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Patentes

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Número de publicaciónDE10058446 B8
Tipo de publicaciónConcesión
Número de solicitudDE2000158446
Fecha de publicación11 Abr 2013
Fecha de presentación24 Nov 2000
Fecha de prioridad24 Nov 1999
También publicado comoDE10058446A1, DE10058446B4, DE10066441B4, DE10066442B4, DE10066443B4, DE10066443B8, DE10066445B4, DE10066446B4, US6703707, US6798062, US6891265, US6960825, US6967404, US6992383, US6998707, US20040070060, US20040070072, US20040089925, US20040089940, US20040089941, US20040089942, US20040097082, US20050167821
Número de publicación00158446, 2000158446, DE 10058446 B8, DE 10058446B8, DE-B8-10058446, DE00158446, DE10058446 B8, DE10058446B8, DE2000158446
InventoresKuniaki Mamitsu, Yasuyoshi Hirai, Kazuhito Nomura, Yutaka Fukuda, Kazuo Kajimoto, Takeshi Miyajima, Tomoatsu Makino, Yoshimi Nakase
SolicitanteDenso Corporation
Exportar citaBiBTeX, EndNote, RefMan
Enlaces externos: DPMA, Espacenet
Halbleitervorrichtung mit Abstrahlungsbauteilen
DE 10058446 B8
Resumen  disponible en
Descripción  disponible en
Reclamaciones  disponible en
Citas de patentes
Patente citada Fecha de presentación Fecha de publicación Solicitante Título
EP0939436A2 *16 Feb 19991 Sep 1999Lucent Technologies Inc.Manufacture of flip-chip devices
EP1005089A1 *22 Nov 199931 May 2000Alstom HoldingsDispositif électronique de puissance
EP1014451A1 *26 Mar 199728 Jun 2000Hitachi, Ltd.Flat semiconductor device and power converter employing the same
JP2000068447A * Título no disponible
JPH0945773A * Título no disponible
JPH06291223A * Título no disponible
JPH11284176A * Título no disponible
JPS61147539A * Título no disponible
US3295089 *11 Oct 196327 Dic 1966American Mach & FoundrySemiconductor device
US3652903 *1 Feb 197128 Mar 1972Gen ElectricFluid cooled pressure assembly
US4196442 *31 May 19781 Abr 1980Hitachi, Ltd.Semiconductor device
US4240099 *12 Mar 197916 Dic 1980Licentia Patent-Verwaltungs-G.M.B.H.Semiconductor device plastic jacket having first and second annular sheet metal strips with corrugated outer edges embedded in said plastic jacket
US4392153 *6 Nov 19785 Jul 1983General Electric CompanyCooled semiconductor power module including structured strain buffers without dry interfaces
US4470063 *18 Nov 19814 Sep 1984Hitachi, Ltd.Copper matrix electrode having carbon fibers therein
US4935803 *9 Sep 198819 Jun 1990Motorola, Inc.Self-centering electrode for power devices
US5006921 *31 Mar 19899 Abr 1991Kabushiki Kaisha ToshibaPower semiconductor switching apparatus with heat sinks
US5276586 *22 Abr 19924 Ene 1994Hitachi, Ltd.Bonding structure of thermal conductive members for a multi-chip module
US5352629 *19 Ene 19934 Oct 1994General Electric CompanyProcess for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules
US5563076 *29 Sep 19948 Oct 1996Fuji Electric Co., Ltd.Process for adjusting heights of plural semiconductor devices on a circuit board
US5669546 *13 Mar 199523 Sep 1997Fuji Electric Co., Ltd.Apparatus for manufacturing semiconductor device and method of manufacturing the semiconductor device using the same
US5856913 *21 Abr 19975 Ene 1999Semikron Elektronik GmbhMultilayer semiconductor device having high packing density
Eventos legales
FechaCódigoEventoDescripción
4 Ene 20078110Request for examination paragraph 44
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