DE10084996B8 - Solder-carrying body for use in soldering operations - Google Patents

Solder-carrying body for use in soldering operations Download PDF

Info

Publication number
DE10084996B8
DE10084996B8 DE10084996A DE10084996A DE10084996B8 DE 10084996 B8 DE10084996 B8 DE 10084996B8 DE 10084996 A DE10084996 A DE 10084996A DE 10084996 A DE10084996 A DE 10084996A DE 10084996 B8 DE10084996 B8 DE 10084996B8
Authority
DE
Germany
Prior art keywords
solder
carrying body
soldering operations
soldering
operations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10084996A
Other languages
German (de)
Other versions
DE10084996B4 (en
DE10084996T1 (en
Inventor
Joseph S. Cachina
James R. Zanolli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NAS Interplex Industries Inc
Original Assignee
NAS Interplex Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NAS Interplex Industries Inc filed Critical NAS Interplex Industries Inc
Publication of DE10084996B4 publication Critical patent/DE10084996B4/en
Application granted granted Critical
Publication of DE10084996B8 publication Critical patent/DE10084996B8/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
DE10084996A 1999-09-20 2000-09-20 Solder-carrying body for use in soldering operations Expired - Fee Related DE10084996B8 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15477199P 1999-09-20 1999-09-20
US60/154,771 1999-09-20
PCT/US2000/026160 WO2001022785A1 (en) 1999-09-20 2000-09-20 Solder-bearing wafer for use in soldering operations

Publications (2)

Publication Number Publication Date
DE10084996B4 DE10084996B4 (en) 2008-09-18
DE10084996B8 true DE10084996B8 (en) 2009-01-29

Family

ID=22552709

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10084996A Expired - Fee Related DE10084996B8 (en) 1999-09-20 2000-09-20 Solder-carrying body for use in soldering operations
DE10084996T Pending DE10084996T1 (en) 1999-09-20 2000-09-20 Solder-carrying wafer for use in soldering processes

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE10084996T Pending DE10084996T1 (en) 1999-09-20 2000-09-20 Solder-carrying wafer for use in soldering processes

Country Status (5)

Country Link
CN (2) CN1203733C (en)
AU (1) AU7609500A (en)
DE (2) DE10084996B8 (en)
GB (1) GB2372154B (en)
WO (1) WO2001022785A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1203733C (en) * 1999-09-20 2005-05-25 纳斯因特普拉克斯工业公司 Solder-bearing wafer for use in soldering operations
DE10229953A1 (en) * 2002-07-03 2004-01-29 Hartmann Codier Gmbh & Co.Kg Component for PCB assembly
CN101752705B (en) * 2008-11-28 2012-11-28 富士康(昆山)电脑接插件有限公司 Electric coupler
CN107538094B (en) * 2017-09-19 2018-08-14 南昌航空大学 A kind of precision resistance method for welding of stranded conductor and microfilament
CN111842015A (en) * 2019-04-28 2020-10-30 江苏长电科技股份有限公司 Printing apparatus and printing method
CN116851986B (en) * 2023-09-05 2023-11-21 微网优联科技(成都)有限公司 Efficient welding device and method for camera module and PCB

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4216350A (en) * 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
US4641426A (en) * 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US5046957A (en) * 1990-06-25 1991-09-10 Amp Incorporated Solder plate assembly and method
DE19653499A1 (en) * 1995-12-25 1997-06-26 Mitsubishi Electric Corp Solder application method for solder bump manufacture in e.g. ball grid array
US5875546A (en) * 1995-11-03 1999-03-02 North American Specialties Corporation Method of forming solder-holding clips for applying solder to connectors
WO1999030543A1 (en) * 1997-12-08 1999-06-17 Minnesota Mining And Manufacturing Company Method for making circuit elements for a z-axis interconnect

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684055A (en) * 1985-09-09 1987-08-04 Harris Corporation Method of selectively soldering the underside of a substrate having leads
US4956913A (en) * 1988-05-11 1990-09-18 E. I. Du Pont De Nemours And Company Pin alignment method
US4807799A (en) * 1988-06-01 1989-02-28 Raychem Corporation Device for applying solder
JP3387282B2 (en) * 1995-08-03 2003-03-17 日産自動車株式会社 Semiconductor device structure and method of manufacturing the same
US5875102A (en) * 1995-12-20 1999-02-23 Intel Corporation Eclipse via in pad structure
US5796590A (en) * 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
US6119920A (en) * 1996-12-20 2000-09-19 Rf Monolithics, Inc. Method of forming an electronic package with a solder seal
JP3792358B2 (en) * 1997-07-30 2006-07-05 京セラ株式会社 Optical connection component and manufacturing method thereof
CN1203733C (en) * 1999-09-20 2005-05-25 纳斯因特普拉克斯工业公司 Solder-bearing wafer for use in soldering operations

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4216350A (en) * 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
US4641426A (en) * 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US5046957A (en) * 1990-06-25 1991-09-10 Amp Incorporated Solder plate assembly and method
US5875546A (en) * 1995-11-03 1999-03-02 North American Specialties Corporation Method of forming solder-holding clips for applying solder to connectors
DE19653499A1 (en) * 1995-12-25 1997-06-26 Mitsubishi Electric Corp Solder application method for solder bump manufacture in e.g. ball grid array
WO1999030543A1 (en) * 1997-12-08 1999-06-17 Minnesota Mining And Manufacturing Company Method for making circuit elements for a z-axis interconnect

Also Published As

Publication number Publication date
AU7609500A (en) 2001-04-24
CN1390437A (en) 2003-01-08
GB0205160D0 (en) 2002-04-17
DE10084996B4 (en) 2008-09-18
CN1668168B (en) 2010-12-01
WO2001022785A9 (en) 2002-11-28
GB2372154B (en) 2003-09-24
WO2001022785A1 (en) 2001-03-29
CN1203733C (en) 2005-05-25
DE10084996T1 (en) 2002-11-07
GB2372154A (en) 2002-08-14
CN1668168A (en) 2005-09-14

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8396 Reprint of erroneous front page
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20150401