DE102008030816A1 - Organic light emitting component, has two substrates mechanically connected with each other by insulating region of connecting unit, and electrically connected with each other by conducting region of connecting unit - Google Patents

Abstract

The component has an opto-electronic element e.g. organic LED, made of organic material and arranged on a substrate. The substrate and another substrate (2) are arranged relative to each other such that the element is arranged between the substrates. A connecting unit (45) has a glass insulating region (4), and a conducting region (5). A channel of the unit arranged between the substrates encloses the element in the form of a housing. The substrates are mechanically connected with each other by the insulating region, and are electrically connected with each other by the conducting region. An independent claim is also included for a method for manufacturing an organic light emitting component.

Description

It becomes a component with at least one organic material as well a process for its preparation indicated.

The publication US 6,936,963 B2 describes an organic radiation-emitting component which is hermetically sealed by means of a glass solder.

The publication US 6,998,776 B2 describes an organic radiation-emitting component which is hermetically sealed by means of a molten glass frit.

A to be solved task is a component with at least indicate an organic material that has a good encapsulation has and is good to contact electrically. Another to be solved The object is a process for efficient production specify such a component.

At least an embodiment of the component comprises a first Substrate and a second substrate. As materials for the substrates may be metals, metal alloys, plastics, semiconductor materials, Ceramics or glasses serve. The substrate can be mechanical be configured rigid or mechanically flexible. Preferably At least the first substrate has a smooth surface. Smooth means that the surface is suitable for this purpose is, on it thin layers, which are organic, for example Light-emitting diodes, short OLEDs, are required to apply. The fat each of the first and second substrates is preferably within the range between 0.2 mm and 3 mm, more preferably between 0.5 mm and 1.5 mm.

At least an embodiment of the component is on the first substrate at least one radiation-emitting or receiving component arranged containing at least one organic material. The device can, for example, as an organic light emitting diode, short OLED, be configured as a detector diode or as a solar cell.

At least an embodiment of the component are first and second Substrate relative to each other arranged such that the device with the at least one organic material between the first and the second substrate is arranged. Preferred are first and second Substrate as flat platelets or plates with each opposite main sides configured. First and second substrate are preferably arranged or designed so that the facing main sides parallel aligned with each other.

At least an embodiment of the component, this has a connecting means on, which is arranged between the first and second substrate. about the connecting means are first and second substrates mechanical connected with each other. Preferably, the connecting means is in a web arranged, the organic material-containing component frame-shaped encloses. The width of the web is preferably in the range between 0.3 mm and 3 mm, in particular between 0.5 mm and 1 mm. The frame-shaped path can be similar to a rectangle be shaped. Depending on the specific requirements but also differently shaped tracks are possible, for example with an L-shaped outline or with a round or oval shape.

At least an embodiment of the component, the connecting means at least one insulator area containing a glass, and at least one ladder area. The ladder area can with an electrically conductive material, for example with a metallic solder, be designed. The insulator area of the Lanyard may in particular as a glass solder or in the form of Glass frits be designed. The insulator area can also admixtures contain. The admixture is for example a binder or may lower the melting point of the material of the insulator area. Also is about the addition of an adjustment of the thermal Expansion coefficients of the insulator region to the thermal Expansion coefficients of first and second substrate possible. Likewise, the admixture can act as a spacer over which is a desired distance between first and second Substrate is adjusted so that the device with the organic Material has a sufficient distance from the second substrate. In addition, the insulator area substances or mixtures include, for example, metals or oxides that are more elemental Form, ionic form or may be present as particles, the a melting or curing of the bonding agent about electromagnetic radiation from the ultraviolet, allow visible or infrared spectral range. Corresponding admixture can also be the material of the conductor area exhibit. It is not necessary that all isolator and / or Ladder areas consist of the same material or the same admixture exhibit.

At least an embodiment of the component comprises at least one the components first substrate, second substrate or connecting means at least one admixture. The admixture can be for example as a reflection, conversion, filter, absorption or scattering means designed be.

In at least one embodiment of the Component includes this at least a first substrate and a second substrate, wherein on the at least one first substrate at least one optoelectronic device is arranged, which contains at least one organic material. The first substrate and the second substrate are arranged relative to one another such that the component is arranged between the first substrate and the second substrate. Furthermore, the component comprises a connection means with at least one insulator region which contains a glass, and at least one conductor region. The connection means is arranged in at least one path between the first substrate and the second substrate, wherein the path of the connection means surrounds the component like a frame and the first and second substrate are mechanically and / or mechanically interconnected via the insulator region and via the conductor region.

A Such arrangement protects the device with the at least an organic material well opposite outer Influences such as moisture and oxygen and guaranteed This increases the life of the component. about the conductor areas of the connecting means is an efficient electrical Contacting of the optoelectronic component possible.

At least an embodiment of the component is on the second Substrate arranged a plurality of first substrates. The first substrates each preferably comprise at least one optoelectronic component with at least one organic material. The different, up The first substrate can be arranged on the second substrate also have different optoelectronic components. So can light-emitting with light-receiving, for example as a detector designed components are combined.

The first substrates can be like a matrix, in the form of columns and rows, placed on the second substrate and a kind Training display. Likewise, it is possible, among other things, that pictogram-like arrangements of first substrates on a second substrate use, so that through components on the first substrates patterns, signs or logos are formed. For example, of the first substrates different colored emitting areas of a display device be formed. By using a variety of first substrates on a second substrate, the design possibilities increase of the component and it can efficiently create a complex component be realized on a single substrate.

At least an embodiment of the component are at least a first substrate at least two electrical lines to Contacting the at least one optoelectronic component appropriate. The cables can be in direct contact to the first substrate, or in places or completely over For example, at least one electrically insulating layer of be separated from this. The electrical lines can be structured be to the electrical wiring of an optoelectronic device to enable. About such electrical lines is an efficient contacting of the optoelectronic component guaranteed.

At least an embodiment of the component, the second substrate at least two electrical conductors on. The tracks can be structured so that a plurality of first substrates on the second substrate is electrically contacted. The tracks may be in direct contact with the second substrate, or also in places or completely over, for example, at least an electrically insulating layer separated from this. Especially by the combination of electrical wires on the first Substrate and electrical traces on the second substrate can also handle complex electrical circuits with one Variety of components are integrated into the component.

At least An embodiment of the component are electrical lines and conductor tracks with a metal, a metal alloy or a transparent, conductive oxide, short TCO, designed. Possible Materials are in particular aluminum, chromium, molybdenum, Copper and / or indium tin oxide. Cables and tracks can consist of a single material or of several layers, which may have different materials. It is possible to vaporize or sputter on cables and conductors. About the Use of metallic lines and / or conductor tracks can be apply these efficiently. Metals also have a high electrical Conductivity on.

In accordance with at least one embodiment of the component, at least one line on a first substrate is electrically connected to at least one conductor track on the second substrate via at least one conductor region of the connection means. Thus, the first substrate and the second substrate can be electrically connected to one another via the conductor region of the connection means. The at least one, electrically conductive conductor region is preferably in direct physical contact with at least one electrical line and at least one printed conductor. About electrical connections of cables and conductors increase the design options of the component and a compact electrical wiring of the device is also possible.

At least an embodiment of the component is the material of the wetting at least one conductor area. That is, at a melting or softening of the conductor area wets the Material an area to which the conductor area in contact stands. In particular, the material of the conductor region can be wetting with respect to the electrical wires and the tracks be, as well as to an insulator region of the connecting means or to a substrate. By such a conductor area is an electrical contacting of the at least one optoelectronic component simplified.

At least An embodiment of the component are lines and printed conductors arranged so that these are in areas where lines and interconnects are connected via a conductor area, at least in places. In one direction perpendicular to the second substrate and seen from this, results So a sequence of trace, conductor area electrical Lead and first substrate. About such traces and Lines is an efficient electrical contact possible.

At least an embodiment of the component, the second substrate electrical connection areas on. About these connection areas can the optoelectronic device with an external device be contacted electrically. The connection areas can be designed for example flat. A connection between component and an external device can, for example, over Glue, over terminals or over soldering respectively. The electrical contacting of the optoelectronic component Thus, for example, via an electrical contact via a connection region, a conductor on the second substrate, a Conduction region of the connecting means and an electrical line on the first substrate. About such connection areas is the component and thus the at least one optoelectronic Component efficient and flexible on an external device connected.

At least an embodiment of the component are at least two Lines on a first substrate so arranged over at least two conductor areas of the connecting means in the direction perpendicular to the first substrate an electrical connection to at least two tracks on the second substrate takes place. Preference is more as two-thirds, especially all lines over such designed conductor areas with tracks on the second substrate electrically connected. About such an arrangement of the lines is a space-saving electrical contacting of the components possible.

At least An embodiment of the component is the insulator region the bonding agent with a glass solder or with glass frits, and the conductor region with a metallic, in particular a silver-containing or a silver solder. Such solders or frits are inexpensive and resistant to diffusion Materials that have good processability. The combination of insulator regions and conductor regions of the bonding agent allows the electrical properties of the bonding agent targeted. In particular, over the insulator areas short circuits between lines and Circuit traces are prevented. This makes it possible the connecting means via an encapsulation of the element in addition to the electrical circuit design to use.

At least an embodiment of the component is the optoelectronic Component designed as an organic light emitting diode. It is also possible that the optoelectronic component as an organic solar cell is designed. On organic materials based light emitting diodes or solar cells can in particular a large area and thus, based on the area of the device, cost-effective getting produced. Large area means that Component of a size of more than ten square centimeters, may preferably have more than 100 square centimeters. about the design of the device as a light emitting diode or solar cell can large area, and thus over a good area utilization very efficient components are realized.

It In addition, a method for producing a Component with an optoelectronic component with at least an organic material indicated.

For example can be made by the method, a component, such as it in conjunction with one or more of the above embodiments is described.

• – Aufbringen zumindest eines Bauelements auf mindestens einem ersten Substrat,
• – Aufbringen zumindest einer Bahn des Verbindungsmittels auf dem zweiten Substrat,
• – Positionieren von erstem und zweitem Substrat relativ zueinander, und
• – zumindest stellenweises Aufschmelzen oder Aushärten des Verbindungsmittels über elektromagnetische Strahlung.

The method has the following method steps according to at least one embodiment:

• Applying at least one component to at least one first substrate,
• Applying at least one path of the bonding agent to the second substrate,
• Positioning the first and second substrates relative to one another, and
• - At least some melting or curing of the bonding agent via electromagnetic radiation.

The Order of the method steps is preferably carried out as indicated. However, individual process steps can also, depending on the concrete requirements or process conditions, be carried out in a different order.

The Application of the device on the first substrate can thereby done that the component is manufactured separately and then placed on the substrate. It is also possible that the device is fabricated on the first substrate, that is, for example, in successive steps all necessary layers applied to the first substrate, to the device as an organic light emitting diode or solar cell to design.

Of the Process step of applying the bonding agent can thereby done that paste-like glass solders or glass frits for at least one insulator region and / or metallic solders for at least a conductor region on the second or the first substrate be applied. When applying, particular care must be taken to ensure that a continuous framework without gaps arises, to ensure that this is later inside the web-like bonding agent and between the Both substrates located component with the organic material is sealed well. Preferably, the connecting means before the Positioning the substrates applied to the second substrate, for example via sintering, so that between connecting means and second substrate already a mechanically stable connection results.

At least An embodiment of the method is the melting or curing the bonding agent carried out via laser radiation. Laser radiation, especially in the near-infrared spectral range, can efficiently generated with high light output. The beam quality of Laser radiation is also very high, so that the radiation is good in Point or line shape is focused. About the use of lasers, the bonding agent can be melted or melted efficiently be cured.

Of the Method step of connecting first and second substrate is preferred via softening and / or curing completed at least a portion of the connecting means. The Connecting agent can be about absorption of infrared or UV radiation to be heated. This contains the Connecting agents, for example, additives, the corresponding absorb electromagnetic radiation. The connecting means may also contain admixtures that are about absorption Allow UV curing of the bonding agent. Preferably, the softening of the bonding agent over a radiation completed, the first and second substrate not or is not absorbed significantly. "Not essential" means In this case, that the absorption by the or the substrates less than 20%, preferably less than 10%, more preferably less than 5%.

At least an embodiment of the method can both at least one insulator region as well as at least one conductor region the connecting means via electromagnetic radiation the same wavelength cured or melted become. Preferably, all areas of the connecting means are over Radiation of a wavelength curable or fusible. This means that both conductor area and insulator area, for example in a spectral range or at a wavelength show a strong absorption and therefore electromagnetic radiation of this Wavelength absorbed by the conductor region and the insulator region becomes. About this absorption can be a heating and thus Melting or curing takes place.

alternative it is also possible that, for example, the insulator areas strongly absorb radiation and heat transport then the connecting means in the conductor areas up or is melted or cured. In the latter case the melting point of the material of the conductor regions is preferred lower than the melting or softening point of the material of the insulator regions. In case of using a glass solder or glass frits for the insulator areas and a metallic connecting means this is easy to realize. Because metals usually have a high thermal conductivity it may be sufficient if a conductor area only locally absorbs radiation and via heat conduction the ladder area completely or even at its surface is heated. About the melting or curing of Insulator areas and conductor areas via electromagnetic Radiation of the same wavelength simplifies the encapsulation process of the component.

At least In one embodiment of the method, the melting takes place or curing the web of the bonding agent by moving off with a radiation source. "Departure" means Here, that the component with the connecting means relative to a radiation source is moved. So it can be the component are moved relative to the radiation source, or vice versa. about such a departure can be precise even more complex configured webs of the bonding agent melted or be cured.

At least an embodiment of the method, the electrical Contacting between optoelectronic component on the first Substrate and the connection areas on the second substrate by Melting or curing at least one conductor area. That is, the first substrate with the optoelectronic component and with the leads separate from the second substrate with the connecting means, the conductor tracks and the connection areas is manufactured. Subsequently The first and second substrates are positioned relative to one another. Then, the path of the connecting means, for example, with a Laser traversed, creating both conductor areas and insulator areas melt the connecting agent and thereby on the one hand the mechanical connection between the first and second substrate takes place and on the other hand at the same time the electrical contacts between Conductor tracks and lines, and thus first and second substrate electrically connected to each other. Preferably, the wet Materials of insulator and conductor areas to be contacted Surfaces during melting. By the electrical contact via the melting or curing of the bonding agent eliminates steps for a separate electrical Contacting the optoelectronic component.

in the Below is the component described here with at least one organic material based on embodiments and the accompanying figures explained in more detail. The same reference numerals indicate the same elements in the individual figures at. However, they are not true to scale rather, individual elements can do better Understanding shown exaggeratedly large be.

It demonstrate:

1 schematic plan views of a second substrate (A) and a first substrate (B), and a schematic sectional view of an embodiment of a component (C) described here,

2 a schematic plan view of an embodiment of a second substrate having a plurality of terminal regions (B) and a schematic plan view of a first substrate (A), and

3 a schematic illustration of a manufacturing method for an embodiment of a component described here.

In 1C is an embodiment of a component 10 shown. The component 10 consists essentially of a first substrate 1 made of glass with an optoelectronic component 3 , shown in more detail in 1A , and a separately prepared second substrate 2 made of glass, shown in more detail in 1B that have a lanyard 45 connected to each other.

On a mounting side 21 of the second substrate 2 , please refer 1A , are flat electrical connection areas 8th , electrical conductors 7 and the connecting means 45 applied. lands 8th and the tracks 7 are metallic or with a TCO. The connecting means 45 has a frame-like shape. An insulator area 4 , which is decorated with a glass solder, is of two ladder areas 5 interrupted. conductor areas 5 and insulator areas 4 are gas-tight, so that the device 3 that is between the two substrates 1 . 2 is tightly encapsulated. The ladder areas 5 are electrical with the tracks 7 connected.

On the first substrate 1 , shown in 1B , are electrical wires 6 for contacting the optoelectronic component 3 applied. The electrical wires 6 are metallic. Both first substrate 1 as well as second substrate 2 are formed from flat window glass plates. The first substrate 1 has a smaller footprint than the second substrate 2 on. The size of the first substrate 1 essentially corresponds to that of the connecting means 45 frame-like enclosed area on the second substrate 2 ,

When assembling first substrate 1 with the second substrate 2 in which the mounting pages 11 . 21 facing each other, the electrical connection of component 3 via lines 6 and over ladder areas 5 to the tracks 7 and thus to the connection points 8th closed. The connection points 8th are in a direction perpendicular to the mounting side 21 the second substrate freely accessible, so that a contact with an external, not shown device via gluing, soldering or terminals is easily possible.

According to the embodiment 2A are several frame-like structures of a connecting means 45a . 45b . 45c on the second substrate 2 appropriate. The electrical conductors 7 lead from the two connection points 8th each to ladder areas 5 of the bonding agent 45a . 45b . 45c , The various frame-like, from the lanyard 45a . 45b . 45c formed areas may have the same or as shown, different shapes.

In 2 B is schematically a glass substrate 1a with a designed as an organic light emitting device 3 and two strip-shaped electrical wires 6 shown. The first substrate 1a can, for example, analogous to the representation according to 1C , on the lanyard 45a be applied. The electrical wires 6 are so applied that after joining the substrates 1a . 2 over the ladder areas 5 of the bonding agent 45a in the direction perpendicular to the first substrate 1a an electrical connection to the tracks 7 on the second substrate 2 is realized. The same applies to not subscribed first substrates, via the connecting means 45b . 45c with the second substrate 2 get connected.

It is possible on the second substrate 2 various first substrates, which can be designed both as about different colored emitting LEDs and as detectors or receiving modules designed to apply. By means of this modular construction, similarly designed second substrates can also be used 2 depending on the specific application, each with different first substrates 1a , for example, in the optoelectronic component 3 distinguish, be equipped.

In the 3A to 3G is a manufacturing process for a component 10 illustrated.

In a process step shown in 3A , be on the mounting side 21 of the second substrate 2 the electrical connection areas 8th as well as the electrical conductors 7 applied, for example via vapor deposition or sputtering. lands 8th and tracks 7 can, unlike in 3A shown to be designed in one piece.

In another process step, shown in 3B as a side view and in 3C as a top view, is on the mounting side 21 the connecting means 45 applied. The connecting means has an insulator area 4 on top of two ladder areas 5 is interrupted. The path of the lanyard 45 is closed, that is, conductor areas and insulator areas close together. The thickness of the bonding agent 45 in a direction perpendicular to the mounting side 21 is about 10 microns. The connecting means 45 is in the form of glass frits along with binder on the second substrate 2 applied and mechanically sintered by means of the second substrate 2 firmly and gastight connected. Depending on the process control, the conductor areas 5 simultaneously with the insulator area 4 be applied, or even in a subsequent process step.

In a further process step, shown in the side view according to 3B and in the plan view according to 3E , be on the first substrate 1 an optoelectronic component 3 as well as electrical lines 6 applied. The base of the first substrate 1 is smaller than that of the second substrate 2 ,

In the process step according to 3F become the first substrate 1 and second substrate 2 joined together. Joining or positioning can be carried out under a protective gas atmosphere or under vacuum conditions in order to prevent contamination of the component 3 to prevent it by means of oxygen or moisture. When positioning first 1 and second substrate 2 the ladder areas come to each other 5 in contact with the tracks 7 and the wires 6 , conductor tracks 7 on the second substrate 2 and wires 6 on the first substrate 1 lie in places opposite each other and are in areas to be connected in contact with a ladder area 5 ,

In the process step according to 3G For example, laser radiation L is transmitted through a mirror 9 in the lanyard 45 focused. As a result, the connecting means 45 locally melted. About a slight contact pressure from the first substrate 1 to the second substrate 2 then there is a mechanically stable and hermetically sealed connection between the two substrates 1 . 2 , The laser radiation L drives the complete path of the connecting means 45 from. The laser radiation L can be focused point or line.

The The invention described herein is not by the descriptions limited to the embodiments. Much more For example, the invention includes every novel feature as well as every combination of features, in particular any combination of features in the patent claims, even if this feature or this combination itself is not explicitly stated in the claims or embodiments is given.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - US 6936963 B2 [0002]
• - US 6998776 B2 [0003]

Claims (14)

Component ( 10 ), which is at least a first substrate ( 1 ) and a second substrate ( 2 ), in which - on the first substrate ( 1 ) at least one optoelectronic component ( 3 ), which contains at least one organic material, - the first substrate ( 1 ) and the second substrate ( 2 ) are arranged relative to one another such that the component ( 3 ) between the first substrate ( 1 ) and the second substrate ( 2 ), - a connecting means ( 45 ) at least one isolator region ( 4 ) containing a glass, and at least one conductor area ( 5 ), and - at least one path of the connecting means ( 4 . 5 ) between the first substrate ( 1 ) and the second substrate ( 2 ), the path of the bonding agent ( 45 ) the component ( 3 ) encloses frame-shaped and first ( 1 ) and second substrate ( 2 ) over the insulator region ( 4 ) mechanically and over the conductor area ( 5 ) are electrically connected together. Component ( 10 ) according to claim 1, wherein a plurality of first substrates ( 1 ) on a second substrate ( 2 ) is arranged. Component ( 10 ) according to claim 1 or 2, wherein the first substrate ( 1 ) at least two electrical lines ( 6 ) for contacting the component ( 3 ) having. Component ( 10 ) according to one of the preceding claims, in which the second substrate ( 2 ) at least two electrical conductors ( 7 ) having. Component ( 10 ) according to claim 3 and 4, wherein at least one line ( 6 ) with at least one conductor track ( 7 ) over at least one ladder area ( 5 ) is electrically connected. Component ( 10 ) according to one of the preceding claims, in which the second substrate ( 2 ) electrical connection areas ( 8th ), via which the optoelectronic component ( 3 ) is contactable with an external device. Component ( 10 ) according to one of the preceding claims, in which the insulator region ( 4 ) of the connecting agent ( 45 ) with a glass solder or with glass frits, and the conductor area ( 5 ) is designed with a metallic solder. Component ( 10 ) according to one of the preceding claims, in which the optoelectronic component ( 3 ) is designed as an organic light emitting diode. Component ( 10 ) according to one of the preceding claims, in which the optoelectronic component ( 3 ) is designed as a solar cell. Method for producing a component ( 10 ) according to one of the preceding claims, comprising the steps of: - applying at least one component ( 3 ) on at least one first substrate ( 1 ), - applying at least one track of the connecting means ( 45 ) on the second substrate ( 2 ), - positioning of the first ( 1 ) and second substrate ( 2 ) relative to each other, and - at least some melting or curing of the bonding agent ( 45 ) via electromagnetic radiation. The method of claim 10, wherein the melting or curing of the bonding agent ( 45 ) takes place via laser radiation. Method according to claim 10 or 11, wherein both at least one isolator region ( 4 ) of the connecting agent ( 45 ) as well as at least one ladder area ( 5 ) are melted or cured via electromagnetic radiation of the same wavelength. Method according to one of claims 10 to 12, wherein the melting or curing of the web of the bonding agent ( 45 ) by driving off with a radiation source happens. Method according to one of claims 10 to 13, wherein the electrical contact between optoelectronic component ( 3 ) on the first substrate ( 1 ) and the connection areas ( 8th ) on the second substrate ( 2 ) by melting or curing the at least one conductor region ( 5 ) he follows.