DE10196262T1 - Füllsystem - Google Patents

Füllsystem

Info

Publication number
DE10196262T1
DE10196262T1 DE10196262T DE10196262T DE10196262T1 DE 10196262 T1 DE10196262 T1 DE 10196262T1 DE 10196262 T DE10196262 T DE 10196262T DE 10196262 T DE10196262 T DE 10196262T DE 10196262 T1 DE10196262 T1 DE 10196262T1
Authority
DE
Germany
Prior art keywords
filling system
filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10196262T
Other languages
English (en)
Inventor
Jesse Pedigo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/752,503 external-priority patent/US6506332B2/en
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of DE10196262T1 publication Critical patent/DE10196262T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0182—Using a temporary spacer element or stand-off during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
DE10196262T 2000-05-31 2001-05-24 Füllsystem Withdrawn DE10196262T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20845600P 2000-05-31 2000-05-31
US09/752,503 US6506332B2 (en) 2000-05-31 2000-12-28 Filling method
PCT/US2001/016956 WO2001093647A2 (en) 2000-05-31 2001-05-24 Filling method

Publications (1)

Publication Number Publication Date
DE10196262T1 true DE10196262T1 (de) 2003-05-15

Family

ID=26903212

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10196262T Withdrawn DE10196262T1 (de) 2000-05-31 2001-05-24 Füllsystem

Country Status (7)

Country Link
US (3) US6793852B2 (de)
JP (1) JP2004501513A (de)
KR (1) KR20030007753A (de)
CN (1) CN1444839A (de)
AU (1) AU2001274958A1 (de)
DE (1) DE10196262T1 (de)
WO (1) WO2001093647A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001093648A2 (en) * 2000-05-31 2001-12-06 Honeywell International Inc. Filling device
US7557304B2 (en) * 2006-11-08 2009-07-07 Motorola, Inc. Printed circuit board having closed vias
US7427562B2 (en) * 2006-11-08 2008-09-23 Motorla, Inc. Method for fabricating closed vias in a printed circuit board
GB0624562D0 (en) * 2006-12-08 2007-01-17 Airbus Uk Ltd Self Curing Injection Nozzle
DE102007053513B3 (de) * 2007-11-09 2009-07-16 Itc Intercircuit Electronic Gmbh Füllanlage
WO2012074563A2 (en) * 2010-01-21 2012-06-07 Henkel Corporation Ultrasonic assisted filling of cavities
JP2013171862A (ja) * 2012-02-17 2013-09-02 Tokyo Electron Ltd 金属ペースト充填方法及び金属ペースト充填装置及びビアプラグ作製方法
EP2636322B1 (de) * 2012-03-06 2018-05-23 Hauni Maschinenbau GmbH Vorrichtung zum Einlegen eines oder mehrerer Objekte in eine Filterkomponente eines Tabakstocks und Maschine der Tabak verarbeitenden Industrie
DE102016006813B4 (de) * 2016-06-03 2021-04-08 Ksg Austria Gmbh Verfahren zur Herstellung einer Mehrlagenleiterplatte mit Kontaktierung von Innenlagen sowie Mehrlagenleiterplatte
WO2023036982A1 (en) 2021-09-10 2023-03-16 Harbour Antibodies Bv Anti-sars2-s antibodies

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Also Published As

Publication number Publication date
US6921505B2 (en) 2005-07-26
US20020135104A1 (en) 2002-09-26
US6797224B2 (en) 2004-09-28
US6793852B2 (en) 2004-09-21
AU2001274958A1 (en) 2001-12-11
CN1444839A (zh) 2003-09-24
KR20030007753A (ko) 2003-01-23
US20020113330A1 (en) 2002-08-22
WO2001093647A2 (en) 2001-12-06
WO2001093647A3 (en) 2002-04-04
US20020089086A1 (en) 2002-07-11
JP2004501513A (ja) 2004-01-15

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