DE102005032804B4 - Multilayer structure for receiving an electronic circuit - Google Patents

Abstract

Multilayer structure for receiving an electronic circuit, in particular printed circuit board, with a layer arrangement of a plurality of insulating layers and a plurality of conductor layers, in which on one side of an insulating layer (1) a printed functional layer (6) with printed circuit elements (4) is applied and on the side opposite to the side Side of the insulating layer (1) a conductor layer (3) with conductor structures (13) is formed, wherein the printed conductor elements (4) of the printed functional layer (6) via conductive passages (2) in the insulating layer (1) with the conductor structures (13). and wherein on at least part of the printed circuit elements (4) in the printed functional layer (6) a galvanically formed, metallic conductor layer (5) is arranged, wherein on the back of a layer arrangement mechanically stabilizing carrier substrate (12) is pressed.

Description

The The invention relates to a multilayer structure for receiving a electronic circuit, in particular printed circuit board.

State of the art

To the Recording an electronic circuit are usually multi-layered Printed circuit boards used which have one or more conductor layers as well include one or more insulating layers. With the help of the conductor layers are formed conductor tracks, which are used to connect the male serve electronic circuit. But it is also known, with help the conductor layers to form passive components, for example Resistors, capacitors, shields, Antennas or inductors.

From the document DE 197 05 003 A1 a bi- or multilayer arrangement is known in which a pad or conductor layer is electrodeposited. By means of repeated electrodeposition, conductor tracks and / or further internal connections are created.

In the document DE 199 22 468 C2 For example, a method of making electrical connection between multilayer conductor structures is disclosed. The document teaches that in making electrical contacts in wiring planes for multilayer structures in electronic package fabrication, through holes or blind holes are made vertical to the individual wiring planes, also referred to as vias, which are metallized in a subsequent process step. Usually, the metallization of the through holes or blind holes is done by means of electroless plating. In this case, it is a prerequisite that a metallization base or a metallization nucleus are formed in the holes. It is proposed to use exposed metal particles in an insulating layer, which is mixed with metal particles, as metallization nuclei for the subsequently performed galvanic metal deposition process. The metal deposition either takes place on the inner wall of a vertical connection channel or leads to the complete filling of the connection channel with metal. By means of the thus metallized connection channel superimposed wiring levels are contacted.

The publication US 5,830,563 A discloses a multi-layer composite in which a plurality of insulating layers and a plurality of layers alternate with conductive elements, the conductive elements being partially interconnected through the layers. The line elements are formed by electroless deposition and can be thickened by electrodeposition.

The publication EP 0 222 618 A2 discloses a multilayer integrated circuit formed on an insulator layer having alternating insulator layers and layers of screen printed conductive components and interconnect structures between the conductor components of different layers.

The publication EP 1 450 590 A2 discloses a multilayer structure of alternating insulator layers and layers with conductor components, wherein vertical line connections are provided between a plurality of conductor layers. A second conductive layer is electrodeposited onto a first conductive layer disposed in an opening to provide conductive connections within the corresponding portion of the multilayer structure.

The publication US Pat. No. 6,287,890 B1 shows a method for producing a multilayer structure, wherein an insulator layer is first deposited on a metallic substrate to form a mask, further metal is deposited on exposed areas of the mask on the metallic substrate, and finally, after removal of the insulator layer in an etching step, remain thin Metal areas are etched so that only the reinforced conductor areas remain.

When a modern technology for forming conductor structures up to towards electronic circuits, printing has evolved. Here are the desired Structures produced by means of various printing processes, wherein Materials are printed, the electrically conductive particles contain. For example, an inkjet method is usable. The Advantages of printed circuits are, in particular, that in comparison to conventional Printed circuit boards for forming the structures no copper foil too edit, so no etching processes and processes associated with a photomask are necessary.

The invention

task It is an object of the invention to provide an improved multilayer structure for receiving to create an electronic circuit in which the design options for forming components based on printed conductor structures are improved.

This object is achieved by a multi-layer structure according to the independent Claim 1 solved.

According to the invention is a Multilayer structure for receiving an electronic circuit, in particular Printed circuit board, with a layer arrangement of several insulating layers and a plurality of conductor layers, in which on one side an insulating layer a printed functional layer with printed Conductor elements is applied and on the opposite side to the side Side of the insulating layer, a conductor layer with conductor structures is formed, wherein the printed conductor elements of the printed Functional layer over conductive passages in the insulating layer are connected to the conductor structures and being on at least a part of the printed circuit elements in the printed functional layer in each case a galvanically formed, metallic Conductor layer is arranged.

On this way, an integrated multilayer structure is created, in which the printed matter covered by the printed functional layer Conductor elements provided with galvanically formed conductor layers are so that the design options for the electrical / electronic elements in the functional layer essential are extended. While Printed conductor elements with regard to their design variants are limited, in particular with respect the formable thickness of the printed layer structures, can with Help of the galvanically formed conductor layer on this individually adapted structures / components made become. The thickness of the galvanically formed, metallic conductor layer can be customized be by the process parameters be set during the electrodeposition, for example the duration of the deposition process can be varied to different Form layer thicknesses. Galvanic deposition processes for manufacturing Metallic layers are as such in various process designs known.

A preferred embodiment of the invention provides that the printed Functional layer comprises printed components, whereby the design variety expanded in the printed functional layer.

The Application options are in an advantageous embodiment the invention thereby extended that the printed components one or more with the help of the printed conductor elements and the respective galvanically formed metallic conductor layer thereon comprise formed, passive components.

Prefers the insulating layer is made with the help of a foil. printed Films with electrical lines and / or circuits formed thereon are in different embodiments available. For example, polymer materials are used.

A simple and inexpensive execution the invention is achieved in that the back of the layer arrangement mechanically stabilizing carrier substrate aufgpreßt is. In this way it can be used in conjunction with the usual PCB manufacturing resorted to known method step become. In this way it is also achieved that the layer arrangement of a conventional Printed circuit board can be processed accordingly in the manufacturing process. It is provided sufficient mechanical stabilization, so that the Handling during the different process steps and the transport between the process steps without damaging the layer arrangement guaranteed can be.

The conducting passageways for electrically connecting the printed conductor elements to the conductor patterns can preferably completely be metallized. Alternatively, a continuous metallization be provided on an inner wall of the passages. The ladder structures on the opposite side Side of the insulating layer are used in particular for contacting electronic components of the male electronic circuit, which in turn then over the conductor structures and the printed conductor element passages and connected thereto on the galvanically formed conductor layers is. The printed circuit elements and the partially galvanic formed thereon Conductor layers form a kind of wiring plane in which optional also passive components can be formed.

Preferred embodiment the invention

The Invention will be described below with reference to an embodiment with reference explained in more detail on the figures of a drawing. Hereby show:

1 a schematic sectional view of a Schichtannordnung with an insulating layer in which metallized passages are formed;

2 a schematic sectional view of the layer arrangement according to 1 wherein printed on the insulating layer in the region of the passages printed circuit elements;

3 a schematic sectional view of the layer arrangement according to 2 wherein in each case a galvanically formed conductor layer is deposited on the printed conductor elements;

4 a schematic sectional view of the layer arrangement according to 3 , being in one Functional layer components are printed on the insulating layer;

5 a schematic sectional view of the layer arrangement according to 4 wherein on the functional layer, a further insulating layer is applied by means of printing and in the further insulating layer, a further metallized passage is formed;

6 a schematic sectional view of the layer arrangement according to 5 , on the further insulating layer further printed circuit elements are printed;

7 a schematic sectional view of the layer arrangement according to 6 , wherein on the other printed circuit elements further components are printed; and

8th a schematic sectional view of a multi-layer structure with the layer arrangement according to 7 in which a rear-side insulating layer is pressed on and front side conductor structures are formed.

in the The following will be the preparation of a multilayer structure for picking up an electronic circuit to an embodiment described in detail. In this case, printing methods for applying structures from electrically conductive materials as well as electrically non-conductive materials used. Such methods are well known to those skilled in the art and therefore will not be closer here described.

1 shows a schematic sectional view of a layer arrangement with an insulating layer 1 that with passages 2 is provided. The insulating layer 1 is preferably formed by means of a film of a non-conductive material. The passages are expediently generated by means of a selective laser processing. For example, a pulsed CO ₂ laser carries only the insulating layer 1 from. The passages 2 are completely filled with a conductive material, wherein the filling is preferably carried out by means of electrodeposition of the conductive material. Opposite is the insulating layer 1 with a metal layer 3 provided with the material in the passages 2 is in contact and is formed, for example, of copper. The metal layer 3 is either in a preliminary step on the insulating layer 1 deposited by thin-film technique in a vacuum or in a Heißlaminierprozeß as a thin metal foil with the insulating layer 1 laminated.

2 shows a schematic sectional view of the layer arrangement according to 1 , Wherein, on the insulating layer 1 in the region of the passages 2 printed conductor elements 4 are printed. As the printing method, for example, an Iraqjet method or the like is used, with which an electrically conductive particle-containing material is printed. Instead of the material with conductive particles, it is also possible to print an intrinsically conductive polymer or liposome-supported metal clusters.

3 shows a schematic sectional view of the layer arrangement according to 2 , wherein on the printed conductor elements 4 in each case a galvanically formed, metallic conductor layer 5 is deposited. With the help of the galvanically formed conductor layers 5 It allows the electrical resistance of printed circuit elements 4 significantly lower and adapt to given application parameters. The metallized passages 2 serve to connect the printed circuit elements 4 with the metal layer 3 and enable the electrodeposition of the conductor layers during a plating process 5 made of metal on the printed conductor elements 4 ,

The layer thickness of the galvanically formed conductor layers 5 can be adjusted individually according to the requirements for the respective multi-layer structure by means of the galvanization process. While the printed conductor elements 4 , which contain electrically conductive particles, are limited in their design for the production of conductor and / or component structures, allows the deposition of the electrodeposited conductor layers 5 overcoming these limits.

4 shows a schematic sectional view of the layer arrangement according to 3 , being in a printed functional layer 6 one or more components 7 , which at least partially to the previously galvanically formed conductor layer 5 connect to the insulating layer 1 are printed.

5 shows a schematic sectional view of the layer arrangement according to 4 , being on the printed functional layer 6 another insulating layer 8th applied by means of printing. In the further insulating layer 8th is another passage 8a formed, which in turn may preferably be filled with galvanized metal.

6 shows a schematic sectional view of the layer arrangement according to 5 , wherein on the further insulating layer 8th further printed conductor elements 9 are printed. This is done in a similar manner as above for the printed circuit elements 4 combined with 2 was explained.

7 shows a schematic sectional view position of the layer arrangement 6 , wherein the other printed circuit elements 9 other components 10 printed by means of printing process.

8th shows a schematic sectional view of a multi-layer structure 11 based on the layer arrangement according to 1 to 7 , at the back a carrier substrate 12 is pressed from a non-conductive material and the metal layer 3 for forming printed conductor and / or pad structures 13 is edited. The trace and / or pad structures 13 are fabricated using the processes known for printed circuit board fabrication, such as photomasking and etching. On the trace and / or pad structures 13 In the usual way, as is known for printed circuit boards or other layer structures, electronic components (not shown) can be applied by means of known technologies, in particular soldering or conductive bonding.

The multi-layer structure 11 to 8th and the process for their preparation, which is described above with reference to the 1 to 8th have been explained form only an example of the use of the electrodeposited conductor layers 5 on the printed conductor elements 4 , Basically, based on the layer arrangement in 3 Subsequently, any layer structures with layers of electrically conductive and / or non-conductive material can be applied. In particular, it is possible to provide the multilayer structure as an HDI printed circuit board (HDI - "High Density Interconnections") with the buried components 7 and the other components 10 perform.

The in the foregoing description, claims and drawings Features of the invention can both individually and in any combination for the realization of the invention in its various embodiments of importance be.

Claims (6)

Multilayer structure for receiving an electronic circuit, in particular printed circuit board, with a layer arrangement of a plurality of insulating layers and a plurality of conductor layers, in which on one side an insulating layer ( 1 ) a printed functional layer ( 6 ) with printed circuit elements ( 4 ) is applied and on the side opposite to the side of the insulating layer ( 1 ) a conductor layer ( 3 ) with ladder structures ( 13 ), wherein the printed conductor elements ( 4 ) of the printed functional layer ( 6 ) via conducting passages ( 2 ) in the insulating layer ( 1 ) with the ladder structures ( 13 ) and wherein on at least a part of the printed circuit elements ( 4 ) in the printed functional layer ( 6 ) a galvanically formed, metallic conductor layer ( 5 ), wherein at the back a layer arrangement mechanically stabilizing carrier substrate ( 12 ) is pressed. Multilayer structure according to Claim 1, characterized in that the printed functional layer ( 6 ) printed components ( 7 ). Multilayer structure according to Claim 2, characterized in that the printed components ( 7 ) one or more using the printed circuit elements ( 4 ) and the respective galvanically formed metallic conductor layer ( 5 ) formed passive components. Multilayer structure according to one of the preceding claims, characterized in that the insulating layer ( 1 ) is carried out with the aid of a film. Multilayer structure according to one of the preceding claims, characterized in that the conductive passages ( 2 ) are completely metallized. Multilayer structure according to one of the preceding Claims, characterized in that the Layer arrangement as an HDI board (HDI - "High Density Interconnections") formed is.