DE10007577C1 - Piezoresonator - Google Patents
PiezoresonatorInfo
- Publication number
- DE10007577C1 DE10007577C1 DE10007577A DE10007577A DE10007577C1 DE 10007577 C1 DE10007577 C1 DE 10007577C1 DE 10007577 A DE10007577 A DE 10007577A DE 10007577 A DE10007577 A DE 10007577A DE 10007577 C1 DE10007577 C1 DE 10007577C1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- electroactive
- piezo
- electrode
- electrostrictive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 30
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 230000008602 contraction Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 101
- 230000000694 effects Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 101100400378 Mus musculus Marveld2 gene Proteins 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011263 electroactive material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920005569 poly(vinylidene fluoride-co-hexafluoropropylene) Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/175—Acoustic mirrors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H2009/02165—Tuning
- H03H2009/02173—Tuning of film bulk acoustic resonators [FBAR]
- H03H2009/02188—Electrically tuning
- H03H2009/02196—Electrically tuning operating on the FBAR element, e.g. by direct application of a tuning DC voltage
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H2009/02165—Tuning
- H03H2009/02173—Tuning of film bulk acoustic resonators [FBAR]
- H03H2009/02188—Electrically tuning
- H03H2009/02204—Electrically tuning operating on an additional circuit element, e.g. applying a tuning DC voltage to a passive circuit element connected to the resonator
Abstract
Description
Claims (6)
eine dritte Elektrodenschicht (5) und eine elektroaktive oder elektrostriktive Schicht (2) zwischen der dritten Elektroden schicht (5) und der zweiten Elektrodenschicht (4) vorhanden sind,
wobei das Material der elektroaktiven oder elektrostriktiven Schicht so gewählt ist, dass durch Anlegen einer Gleichspan nung zwischen der zweiten Elektrodenschicht und der dritten Elektrodenschicht eine Kontraktion der elektroaktiven oder elektrostriktiven Schicht in der vertikalen Richtung bezüg lich der Schichtebenen so herbeigeführt werden kann, dass die Resonanzfrequenz des Schichtstapels für eine Abstimmung des Piezoresonators geändert wird.
die elektroaktive oder elektrostriktive Schicht (2) als wei tere Schicht niedriger akustischer Impedanz vorgesehen ist und
die dritte Elektrodenschicht (5) als weitere Schicht hoher akustischer Impedanz vorgesehen ist.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10007577A DE10007577C1 (de) | 2000-02-18 | 2000-02-18 | Piezoresonator |
EP01102577A EP1126602B1 (de) | 2000-02-18 | 2001-02-06 | Piezoresonator |
US09/789,342 US6534900B2 (en) | 2000-02-18 | 2001-02-20 | Piezoresonator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10007577A DE10007577C1 (de) | 2000-02-18 | 2000-02-18 | Piezoresonator |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10007577C1 true DE10007577C1 (de) | 2001-09-13 |
Family
ID=7631525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10007577A Expired - Fee Related DE10007577C1 (de) | 2000-02-18 | 2000-02-18 | Piezoresonator |
Country Status (3)
Country | Link |
---|---|
US (1) | US6534900B2 (de) |
EP (1) | EP1126602B1 (de) |
DE (1) | DE10007577C1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008028885A1 (de) * | 2008-06-18 | 2009-12-31 | Epcos Ag | Verfahren zur Abstimmung einer Resonanzfrequenz eines piezoelektrischen Bauelementes |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10007577C1 (de) * | 2000-02-18 | 2001-09-13 | Infineon Technologies Ag | Piezoresonator |
JP3846271B2 (ja) * | 2001-11-05 | 2006-11-15 | 松下電器産業株式会社 | 薄膜圧電体素子およびその製造方法 |
US6767749B2 (en) * | 2002-04-22 | 2004-07-27 | The United States Of America As Represented By The Secretary Of The Navy | Method for making piezoelectric resonator and surface acoustic wave device using hydrogen implant layer splitting |
US7312674B2 (en) * | 2002-08-06 | 2007-12-25 | The Charles Stark Draper Laboratory, Inc. | Resonator system with a plurality of individual mechanically coupled resonators and method of making same |
AU2003259512A1 (en) * | 2002-09-12 | 2004-04-30 | Koninklijke Philips Electronics N.V. | Bulk acoustic wave resonator with means for suppression of pass-band ripple in bulk acoustic wave filters |
US6741147B2 (en) * | 2002-09-30 | 2004-05-25 | Agere Systems Inc. | Method and apparatus for adjusting the resonant frequency of a thin film resonator |
DE10301261B4 (de) * | 2003-01-15 | 2018-03-22 | Snaptrack, Inc. | Mit akustischen Volumenwellen arbeitendes Bauelement und Verfahren zur Herstellung |
US7275292B2 (en) | 2003-03-07 | 2007-10-02 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Method for fabricating an acoustical resonator on a substrate |
JP3966237B2 (ja) * | 2003-06-19 | 2007-08-29 | セイコーエプソン株式会社 | 圧電デバイス、圧電デバイスを搭載した電子機器 |
US7019605B2 (en) * | 2003-10-30 | 2006-03-28 | Larson Iii John D | Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth |
US7332985B2 (en) * | 2003-10-30 | 2008-02-19 | Avago Technologies Wireless Ip (Singapore) Pte Ltd. | Cavity-less film bulk acoustic resonator (FBAR) devices |
EP1528677B1 (de) | 2003-10-30 | 2006-05-10 | Agilent Technologies, Inc. | Akustisch gekoppelter Dünnschicht-Transformator mit zwei piezoelektrischen Elementen, welche entgegengesetzte C-Axen Orientierung besitzten |
US6946928B2 (en) * | 2003-10-30 | 2005-09-20 | Agilent Technologies, Inc. | Thin-film acoustically-coupled transformer |
US7391285B2 (en) | 2003-10-30 | 2008-06-24 | Avago Technologies Wireless Ip Pte Ltd | Film acoustically-coupled transformer |
JP2005260484A (ja) * | 2004-03-10 | 2005-09-22 | Tdk Corp | 圧電共振器およびそれを備えた電子部品 |
JP2005277454A (ja) * | 2004-03-22 | 2005-10-06 | Tdk Corp | 圧電共振器およびそれを備えた電子部品 |
JP4280198B2 (ja) * | 2004-04-30 | 2009-06-17 | 株式会社東芝 | 薄膜圧電共振器 |
US7161448B2 (en) * | 2004-06-14 | 2007-01-09 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator performance enhancements using recessed region |
US20060059269A1 (en) * | 2004-09-13 | 2006-03-16 | Chien Chen | Transparent recovery of switch device |
US7388454B2 (en) * | 2004-10-01 | 2008-06-17 | Avago Technologies Wireless Ip Pte Ltd | Acoustic resonator performance enhancement using alternating frame structure |
US7098758B2 (en) * | 2004-11-03 | 2006-08-29 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustically coupled thin-film resonators having an electrode with a tapered edge |
US8981876B2 (en) * | 2004-11-15 | 2015-03-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Piezoelectric resonator structures and electrical filters having frame elements |
US20060125084A1 (en) * | 2004-12-15 | 2006-06-15 | Fazzio Ronald S | Integration of micro-electro mechanical systems and active circuitry |
US7202560B2 (en) * | 2004-12-15 | 2007-04-10 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Wafer bonding of micro-electro mechanical systems to active circuitry |
US7791434B2 (en) * | 2004-12-22 | 2010-09-07 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric |
DE102005004435B4 (de) * | 2005-01-31 | 2006-10-19 | Infineon Technologies Ag | Baw-resonator |
US7427819B2 (en) * | 2005-03-04 | 2008-09-23 | Avago Wireless Ip Pte Ltd | Film-bulk acoustic wave resonator with motion plate and method |
US7369013B2 (en) * | 2005-04-06 | 2008-05-06 | Avago Technologies Wireless Ip Pte Ltd | Acoustic resonator performance enhancement using filled recessed region |
US20060274476A1 (en) * | 2005-04-13 | 2006-12-07 | Andrew Cervin-Lawry | Low loss thin film capacitor and methods of manufacturing the same |
US7436269B2 (en) | 2005-04-18 | 2008-10-14 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustically coupled resonators and method of making the same |
US20070063777A1 (en) * | 2005-08-26 | 2007-03-22 | Mircea Capanu | Electrostrictive devices |
US7868522B2 (en) | 2005-09-09 | 2011-01-11 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Adjusted frequency temperature coefficient resonator |
US7362035B2 (en) * | 2005-09-22 | 2008-04-22 | The Penn State Research Foundation | Polymer bulk acoustic resonator |
US7486003B1 (en) * | 2005-09-22 | 2009-02-03 | Sei-Joo Jang | Polymer bulk acoustic resonator |
US7391286B2 (en) * | 2005-10-06 | 2008-06-24 | Avago Wireless Ip Pte Ltd | Impedance matching and parasitic capacitor resonance of FBAR resonators and coupled filters |
US7675390B2 (en) * | 2005-10-18 | 2010-03-09 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic galvanic isolator incorporating single decoupled stacked bulk acoustic resonator |
US7525398B2 (en) * | 2005-10-18 | 2009-04-28 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustically communicating data signals across an electrical isolation barrier |
US7423503B2 (en) * | 2005-10-18 | 2008-09-09 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic galvanic isolator incorporating film acoustically-coupled transformer |
US7737807B2 (en) | 2005-10-18 | 2010-06-15 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic galvanic isolator incorporating series-connected decoupled stacked bulk acoustic resonators |
US7463499B2 (en) * | 2005-10-31 | 2008-12-09 | Avago Technologies General Ip (Singapore) Pte Ltd. | AC-DC power converter |
US7561009B2 (en) * | 2005-11-30 | 2009-07-14 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator (FBAR) devices with temperature compensation |
US7612636B2 (en) * | 2006-01-30 | 2009-11-03 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Impedance transforming bulk acoustic wave baluns |
US7694397B2 (en) * | 2006-02-24 | 2010-04-13 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Method of manufacturing an acoustic mirror for piezoelectric resonator |
US7746677B2 (en) | 2006-03-09 | 2010-06-29 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | AC-DC converter circuit and power supply |
US20070210724A1 (en) * | 2006-03-09 | 2007-09-13 | Mark Unkrich | Power adapter and DC-DC converter having acoustic transformer |
US7479685B2 (en) * | 2006-03-10 | 2009-01-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Electronic device on substrate with cavity and mitigated parasitic leakage path |
FR2905207B1 (fr) | 2006-08-28 | 2009-01-30 | St Microelectronics Sa | Filtre commutable a resonateurs. |
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US20080202239A1 (en) * | 2007-02-28 | 2008-08-28 | Fazzio R Shane | Piezoelectric acceleration sensor |
US20090079514A1 (en) * | 2007-09-24 | 2009-03-26 | Tiberiu Jamneala | Hybrid acoustic resonator-based filters |
US7791435B2 (en) * | 2007-09-28 | 2010-09-07 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Single stack coupled resonators having differential output |
US8531083B2 (en) * | 2008-02-25 | 2013-09-10 | Resonance Semiconductor Corporation | Devices having a tunable acoustic path length and methods for making same |
US7732977B2 (en) * | 2008-04-30 | 2010-06-08 | Avago Technologies Wireless Ip (Singapore) | Transceiver circuit for film bulk acoustic resonator (FBAR) transducers |
US7855618B2 (en) * | 2008-04-30 | 2010-12-21 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator electrical impedance transformers |
US8228141B2 (en) * | 2008-11-26 | 2012-07-24 | The Board Of Regents For Oklahoma State University | Q enhancement in micromachined lateral-extensional resonators |
US8373519B2 (en) * | 2009-01-26 | 2013-02-12 | Resonance Semiconductor Corporation | Switchable power combiner |
JP2010190706A (ja) * | 2009-02-18 | 2010-09-02 | Panasonic Corp | 慣性力センサ |
US8248185B2 (en) * | 2009-06-24 | 2012-08-21 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic resonator structure comprising a bridge |
US8902023B2 (en) * | 2009-06-24 | 2014-12-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator structure having an electrode with a cantilevered portion |
US8193877B2 (en) * | 2009-11-30 | 2012-06-05 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Duplexer with negative phase shifting circuit |
US8796904B2 (en) | 2011-10-31 | 2014-08-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator comprising piezoelectric layer and inverse piezoelectric layer |
US9243316B2 (en) | 2010-01-22 | 2016-01-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method of fabricating piezoelectric material with selected c-axis orientation |
FR2966305B1 (fr) * | 2010-10-15 | 2013-07-12 | Commissariat Energie Atomique | Structure acoustique heterogene formee a partir d'un materiau homogene |
US8962443B2 (en) | 2011-01-31 | 2015-02-24 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Semiconductor device having an airbridge and method of fabricating the same |
US9425764B2 (en) | 2012-10-25 | 2016-08-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having composite electrodes with integrated lateral features |
US9083302B2 (en) | 2011-02-28 | 2015-07-14 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Stacked bulk acoustic resonator comprising a bridge and an acoustic reflector along a perimeter of the resonator |
US9136818B2 (en) | 2011-02-28 | 2015-09-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Stacked acoustic resonator comprising a bridge |
US9048812B2 (en) | 2011-02-28 | 2015-06-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer |
US9154112B2 (en) | 2011-02-28 | 2015-10-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge |
US9148117B2 (en) | 2011-02-28 | 2015-09-29 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Coupled resonator filter comprising a bridge and frame elements |
US9203374B2 (en) | 2011-02-28 | 2015-12-01 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator comprising a bridge |
US8575820B2 (en) | 2011-03-29 | 2013-11-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Stacked bulk acoustic resonator |
US9444426B2 (en) | 2012-10-25 | 2016-09-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Accoustic resonator having integrated lateral feature and temperature compensation feature |
US8350445B1 (en) | 2011-06-16 | 2013-01-08 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator comprising non-piezoelectric layer and bridge |
US8922302B2 (en) | 2011-08-24 | 2014-12-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator formed on a pedestal |
CN110034770A (zh) | 2017-12-07 | 2019-07-19 | 英飞凌科技股份有限公司 | 用于射频滤波器的系统和方法 |
US11146235B1 (en) | 2020-05-15 | 2021-10-12 | Qorvo Us, Inc. | Tunable BAW resonator with ion-conductible structure |
US20230170877A1 (en) * | 2021-11-30 | 2023-06-01 | Texas Instruments Incorporated | Tunable bulk acoustic wave (baw) resonator based on application of radio-frequency (rf) signal to bragg mirror metal layer |
Citations (1)
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---|---|---|---|---|
EP0865157A2 (de) * | 1997-03-13 | 1998-09-16 | Nokia Mobile Phones Ltd. | Akustisches Volumenwellenfilter |
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DE10007577C1 (de) * | 2000-02-18 | 2001-09-13 | Infineon Technologies Ag | Piezoresonator |
US6292143B1 (en) * | 2000-05-04 | 2001-09-18 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Multi-mode broadband patch antenna |
-
2000
- 2000-02-18 DE DE10007577A patent/DE10007577C1/de not_active Expired - Fee Related
-
2001
- 2001-02-06 EP EP01102577A patent/EP1126602B1/de not_active Expired - Lifetime
- 2001-02-20 US US09/789,342 patent/US6534900B2/en not_active Expired - Fee Related
Patent Citations (1)
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---|---|---|---|---|
EP0865157A2 (de) * | 1997-03-13 | 1998-09-16 | Nokia Mobile Phones Ltd. | Akustisches Volumenwellenfilter |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008028885A1 (de) * | 2008-06-18 | 2009-12-31 | Epcos Ag | Verfahren zur Abstimmung einer Resonanzfrequenz eines piezoelektrischen Bauelementes |
US8324784B2 (en) | 2008-06-18 | 2012-12-04 | Epcos Ag | Method for tuning a resonant frequency of a piezoelectric component |
Also Published As
Publication number | Publication date |
---|---|
EP1126602B1 (de) | 2011-08-17 |
EP1126602A3 (de) | 2002-01-09 |
EP1126602A2 (de) | 2001-08-22 |
US6534900B2 (en) | 2003-03-18 |
US20010017504A1 (en) | 2001-08-30 |
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