DE102005053765A1 - MEMS-Package und Verfahren zur Herstellung - Google Patents
MEMS-Package und Verfahren zur Herstellung Download PDFInfo
- Publication number
- DE102005053765A1 DE102005053765A1 DE102005053765A DE102005053765A DE102005053765A1 DE 102005053765 A1 DE102005053765 A1 DE 102005053765A1 DE 102005053765 A DE102005053765 A DE 102005053765A DE 102005053765 A DE102005053765 A DE 102005053765A DE 102005053765 A1 DE102005053765 A1 DE 102005053765A1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- mems package
- chip
- carrier substrate
- mems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Das erfindungsgemäße MEMS-Package ist auf einem mechanisch stabilen Trägersubstrat (TS) aufgebaut. Auf dessen Oberseite ist ein MEMS-Chip (MC) montiert. Ebenfalls auf oder über der Oberseite des Trägersubstrats ist zumindest ein Chipbauelement (CB) angeordnet. Eine metallische Schirmungsschicht (SL) überdeckt den MEMS-Chip und das Chipbauelement und schließt mit der Oberseite des Trägersubstrats ab.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005053765.0A DE102005053765B4 (de) | 2005-11-10 | 2005-11-10 | MEMS-Package und Verfahren zur Herstellung |
PCT/DE2006/001945 WO2007054070A1 (de) | 2005-11-10 | 2006-11-06 | Mems-package und verfahren zur herstellung |
US12/092,439 US8169041B2 (en) | 2005-11-10 | 2006-11-06 | MEMS package and method for the production thereof |
JP2008539238A JP5130223B2 (ja) | 2005-11-10 | 2006-11-06 | Memsパッケージおよび製造方法 |
US13/075,936 US8432007B2 (en) | 2005-11-10 | 2011-03-30 | MEMS package and method for the production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005053765.0A DE102005053765B4 (de) | 2005-11-10 | 2005-11-10 | MEMS-Package und Verfahren zur Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102005053765A1 true DE102005053765A1 (de) | 2007-05-16 |
DE102005053765B4 DE102005053765B4 (de) | 2016-04-14 |
Family
ID=37982602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102005053765.0A Active DE102005053765B4 (de) | 2005-11-10 | 2005-11-10 | MEMS-Package und Verfahren zur Herstellung |
Country Status (4)
Country | Link |
---|---|
US (2) | US8169041B2 (de) |
JP (1) | JP5130223B2 (de) |
DE (1) | DE102005053765B4 (de) |
WO (1) | WO2007054070A1 (de) |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008021091A1 (de) * | 2008-04-28 | 2009-10-29 | Epcos Ag | Drucksensor |
DE102009019446A1 (de) * | 2009-04-29 | 2010-11-04 | Epcos Ag | MEMS Mikrofon |
EP2375232A1 (de) * | 2010-04-08 | 2011-10-12 | Robert Bosch GmbH | Drucksensoranordnung |
WO2011144570A1 (de) * | 2010-05-20 | 2011-11-24 | Epcos Ag | Elektrisches bauelement mit flacher bauform und herstellungsverfahren |
DE102010033551A1 (de) * | 2010-08-05 | 2012-02-09 | Epcos Ag | Verfahren zur Herstellung einer Mehrzahl von elektronischen Bauelementen mit elektromagnetischer Schirmung und elektronisches Bauelement mit elektromagnetischer Schirmung |
DE102007027127B4 (de) * | 2006-06-13 | 2012-02-16 | Denso Corporation | Sensor für eine physikalische Grösse |
US8130506B2 (en) | 2008-06-19 | 2012-03-06 | Infineon Technologies Ag | Sensor module |
US20120263978A1 (en) * | 2011-04-14 | 2012-10-18 | Chung-Hsiung Wang | Energy storage device and method of manufacturing the same |
DE102011075260A1 (de) * | 2011-05-04 | 2012-11-08 | Robert Bosch Gmbh | MEMS-Mikrofon |
DE102009016487B4 (de) * | 2008-06-17 | 2013-02-07 | Infineon Technologies Ag | Mikrofonchip |
DE102011086765A1 (de) | 2011-11-22 | 2013-05-23 | Robert Bosch Gmbh | Chip mit mikro-elektromechanischer Struktur und Verfahren zum Herstellen eines Chips mit mikro-elektromechanischer Struktur |
US8713789B2 (en) | 2011-04-26 | 2014-05-06 | Epcos Ag | Method of manufacturing a microphone |
US8865499B2 (en) | 2010-07-08 | 2014-10-21 | Epcos Ag | MEMS microphone and method for producing the MEMS microphone |
DE102013224607A1 (de) | 2013-11-29 | 2015-06-03 | Robert Bosch Gmbh | Mikro-elektromechanische Anordnung und Verfahren zum Aufbau einer mikro-elektromechanischen Anordnung |
WO2015161940A1 (de) * | 2014-04-25 | 2015-10-29 | Epcos Ag | MIKROFON MIT VERGRÖßERTEM RÜCKVOLUMEN UND VERFAHREN ZUR HERSTELLUNG |
WO2015197551A1 (de) * | 2014-06-23 | 2015-12-30 | Epcos Ag | Gehäuse für ein elektrisches bauelement und verfahren zur herstellung eines gehäuses für ein elektrisches bauelement |
EP2657669A3 (de) * | 2012-04-27 | 2016-05-18 | Melexis Technologies NV | TMAP-Sensor-Systeme und Verfahren zu deren Herstellung |
US9386734B2 (en) | 2010-08-05 | 2016-07-05 | Epcos Ag | Method for producing a plurality of electronic devices |
US9556022B2 (en) | 2013-06-18 | 2017-01-31 | Epcos Ag | Method for applying a structured coating to a component |
DE102016208325A1 (de) * | 2016-05-13 | 2017-05-04 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Verfahren zum Verpacken eines Substrats mit einer mindestens eine piezoelektrische Schicht umfassenden mikroelektromechanischen Mikrofonstruktur |
US9818665B2 (en) | 2014-02-28 | 2017-11-14 | Infineon Technologies Ag | Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces |
EP3254728A1 (de) * | 2016-06-08 | 2017-12-13 | BIOTRONIK SE & Co. KG | Stoffschlüssige metallische verbindung basierend auf einer galvanischen abscheidung |
DE102016113347A1 (de) * | 2016-07-20 | 2018-01-25 | Infineon Technologies Ag | Verfahren zum produzieren eines halbleitermoduls |
DE102008005686B4 (de) | 2008-01-23 | 2019-01-31 | Tdk Corporation | MEMS-Bauelement und Verfahren zur Herstellung eines MEMS-Bauelements |
DE102018203098B3 (de) | 2018-03-01 | 2019-06-19 | Infineon Technologies Ag | MEMS-Sensor |
DE112017003785B4 (de) | 2016-07-27 | 2021-09-02 | Knowles Electronics, Llc | Mikroelektromechanische Systemvorrichtungs (MEMS-Vorrichtungs)-Packung |
US11245977B2 (en) | 2014-12-09 | 2022-02-08 | Snaptrack, Inc. | Electric component with sensitive component structures and method for producing an electric component with sensitive component structures |
US11267698B2 (en) | 2014-08-06 | 2022-03-08 | Infineon Technologies Ag | Low profile transducer module |
EP4226957A1 (de) * | 2022-02-10 | 2023-08-16 | F. Hoffmann-La Roche AG | Am körper tragbare medizinische vorrichtung mit dichtungselement |
Families Citing this family (207)
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US7608789B2 (en) * | 2004-08-12 | 2009-10-27 | Epcos Ag | Component arrangement provided with a carrier substrate |
DE102005008511B4 (de) * | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
DE102005008512B4 (de) | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
DE102005008514B4 (de) * | 2005-02-24 | 2019-05-16 | Tdk Corporation | Mikrofonmembran und Mikrofon mit der Mikrofonmembran |
DE102005053767B4 (de) * | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
DE102005053765B4 (de) * | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
DE102006039515B4 (de) * | 2006-08-23 | 2012-02-16 | Epcos Ag | Drehbewegungssensor mit turmartigen Schwingstrukturen |
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EP2177049A1 (de) * | 2007-08-02 | 2010-04-21 | Nxp B.V. | Elektroakustischer wandler mit einem mems-sensor |
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- 2006-11-06 WO PCT/DE2006/001945 patent/WO2007054070A1/de active Application Filing
- 2006-11-06 US US12/092,439 patent/US8169041B2/en active Active
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2011
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Also Published As
Publication number | Publication date |
---|---|
DE102005053765B4 (de) | 2016-04-14 |
US8432007B2 (en) | 2013-04-30 |
JP2009514691A (ja) | 2009-04-09 |
US8169041B2 (en) | 2012-05-01 |
WO2007054070A1 (de) | 2007-05-18 |
US20090001553A1 (en) | 2009-01-01 |
JP5130223B2 (ja) | 2013-01-30 |
US20110186943A1 (en) | 2011-08-04 |
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