) * 1992-06-17 1994-09-13 Eastman Kodak Company Planar waveguide liquid crystal variable retarder
US5818095A (en) * 1992-08-11 1998-10-06 Texas Instruments Incorporated High-yield spatial light modulator with light blocking layer
US5345328A (en) 1992-08-12 1994-09-06 Sandia Corporation Tandem resonator reflectance modulator
US5293272A (en) 1992-08-24 1994-03-08 Physical Optics Corporation High finesse holographic fabry-perot etalon and method of fabricating
US5327286A (en) 1992-08-31 1994-07-05 Texas Instruments Incorporated Real time optical correlation system
US5325116A (en) 1992-09-18 1994-06-28 Texas Instruments Incorporated Device for writing to and reading from optical storage media
US5296775A (en) 1992-09-24 1994-03-22 International Business Machines Corporation Cooling microfan arrangements and process
US6674562B1 (en) * 1994-05-05 2004-01-06 Iridigm Display Corporation Interferometric modulation of radiation
US5324683A (en) 1993-06-02 1994-06-28 Motorola, Inc. Method of forming a semiconductor structure having an air region
US5489952A (en) * 1993-07-14 1996-02-06 Texas Instruments Incorporated Method and device for multi-format television
US5365283A (en) 1993-07-19 1994-11-15 Texas Instruments Incorporated Color phase control for projection display using spatial light modulator
US5457493A (en) 1993-09-15 1995-10-10 Texas Instruments Incorporated Digital micro-mirror based image simulation system
US5497197A (en) * 1993-11-04 1996-03-05 Texas Instruments Incorporated System and method for packaging data into video processor
US5452024A (en) 1993-11-01 1995-09-19 Texas Instruments Incorporated DMD display system
WO1995012774A1 (fr) * 1993-11-05 1995-05-11 Mitsubishi Jidosha Kogyo Kabushiki Kaisha Procede de commande de changement de vitesse destine a une transmission automatique
US5448314A (en) 1994-01-07 1995-09-05 Texas Instruments Method and apparatus for sequential color imaging
US5500761A (en) * 1994-01-27 1996-03-19 At&T Corp. Micromechanical modulator
JPH07221323A (ja) * 1994-02-07 1995-08-18 Mitsubishi Materials Corp 半導体センサおよびその製造方法
US5444566A (en) 1994-03-07 1995-08-22 Texas Instruments Incorporated Optimized electronic operation of digital micromirror devices
JPH07253594A (ja) * 1994-03-15 1995-10-03 Fujitsu Ltd 表示装置
US5503952A (en) * 1994-03-22 1996-04-02 Shinto Paint Co., Ltd. Method for manufacture of color filter and liquid crystal display
US5690839A (en) * 1994-05-04 1997-11-25 Daewoo Electronics Co., Ltd. Method for forming an array of thin film actuated mirrors
US6040937A (en) * 1994-05-05 2000-03-21 Etalon, Inc. Interferometric modulation
US6710908B2 (en) * 1994-05-05 2004-03-23 Iridigm Display Corporation Controlling micro-electro-mechanical cavities
US6680792B2 (en) * 1994-05-05 2004-01-20 Iridigm Display Corporation Interferometric modulation of radiation
US7123216B1 (en) * 1994-05-05 2006-10-17 Idc, Llc Photonic MEMS and structures
US20010003487A1 (en) * 1996-11-05 2001-06-14 Mark W. Miles Visible spectrum modulator arrays
US7550794B2 (en) * 2002-09-20 2009-06-23 Idc, Llc Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer
US7460291B2 (en) * 1994-05-05 2008-12-02 Idc, Llc Separable modulator
US5497172A (en) * 1994-06-13 1996-03-05 Texas Instruments Incorporated Pulse width modulation for spatial light modulator with split reset addressing
US5454906A (en) 1994-06-21 1995-10-03 Texas Instruments Inc. Method of providing sacrificial spacer for micro-mechanical devices
US5499062A (en) * 1994-06-23 1996-03-12 Texas Instruments Incorporated Multiplexed memory timing with block reset and secondary memory
JPH0822024A (ja) * 1994-07-05 1996-01-23 Mitsubishi Electric Corp アクティブマトリクス基板およびその製法
US5485304A (en) * 1994-07-29 1996-01-16 Texas Instruments, Inc. Support posts for micro-mechanical devices
CN1157668A (zh) * 1994-09-02 1997-08-20 拉德·哈桑·达巴 反射式光阀调制器
US5619059A (en) * 1994-09-28 1997-04-08 National Research Council Of Canada Color deformable mirror device having optical thin film interference color coatings
US5526951A (en) * 1994-09-30 1996-06-18 Texas Instruments Incorporated Fabrication method for digital micro-mirror devices using low temperature CVD
US5703728A (en) * 1994-11-02 1997-12-30 Texas Instruments Incorporated Support post architecture for micromechanical devices
US5474865A (en) * 1994-11-21 1995-12-12 Sematech, Inc. Globally planarized binary optical mask using buried absorbers
US5610624A (en) * 1994-11-30 1997-03-11 Texas Instruments Incorporated Spatial light modulator with reduced possibility of an on state defect
US5726480A (en) * 1995-01-27 1998-03-10 The Regents Of The University Of California Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making the same
US5610438A (en) * 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
US6969635B2 (en) * 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
JP3489273B2 (ja) * 1995-06-27 2004-01-19 株式会社デンソー 半導体力学量センサの製造方法
US6324192B1 (en) * 1995-09-29 2001-11-27 Coretek, Inc. Electrically tunable fabry-perot structure utilizing a deformable multi-layer mirror and method of making the same
US5739945A (en) * 1995-09-29 1998-04-14 Tayebati; Parviz Electrically tunable optical filter utilizing a deformable multi-layer mirror
GB9522135D0 (en) * 1995-10-30 1996-01-03 John Mcgavigan Holdings Limite Display panels
JP3799092B2 (ja) * 1995-12-29 2006-07-19 アジレント・テクノロジーズ・インク 光変調装置及びディスプレイ装置
US5967163A (en) * 1996-01-30 1999-10-19 Abbott Laboratories Actuator and method
US5783864A (en) * 1996-06-05 1998-07-21 Advanced Micro Devices, Inc. Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect
US5710656A (en) * 1996-07-30 1998-01-20 Lucent Technologies Inc. Micromechanical optical modulator having a reduced-mass composite membrane
US5838484A (en) * 1996-08-19 1998-11-17 Lucent Technologies Inc. Micromechanical optical modulator with linear operating characteristic
US5884083A (en) * 1996-09-20 1999-03-16 Royce; Robert Computer system to compile non-incremental computer source code to execute within an incremental type computer system
KR100237000B1 (ko) * 1996-09-21 2000-01-15 정선종 희생층을 사용한 미소구조체 제조 방법
KR100532801B1 (ko) * 1997-01-21 2005-12-02 굿리치 코포레이션 용량성 결합을 감소시키기 위하여 에어 갭을 가진 반도체 디바이스를 제조하는 방법
DE69806846T2 (de) * 1997-05-08 2002-12-12 Texas Instruments Inc Verbesserungen für räumliche Lichtmodulatoren
DE19736674C1 (de) * 1997-08-22 1998-11-26 Siemens Ag Mikromechanisches elektrostatisches Relais und Verfahren zu dessen Herstellung
US6031653A (en) * 1997-08-28 2000-02-29 California Institute Of Technology Low-cost thin-metal-film interference filters
US5822170A (en) * 1997-10-09 1998-10-13 Honeywell Inc. Hydrophobic coating for reducing humidity effect in electrostatic actuators
JP2001522072A (ja) * 1997-10-31 2001-11-13 テーウー エレクトロニクス カンパニー リミテッド 薄膜型光路調節装置の製造方法
US6028690A (en) * 1997-11-26 2000-02-22 Texas Instruments Incorporated Reduced micromirror mirror gaps for improved contrast ratio
US5920421A (en) * 1997-12-10 1999-07-06 Daewoo Electronics Co., Ltd. Thin film actuated mirror array in an optical projection system and method for manufacturing the same
US6180428B1 (en) * 1997-12-12 2001-01-30 Xerox Corporation Monolithic scanning light emitting devices using micromachining
KR100253378B1 (ko) * 1997-12-15 2000-04-15 김영환 주문형반도체의외부표시장치
US6016693A (en) * 1998-02-09 2000-01-25 The Regents Of The University Of California Microfabrication of cantilevers using sacrificial templates
US6610440B1 (en) * 1998-03-10 2003-08-26 Bipolar Technologies, Inc Microscopic batteries for MEMS systems
US6195196B1 (en) * 1998-03-13 2001-02-27 Fuji Photo Film Co., Ltd. Array-type exposing device and flat type display incorporating light modulator and driving method thereof
US6166422A (en) * 1998-05-13 2000-12-26 Lsi Logic Corporation Inductor with cobalt/nickel core for integrated circuit structure with high inductance and high Q-factor
US6395618B2 (en) * 1998-07-10 2002-05-28 Stmicroelectronics S.R.L. Method for manufacturing integrated structures including removing a sacrificial region
US6100477A (en) * 1998-07-17 2000-08-08 Texas Instruments Incorporated Recessed etch RF micro-electro-mechanical switch
US6057903A (en) * 1998-08-18 2000-05-02 International Business Machines Corporation Liquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layer
US6249039B1 (en) * 1998-09-10 2001-06-19 Bourns, Inc. Integrated inductive components and method of fabricating such components
JP4074714B2 (ja) * 1998-09-25 2008-04-09 富士フイルム株式会社 アレイ型光変調素子及び平面ディスプレイの駆動方法
US6323834B1 (en) * 1998-10-08 2001-11-27 International Business Machines Corporation Micromechanical displays and fabrication method
JP3919954B2 (ja) * 1998-10-16 2007-05-30 富士フイルム株式会社 アレイ型光変調素子及び平面ディスプレイの駆動方法
US6115326A (en) * 1998-10-22 2000-09-05 Integrated Medical Systems, Inc. Ultrasonic micro-machined selectable transducer array
JP3362714B2 (ja) * 1998-11-16 2003-01-07 株式会社豊田中央研究所 静電容量型圧力センサおよびその製造方法
US6391675B1 (en) * 1998-11-25 2002-05-21 Raytheon Company Method and apparatus for switching high frequency signals
US6194323B1 (en) * 1998-12-16 2001-02-27 Lucent Technologies Inc. Deep sub-micron metal etch with in-situ hard mask etch
US6335831B2 (en) * 1998-12-18 2002-01-01 Eastman Kodak Company Multilevel mechanical grating device
US6210988B1 (en) * 1999-01-15 2001-04-03 The Regents Of The University Of California Polycrystalline silicon germanium films for forming micro-electromechanical systems
JP2000214804A (ja) * 1999-01-20 2000-08-04 Fuji Photo Film Co Ltd 光変調素子及び露光装置並びに平面表示装置
US6537427B1 (en) * 1999-02-04 2003-03-25 Micron Technology, Inc. Deposition of smooth aluminum films
US6201633B1 (en) * 1999-06-07 2001-03-13 Xerox Corporation Micro-electromechanical based bistable color display sheets
US6359673B1 (en) * 1999-06-21 2002-03-19 Eastman Kodak Company Sheet having a layer with different light modulating materials
US6862029B1 (en) * 1999-07-27 2005-03-01 Hewlett-Packard Development Company, L.P. Color display system
KR100333482B1 (ko) * 1999-09-15 2002-04-25 오길록 초고속 반도체 광변조기 및 그 제조방법
WO2003007049A1 (en) * 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
US6960305B2 (en) * 1999-10-26 2005-11-01 Reflectivity, Inc Methods for forming and releasing microelectromechanical structures
US7041224B2 (en) * 1999-10-26 2006-05-09 Reflectivity, Inc. Method for vapor phase etching of silicon
US6549338B1 (en) * 1999-11-12 2003-04-15 Texas Instruments Incorporated Bandpass filter to reduce thermal impact of dichroic light shift
US6552840B2 (en) * 1999-12-03 2003-04-22 Texas Instruments Incorporated Electrostatic efficiency of micromechanical devices
US6548908B2 (en) * 1999-12-27 2003-04-15 Xerox Corporation Structure and method for planar lateral oxidation in passive devices
US6545335B1 (en) * 1999-12-27 2003-04-08 Xerox Corporation Structure and method for electrical isolation of optoelectronic integrated circuits
US20020071169A1 (en) * 2000-02-01 2002-06-13 Bowers John Edward Micro-electro-mechanical-system (MEMS) mirror device
US6531945B1 (en) * 2000-03-10 2003-03-11 Micron Technology, Inc. Integrated circuit inductor with a magnetic core
CA2352729A1 (en) * 2000-07-13 2002-01-13 Creoscitex Corporation Ltd. Blazed micro-mechanical light modulator and array thereof
US6456420B1 (en) * 2000-07-27 2002-09-24 Mcnc Microelectromechanical elevating structures
US6853129B1 (en) * 2000-07-28 2005-02-08 Candescent Technologies Corporation Protected substrate structure for a field emission display device
US6376787B1 (en) * 2000-08-24 2002-04-23 Texas Instruments Incorporated Microelectromechanical switch with fixed metal electrode/dielectric interface with a protective cap layer
US6522801B1 (en) * 2000-10-10 2003-02-18 Agere Systems Inc. Micro-electro-optical mechanical device having an implanted dopant included therein and a method of manufacture therefor
US6859218B1 (en) * 2000-11-07 2005-02-22 Hewlett-Packard Development Company, L.P. Electronic display devices and methods
KR100381011B1 (ko) * 2000-11-13 2003-04-26 한국전자통신연구원 멤즈소자 제조용 미세구조체를 고착없이 띄우는 방법
DE10063991B4 (de) * 2000-12-21 2005-06-02 Infineon Technologies Ag Verfahren zur Herstellung von mikromechanischen Bauelementen
US6508947B2 (en) * 2001-01-24 2003-01-21 Xerox Corporation Method for fabricating a micro-electro-mechanical fluid ejector
KR100863850B1 (ko) * 2001-01-30 2008-10-15 마츠시타 덴끼 산교 가부시키가이샤 가변형 미러와 당해 가변형 미러를 구비한 정보 장치 및 보상 광학 장치
FR2820513B1 (fr) * 2001-02-05 2004-05-21 Centre Nat Rech Scient Dispositif optoelectronique a filtrage de longueur d'onde par couplage de cavites
US6602791B2 (en) * 2001-04-27 2003-08-05 Dalsa Semiconductor Inc. Manufacture of integrated fluidic devices
JP4720022B2 (ja) * 2001-05-30 2011-07-13 ソニー株式会社 光学多層構造体およびその製造方法、光スイッチング素子、並びに画像表示装置
JP4032216B2 (ja) * 2001-07-12 2008-01-16 ソニー株式会社 光学多層構造体およびその製造方法、並びに光スイッチング素子および画像表示装置
US6862022B2 (en) * 2001-07-20 2005-03-01 Hewlett-Packard Development Company, L.P. Method and system for automatically selecting a vertical refresh rate for a video display monitor
WO2003014920A2 (en) * 2001-08-03 2003-02-20 Koninklijke Philips Electronics N.V. Display of a document on a client computer
US6577785B1 (en) * 2001-08-09 2003-06-10 Sandia Corporation Compound semiconductor optical waveguide switch
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6842009B2 (en) * 2001-09-13 2005-01-11 Nth Tech Corporation Biohazard sensing system and methods thereof
US6717488B2 (en) * 2001-09-13 2004-04-06 Nth Tech Corporation Resonator with a member having an embedded charge and a method of making thereof
US6590157B2 (en) * 2001-09-21 2003-07-08 Eastman Kodak Company Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
US6788175B1 (en) * 2001-10-04 2004-09-07 Superconductor Technologies, Inc. Anchors for micro-electro-mechanical systems (MEMS) devices
US6866669B2 (en) * 2001-10-12 2005-03-15 Cordis Corporation Locking handle deployment mechanism for medical device and method
US6870581B2 (en) * 2001-10-30 2005-03-22 Sharp Laboratories Of America, Inc. Single panel color video projection display using reflective banded color falling-raster illumination
US6782166B1 (en) * 2001-12-21 2004-08-24 United States Of America As Represented By The Secretary Of The Air Force Optically transparent electrically conductive charge sheet poling electrodes to maximize performance of electro-optic devices
US7106491B2 (en) * 2001-12-28 2006-09-12 Texas Instruments Incorporated Split beam micromirror
US6915046B2 (en) * 2002-01-22 2005-07-05 Agere Sysems, Inc. Optical systems comprising curved MEMs mirrors and methods for making same
US6794119B2 (en) * 2002-02-12 2004-09-21 Iridigm Display Corporation Method for fabricating a structure for a microelectromechanical systems (MEMS) device
JP3558066B2 (ja) * 2002-02-19 2004-08-25 ソニー株式会社 Mems素子とその製造方法、光変調素子、glvデバイスとその製造方法、及びレーザディスプレイ
US7029829B2 (en) * 2002-04-18 2006-04-18 The Regents Of The University Of Michigan Low temperature method for forming a microcavity on a substrate and article having same
US20040058531A1 (en) * 2002-08-08 2004-03-25 United Microelectronics Corp. Method for preventing metal extrusion in a semiconductor structure.
US6674033B1 (en) * 2002-08-21 2004-01-06 Ming-Shan Wang Press button type safety switch
TW544787B (en) * 2002-09-18 2003-08-01 Promos Technologies Inc Method of forming self-aligned contact structure with locally etched gate conductive layer
KR100512960B1 (ko) * 2002-09-26 2005-09-07 삼성전자주식회사 플렉서블 mems 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 mems 무선 마이크로폰
US6905621B2 (en) * 2002-10-10 2005-06-14 Taiwan Semiconductor Manufacturing Co., Ltd. Method for preventing the etch transfer of sidelobes in contact hole patterns
KR100454136B1 (ko) * 2002-10-23 2004-10-26 삼성전자주식회사 플로팅 게이트의 전하 손실을 막을 수 있는 비휘발성메모리 장치 및 그 제조방법
US6747785B2 (en) * 2002-10-24 2004-06-08 Hewlett-Packard Development Company, L.P. MEMS-actuated color light modulator and methods
US6944008B2 (en) * 2002-12-18 2005-09-13 Lucent Technologies Inc. Charge dissipation in electrostatically driven devices
TW557395B (en) * 2003-01-29 2003-10-11 Yen Sun Technology Corp Optical interference type reflection panel and the manufacturing method thereof
TW200413810A (en) * 2003-01-29 2004-08-01 Prime View Int Co Ltd Light interference display panel and its manufacturing method
US7027202B1 (en) * 2003-02-28 2006-04-11 Silicon Light Machines Corp Silicon substrate as a light modulator sacrificial layer
US6987432B2 (en) * 2003-04-16 2006-01-17 Robert Bosch Gmbh Temperature compensation for silicon MEMS resonator
TW567355B (en) * 2003-04-21 2003-12-21 Prime View Int Co Ltd An interference display cell and fabrication method thereof
TW594360B (en) * 2003-04-21 2004-06-21 Prime View Int Corp Ltd A method for fabricating an interference display cell
US6829132B2 (en) * 2003-04-30 2004-12-07 Hewlett-Packard Development Company, L.P. Charge control of micro-electromechanical device
TW570896B (en) * 2003-05-26 2004-01-11 Prime View Int Co Ltd A method for fabricating an interference display cell
US7221495B2 (en) * 2003-06-24 2007-05-22 Idc Llc Thin film precursor stack for MEMS manufacturing
US7119945B2 (en) * 2004-03-03 2006-10-10 Idc, Llc Altering temporal response of microelectromechanical elements
US7327510B2 (en) * 2004-09-27 2008-02-05 Idc, Llc Process for modifying offset voltage characteristics of an interferometric modulator
US20060066932A1 (en) * 2004-09-27 2006-03-30 Clarence Chui Method of selective etching using etch stop layer

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104098065A (zh) * 2013-04-12 2014-10-15 国际商业机器公司 微电子机械系统(mems)结构和设计结构
US9932222B2 (en) 2013-04-12 2018-04-03 International Business Machines Corporation Micro-electro-mechanical system (MEMS) structures and design structures
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US9969613B2 (en) 2013-04-12 2018-05-15 International Business Machines Corporation Method for forming micro-electro-mechanical system (MEMS) beam structure
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US11167980B2 (en) 2013-04-12 2021-11-09 International Business Machines Corporation Micro-electro-mechanical system (MEMS) structures and design structures

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US7616369B2 (en) 2009-11-10
KR20060066675A (ko) 2006-06-16
WO2005001545A1 (en) 2005-01-06
US7221495B2 (en) 2007-05-22
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US20040263944A1 (en) 2004-12-30
HK1093779A1 (en) 2007-03-09

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