CN1881133A - Method for eliminating electromagnetic wave interference of board card - Google Patents

Method for eliminating electromagnetic wave interference of board card Download PDF

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Publication number
CN1881133A
CN1881133A CN 200510078064 CN200510078064A CN1881133A CN 1881133 A CN1881133 A CN 1881133A CN 200510078064 CN200510078064 CN 200510078064 CN 200510078064 A CN200510078064 A CN 200510078064A CN 1881133 A CN1881133 A CN 1881133A
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CN
China
Prior art keywords
interface card
chipset
circuit board
pcb
printed circuit
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Application number
CN 200510078064
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Chinese (zh)
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CN100428111C (en
Inventor
洪圣昌
江政雄
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Micro Star International Co Ltd
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Micro Star International Co Ltd
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Priority to CNB2005100780644A priority Critical patent/CN100428111C/en
Publication of CN1881133A publication Critical patent/CN1881133A/en
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Publication of CN100428111C publication Critical patent/CN100428111C/en
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Abstract

The invention discloses a dielectric card structure on the computer case, which contains print circuit board with chip group, wherein the radiating fin group is set on the chip group, which dissipates heat for chip; the fixing board on one side of print circuit board can chuck the dielectric card in the dielectric card locating groove of computer case; the fitful part of ground part possesses elastic segment with two ends of ground part resisting the fixing board and radiating fin group, which conducts electromagnetic wave in the chip group working procedure to computer case through radiating fin and ground part to reinforce the effect to prevent electromagnetic filter (EMI).

Description

Integrated circuit board is eliminated the method for Electromagnetic Interference
Technical field
The present invention relates to a kind of interface card structure that is applied to all kinds of Data Processing equipment, relate in particular to a kind of with low cost, interface card structure of strengthening pre-anti electromagnetic wave effect.
Background technology
Along with the progress of science and technology, make the performance of computer equipment be gradually improved, and price is cheap gradually; Nowadays data processing device has become the industry running, and even the individual uses indispensable electronic product in family's amusement and recreation and is deep in the daily life of society.
For meeting the different needs, computer equipment has polytype, for example bear the military national defence super computer (Super Computer) of national security important task, desktop computer (Desktop Computer) that widely the employed servomechanism main frame of industry (Server), individual are commonly used or be convenient to the laptop (Note Book) of business people's portable even more petite personal digital assistant (the Personal Digital Assist of volume, PDA) etc., they are used for many years by society.
Because the formation of computer equipment is complicated day by day, the electronic component setting that usually is closely adjacent to each other, thereby distribution density is quite high, in addition, also produce frequency electromagnetic waves during their work, (Electro Magnetic Interference EMI) discharges (Electro Static Discharge, problem such as ESD) to the Electromagnetic Interference of deriving thus with static.Therefore before production marketing, need through every standard testing operation such as vibration, noise.Owing to comprise a lot of electronic components in the computer equipment, the electromagenetic wave radiation that electronic component the time is produced in work all will damage the nervous centralis of human body, biosome immunologic function, cardiovascular system, blood, vision system etc., therefore, in every standard testing operation, the most important with the EMI Electromagnetic Wave Detection especially.
Common electronic component in the computer equipment, as all kinds of interface cards of motherboard, adlib, display card or the like one of the main source of electromagenetic wave radiation normally.The basic composition of this type of interface card is at plant chipset on the printed circuit board (PCB) and suitable lead-in wire is set connects on the printed circuit board (PCB) other electronic component.Yet when after product is finished, carrying out Electromagnetic Wave Detection, may occur that chipset on the printed circuit board (PCB) or other electronic components produce too high electromagenetic wave radiation and can't be by the situation of trace routine.
So, the lead-in wire on the necessary redesign interface card and the configuration of electronic component, the product of being finished can't use and scrap.Traditional means to save the situation is that additional configuration conducting foam (gasket), absorbing material (absorber), Copper Foil, aluminium foil etc. are to block electromagnetic wave.Yet these methods not only cause procrastinateing of production marketing, and the additional recondition expense of deriving, or comparatively expensive and be difficult to carry out.Moreover above-mentioned part measure effect is not good enough, can't directly solve the electromagenetic wave radiation problem.
Should manage to be got rid of to above prior art or the existing defective of existing product.
Summary of the invention
Given this, the technical problem to be solved in the present invention is that a kind of interface card structure that can fast and effectively the electromagenetic wave radiation in the product be derived is provided.
Interface card structure of the present invention can be applicable in the various computer equipments, and it mainly comprises printed circuit board (PCB), radiating subassembly, fixed head and earthing member.Wherein, printed circuit board (PCB) is provided with the required electronic packages such as chipset (heater element) of work, and radiating subassembly is located on the chipset, and it comprises the multi-disc radiating fin, in order to chipset is dispelled the heat.Fixed head is located at a side of printed circuit board (PCB), and planting for printed circuit board (PCB) is fixed on the computer chassis.The stage casing appropriate location of earthing member has stretch section, so that the two ends of earthing member difference contact radiating subassembly and fixed head.So, the electromagnetic wave that the time produced of chipset work can be via radiating subassembly and earthing member conducting to computer chassis.
The present invention is based on electron irradiation and can follow short distance and directly lead the characteristic on ground, utilize earthing member that the electromagenetic wave radiation of chipset is passed to computer chassis, can get rid of the problem of excessive electromagnet radiation human body in the product.The present invention can derive electromagenetic wave radiation fast and effectively, and have with low cost, element is simple, advantage such as easy to implement.
Description of drawings
For make above-mentioned purpose of the present invention and other purposes, feature, and advantage can become apparent, several preferred implementations cited below particularly also are elaborated in conjunction with the accompanying drawings.
Fig. 1 is the schematic perspective view of first preferred implementation of interface card structure of the present invention;
Fig. 2 is the decomposing schematic representation of first preferred implementation of interface card structure of the present invention;
Fig. 3 is the assembly synoptic diagram of first preferred implementation of interface card structure of the present invention;
Fig. 4 is the decomposing schematic representation of second preferred implementation of interface card structure of the present invention;
Fig. 5 is the assembly synoptic diagram of second preferred implementation of interface card structure of the present invention;
Fig. 6 is the decomposing schematic representation of the 3rd preferred implementation of interface card structure of the present invention;
Fig. 7 is the first action synoptic diagram of the 3rd preferred implementation of interface card structure of the present invention;
Fig. 8 is the second action synoptic diagram of the 3rd preferred implementation of interface card structure of the present invention.
Description of reference numerals
10 printed circuit board (PCB)s
11 chipsets
20 radiating subassemblies
21 radiating fins
30 fixed heads
31 screws
32 circular holes
40 earthing members
41 stretch sections
42 through holes
43 pressure sections
50 earthing members
60 radiating subassemblies
61 radiating fins
62 movable fins
63 conducting parts
64 stretch sections
100 computer chassis
110 interface card locating slots
Embodiment
Interface card structure of the present invention can be applicable in the computer equipment of desktop computer (desktop), servomechanism (server), laptop and so on, refers now to Fig. 1 to Fig. 3 first preferred implementation of the present invention is described.Wherein, computer equipment comprises computer chassis 100, and a side of computer chassis 100 offers many interface card locating slots 110.
According to first preferred implementation of the present invention, interface card structure of the present invention mainly is made up of with earthing member 40 printed circuit board (PCB) 10, radiating subassembly 20, fixed head 30.Printed circuit board (PCB) 10 is provided with chipset 11 and other required electronic components of work, and be provided with and make its lead-in wire connected to one another, because these are prior art, so the present invention repeats no more the ins and outs that are referred to as printed circuit board (PCB) 10, and only schematically and not draw in detail in the accompanying drawings, obviously, different types of product is equipped with different electronic components.
Radiating subassembly 20 is made up of multi-disc radiating fin 21 (heat sink), and it is arranged on the chipset 11, in order to chipset 11 is dispelled the heat.Fixed head 30 is installed in the side of printed circuit board (PCB) 10, and fixed head 30 is provided with screw 31, can pass for outside screw, is fixed on interface card locating slot 110 places of computer chassis 100 so that printed circuit board (PCB) 10 is planted.
Earthing member 40 is made by conducting metal, and its two ends contact or be resisted against radiating subassembly 20 and fixed head 30 respectively.One end of earthing member 40 corresponding fixed heads 30 is provided with the through hole 42 corresponding with screw 31, and an end that joins with radiating subassembly 20 then bends out pressure section 43, so as to promoting the effect of conflicting and connecting.The stage casing appropriate location of earthing member 40 is recessed to form stretch section 41, can adapt to the assembling tolerance of radiating subassembly 20 and fixed head 30 so that earthing member 40 well contact both.
Follow the characteristic that short distance is directly led ground based on electron irradiation, the electromagenetic wave radiation that is produced during chipset 20 work will conduct to earthing member 40 by the radiating fin on the radiating subassembly 20 21, then by earthing member 40 again conducting and electromagenetic wave radiation is derived to computer chassis 100.
Then, with reference to figure 4 and Fig. 5 second preferred implementation of the present invention is described.The composition of second preferred implementation and last preferred implementation is roughly the same, mainly comprises printed circuit board (PCB) 10, radiating subassembly 20, fixed head 30 and earthing member 50.Printed circuit board (PCB) 10 is provided with chipset 11, and radiating subassembly 20 is made up of multi-disc radiating fin 21, and they are located on the chipset 11.Fixed head 30 is located at a side of printed circuit board (PCB) 10, is fixed on the interface card locating slot 110 of computer chassis 100 so that printed circuit board (PCB) 10 is planted.Different is, the fixed head 30 in second preferred implementation offers circular hole 32 in appropriate location, and earthing member 50 preferably can be selected the major axis gib screw for use.So, be assemblied on the locating slot 110 of computer chassis 100 when printed circuit board (PCB) 10 after, earthing member 50 is passed circular hole 32, contact with radiating subassembly 20 in the mode of interlocking or contact.Therefore, the electromagnetic wave that produces of chipset 11 work can be in regular turn conducted to fixed head 30 and computer chassis 100 via radiating subassembly 20 and earthing member 50.
About the 3rd preferred implementation of the present invention, please refer to Fig. 6 to Fig. 8, this embodiment is the design that improves at the radiator structure on the interface card.The 3rd preferred implementation is applied on the printed circuit board (PCB) 10, and is provided with a chipset 11 on this printed circuit board (PCB) 10 at least, and is set in the computer chassis 100.The 3rd preferred implementation has mainly disclosed a kind of radiating subassembly 60 that is applied to the interface card, and it is assemblied on the chipset 11, and it mainly comprises multi-disc radiating fin 61 and movable fin 62.Radiating fin 61 is shaped with spaced form and is provided with, so that chipset 11 is dispelled the heat.The effect of movable fin 62 is equal to radiating fin, and its neighbour is located at a side of the radiating fin 61 of side, and an end of movable fin 62 is extended with conducting part 63.Specifically, movable fin 62 chipset 11 rotations relatively in case of necessity.So, after printed circuit board (PCB) 10 is finished assembly operation, movable fin 62 on the radiating subassembly 60 is promptly rotatable, till taking electric shock brain casing 100, so that the electromagnetic wave that is produced during with chipset 11 work through movable fin 62 and conducting to computer chassis 100, the middle section of movable fin 62 is provided with stretch section 64, and an end of movable fin 62 is bent with conducting part 63, so as to promoting the effect that contacts with computer chassis 100.
Follow the characteristic that short distance is directly led ground based on electron irradiation, interface card structure of the present invention uses earthing member that electromagenetic wave radiation is passed to computer chassis, so as to getting rid of the problem of excessive electromagenetic wave radiation in the product.The disclosed preferred implementation of the present invention can derive electromagenetic wave radiation fast and effectively, and have with low cost, element is simple, advantage such as easy to implement.
Below only preferred implementation of the present invention is described, obviously, the invention is not restricted to described embodiment, all equivalents of making in design scope of the present invention all should fall into claim of the present invention scope required for protection with modification.

Claims (7)

1. interface card structure, it is installed on the computer chassis, and a side of this computer chassis is provided with interface card locating slot, and described interface card structure comprises:
Printed circuit board (PCB) is provided with a chipset at least on this printed circuit board (PCB);
Radiating subassembly, it is made of the multi-disc radiating fin, and this radiating subassembly is located on the described chipset, in order to described chipset is dispelled the heat;
Fixed head, it is installed in a side of described printed circuit board (PCB), by means of this fixed head described printed circuit board (PCB) is inserted in the described interface card locating slot; And
Earthing member, the appropriate location in its stage casing has stretch section, so that an end of this earthing member is resisted against described radiating subassembly, and the other end is resisted against described fixed head, and the electromagnetic wave that produces when making the work of described chipset in regular turn via described radiating subassembly and earthing member conducting to described computer chassis.
2. interface card structure as claimed in claim 1, wherein, described fixed head is provided with the screw that passes for outside screw.
3. interface card structure as claimed in claim 2, wherein, an end of described earthing member is provided with the through hole corresponding with described screw.
4. interface card structure as claimed in claim 1, wherein, described earthing member is bent with a pressure section corresponding to an end of described radiating subassembly.
5. interface card structure, it is installed on the computer chassis of Data Processing equipment, and a side of this computer chassis is provided with interface card locating slot, described interface card structure comprises:
Printed circuit board (PCB) is provided with a chipset at least on this printed circuit board (PCB);
Radiating subassembly, it is made of the multi-disc radiating fin, and this radiating subassembly is located at the top side of described chipset, in order to described chipset is dispelled the heat;
Fixed head, it is installed in a side of described printed circuit board (PCB), by means of this fixed head described printed circuit board (PCB) is inserted in the described interface card locating slot, and this fixed head is provided with circular hole; And
Earthing member, it can pass described circular hole and make an end of major axis fixture contact at described fixed head so that described chipset when work the electromagnetic wave that produces in regular turn via described radiating subassembly and earthing member conducting to described computer chassis.
6. radiator structure that is applied to the interface card, it is installed on the printed circuit board (PCB), and this printed circuit board (PCB) is located in the computer chassis, is provided with a chipset on this printed circuit board (PCB) at least, described radiator structure comprises:
The multi-disc radiating fin, they are located at the top side of described chipset, in order to this chipset is dispelled the heat;
One movable fin, it is selectively with respect to the rotation of described chipset, touch and take with described computer chassis so that the electromagnetic wave that produces during the work of described chipset via this activity fin conducting to described computer chassis.
7. interface card structure as claimed in claim 6, wherein, an end of described movable fin is extended with a conducting part.
CNB2005100780644A 2005-06-14 2005-06-14 Method for eliminating electromagnetic wave interference of board card Active CN100428111C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2005100780644A CN100428111C (en) 2005-06-14 2005-06-14 Method for eliminating electromagnetic wave interference of board card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005100780644A CN100428111C (en) 2005-06-14 2005-06-14 Method for eliminating electromagnetic wave interference of board card

Publications (2)

Publication Number Publication Date
CN1881133A true CN1881133A (en) 2006-12-20
CN100428111C CN100428111C (en) 2008-10-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100780644A Active CN100428111C (en) 2005-06-14 2005-06-14 Method for eliminating electromagnetic wave interference of board card

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Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347430A (en) * 1993-04-06 1994-09-13 Dell Usa, L.P. Computer chassis construction
US5691504A (en) * 1995-05-05 1997-11-25 Dell Usa, L.P. Multilayer computer chassis having integral circuit board mounting and grounding structure
US5838542A (en) * 1996-09-30 1998-11-17 Intel Corporation Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage
CN2349671Y (en) * 1998-04-30 1999-11-17 刘彦妏 Radiation structure for integrated block
CN2388638Y (en) * 1999-02-27 2000-07-19 富准精密工业(深圳)有限公司 Wafer radiator attaching clamp
JP2005122630A (en) * 2003-10-20 2005-05-12 Hitachi Ltd Circuit board card and electronic equipment

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