DE102004049053A1 - Printed circuit board (PCB) with spark path for overvoltage protection between two electrically conductive regions on PCB, especially caused by electrostatic discharge (ESD), for electronic modules - Google Patents

Printed circuit board (PCB) with spark path for overvoltage protection between two electrically conductive regions on PCB, especially caused by electrostatic discharge (ESD), for electronic modules Download PDF

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Publication number
DE102004049053A1
DE102004049053A1 DE102004049053A DE102004049053A DE102004049053A1 DE 102004049053 A1 DE102004049053 A1 DE 102004049053A1 DE 102004049053 A DE102004049053 A DE 102004049053A DE 102004049053 A DE102004049053 A DE 102004049053A DE 102004049053 A1 DE102004049053 A1 DE 102004049053A1
Authority
DE
Germany
Prior art keywords
pcb
spark
esd
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102004049053A
Other languages
German (de)
Inventor
Uli Joos
Armin Lenk
Michael Krautmacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Priority to DE102004049053A priority Critical patent/DE102004049053A1/en
Publication of DE102004049053A1 publication Critical patent/DE102004049053A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/026—Spark gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00—Overvoltage arresters using spark gaps
    • H01T4/08—Overvoltage arresters using spark gaps structurally associated with protected apparatus

Abstract

On second conductive region (2) is formed second spark tip in direction of first region (1). Between first region spark tip (11) and second spark tip remains gap (d2) which is greater than gap (d0) between each spark tip and opposite rim of opposite region.Preferably both regions, including spark tips, are structured by etching. PCB may be coated by non-conductive protective layer in section adjacent to spark tip and opposite rim, while spark path proper is without any protective layer.
DE102004049053A 2003-10-11 2004-10-08 Printed circuit board (PCB) with spark path for overvoltage protection between two electrically conductive regions on PCB, especially caused by electrostatic discharge (ESD), for electronic modules Withdrawn DE102004049053A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102004049053A DE102004049053A1 (en) 2003-10-11 2004-10-08 Printed circuit board (PCB) with spark path for overvoltage protection between two electrically conductive regions on PCB, especially caused by electrostatic discharge (ESD), for electronic modules

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10347344 2003-10-11
DE102004049053A DE102004049053A1 (en) 2003-10-11 2004-10-08 Printed circuit board (PCB) with spark path for overvoltage protection between two electrically conductive regions on PCB, especially caused by electrostatic discharge (ESD), for electronic modules

Publications (1)

Publication Number Publication Date
DE102004049053A1 true DE102004049053A1 (en) 2005-05-04

Family

ID=34399466

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004049053A Withdrawn DE102004049053A1 (en) 2003-10-11 2004-10-08 Printed circuit board (PCB) with spark path for overvoltage protection between two electrically conductive regions on PCB, especially caused by electrostatic discharge (ESD), for electronic modules

Country Status (1)

Country Link
DE (1) DE102004049053A1 (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009129188A1 (en) * 2008-04-14 2009-10-22 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US7872251B2 (en) 2006-09-24 2011-01-18 Shocking Technologies, Inc. Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same
US20110058291A1 (en) * 2009-09-09 2011-03-10 Lex Kosowsky Geometric configuration or alignment of protective material in a gap structure for electrical devices
US7923844B2 (en) 2005-11-22 2011-04-12 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US7968014B2 (en) 2006-07-29 2011-06-28 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
DE102010025887A1 (en) 2010-07-02 2012-01-05 Siemens Aktiengesellschaft Spark gap, circuit board and method for their production
US8117743B2 (en) 1999-08-27 2012-02-21 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8362871B2 (en) 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8968606B2 (en) 2009-03-26 2015-03-03 Littelfuse, Inc. Components having voltage switchable dielectric materials
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US9208930B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
DE102015205700A1 (en) 2015-03-30 2016-10-06 Robert Bosch Gmbh Electronic device

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9144151B2 (en) 1999-08-27 2015-09-22 Littelfuse, Inc. Current-carrying structures fabricated using voltage switchable dielectric materials
US8117743B2 (en) 1999-08-27 2012-02-21 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
US7923844B2 (en) 2005-11-22 2011-04-12 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US8310064B2 (en) 2005-11-22 2012-11-13 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US7981325B2 (en) 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
US7968015B2 (en) 2006-07-29 2011-06-28 Shocking Technologies, Inc. Light-emitting diode device for voltage switchable dielectric material having high aspect ratio particles
US7968014B2 (en) 2006-07-29 2011-06-28 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US8163595B2 (en) 2006-09-24 2012-04-24 Shocking Technologies, Inc. Formulations for voltage switchable dielectric materials having a stepped voltage response and methods for making the same
US7872251B2 (en) 2006-09-24 2011-01-18 Shocking Technologies, Inc. Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
KR101235950B1 (en) * 2008-04-14 2013-02-21 쇼킹 테크놀로지스 인코포레이티드 Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
CN101965758B (en) * 2008-04-14 2012-08-29 肖克科技有限公司 Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
WO2009129188A1 (en) * 2008-04-14 2009-10-22 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US9208930B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US8362871B2 (en) 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8968606B2 (en) 2009-03-26 2015-03-03 Littelfuse, Inc. Components having voltage switchable dielectric materials
US9053844B2 (en) * 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
US20110058291A1 (en) * 2009-09-09 2011-03-10 Lex Kosowsky Geometric configuration or alignment of protective material in a gap structure for electrical devices
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
DE102010025887A1 (en) 2010-07-02 2012-01-05 Siemens Aktiengesellschaft Spark gap, circuit board and method for their production
WO2012000697A1 (en) 2010-07-02 2012-01-05 Siemens Aktiengesellschaft Spark gap, printed circuit board and method for producing same
DE102015205700A1 (en) 2015-03-30 2016-10-06 Robert Bosch Gmbh Electronic device
WO2016156011A1 (en) 2015-03-30 2016-10-06 Robert Bosch Gmbh Electronic device
US10512156B2 (en) 2015-03-30 2019-12-17 Robert Bosch Gmbh Electronic device

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Legal Events

Date Code Title Description
R005 Application deemed withdrawn due to failure to request examination

Effective date: 20111011