DE102009011538A1 - Producing conductive structures on surface of polymer molded bodies, comprises providing polymer molded body from a polymer phase containing carbon nanotubes and thermally treating a surface of the polymer molded body - Google Patents

Abstract

Producing conductive structures on the surface of no or only slightly conductive polymer molded bodies, comprises: (a) providing a polymer molded body from at least one polymer phase containing carbon nanotubes; and (b) thermally treating at least one surface of the polymer molded body to produce the conductive structures on the surface of the polymer molded body, where the thermal treatment comprises heating at a temperature, which corresponds to at least the melting temperature of at least one polymer phase. Independent claims are included for: (1) the polymer molded body with conductive structures on the surface, produced by the above process, preferably comprising at least one polymer phase with carbon nanotubes, where the polymer molded body exhibits electrically or thermally conductive structure on the surface and the concentration of carbon nanotubes in the area of the electrically conductive surface structure is higher than in the non-electrically conductive surface area, and the non-electrically conductive surface area contains carbon nanotubes; (2) a printed circuit board-arrangement comprising at least one printed circuit board, which is preferably a polymer molded body, with at least one electrically conductive trace pitch, where the printed circuit board contains the polymer molded body with 0.1-10 wt.% of carbon nanotubes, relative to the mass of the polymer phase, and at least one electrically conductive trace pitch comprises a metal layer, preferably a copper layer, and/or at least one electronic component, which is bonded by an organic adhesive composition comprising 0.05-10 wt.% of carbon nanotubes, relative to the mass of the adhesive composition, and/or by a bond comprising the carbon nanotubes containing material, preferably one or more carbon nanotubes containing polymer phases, and/or by a solder connection with at least one electrically conductive trace pitch of the printed circuit board; (3) a process for producing the printed circuit board arrangement, comprising the steps (a) and (b), (c) galvanizing the electrically conductive structure with a metal, preferably copper, and/or (d) providing at least one electronic component, and (e) connecting, preferably thermally and/or electrically conductive connections, the electronic component having at least one electrically conductive trace pitch or at least an electrically conductive area using the adhesive composition, by producing a bond and/or by a solder connection; (4) use of an adhesive composition comprising carbon nanotubes for electrically conductive connecting of an electronic component with another electrically conductive component or molded part, preferably an electrically conductive trace pitch or an electrically conductive area on a trace pitch; and (5) use of a device for producing conductive structures on the surface of a polymer molded body of at least one polymer phase, where the device has an energy source with at least one electrode, which is provided to lose an energy with which the body to be processed is at least partially heated.

Description

The The invention relates to a printed circuit board assembly comprising at least a printed circuit board with at least one electrically conductive Conductor track and at least one electronic component, wherein the printed circuit board a polymer molding with 0.1-10 % By weight of carbon nanotubes (CNT), based on the mass of the polymer phase (s), and wherein the at least one electronic component by an organic adhesive composition containing 0.05-10 % By weight of carbon nanotubes (CNT), based on the mass of the adhesive composition, and / or by a bond containing carbon nanotubes (CNT) Material, in particular one or more carbon nanotubes (CNT) containing polymer phases comprises, and / or by a solder joint with at least one electrically conductive conductor track the circuit board is connected.

Of Furthermore, the invention relates to printed circuit board assemblies the printed circuit boards comprising polymer moldings, wherein the conductor tracks have a copper layer. The invention also relates to methods for Production of the printed circuit board arrangements according to the invention.

Electrically conductive plastics have long been known. US 4,404,125 describes the production of such plastics by admixing carbon fibers, optionally together with conductive carbon blacks, into a thermoplastic. In US 4,664,971 In place of the carbon fibers, electrically conductive metal fibers are used. In all these plastic mixtures, large amounts of electrically conductive additives are required, which are usually in a range of 10-30 wt .-%. Nevertheless, the electrical conductivity of these plastics, especially on the surface, is not yet sufficient for many technical applications.

WO 02/19346 describes the use of metal-coated carbon fibers for the production of electrically conductive plastics. This z. As a high-energy laser used to evaporate the plastic located on the surface and expose the underlying layers of electrically conductive additives. One drawback is the conductivity which frequently occurs over the entire volume of the plastic, also transversely to and beyond the laser-treated web, and the resulting problems in the arrangement of adjacent printed conductors.

Another method for producing electrically conductive structures on any substrate materials is disclosed in U.S. Patent Nos. 4,767,859 DD 263 179 described, wherein the substrate materials coated with an electrically conductive additive and crosslinking initiators containing prepolymer, the prepolymer selectively crosslinked by the action of high-energy radiation and the non-crosslinked portions of the plastic mixture with the aid of suitable solvents are removed. This procedural ren is very complex and associated with significant problems in terms of sufficient adhesion of the structures on the substrate surface.

The DE 102 59 498 describes electrically conductive thermoplastics in which carbon nanotubes (CNT) are used in addition to particulate carbon modifications such as carbon black or graphite. By adding such carbon modifications, the electrical conductivity compared to metal fibers can be realized even with small amounts added. The electrical conductivity is distributed more or less evenly over the entire plastic volume and the surface. The electrical conductivity usually occurs only above a certain minimum addition of electrically conductive additives. Below this concentration, the conductivity is almost at the initial level of the non-conductive plastics. The limit from which conductivity is observed depends essentially on the plastic itself, the added filler or the added filler mixture and on the mixing and processing conditions to which the plastic mixture has been subjected.

Around To achieve a good electrical conductivity are at All these procedures require sufficient amounts of additives and the conductivity is largely uniform across the volume of the plastic molding distributed. With the rising Filling degree is but usually a deterioration of associated with mechanical properties, so at high fill levels for example, toughness and tensile and tear strength are significantly reduced.

Another possibility for producing electrically conductive structures on surfaces was T. Dekker (Carbon Nanotubes as Molecular Quantum Wires, Physics Today, pp. 22-28, 1999 ). Carbon nanotubes from the gas phase are deposited on a substrate. This method is also associated with a high technical complexity.

electronic Circuits are usually made by applying a copper layer made on a substrate, taking care of the circuit unneeded parts of the copper layer by chemical Processes are etched away. The production of such circuits is usually very complex and involves many process steps.

at in particular, the generation of conductive structures the electroplating process can be used. To this procedure also to use for plastic surfaces, must first have a conductive on the plastic surface Layer are applied before galvanically a metallic layer can be deposited. Suitable methods for this purpose are known and include several individual treatment steps that are laborious and are awkward. It would therefore be advantageous when the plastic surfaces are galvanized directly could.

A Variant of plastic components made using the galvanizing process can be generated are Molded interconnect devices (MIDs). In these injection molded components are metallic Printed conductors applied to plastic substrates. These MIDs can be made in different ways. A Possibility is the circuit carrier in two-component injection molding. A plastic forms in this case the main body, another is metallizable and maps the trace layout. In the SKW procedure becomes first the conductor track structure as a recess of the non-metallizable component injected. Subsequently, these areas with the metallizable Component filled. In the following steps will be the corresponding metals applied to the metallizable plastic. Here, first, the surface of the metallizable Plastic activated. On this surface becomes galvanic Copper applied to the desired thickness.

Another problem in the art is the mounting of the electronic components or electronic components on the printed circuit boards. The components or components must be fastened in a simple manner so that excellent or optimal electrical properties can be achieved. For this purpose, suitable adhesives are for example from EP 0 914 027 or EP 0 870 418 known. In order to produce an electrically conductive connection between the strip conductors and the electronic components, electrically conductive substances are added to the plastics. However, these adhesive bonds often do not achieve the desired conductivity and strength, and in particular, there is a need for new adhesive compositions and / or bindings that work well or optimally with the properties of the printed circuit boards.

A Object of the present invention is therefore printed circuit board assemblies to provide, wherein the printed circuit boards polymer molding comprise, which have electrically conductive structures, where appropriate, the electrically conductive structures Copper included. In addition, a simple method for connecting of electronic (or other) components or electronic (or other) components with the printed circuit boards available be put.

In In a first aspect, therefore, the invention relates to a polymer molding with conductive, in particular electrically conductive, Structures on the surface, as well as a method for Production of these polymer moldings.

A Object of the present invention was the known methods for the production of conductive structures on polymer moldings to simplify and improve and in particular polymer moldings to provide with particularly good properties.

The The object described above is achieved by the shaped polymer bodies defined herein and solved the process for their preparation.

in the The scope of the present invention has been surprisingly found that the partial melting of the surface a polymer molding containing carbon nanotubes, to a migration of the CNT to the surface of the polymer molding leads. By targeted melting of the surface in defined areas, it is thus possible in an advantageous manner to increase the concentration of CNT in these areas and the electrical and thermal conductivity of these Increase areas. A proof of the higher Concentration of CNT in the electrically conductive (thermal treated) areas may z. B. on light microscopic or electron micrographs. in this connection appear, for example, in a polymer molding Polycarbonate and CNT in the light microscope, the sites with high CNT density in black color, whereas those with low CNT density are white.

In contrast, it has surprisingly been found in the context of the present invention that the use of polymer moldings with other electrically conductive additives does not lead to a migration of the conductive substances to the surface. For example, the melting of polymer moldings with conductive fiber systems, such as. Aluflakes (manufacturer Alufllakes of the company Silverline, GB, used polymer blend polycarbonate / polypropylene, see example) or steel fibers does not lead to a migration of the conductive fibers to the surface. In these polymer moldings, therefore, only the method described above is made WO 02/19346 applicable. In the process of the invention, however, advantageously no evaporation of the polymer on the surface of the polymer molding is necessary.

at the method according to the invention is the speed the migration of both the viscosity of the polymer phases, through which the CNT must move, as well as from the respective compatibility of the surfaces of the CNT and the polymer phases, and the duration of treatment, d. H. currently, which is the CNT available to melt through the Polymer to advance to the surface, depending. The longer the melting, the better the CNTs go to the surface, and the better the increase in electrical conductivity in the thermally treated areas.

Of Furthermore, it was surprisingly found that by stretching or bending the polymer molding of the Surface resistance of the same changes. Especially the surface resistance becomes larger the more the polymer molding is stretched. this makes possible the application of the polymer molding according to the invention in strain gauges.

The The present invention therefore relates in one aspect to polymer moldings with conductive, in particular electrically conductive, Structures on the surface, as well as a method for Production of these polymer moldings.

One Polymer molding in the context of the present invention an arbitrarily shaped three-dimensional body or a Polymer layer of one or more different polymers, the following both for the inventive Process as well as for the invention Polymer moldings are described.

According to the invention suitable Polymers are thermoplastics, thermosets, elastomers and inorganic Polymers and mixtures thereof, are preferred thermoplastics and Thermosets used. Preferred polymers are polycarbonate, acrylonitrile-butadiene-styrene (ABS), polyamides such as polyamide 6 (PA 6), polyamide 6.6 (PA 6.6), polyamide 6.4 (PA 6.4)), polyamide 12 (PA 12), aromatic polyamide, polyvinyl chloride, Nylon 6,6, polyvinyl fluoride, polyvinylidene fluoride, polyphenylene ether, Polystyrene, polyolefins such as polypropylene or polyethylene, polysulfone, thermoplastic polyurethane, polyethylene terephthalate, polybutylene terephthalate, thermoplastic Elastomer alloys, acetal, styrene-maleic anhydride, Butadiene-styrene, polyetheretherketone, polyethersulfone, polytetrafluoroethene, Polyalkylacrylates, polymethyl methacrylate, unsaturated Polyesters, polylactones, polyepoxides, polyamides, polybutadienes, polyphosphazenes, Styrene maleic anhydride (SMA), styrene methyl methacrylate (SMMA), polysulfone, polyvinyl acetate and polyacrylamide. Furthermore Can be phenolic resin, polyester resin, more natural or synthetic Rubber or silicone rubber can be used. Special examples Inorganic polymers include phosphorus based compounds and Silicones. The polymers listed above may be prepared and processed in a manner known to those skilled in the art. preferably, be at least two, more preferably at least three, different Polymers used to produce the polymer molding.

Preferred polymer blends are: polycarbonate / polyolefin (especially polypropylene or polyethylene), polyethylene terephthalate (PET) / polyvinylidene fluoride, PET / nylon 6,6, PET / polypropylene, high density PET / polyethylene blends, polyamide 6 (PA6) / acrylonitrile-butadiene-styrene and polycarbonate / polyolefins (preferably polypropylene), polyamide 6 (PA6) / polyamide 12 (PA 12), polyamide 6.6 (PA 6.6) / polyamide 12 (PA 12), aromatic polyamide / polyamide 12 (PA 12), polybutylene terephthalate / thermoplastic polyester , and polyethylene terephthalate / thermoplastic polyester. Suitable polymer blends have been used, for example, by Wu et al. (Journal of applied polymer science, 2006, vol. 99, no2, pp. 477-488) described in connection with CNT. When using a plurality of different polymers, depending on the property of the polymers, a single-phase or multi-phase system can arise.

According to the invention, the polymer molding preferably consists of at least two mutually substantially immiscible polymers (phase incompatible). If two or more phase-incompatible polymers are used, they can form a two-phase or multi-phase system even after the polymer molding has melted on. Phase-incompatible systems are known to the person skilled in the art. Become the two types of polymer blended, they are in separate phases next to each other. If such a mixture is kept in the melt for an extended period of time, the domains formed from one particular type of polymer coalesce, ie a phase separation takes place.

For example are polymers selected from the group consisting of Polystyrene (PS), polymethylmethacrylate (PMMA) and acrylonitrile-butadiene-styrene (ABS), as well as thermoplastic polyesters, such as polyethylene terephthalate (PET) or polybutylene terephthalate (PBT), and polycarbonates not miscible with polypropylene and / or polypropylene copolymers. Of Further, polystyrene and polyamide-6 are not polyethylene or Polypropylene miscible. Combinations of two or more of the above mentioned polymers are preferred according to the invention, the use of polycarbonate in combination with polypropylene is particularly preferred.

at Use of polypropylene and / or a polypropylene copolymer in a mixture with phase-incompatible polymers it is preferred, in each case based on the total mass of the polymer mixture (including any auxiliary substances and carbon nanotubes), at least 40% by weight more preferably at least 60% by weight still more preferably at least 80% by weight, more preferably at least 90% by weight, and most preferably at least 99% by weight of polypropylene and / or polypropylene copolymer. Further preferred Amount range are: 40 to 99 wt .-%, more preferably 60 to 95 Wt .-%, more preferably 70 to 95 wt .-%, polypropylene and / or Polypropylene copolymer.

carbon Nanotubes (CNT), also carbon nanotubes or carbon nanotubes called, are made of carbon atoms in a certain molecular arrangement trained, fibrous structures. CNTs consist of wall sections, enclose the cavities. The walls are here made of carbon atoms with three bonding partners constructed, which form a honeycomb-like structure of hexagons. Depending on the arrangement of the wall structures one speaks of single-layered Kohlenstoffnanotubes (single wall carbon nanotubes, SWCNT), the are constructed of individual tubes and an inner diameter of 1-3 nm, or of multi-layered carbon nanotubes (multi wall carbon nanotubes, MWCNT) consisting of several concentric consist of nested tubes. The outside diameter The carbon nanotubes are between 1 nm and 400 nm, with carbon Nanotubes with an outer diameter between 10 and 400 nm often as a carbon nanofiber (Carbon Nano Fiber, CNF).

The production of carbon nanotubes is known to the person skilled in the art and can be carried out, for example, in the arc process (US Pat. Iijima, Nature 354, 1991, 56-8 ) or by means of deposition processes from the gas phase (Chemical Vapor Deposition, CVD) ( PM Ajayan, Nanotubes from Carbon, Chem. Rev. 99, pp. 1787-1799, 1999 ). Another method is in the WO 99/13127 . DE 19946182 and WO 98/39250 described. In this case, pulsed lasers are used for the vaporization of carbonaceous materials which are arranged in a vacuum chamber. Part of the vaporized carbon molecules condenses on so-called scavengers, whose temperature is controlled by external heating and cooling, which causes the growth of nanotubes. Other manufacturing methods include, for example, arc, laser ablation and catalytic processes. WO 86/03455 and WO 2006/050903 describe production processes in which aliphatic or aromatic hydrocarbons are decomposed in the presence of an iron-containing catalyst at temperatures of 800-900 ° C. In the known processes, carbon black, amorphous carbon and high-diameter fibers are often formed as by-products. In the catalytic deposition of carbon from gaseous hydrocarbons (Catalytic Carbon Vapor Deposition), for example, acetylene, methane, ethane, ethylene, butane, butene, butadiene, or benzene can be used. As catalysts z. As metals such as Fe or Ni or metal oxides can be used. The carbon nanotubes produced using the above methods are most likely to be CNT powders and can be mixed directly with the polymers.

According to the invention preferably CNT with an average diameter of 2 to 100 nm, more preferably 5 to 80 nm, and more preferably 6 to 50 nm used. Preference is given to using MWCNT. Furthermore, the Skilled in the art that the carbon nanotubes depending on the symmetry or Arrangement of carbon hexagons in the tube walls have different electronic states and thus Properties of metals or semiconductors. Depending on the application, the person skilled in the art, therefore, the appropriate, in the Literature described, carbon nanotubes can select.

"Functionalized carbon nanotubes" can also be used according to the invention as long as these carbon nanotubes do not combine with the polymers in such a way that migration is prevented. "Functionalized carbon nanotubes" have a modified surface and are for example in US 6,203,814 and US 08 / 812,856 described.

Instead of of or in addition to the carbon nanotubes after a possible inventive Embodiment also graphene instead of the CNTs or together be used with these. Graphene and process for its preparation are known in the art. Graphenes are monatomic graphite layers, for example by epitaxial growth on a silica substrate can be produced. However, CNTs are according to the invention prefers.

According to the invention preferred are carbon nanotubes in a proportion (based on the total mass the polymer phase (s) of the polymer molding), so that the polymer molding without the inventive conductive structures not or only slightly conductive is. For pure polycarbonate materials, therefore, for example in total, only less than about 5% by weight of CNT can be used. For Polypropylene can not exceed about 8-10 wt .-% CNT be used. A person skilled in the art will depend on the application of the invention Polymer molding the appropriate total amount of CNT Determine test experiments.

In addition, nanocomposites may additionally be used in the process according to the invention or in the polymer moldings according to the invention. Such substances and their application are known in the art and, for example, in the EP 1 776 418 described. Nano-layered silicates, such as, for example, aluminum layered silicate, are preferably used here. Preferably, nanocomposites in a proportion, based on the total mass of the polymer phase / s in the polymer molding, of 0.1 to 10 wt .-%, preferably from 0.5 to 5 wt .-%, particularly preferably from 0.5 to 2 wt .-% used.

additionally Preferably, the polymer phase (s) of the polymer molding can / can Other substances that contain the electrical conductivity of the polymer molding can increase. For example, metal-coated carbon fiber or the like be included.

additionally Preferably, the polymer molding contains except polymeric constituents, CNT and nanocomposites not more than 20% by weight, more preferably not more than 10% by weight, of other substances, such as processing aids, Dispersing agents, adhesion and compatibilizer, Light and aging inhibitors, dyes, etc.

The term "electrically conductive" as used herein refers to a body having a surface resistance of less than 10 ⁹ , preferably less than 10 ⁷ ohms, more preferably less than 10 ⁵ , and most preferably less than 10 ⁴ ohms. Accordingly, the terms "non-electrically conductive" and "low electrical conductivity" as used herein refer to a body having a surface resistance of greater than 10 ⁹ ohms, preferably greater than 10 ⁷ ohms, more preferably greater than 10 ⁵ , and most preferably more than 10 ⁴ ohms. The method according to the invention makes it possible to reduce the surface resistance in defined regions by a factor of 10, in particular 100, in particular 1000 or more, in order to produce electrically conductive structures.

A electrically conductive structure in the sense of the present Invention is a geometric arrangement of electrically conductive Areas on the surface of a polymer molding, wherein the electrically conductive regions to electrically adjoin non-conductive areas on the surface. In particular, the electrically conductive Structures for electronic applications be formed. The electrically conductive structures can therefore have any geometric shapes, in particular the shape of Lines, areas or patterns, preferably always delimited by untreated (and thus not electrically conductive) Areas.

additionally to the electrical conductivity increases also the thermal conductivity of the thermally treated Regions of the surface of the polymer molding. This allows further technical applications.

The inventive method comprises in a first Step, providing a polymer molding at least one polymer phase containing carbon nanotubes (CNT).

In this case, one or more of the polymers listed above are mixed with the carbon nanotubes while melting the polymers. The mixing of the individual components can be done in any desired manner. Known methods for the production of polymers with CNT are the synthesized polymer, which is present regularly as granules, powders or in block form, by supplying heat to melt and thus to convert into a liquid-viscous state. This can lower the viscosity of the polymer and mix the CNT into the polymer. Such a method may be the US 4,157,325 be removed. From the Canadian disclosure CA 2,324,353 Al It is known to mix fillers in a monomer, to initiate in-seat polymerization and subsequently melting the thus synthesized thermoplastic to introduce further fillers therein. Here, the carbon nanotubes can be added before or during the melting process.

To the Mixing of substances in low-viscosity plastic precursors can for example, the known dispersing using a bead mill, ultrasonic probe, a three-roll mill or a high-pressure disperser can be used. To interfere in high-viscosity plastic melts find the known methods such as z. B. the use of co-rotating twin-screw extruders z. B. from the company. Coperion (DE) or Fa. Leistritz (DE), of opposing Twin screw extruders from Pomini (IT) and Farell (US) or the co-kneader made by the company Buss (CH) use.

These Methods can also be used if phase incompatible Polymers are used. For example, polypropylene and / or polypropylene copolymer with phase incompatible Polymers are mixed in this way and then melted together and be mixed up. When using nanocomposites can these also added before or during the melting become.

preferably, The polymer phase (s) are / are prepared by mixing molten Polymer with 0.1-10% by weight of carbon nanotubes, based on the total mass of the polymer phase (s) of the polymer molding, produced.

In addition, it is possible to carry out the mixing of all components in several successive steps. For example, a polymer may first be melt-mixed with the carbon nanotubes and the resulting masterbatch mixed and melted in a subsequent step, for example after cooling and granulation, with the remaining polymers. The production of such Ma sterbatches is z. In US 5,643,502 described. By using such masterbatches, the distribution of the carbon nanotubes in the plastic composition can be improved.

in this connection it is additionally preferred that the polymer molding by fusing at least one polymer phase, the carbon nanotubes (CNT) in a proportion (based on the polymer phase) between 1 and 40 wt .-%, more preferably between 5 and 30 wt .-%, more preferably 15 and 30 wt .-%, containing at least one other Polymer phase with lower carbon nanotubes (CNT) content, obtained becomes. Nevertheless, the total content of CNT should not be that high be that the polymer molding already without the inventive conductive structures is conductive. The polymer phases with different carbon nanotube (CNT) proportions here, as described above, with melting of the polymers or Polymer blends with the carbon nanotubes are obtained. Further preferred is the polymer phase with the higher carbon Nanotubes content in lower proportions by weight than the polymer phases used with lower carbon nanotube proportions. Preferably have the polymer phases with lower carbon nanotube portions between 0 and 10 wt .-% CNT (based on the polymer phase), more preferably between 0 and 5 wt .-% CNT, on. Preferably, the polymer phase with the higher carbon nanotubes share in one share between 0.5 and 40% by weight, more preferably between 1 and 40% by weight, more preferably between 1 and 30% by weight, more preferably between 1 and 20% by weight, and most preferably between 1 and 10% by weight, based on the total mass of the polymer phases of the polymer molding, be included.

It Surprisingly, it has been shown that the use of two phase incompatible polymer phases, of which a polymer phase has a high carbon nanotube content, a particularly high conductivity of the structures produced allows. It has been shown here that the polymer phases also after the Melting (in the production of the polymer molding) still have different carbon nanotubes shares. In contrast this is due to the familiar use of masterbatches increased soot content, for example, in processes for coloring polymer moldings, to a uniform distribution of the soot particles on the polymer phases.

Further preferred here is the polymer phase containing carbon nanotubes (CNT) in a higher proportion of one or more polymers selected from the group consisting of polycarbonate, polystyrene, acrylonitrile-butadiene-styrene (ABS), styrene-maleic anhydride (SMA), styrene methyl methacrylate (SMMA), polymethyl methacrylate (PMMA), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyamide 6 (PA 6), polyamide 6.6 (PA 6.6), polyamide 6.4 (PA 6.4), polyamide 12 (PA 12), aromatic polyamide, Polysulfone, manufactured. Preferably, this polymer phase is at least 50 wt%, more preferably at least 60 wt%, more preferably at least 70 wt%, even more preferably at least 80 wt%, and most preferably at least 90 Wt .-% of polycarbonate.

The desired polymer molding can then in the usual way by extrusion or injection molding are obtained from the polymer mixtures.

In a second step of the method according to the invention a thermal treatment of at least one surface takes place of the polymer molding to produce the conductive, in particular the electrically conductive structures the surface of the polymer molding, wherein the thermal treatment heating the area of the surface to a temperature that is at least the melting temperature which corresponds to at least one polymer phase. After a preferred Embodiment takes place after cooling the thermally treated areas (until the polymer phases are again solidified), one (or more) further thermal treatment same areas.

preferably, the thermal treatment of the surface (s) of the Polymer molding by contact with a heated body, Gas (eg hot air) or liquid, or through electromagnetic radiation or using the invention Device (described below). A specialist can select each appropriate means to a defined Melt area of the surface.

in this connection is it possible to either post the thermal treatment previous generation of the polymer molding, d. H. after the polymer molding leave the "molding tool" has, or already in the production of such a shaped body in the mold, perform. There are already tools known in which individual parts of a shaped body in Tool specifically heated or kept hot for longer can be.

Preferably, however, electromagnetic radiation is used for the thermal treatment of the surface of the polymer molding. It is further preferred here to use laser radiation or IR radiation, more preferably laser radiation. In this case, known lithographic processes can be used for the targeted irradiation of defined areas of substrate surfaces. Methods for targeted irradiation of surfaces are known in the art and for example in the EP 0 847 329 A or WO 02/079881 A disclosed.

Suitable lasers for the method according to the invention are: He-Ne laser, Nd: YAG laser, carbon dioxide laser (CO ₂ laser), carbon monoxide laser (CO laser), nitrogen laser (N ₂ laser), argon ion laser, helium Cadmium lasers (HeCd lasers), krypton ion lasers, oxygen ion lasers, xenon ion lasers, mixed gas lasers (eg, argon and krypton), excimer lasers, metal vapor lasers (eg, copper vapor lasers), and metal halide lasers (For example, copper bromide laser), preferred are carbon dioxide (CO ₂ ) laser and Nd: YAG laser.

preferably, becomes a position of the surface of the polymer molded body heated for 0.001 to 1 second. The period of heating refers to the length of time in which the surface of the polymer molding is in a molten state. This period of time can be selected by the person skilled in the art Application and the polymers used are easily chosen. In particular, it is possible, by the duration of the heating, in which the surface is melted, the surface resistance adjust. The longer the surface melted and the deeper the melted area gets into the surface extends into it, the more carbon nanotubes migrate to the surface, whereby the electrical conductivity of the structure increases becomes.

It is additionally preferred that the surface of the polymer molding is heated to a temperature which is sufficient to melt the polymer phase (s), but not too a noticeable evaporation of the polymer phase / s leads. Of the Expression "appreciable evaporation" means that the generated conductive structure is less than 1 micron, more preferably less than 500 nm, deep in the surface of the polymer molding is.

The inventive method can in particular for Production of electronic circuits on the surface be used of the polymer molding. Thus, you can in a simple way, in particular very small components, for example as MIDs (molded interconnected devices) are produced. in this connection For example, the polymer moldings are used according to the invention in a standard injection molding as any moldings and then the electrically conductive Structures generated.

Of Furthermore, the invention relates to a polymer molding, comprising at least one polymer phase and between 0.01 and 10 Wt .-%, preferably between 0.1 and 10 wt .-%, more preferably between 0.1 and 10 wt .-%, more preferably between 0.1 and 8 wt .-%, and am most preferably between 0.1 and 6 wt .-%. Carbon nanotubes (CNT) (based on the total mass of the polymer phase (s) of the polymer molding), wherein the polymer molding is on the surface electrically or thermally, preferably electrically, conductive Having structures, wherein the concentration of CNT in the areas the conductive surface structures higher is as in the non-conductive surface areas.

preferably, the polymer molding consists of the above described, in particular as preferred mentioned, polymers. Particularly preferably, the polymer molding contains at least one polymer phase containing a polymer selected from the group consisting of: polycarbonate, polystyrene, acrylonitrile-butadiene-styrene (ABS), styrene-maleic anhydride (SMA), styrene methyl methacrylate (SMMA), Polymethyl methacrylate (PMMA), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyamide 6 (PA 6), polyamide 6.6 (PA 6.6), polyamide 6.4 (PA 6.4), polyamide 12 (PA 12), aromatic polyamide and polysulfone, Polypropylene.

additionally The polymer molding preferably contains nanocomposites. Suitable nanocomposites and appropriate amounts have been previously mentioned described.

In a further preferred embodiment of the invention the polymer molding has at least two separate polymer phases on. Particularly preferably, the polymer molding contains at least two, more preferably two, polymer phases, wherein the a polymer phase consists of polymers selected from the group consisting of polystyrene (PS), polymethyl methacrylate (PMMA) and acrylonitrile-butadiene-styrene (ABS), as well as thermoplastic polyesters, such as polyethylene terephthalate (PET) or polybutylene terephthalate (PBT), and polycarbonate, as well as mixtures thereof. The second polymer phase consists of polypropylene and / or polypropylene copolymers. alternative For this purpose, the two polymer phases of polystyrene and / or Polyamide-6 in combination with polyethylene and / or polypropylene consist. Particularly preferred is the use of polycarbonate in combination with polyolefins, in particular polypropylene. The preferred ones Amounts of polypropylene and / or polypropylene copolymers are described above.

The Analysis of the finished polymer molding in terms of the existing polymer phase (s) is described in the Methods section. The conductive structures (with increased CNT content) on the surface of the polymer molding, as already mentioned, with conventional optical measuring methods be detected. More preferably, one of the Polymer phases have a higher proportion of carbon nanotubes (CNT) as the other phases.

It is also preferred that the electrically conductive structures of the polymer molding to a maximum of 10 microns, preferably not more than 1 μm, more preferably not more than 100 nm in the inside of the polymer molding (from the outer Surface on).

In a particularly preferred embodiment of the invention, the polymer molding contains a polypropylene phase and a polycarbonate phase, preferably between 50 and 80% by weight, more preferably between 60 and 80% by weight, and even more preferably between 70 and 80% by weight. Polypropylene, based on the total mass of the polymer mixture used. Particularly suitable polycarbonates can be used, such as in DE 13 002 66 or DE 14 957 30 described, are produced.

Of the Polymer molding according to the invention can be designed in particular so that its electrically conductive Surface structures Circuits or electronic circuits represent. Thus, the polymer molding as a board or printed circuit board in an electronic component or device be used. On this board or PCB can according to conventional methods, such as soldering, Gluing, gluing, followed by soldering, welding or ultrasonic welding, any components or (electronic) Components are applied. Also, an attachment by a known to those skilled Bestückungsvorgangsweise, z. B. via a Durchkontaktierungsvorgang. Especially can holes or holes in the circuit board be generated, through which the components performed and then on the circuit board, in particular the "back" of Printed circuit board, attached, for example glued or soldered become.

A particularly advantageous possibility according to the invention for the attachment or application of components to the polymer moldings according to the invention is explained in more detail herein. In short, it will be the Area of the polymer molding in which the component is to be applied or applied, directly or indirectly melted or melted, so that an attachment of the device is made possible. It has surprisingly been found that at the same time a very good conductive connection between the component and the polymer molding is made possible.

One Another aspect of the invention relates to a device for above described thermal treatment of at least one surface of the polymer molding to produce the conductive, in particular the electrically conductive structures the surface of the polymer molding.

This Device for creating a structure on a to be processed Body has an energy source. The energy source has at least one electrode, discharged via the energy can be. This released energy heats up at least partially the body to be processed and allows the above-described melting of the polymer molding, to produce the desired conductive structures.

The Invention is particularly suitable when the body is a polymer molding is at least one polymer phase containing carbon nanotubes, there in this body by applying an energy to very specific Positions the conductivity are changed can. Thus, tracks can be processed on one Body without application of a conductive material layer and then erasing the unneeded Create areas of the conductive material layer. On this way work steps are saved, the production of the PCB accelerates and so the profitability of the production elevated.

Of the The body to be processed is particularly effective generate if the energy source has at least two electrodes, which can be applied to the body to be processed, wherein with the two electrodes, a current through the body to be processed conductive is or a voltage can be applied, the body to be processed warms up and, as further described below, preferably in defined areas z. B. on the surface melted. Through this simple technical measure can be on the body to be machined after a possible Embodiment also create three-dimensional structures, because the two electrodes, for example, on the front and on the back of the body to be machined applied are. For example, holes can be easily made in this way burn in the body to be processed or, in the case the printed circuit board described above, contacts between two Create layers. Thus can be with the device of present invention cost multilayer printed circuit boards produce.

To the Create simple traces in a plane of the machined Body can connect one electrode of the energy source to one Point to be fixed, with the other electrode on the body is moved arbitrarily, whereby, in particular in the case of a printed circuit board the electrical conductors are generated. Alternatively you can but also both or more electrodes are moved simultaneously. According to a further embodiment of the invention the two electrodes also with a spacer on a predetermined Distance apart, so that both electrodes together via the body to be processed in the creation of the structure to be moved. The electrodes or the polymer molding facing parts thereof, z. B. in pencil form, in principle have any shape, wherein the shape in terms of Shape of the desired conductor tracks to be produced by a person skilled in the art is freely selectable. The applied voltage or the Electricity can be chosen freely, with the expert depending on the polymer molding used, its composition and the degree and range of the desired Heating the molding material the appropriate Simply empirically determine values. In many cases is z. B. a voltage of more than 500 V. In particular of 1000 V or more favorable.

To a preferred embodiment of the invention becomes a first electrode in a first region of the polymer molding (or its surface) on the already a conductivity exists or created, while a second Electrode starting from a point on the polymer molding (or its surface), in the same conductive Range, or with this area via a conductive Area (such as a track) is connected via the Polymer molding (or its surface) moves, to create a (new) trace, the conductive Enlarge area or two existing conductive ones To connect areas (eg tracks). This approach allows a great deal of flexibility the generation or design of the conductive structures on the polymer molding.

The device according to the present invention can, according to one possible embodiment, be installed particularly effectively in a plotter, in a matrix printer or in a pen. In a method for producing a structure on a body to be processed, the body to be processed is represented by an En An energy source with at least one electrode, which is provided for discharging an energy, at least partially heated.

In the method according to the invention can be apply the aforementioned device characteristics with the same effect.

The Invention will be described below with reference to two non-limiting Embodiments described in more detail. In the Drawings show:

1 a device with a device according to a first embodiment of the present invention;

2 a device with a device according to a second embodiment of the invention;

3 the device according to the second embodiment of the invention; and

4 the device according to the first embodiment of the invention.

In the figures use the following reference numerals:

10

device

12 14

pencils

16 18

Contact pen

20 22

Contact plug

24

plug

26

polymer body

28

conductor path

30

surrounding area

32

drawn lines

34

contact point

36

bottom

38

device

40

pen

42

heating coil

44

protective body

46

plug

In a first embodiment of the invention, which in the 1 and 4 shown points the device 10 a first pen 12 and a second pen 14 on. Both pins each have a contact on their underside 16 . 18 on, each with a contact 20 . 22 a plug 24 are electrically connected.

When creating the contacts 16 . 18 of the pens 12 . 14 to a polymer body 26 from at least one polymer phase with carbon nanotubes can be when the contacts 16 . 18 of the pens 12 . 14 spaced apart and a current through the polymer body 26 lead, the polymer body 26 to heat specifically. By targeted heating of the polymer body 26 can be on this tracks 28 muster up the electricity from the contacts 16 . 18 of the pens 12 . 14 can also lead. For example, becomes the first pen 12 with the first contact 20 firmly fixed at one position and only the second pin 14 with the second contact 18 moved on the circuit board, so is the distance between the already created trace and the current position of the second contact 18 very low depending on the speed of movement. From this small distance follows a low resistance between the conductor track 28 and the second contact 18 , causing the conductor track 26 in a surrounding area 30 for the second contact 18 of the second pen 14 is heated, and so the trace 28 continues.

In a practical way, according to a possible embodiment, the printed conductors to be produced on the polymer body 26 with marked lines 32 be hinted to assist the manufacturing process of the circuit board. Further, on the polymer body 26 contact points 34 are prepared, which the polymer body 26 penetrate. All you need is the second pin 12 from the polymer body 26 be removed, and at the bottom 36 of the polymer body 26 in about the already produced Lei terbahn 28 be attached. This will turn over the track again 28 a current between the two contacts 16 . 18 the two pins 12 . 14 headed the contact point 34 through the polymer body 26 generated.

In the 2 and 3 a device according to a second embodiment of the invention is shown. After that, the device includes 38 a pen 40 , on the underside of which is a heating spiral 42 followed. This heating coil is preferably of a protective body 44 surround. The protective body may be provided to regulate the heating, or else to the heating coil 42 to protect against contamination or other external influences. Next points the device 38 according to the second embodiment of the invention, a plug 46 on, with the heating coil 42 can be supplied with electrical energy.

In use is the device 38 as shown in the first embodiment, over the pre-drawn lines 32 pulled, so that the already discussed interconnects 28 arise. In the present embodiment, it is not necessary to have a first pin at a predetermined location of the polymer body 26 to position.

With The invention can be easily structures on a Create body without it applying a base material and removing the unneeded locations of the base material needed. As a result, process steps are saved in the production, so that the production of the body to be worked more economically becomes. Accordingly, another aspect of the present invention relates the use of the devices, devices described above and methods for producing (conductive) structures on polymer moldings.

The provide the above devices, devices and methods particular advantages in the use of the invention Polymer moldings with conductive structures on the surface, including processes for its preparation to be discribed.

For Technical applications must be electronic components or Components on the conductive structures of the invention Be applied polymer molding. For this it is necessary on the one hand that sufficient stability of the components or components guaranteed on the circuit boards and on the other hand a electrically conductive connection between the tracks and the electronic components or components is manufactured.

in the Within the scope of the present invention, it has surprisingly been found that produces particularly advantageous printed circuit board assemblies can be when polymer moldings with CNTs can be used as printed circuit boards and on by thermal Treatment generated conductive structures or tracks using an organic according to the invention Adhesive composition, which also contains CNTs, electronic components are applied. Surprisingly allows the use of a CNT-containing adhesive on a CNT-containing circuit board a particularly good fixation the electronic components or components. On the other hand leads the use of adhesives with conductive substances such as silver particles to a bad adhesion on CNT-containing substrates.

in this connection has been shown to have particularly good electrical properties by the combined use of a CNT-containing adhesive and a CNT-containing circuit board can be achieved.

Surprisingly In addition, components can be very reliable and resilient way with low labor costs through production a bond containing material comprising CNT, and / or through a solder joint on a circuit board, the one CNT-containing polymer molding comprises, be attached as explained in detail below. The term "binding" includes while any attachment or connection using CNT containing material, in particular a CNT-containing polymer material. Most preferably, the material comprising CNT is around the material of the polymer molding described herein.

A preferred printed circuit board arrangement therefore comprises at least one printed circuit board with at least one electrically conductive strip conductor and at least one electronic component, wherein the printed circuit board has a polymer molded article with 0.1-10% by weight, more preferably 1-10% by weight, and still more preferably 5-10 wt.%, of carbon nanotubes (CNT), based on the mass of the polymer phase (s), and wherein the at least one electronic component is comprised of an organic adhesive composition containing 0.05-10 wt. , more preferably 0.1-10% by weight, more preferably 1-10% by weight, and most preferably 5-10% by weight of carbon nanotubes (CNT), based on the weight of the adhesive composition , and or by a bond containing carbon nanotubes (CNT) containing material, in particular one or more carbon nanotubes (CNT) containing polymer phases, and / or is connected by a solder joint with at least one electrically conductive trace of the circuit board. In this case, the electrically conductive printed conductors are formed by regions of the surface of the polymer molded article which have an increased CNT concentration.

For the circuit board assembly can all of the invention Adhesive compositions described herein are used become. More preferably, a urethane acrylate adhesive is used. Further Preferably, the connection between the at least one electrically conductive trace and the at least one electronic Component has an electrical resistance of less than 50 ohms on.

Of Furthermore, the invention relates to an adhesive composition containing 0.05-10 wt% carbon nanotubes (CNT). The adhesive composition can be done by mixing the CNTs with the adhesive components. Suitable methods for this purpose are known to the person skilled in the art.

preferably, In this case, such adhesives are used, which are a substance contain those under the influence of radiation or heat react or release a substance containing the reactive ingredients react the adhesive or initiate their polymerization or catalyze. Preferably, the adhesive composition contains Acrylate adhesives, phenol-formaldehyde resin adhesives, silicone adhesives, or polyurethane adhesives, preferably acrylate adhesives. Further Preferably, the adhesive composition is selected from the group consisting of cyanoacrylate adhesives, methyl methacrylate adhesives, urethane acrylate adhesive, Butyl acrylate, and radiation curable acrylate adhesives, In particular, a urethane acrylate adhesive is used. Especially The adhesive composition according to the invention preferably exists only from CNTs and the aforementioned adhesives or mixtures thereof.

preferably, is the electrical resistance of the adhesive composition less than 100, especially less than 50 ohms.

The The present invention also relates to the use of a method according to the invention Adhesive composition for electrically conductive bonding an electronic component with another electrically conductive Component or molded part, in particular an electrically conductive Conductor or an electrically conductive area a trace.

• a) Bereitstellen einer Leiterplatte mit mindestens einer elektrisch leitfähigen Leiterbahn oder mindestens einem elektrisch leitfähigen Bereich, wobei die Leiterplatte einen Polymer formkörper mit 0,1–10 Gew.-% Carbon Nanotubes (CNT), bezogen auf die Masse der Polymerphase/n, darstellt,
• b) Bereitstellen mindestens eines elektronischen Bauelements, und
• c) Verbinden, vorzugsweise thermisch und/oder elektrisch leitfähiges Verbinden, des elektronischen Bauelements mit der elektrisch leitfähigen Leiterbahn oder dem mindestens einen elektrisch leitfähigen Bereich unter Verwendung der erfindungsgemäßen Klebstoff-Zusammensetzung und/oder durch Herstellen einer Bindung, die Carbon Nanotubes (CNT) enthaltendes Material, insbesondere eine oder mehrere Carbon Nanotubes (CNT) enthaltende Polymerphasen, umfasst, und/oder durch Herstellen einer Lötverbindung.

Furthermore, the invention relates to a method for applying at least one electronic component to a printed circuit board, comprising the following steps:

• a) providing a printed circuit board with at least one electrically conductive trace or at least one electrically conductive region, wherein the printed circuit board is a polymer molding with 0.1-10 wt .-% carbon nanotubes (CNT), based on the mass of the polymer phase / s represents .
• b) providing at least one electronic component, and
• c) bonding, preferably thermally and / or electrically conductive bonding, of the electronic component to the electrically conductive trace or the at least one electrically conductive region using the adhesive composition according to the invention and / or by producing a bond containing the carbon nanotubes (CNT) Material, in particular one or more carbon nanotubes (CNT) containing polymer phases comprises, and / or by preparing a solder joint.

preferably, in step a) of the process, the polymer molding with electrically conductive structures with the invention Process as described above. preferably, is in this case with the device according to the invention generates a conductive structure.

Suitable electronic components or components that can be applied to printed circuit boards are known to the person skilled in the art. These components or components can usually have "metallic legs" which must or can be brought into contact with the printed circuit board or the conductive structures located thereon. Examples of electronic components or components are in particular surface-mounted components (surface-mounted devices, SMDs). Surface mountable components (SMDs) can be mounted on a printed circuit board in particular via their connections, in particular their connection surfaces. The attachment can be carried out by methods known in the art of surface mounting technology (surface-mounting technology). Procedures for mounting components, in particular special SMDs, which give excellent results in combination with printed circuit boards, which have CNT comprising a polymer molded body, are explained in the following and above. The SMDs may be, for example, resistors, coils, capacitors, in particular ceramic capacitors, tan talcs, aluminum electrolytic capacitors, quartz, diodes, transistors, voltage regulators, light-emitting diodes, potentiometers, trimmers, buttons, optocouplers, reed contacts or integrated circuits.

Especially Can the electronic components or components connections on at least one, in particular one, two, three or four surfaces, in particular have side surfaces of the housing. The term "legs of a component", as well the terms "section of the electronic component", in particular "section of the electronic component, the with the at least partially melted portion of the polymer molding or the electrically conductive path or the electrical conductive area in contact or brought into contact "as used in the present application, includes in particular connections of surface mountable Components (SMDs), for example, in the form of rods or platelets or in the form of pads may be present. The connections can be preferably comprise one or more bends, and for example in "Gull-Wing" or "J-Lead" form available.

electronic Components or components that are applied to printed circuit boards can, SMD designs or SMD housing exhibit.

in the Within the scope of the present invention, one or more Components, in particular a design or a housing which is selected under MELF (Metal Electrode Faces), chip design, V-chip design, SOD (Small Outline Diode), SOT (Small Outline Transitor), DIL (Dual-In-Line), SOIC (Small-Outline Integrated Circuit), SOP (Small Outline Package), PLCC (plastic leaded chip carrier), QFP (Quad Flat Package), MLP (Micro Leadframe Package), MLF (Micro Lead Frame), QFN (Quad Flat pack No leads), LGA (Land Grid Array), BGA (Ball Grid Array) and their Combinations, on a printed circuit board, especially one Carbon Nanotubes comprehensive polymer moldings having PCB, to be attached.

The Attachment of the components, in particular the SMDs, can be done in the frame of the present invention, for example using Adhesives, in particular carbon nanotubes comprising adhesive compositions, which preferably comprise 0.05 to 10 wt .-% carbon nanotubes, and / or using solder joints and / or by a Binding comprising carbon nanotubes containing material carried out.

The Soldering can in particular by using a Lots, in particular a solder paste are produced, the z. B. tin and / or lead may include. As a soldering process can be a known to those skilled soldering applied become. A very good attachment may be in the attachment of the device obtained by using the reflow soldering method. Here, first, a solder in the form of a solder paste can be applied to the circuit board, then can the device on a provided with solder paste point of Printed circuit board are applied and continue afterwards the solder paste is heated to at least one temperature, in which it comes to a melting of the solder paste.

adhesives and / or solder paste (for making a solder joint, especially in reflow soldering) can according to the general expertise. Very good results can be used in particular if solder paste or adhesive is applied by screen printing or in small Portions, in particular using dosing devices, is applied.

There the adhesive composition of the invention Conductive is also adhesive between the legs and the conductive structure are located. To the components or to apply components to the circuit board can the legs of the components or components, for example, in the Dipped adhesive composition and then be placed on the circuit board. It must be the amount of Adhesive should be chosen so that sufficient stability generated between the component or component and the circuit board is, but no adjacent conductive traces in contact with adhesive come. The curing of the adhesive composition can then in the usual way, for example using a UV lamp, done.

The bonding, preferably the thermally and / or electrically conductive bonding, of the electronic component to the polymer molding or the at least one electrically conductive trace or the at least one electrically conductive region can be further characterized by producing a bond, the material containing carbon nanotubes (CNT), in particular one or more carbon nanotubes (CNT) containing polymer phases, carried out. Particularly advantageous according to this embodiment of the invention, the attachment of the component in one step, possibly in the same step as the generating the tracks on the polymer molding, the permanent connection and the avoidance of solder.

moreover may be the bonding of the electronic component to the polymer molding or the at least one electrically conductive conductor track or the at least one electrically conductive region as well by forming a bond containing carbon nanotubes (CNT) Material, in combination with a use of an inventive Adhesive composition and / or a solder joint, respectively.

Especially For example, at least a first portion of the device may be used the adhesive composition according to the invention and also at least a second portion of the device below Preparation of a Bond Containing Carbon Nanotubes (CNT) Material includes, be attached. The appropriate way a person skilled in the art can, on the basis of his general knowledge, and on the basis of each printed circuit board assembly to be produced and select the electronic components to be attached.

Of the Term "carbon nanotube (CNT) containing material" in the context of the present application, in particular mono- or multiphase Compositions comprising carbon nanotubes, in particular compositions, the one or more polymers, as well as carbon nanotubes, in particular at least two or more phase incompatible polymers, as well as carbon Nanotubes, include.

To the Making a bond containing carbon nanotubes (CNT) Material may include, first, a feeding of Energy to at least a portion, in particular a surface portion of the CNT-containing polymer molding or the electrically conductive, in particular CNT containing web or the electrically conductive, in particular CNT containing area be carried out, wherein the portion of the polymer molding, the electrically conductive path or the electrically conductive Area to which the energy was supplied, at least partially melts.

The Supplying energy can be done in particular by contact with a heated body, gas (eg hot air) or Liquid, or by electromagnetic radiation. A person skilled in the art can select the appropriate means to supply energy or a defined range of To melt the surface.

Of the Term "at least partially melts" in the context of the present application in addition to a partial or complete melting, including any melting, in particular any partial melting, as well as any change of the polymer molding, the electrically conductive Or electrically conductive area, the one Subsidence of the portion (or portion thereof) of the one to be attached Component in the material of the polymer molding or the conductive path or the electrically conductive Range or wetting hereby allows. Especially may be the portion of the polymer molding that is conductive Track or conductive area to a temperature be heated, at least the melting temperature of the material or at least the lowest melting temperature of the respective Materials of the polymer molding or the conductive Rail or electrically conductive area corresponds.

The step of supplying energy to at least one section, in particular a surface section, of the CNT-containing polymer shaped body, the electrically conductive path or the electrically conductive area can be effected, in particular, by heating a portion of the electronic component which is in contact with the polymer shaped body electrically conductive path or the electrically conductive region is in contact or is designed for coming into contact with a portion of the polymer molding, the electrically conductive path or the electrically conductive region and is brought into contact after heating takes place, and / or a heating of at least a portion of the polymer shaped body, the electrically conductive path or the electrically conductive region takes place. The term "portion of an electronic component", in particular "portion of the electronic component, which is in contact with or brought into contact with the at least partially melted portion of the polymer molding or the electrically conductive path or the electrically conductive region", can be used in the context of The present invention includes any portions of an electronic component selected by a person skilled in the art for attachment to a printed circuit board. In particular, these terms include one or more terminals of any shape of a surface mountable device (SMD), in particular in the form of a pad, preferably in the form of a "leg" or one or more terminals of another device, which may in particular have the shape of a "little bone". Such sections of components, in particular terminals of SMDs, one or more metals, esp special metallic alloys, include or consist of.

The Heating the portion of the electronic component and / or the at least one section of the polymer molding, the electrically conductive path or the electrically conductive This area can be done directly, in the one with Energy source, z. B. electromagnetic radiation, in particular Laser radiation or IR radiation, on the relevant section of the electronic component and / or the at least one section of the polymer molding, the electrically conductive Track or the electrically conductive area acted is, or may be done indirectly, in a facility or another portion of the device is acted, the or in a thermally and / or electrically conductive manner with the portion of the electronic component to be heated connected is.

In a next step can come in contact or bringing a portion of the electronic component into contact for example, a little bit of the device, with the at least partially melted portion of the polymer molding, the electrically conductive path or the electrically conductive Area.

at In particular, the section of the. can come into contact to be mounted component already on the circuit board, in particular the polymer molding, preferably the electrically conductive Railway or the electrically conductive area are located and there come in contact with the melt. For example, the Be heated portion of the component to be attached, causing this leads that adjacent to this component section CNT comprehensive material, in particular the polymer molding, the electrically conductive path or the electrically conductive Area through which contact with the heated section melts, and / or it may be CNT adjacent to the portion of the device comprehensive material, in particular the polymer molding, the electrically conductive path or the electrically conductive region, be melted, with the result that CNT comprehensive melt then with the section of the to be attached Component comes into contact.

Especially can also be a CNT comprehensive section of the polymer molding, adjacent to an electrically conductive path or an electrically conductive region is so fused be that after forming the bond an electrically conductive Contact between the bond or the device and the electrical conductive path or the electrically conductive Area is present. Optionally, after the formation of the bond according to the above-mentioned methods created an additional electrically conductive path which are the bond with the electrically conductive Web or the electrically conductive region, in particular connects in an electrically or thermally conductive manner.

In a next step is then a training or Forming a bond, in particular an electrically conductive capable Binding, between the section of the electronic component and the at least one section of the polymer molding, the electrically conductive path or the electrically conductive Range. Very beneficial is that the formation of the bond as well without further action or steps simply when cooling down leave the melt with a section of the device in Contact stands, can be done. Optionally, a specialist can add more Take measures that affect the contact between the melt and further improve the portion of the device.

For example According to one embodiment, the Component on the printed circuit board, preferably on the polymer molding, be applied, wherein the portion to be attached to the device preferably completely or at least partially with the electrically conductive path or the electrically conductive Area is in contact. Then can then with a Light or heat source (such as a laser) on a Section of the device, for example on a little bit of the device, in thermally conductive connection with an adjacent thereto Area of the polymer molding, in particular the electric conductive path or the electrically conductive Area, stands, is acted upon, so that this melts and the melt comes into contact with the leg.

additionally or alternatively to acting on a portion of the device can with a light or heat source (such as a Laser) on one to the portion of the device, for example a little bit of the device, adjacent region of the polymer molding, in particular the electrically conductive path or the electrical conductive area, be acted upon, leaving this melts and the melt comes into contact with the leg.

Upon cooling and thereby solidifying the melt, it then leads to a formation of a bond between the portion of the device, such as a leg, and the Printed circuit board, in particular the polymer molded body, preferably the electrically conductive path or the electrically conductive region. In this way, in a very advantageous manner and with little effort at the same time a component attached and a very good electrically conductive connection can be provided.

According to one Another embodiment may be with a light or heat source (For example, a laser) on the polymer molding, in particular an electrically conductive track or an electrically conductive track Range of which, where it is at the location of the light or heat to a localized melting, especially a surface portion thereof, comes. Subsequently, one or more sections of the to be attached Component, for example one or more legs of the component, then contacted with this melt comprising site. Upon cooling and during the resulting solidification the melt, there is a formation of a bond between the portion of the device, such as a leg, and the printed circuit board, in particular the polymer molding, preferably the electrically conductive path or the electrically conductive Area. In this way, in a very advantageous way and with low workload a component attached simultaneously and provided a very good electrically conductive bond become.

If desired, according to a further embodiment, both a portion of the device, for example, a little bit of it, as well as a section of Printed circuit board, in particular of the polymer molding, in particular an electrically conductive web or an electrical conductive portion thereof, are heated.

The Heating may in particular be at a temperature above the melting point of the material of the section to the device to be attached to form a bond, done.

ever longer and with ever greater amount of energy the surface of the polymer molding is melted, the deeper the molten area extends, as above explained in detail, into the surface and the more carbon nanotubes migrate to the surface, whereby thereby the electrical conductivity of the structure is increased. By choosing the duration of heating and The amount of energy supplied can be this way the conductivity of the bond between the section of the Component and the polymer molding, in particular a electrically conductive path or an electrically conductive Range of which are affected.

Very good results and high reliability of installation can be obtained in particular if the above explained step of dispensing energy respectively heating is performed using a laser.

Suitable lasers for the method of applying the electronic component are: HeNe laser, Nd: YAG laser, carbon dioxide laser (CO ₂ laser), carbon monoxide laser (CO laser), nitrogen laser (N ₂ laser), argon ion laser , Helium-cadmium lasers (HeCd lasers), krypton ion lasers, oxygen ion lasers, xenon ion lasers, mixed gas lasers (eg with argon and krypton), excimer lasers, metal vapor lasers (eg copper vapor lasers) and metal halide Lasers (for example, copper bromide lasers), carbon dioxide lasers (CO ₂ lasers) and Nd: YAG lasers are preferred.

The Binding can contain one or more carbon nanotubes (CNTs) Include or consist of polymer phases, this being when desired by a specialist by the choice of the duration heating and the amount of energy supplied, as well as the material of the polymer molding detailed above has been explained, can be varied.

moreover the binding can be made such that the bond at least one carbon nanotube (CNT) containing polymer phase comprising or consisting of a content of 0.05-10% by weight Carbon nanotubes (CNT), preferably from 0.1-10% by weight Carbon nanotubes (CNT), preferably from 0.2-10% by weight of carbon Nanotubes (CNT), in each case based on the mass of the polymer phase, having.

The term "component connected to the at least one electrically conductive track or the at least one electrically conductive area by an adhesive composition and / or by a bond and / or by a solder connection" may in particular include that the component directly and / or is in contact with the adhesive composition and / or the binding and / or the solder connection via one or more connection devices, and that the at least one electrically conductive track or the at least one electrically conductive area directly and / or via a or a plurality of connecting devices is in contact with the adhesive composition and / or the bond and / or the solder joint.

Farther can a component or (electronic) component in particular by be attached that first an electrically conductive Material comprehensive connection device on a printed circuit board, especially on a circuit board with a carbon nanotubes comprehensive Polymer molding is mounted such that the connecting device with one or more electrically conductive track (s) and / or electrically conductive area (s) in electrical conductive contact. Then it will open this connection device the component or (electronic) component, for example, by soldering or gluing, so applied, that the component or (electronic) component in an electrically conductive manner with the one or more electrically conductive Trace (s) and / or electrically conductive area (s) connected is.

at the conductive material comprising connecting device It can be a one or more metal (s) or alloys comprehensive or existing device act. In particular, can the conductive material connecting device an eyelet or a layer on the polymer molding be on the example by gluing or soldering z. As a surface mountable component (SMD) attached becomes.

According to one Embodiment, the circuit board assembly, a solder joint, optionally in combination with CNT-containing material Binding and / or an organic adhesive composition comprising a CNT compound produced. Through the solder connection can be an electrically conductive connection between at least a section of a component, in particular at least one Section of an SMD, in particular at least one connection an SMD and the polymer molding, in particular the electrical conductive webs and areas on and / or in the polymer molding, getting produced. In particular, the solder joint the device with a layer, the metal, especially copper and / or tin, which on the circuit board, in particular the polymer molding is arranged and in electrically conductive contact with an electrically conductive trace or an electrical conductive region thereof is in electrically conductive Connect way.

One Another aspect of the invention relates to a printed circuit board assembly, wherein the circuit board according to the invention Polymer molding comprises. The inventive Polymer molding may be prepared as described above and with electrically conductive structures or conductor tracks be provided. In this circuit board assembly, the attachment of components, in particular of the aforementioned, according to a the procedures given above. To the electric Conductivity of structures with increased CNT concentration To further increase, it is preferable to have a copper layer applied.

Surprisingly, it was found in the context of the present invention that the polymer moldings having the electrically conductive structures can be used directly in a galvanizing process and a copper layer can be applied directly to the polymer moldings directly. In comparison to previously used electroplating processes for polymer moldings, the steps which have hitherto been necessary are therefore eliminated: pickling, activation and generation of an intermediate layer (see, for example, US Pat "Kunststoffgalvanisierung", LPW Taschenbuch für Galvanotechnik, Volume 1, Process Engineering, 13th Edition 1988, pages 443 to 449 ). According to the invention, therefore, the layer structure can be carried out directly, for example, after the surface of the polymer molding has been cleaned.

Surprisingly it is also possible, the invention Polymer moldings by means of bath electroplating with to coat a metal. Here can be on the usual Immersion of the workpieces to be coated in electrolyte-filled Containers, the so-called galvanizing, waived become. Instead, the required electrolytes of Absorbent materials added, in turn, by coating tools being held. By pressing the tools to be coated Surface, in particular component surface, is the deposition allows, with the required DC is also transmitted from the tool.

Here, the printed circuit board with the conductive structures in a conventional manner in an electrolytic plating bath is introduced (see, for example "Kunststoffgalvanisierung", LPW Taschenbuch für Galvanotechnik, Volume 1, Process Engineering, 13th Edition 1988, pages 443 to 449 ). The plating bath contains, for example, a copper (II) sulfate solution having an anode. By applying a negative voltage (cathode) to the electrically conductive structures on the surface of the polymer moldings and to the Ge copper can be selectively deposited from the solution on the structures and form a metallic layer. The suitable electrolyte solutions, the electrical voltage potential and the appropriate duration of the deposition can be selected by the skilled person depending on the application and desired property of the interconnects. Surprisingly, the use of CNT amounts according to the invention leads to a selective deposition of the copper on the already existing conductive structures with increased CNT concentration on the surface of the polymer molding. When using the CNT fractions according to the invention in the polymer moldings, at the points of the surface of the polymer molded body which have not been thermally treated and therefore contain no conductive structures, there is no sufficiently high voltage potential for the deposition of copper. In contrast, when higher CNT contents are used in the polymer moldings, untargeted deposition of copper on the entire surface of the polymer molding may occur. On the other hand, the minimum amount of CNT according to the invention in the polymer molding is necessary in order to produce conductive structures that allow a sufficiently high voltage potential for the deposition of copper on the conductive structures.

With The process of the invention is based on simple Way possible, conductive structures on one To produce circuit board without, for example, the covering of areas not to be coated with copper is. Because the copper targeted to the already existing conductive In addition, structures must also be applied afterwards no etching process to remove excess copper be performed.

A According to the invention preferred circuit board assembly includes at least one printed circuit board with at least one electrically conductive trace, wherein the printed circuit board is a polymer molding with 0.1-10 wt .-% carbon nanotubes (CNT), based on the Mass of the polymer phase / s, and having at least one electrical conductive trace has a copper layer. Of the Term "copper" (or "tin" or "gold") in the context of the present application, both pure copper (or Tin or gold), usual impurities exhibiting Copper (or tin or gold), as well as alloys and compositions, the copper (or tin or gold), for example at least 20% by weight, in particular at least 90% by weight of copper (or tin or gold), more particularly at least 98 wt .-% copper (or tin or Gold), based on the total weight of the alloy or composition, exhibit.

optional The copper layer can be completely or partially with another layer containing one or more metals or alloys comprises or consists of, be provided. In particular, the Copper layer have a layer comprising tin or gold, especially tinned or gilded. A tin or gold comprehensive Layer may be arranged in particular at locations on which Sections of the component to be attached, preferably SMD connections, to be ordered.

Of Further, it is preferable that the circuit board assembly at least has an electronic component that by an inventive organic adhesive composition as described below is, and / or by making a bond, the carbon nanotubes Comprising (CNT) containing material, and / or by producing a Solder joint, with at least one electrically conductive Conductor of the circuit board is connected. Through the solder connection can be a connection between a component, in particular between at least a portion of a component, preferably between at least one section, e.g. B. at least one port, one SMDs, and the polymer molding. Especially the solder joint, the device with a layer, the metal, in particular copper, which covers the conductive Structures with increased CNT concentration on the surface of the polymer molding, for example as described above, was applied, connect. As soldering can For this example, the skilled person known method, in particular Reflow process, to be used.

• a) Bereitstellen eines Polymerformkörpers aus mindestens einer Polymerphase die Carbon Nanotubes (CNT) enthält,
• b) Thermisches Behandeln mindestens einer Oberfläche des Polymerformkörpers zur Erzeugung der leitfähigen Strukturen auf der Oberfläche des Polymerformkörpers, wobei die thermische Behandlung ein Erhitzen auf eine Temperatur umfasst, die mindestens der Schmelztemperatur der mindestens einen Polymerphase entspricht, und
• c) Galvanisieren der elektrisch leitfähigen Strukturen. Wenn erwünscht, kann auch nur ein Galvanisieren von Teilbereichen der elektrisch leitfähigen Strukturen erfolgen.

The invention also relates to a method for producing a printed circuit board arrangement according to the invention, comprising the steps:

• a) providing a polymer molding comprising at least one polymer phase containing carbon nanotubes (CNT),
• b) thermally treating at least one surface of the polymer shaped body to produce the conductive structures on the surface of the polymer molded body, the thermal treatment comprising heating to a temperature which corresponds at least to the melting temperature of the at least one polymer phase, and
• c) electroplating the electrically conductive structures. If desired, only partial plating of the electrically conductive structures can be performed.

additionally is preferred in the process for preparing a novel Circuit board arrangement in an additional step d) at least one electronic component or component using an adhesive composition according to the invention with at least one conductor track of the printed circuit board and / or by Making a bond containing carbon nanotubes (CNT) Material includes, with at least one trace of the circuit board connected, and / or by making a solder joint, connected to at least one conductor track of the printed circuit board, in particular connected electrically and / or thermally conductive.

To another aspect of the present invention in the preparation of the polymer molding according to the invention, z. B. by injection molding, raised or recessed areas provided be, the z. B. as traces or for the attachment of components can serve. Such areas can be, for example be designed as terminals, clips, holes or the like and allow easy mounting or clamping of the components. More preferably, then used for attachment area the polymer molding are heated directly or indirectly, around the above-described (conductive) bond between the Polymerformköper bze a range thereof and the component to create.

METHODS

The following methods are used to determine the parameters of the polymer shaped bodies according to the invention:
The determination of the electrical surface conductivity was based on the measurement of the surface resistance with an ohmmeter "Metra Hit Plus" from Gossen Metrawatt GmbH according to the manufacturer. Both the resistance on the untreated surface and in each case at different points of the laser-treated surface sections were measured by means of two electrodes at a distance of 2 mm. For comparison, the surface was mechanically removed at one point and the electrical resistance in the material was measured.

The analysis of whether a polymer molding has separate polymer phases can be performed using Differential Scanning Calorimetry (DSC) DIN EN ISO 11357 respectively. In this case, the number of polymer phases can be determined on the basis of the phase transitions during melting of the polymer molding.

The determination of the melting temperature of the polymer phases or the polymer molding can according to DIN EN ISO 3146 respectively.

The total content of CNT in the polymer molding can be determined by the pyrolytic measurement method according to DIN EN ISO 3451 be determined.

EXAMPLES

1. Preparation of a polymer molding with conductive structures

It is a polymer blend of 75% polypropylene (Repol HP-12 of Reliance, India), 3.75 CNT (Baytubes C 150 P, Bayer) and 21.25 wt .-% polycarbonate (Makrolon 2805, Fa. Bayer).

The Mixture is in a ZSE 27 / 44D twin screw extruder company Leistritz, Nuremberg with a diameter of 27 mm and a ratio LID of 44 at a throughput of 10 kg / h with a capacity of 18 kWh melted and mixed. In the extruder was from 200 ° C to 260 ° C increasing Temperature profile set. Subsequently, a Granulation.

The polymer molded article was injection molded (device type: Arburg 270) at a temperature of 220-240 ° C in the form of round plates with 4 cm diameter. For the thermal treatment, a CO ₂ laser was used. The measured values of the surface resistances are given in the following table. Table: measuring point surface resistivity Average Unit of measurement untreated no conductivity (<10 MOhm) Laser track 2 133 122 146 1.34 kohm Laser track 3 64.3 58.9 69.1 64.1 kohm Laser track 4 23.2 21.2 24.4 22.9 kohm abraded no guidance ability (< 10 MOhm)

2. Production of a printed circuit board arrangement with electronic components

Example a)

First becomes an adhesive composition according to the invention produced. This consists of 35 g Photobond PB 437 (Manufacturer: Delo, Germany), 0.35 g Nanocyl 7000 (manufacturer: Nanocyl, Belgium). The components of the adhesive composition are used for 20 min at 45 ° C using a hot plate IKA RH-KT / C with a stirrer (Heidolph RZ RO / 4) stirred at 300 U / min.

Of the Adhesive was used to determine the electrical resistance on a non-conductive surface applied and under a UV lamp (Siemens UV lamp 6ES5985-1AA11) cured for 7 min. Subsequently, with the measuring device Messcontrol M-860 D measured a resistance of 57 ohms / cm.

Around To apply a diode to a printed circuit board, the metal legs were the diode immersed in the adhesive composition and the modes brought into contact with the circuit board, leaving the glue drop creates a connection between the track and the legs. By curing with the UV lamp resulted in a solid Connection. After applying a voltage of 50 V, the diode lit up.

Example b)

Around a diode on a carbon nanotube-containing polymer molding applying the printed circuit board, the diode was in contact brought with the circuit board, and with a laser were one or a plurality of locations of the polymer molding body adjacent to a minor part of the diode melted, allowing melt to connect between the conductor track and makes the legs. After cooling to 20 ° C. resulted in a mechanically strong and electrically conductive Binding.

• 1. Verfahren zur Erzeugung leitfähiger Strukturen auf der Oberfläche von nicht oder nur gering leitfähigen Polymerformkörpern, umfassend die folgenden Schritte: a) Bereitstellen eines Polymerformkörpers aus mindestens einer Polymerphase, die Carbon Nanotubes (CNT) enthält; b) thermische Behandlung mindestens einer Oberfläche des Polymerformkörpers zur Erzeugung der leitfähigen Strukturen auf der Oberfläche des Polymerformkörpers, wobei die thermische Behandlung ein Erhitzen auf eine Temperatur umfasst, die mindestens der Schmelztemperatur der mindestens einen Polymerphase entspricht. Verfahren gemäß Punkt 1, dadurch gekennzeichnet, dass die Polymerphase/n durch Vermischen von geschmolzenem Polymer mit 0,1–10 Gew.-% Carbon Nanotubes, bezogen auf die Masse der Polymerphase/n, erhalten wird/werden.
• 2. Verfahren gemäß Punkt 1, dadurch gekennzeichnet, dass die Polymerphase/n durch Vermischen von geschmolzenem Polymer mit 0,1–10 Gew.-% Carbon Nanotubes, bezogen auf die Masse der Polymerphase/n, erhalten wird/werden.
• 3. Verfahren gemäß Punkt 1 oder 2, dadurch gekennzeichnet, dass der Polymerformkörper durch Verschmelzen mindestens einer Polymerphase, die Carbon Nanotubes (CNT) in einem Anteil zwischen 1 und 40 Gew.-% enthält, mit mindestens einer weiteren Polymerphase mit geringerem Carbon Nanotubes (CNT)-Anteil, erhalten wird.
• 4. Verfahren gemäß einem der vorhergehenden Punkte, dadurch gekennzeichnet, dass die Polymerphase, die Carbon Nanotubes (CNT) in einem Anteil zwischen 1 und 40 Gew.-% enthält, ein oder mehrere Polymer/e umfasst, ausgewählt aus der Gruppe bestehend aus Polycarbonat, Polystryrol, Acrylnitrit-Butadien-Styrol (ABS), Styrolmaleinsäureanhydrid (SMA), Styrolmethylmethacrylat (SMMA), Polymethylmethacrylat (PMMA), Polybutylenterephthalat (PBT), Polyethylenterephthalat (PET), Polyamid 6 (PA 6), Polyamid 6.6 (PA 6.6), Polyamid 6.4 (PA 6.4), Polyamid 12 (PA 12), aromatischem Polyamid und Polysulfon.
• 5. Verfahren gemäß einem der vorhergehenden Punkte, dadurch gekennzeichnet, dass die thermische Behandlung der Oberflä che/n des Polymerformkörpers durch Kontakt mit einem erhitzten Körper, Gas oder Flüssigkeit, oder durch elektromagnetische Strahlung erfolgt.
• 6. Verfahren gemäß einem der vorhergehenden Punkte, dadurch gekennzeichnet, dass als elektromagnetische Strahlung Laserstrahlung oder IR-Strahlung verwendet wird.
• 7. Polymerformkörper, umfassend mindestens eine Polymerphase mit Carbon Nanotubes (CNT), wobei der Polymerformkörper auf der Oberfläche elektrisch oder thermisch leitfähige Strukturen aufweist, wobei die Konzentration der CNT in den Bereichen der elektrisch leitfähigen Oberflächenstrukturen höher ist als in den nicht elektrisch leitfähigen Oberflächenbereichen.
• 8. Polymerformkörper gemäß Punkt 7, dadurch gekennzeichnet, dass mindestens eine Polymerphase ein Polymer enthält, ausgewählt aus der Gruppe bestehend aus: Polycarbonat, Polystryrol, Acrylnitrit-Butadien-Styrol (ABS), Styrolmaleinsäureanhydrid (SMA), Styrolmethylmethacrylat (SMMA), Polymethylmethacrylat (PMMA), Polybutylenterephthalat (PBT), Polyethylenterephthalat (PET), Polyamid 6 (PA 6), Polyamid 6.6 (PA 6.6), Polyamid 6.4 (PA 6.4), Polyamid 12 (PA 12), aromatischem Polyamid und Polysulfon.
• 9. Polymerformkörper gemäß einem der Punkte 7 oder 8, dadurch gekennzeichnet, dass zwischen 0,01 und 10 Gew.-% CNT, bezogen auf die Gesamtmasse der Polymerphase/n des Polymerformkörpers, enthalten sind.
• 10. Polymerformkörper gemäß einem der Punkte 7 bis 9, dadurch gekennzeichnet, dass der Polymerformkörper mindestens zwei getrennte Polymerphasen enthält.
• 11. Polymerformkörper gemäß einem der Punkte 7 bis 10, dadurch gekennzeichnet, dass eine der Polymerphasen einen höheren Anteil an Carbon Nanotubes (CNT) als die andere/n Phasen aufweist.
• 12. Polymerformkörper gemäß einem der vorstehenden Punkte, wobei für den Polymerformkörper eine Polymerblend aus Polycarbonat mit Polyolefin, insbesondere mit Polypropylen oder Polyethylen, verwendet wird.
• 13. Verfahren gemäß Punkt 1, worin die die Polymerphase/n durch Vermischen von geschmolzenem Polymer mit 0,1–10 Gew.-% Carbon Nanotubes, bezogen auf die Masse der Polymerphase/n, erhalten wird/werden.
• 14. Gerät zum Erzeugen einer Struktur an einem zu bearbeitenden Körper gekennzeichnet durch eine Energiequelle mit mindestens einer Elektrode, die zum Abgeben einer Energie vorgesehen ist, mit welcher der zu bearbeitenden Körper wenigstens teilweise erwärmbar ist. Bevorzugterweise dient das Gerät zur thermischen Behandlung der Oberfläche von Polymerformkörpern, wobei an den thermisch behandelten Stellen definierte elektrisch leitfähige Strukturen entstehen.
• 15. Gerät nach Punkt 14, dadurch gekennzeichnet, dass der zu bearbeitende Körper ein Polymerformkörper aus mindestens einer Polymerphase ist, die Carbon-Nanotubes enthält.
• 16. Gerät nach Punkt 14 oder 15, dadurch gekennzeichnet, dass die Energiequelle eine elektrische Energiequelle ist.
• 17. Gerät nach Punkt 16, dadurch gekennzeichnet, dass die Energiequelle mindestens zwei Elektroden aufweist, die an den zu bearbeitenden Körper anlegbar sind, wobei mit den zwei Elektro den ein Strom durch den zu bearbeitenden Körper leitbar ist, der den zu bearbeitenden Körper aufwärmt.
• 18. Gerät nach Punkt 16 oder 17, dadurch gekennzeichnet, dass die elektrische Energiequelle eine Spannungsquelle vorzugsweise mit einer Leerlaufspannung größer als 500 V und insbesondere mit einer Leerlaufspannung von 1000 V ist.
• 19. Gerät nach einem der vorstehenden Punkte, dadurch gekennzeichnet, dass die zu erzeugende Struktur ein elektronischer Schaltkreis ist.
• 20. Gerät nach einem der vorstehenden Punkte, dadurch gekennzeichnet, dass die erste Elektrode und die zweite Elektrode in einer Ebene oder in zwei verschiedenen Ebenen des zu bearbeitenden Körpers angeordnet sind.
• 21. Gerät nach einem der vorstehenden Punkte, dadurch gekennzeichnet, dass der Abstand zwischen der ersten und zweiten Elektrode weniger als 1 mm ist.
• 22. Gerät nach einem der vorstehenden Punkte, gekennzeichnet durch einen Abstandshalter, der die erste und zweite Elektrode miteinander verbindet.
• 23. Vorrichtung zum Erzeugen einer Struktur auf einem zu bearbeitenden Körper mit dem zu bearbeitenden Körper und einem Gerät, nach einem der Punkte 1–9, das den zu bearbeitenden Körper wenigstens teilweise erwärmt.
• 24. Plotter mit einer Vorrichtung nach einem der vorstehenden Punkte.
• 25. Matrixdrucker mit einer Vorrichtung nach einem der vorstehenden Punkte als Druckmatrix.
• 26. Stift mit einer Vorrichtung nach einem der vorstehenden Punkte als Stiftspitze.
• 27. Verfahren zum Erzeugen einer Struktur auf einem zu bearbeitenden Körper, dadurch gekennzeichnet, dass zwischen zwei verschiedenen Punkten des zu bearbeitenden Körpers eine elektrische Energie geleitet wird.

Hereinafter, preferred embodiments of the invention will be described. The polymer shaped bodies according to the invention can be used for the printed circuit board arrangements according to the invention. The device according to the invention is suitable for the thermal treatment of the surface of the polymer molding (step b of the method for producing conductive structures).

• 1. A process for producing conductive structures on the surface of non-conductive or only slightly conductive polymer moldings, comprising the following steps: a) providing a polymer molding of at least one polymer phase containing carbon nanotubes (CNT); b) thermal treatment of at least one surface of the polymer molding to produce the conductive structures on the surface of the polymer molding, wherein the thermal treatment comprises heating to a temperature which corresponds at least to the melting temperature of the at least one polymer phase. Process according to item 1, characterized in that the polymer phase (s) is / are obtained by mixing molten polymer with 0.1-10% by weight of carbon nanotubes, based on the mass of the polymer phase (s).
• 2. Method according to item 1, characterized in that the polymer phase (s) is / are obtained by mixing molten polymer with 0.1-10% by weight of carbon nanotubes, based on the mass of the polymer phase (s).
• 3. The method according to item 1 or 2, characterized in that the polymer molded article by fusion of at least one polymer phase containing carbon nanotubes (CNT) in an amount between 1 and 40 wt .-%, with at least one further polymer phase with a lower carbon nanotubes ( CNT) portion.
• 4. Method according to one of the preceding points, characterized in that the polymer phase, comprising carbon nanotubes (CNT) in an amount between 1 and 40% by weight, comprising one or more polymers selected from the group consisting of polycarbonate, polystyrene, acrylonitrile-butadiene-styrene (ABS), styrene-maleic anhydride (SMA) , Styrene methyl methacrylate (SMMA), polymethyl methacrylate (PMMA), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyamide 6 (PA 6), polyamide 6.6 (PA 6.6), polyamide 6.4 (PA 6.4), polyamide 12 (PA 12), aromatic Polyamide and polysulfone.
• 5. The method according to any one of the preceding points, characterized in that the thermal treatment of Oberflä surface / n of the polymer molding is effected by contact with a heated body, gas or liquid, or by electromagnetic radiation.
• 6. Method according to one of the preceding points, characterized in that laser radiation or IR radiation is used as the electromagnetic radiation.
• 7. A polymer molding comprising at least one polymer phase with carbon nanotubes (CNT), wherein the polymer molding has electrically or thermally conductive structures on the surface, wherein the concentration of CNT is higher in the regions of the electrically conductive surface structures than in the non-electrically conductive surface regions.
• 8. The polymer molding according to item 7, characterized in that at least one polymer phase contains a polymer selected from the group consisting of: polycarbonate, polystyrene, acrylonitrile butadiene styrene (ABS), styrene maleic anhydride (SMA), styrene methyl methacrylate (SMMA), polymethyl methacrylate ( PMMA), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyamide 6 (PA 6), polyamide 6.6 (PA 6.6), polyamide 6.4 (PA 6.4), polyamide 12 (PA 12), aromatic polyamide and polysulfone.
• 9. Polymer molding according to one of the items 7 or 8, characterized in that between 0.01 and 10 wt .-% CNT, based on the total mass of the polymer phase / n of the polymer molding, are included.
• 10. Polymer molding according to one of the items 7 to 9, characterized in that the polymer molding contains at least two separate polymer phases.
• 11. Polymer molding according to one of the items 7 to 10, characterized in that one of the polymer phases has a higher proportion of carbon nanotubes (CNT) than the other phases.
• 12. Polymer molding according to one of the preceding points, wherein for the polymer molding a polymer blend of polycarbonate with polyolefin, in particular polypropylene or polyethylene, is used.
• 13. The method according to item 1, wherein the polymer phase (s) is / are obtained by mixing molten polymer with 0.1-10% by weight of carbon nanotubes, based on the mass of the polymer phase (s).
• 14. An apparatus for producing a structure on a body to be processed characterized by a power source having at least one electrode which is provided for discharging an energy with which the body to be processed is at least partially heated. Preferably, the device is used for the thermal treatment of the surface of shaped polymer bodies, wherein at the thermally treated sites defined electrically conductive structures arise.
• 15. Apparatus according to item 14, characterized in that the body to be processed is a polymer molding of at least one polymer phase containing carbon nanotubes.
• 16. Apparatus according to item 14 or 15, characterized in that the energy source is an electrical energy source.
• 17. Device according to item 16, characterized in that the energy source has at least two electrodes which can be applied to the body to be processed, with the two electric a current through the body to be processed can be conducted, which warms up the body to be processed.
• 18. Device according to item 16 or 17, characterized in that the electrical energy source is a voltage source, preferably with an open circuit voltage greater than 500 V and in particular with an open circuit voltage of 1000 V.
• 19. Device according to one of the preceding points, characterized in that the structure to be generated is an electronic circuit.
• 20. Device according to one of the preceding points, characterized in that the first electrode and the second electrode are arranged in one plane or in two different planes of the body to be machined.
• 21. Device according to one of the preceding points, characterized in that the distance between the first and second electrode is less than 1 mm.
• 22. Device according to one of the preceding points, characterized by a spacer which connects the first and second electrodes together.
• 23. A device for producing a structure on a body to be processed with the body to be processed and a device, according to any of the items 1-9, which at least partially heats the body to be processed.
• 24. Plotter with a device according to one of the preceding points.
• 25. Dot matrix printer with a device according to one of the preceding points as a pressure matrix.
• 26. Pen with a device according to one of the above points as a pen tip.
• 27. A method for producing a structure on a body to be machined, characterized in that between two different points of the body to be processed an electrical energy is passed.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• US 4404125 [0003]
• - US 4664971 [0003]
• WO 02/19346 [0004, 0018]
• - DD 263179 [0005]
• - DE 10259498 [0006]
• - EP 0914027 [0012]
• - EP 0870418 [0012]
• WO 99/13127 [0029]
• - DE 19946182 [0029]
• WO 98/39250 [0029]
• WO 86/03455 [0029]
• WO 2006/050903 [0029]
• US 6203814 [0031]
• US 08/812856 [0031]
• - EP 1776418 [0034]
• US 4157325 [0041]
• CA 2324353 A1 [0041]
• US 5643502 [0045]
• - EP 0847329 A [0053]
• WO 02/079881 A [0053]
• - DE 1300266 [0064]
• - DE 1495730 [0064]

Cited non-patent literature

• T. Dekker (Carbon Nanotubes as Molecular Quantum Wires, Physics Today, pp. 22-28, 1999 [0008]
• - Wu et al. (Journal of applied polymer science, 2006, vol. 99, no2, pp. 477-488) [0024]
• - Iijima, Nature 354, 1991, 56-8 [0029]
• PM Ajayan, Nanotubes from Carbon, Chem. Rev. 99, pp. 1787-1799, 1999 [0029]
• - "Kunststoffgalvanisierung", LPW Taschenbuch für Galvanotechnik, Volume 1, Process Engineering, 13th Edition 1988, pages 443 to 449 [0137]
• - "Kunststoffgalvanisierung", LPW Taschenbuch für Galvanotechnik, Volume 1, Process Engineering, 13th Edition 1988, pages 443 to 449 [0139]
• - DIN EN ISO 11357 [0148]
• - DIN EN ISO 3146 [0149]
• - DIN EN ISO 3451 [0150]

Claims (19)

Printed circuit board assembly comprising at least a printed circuit board with at least one electrically conductive Conductor track and at least one electronic component, wherein the printed circuit board a polymer molding with 0.1-10 % By weight of carbon nanotubes (CNT), based on the mass of the polymer phase (s), includes, and wherein the at least one electronic component by an organic adhesive composition containing 0.05-10 % By weight of carbon nanotubes (CNT), based on the mass of the adhesive composition, and / or by a bond containing carbon nanotubes (CNT) Material, in particular one or more carbon nanotubes (CNT) containing polymer phases comprises, and / or by a solder joint with at least one electrically conductive conductor track the circuit board is connected. Printed circuit board arrangement according to claim 1, wherein the organic adhesive composition has a resistance of less than 100 ohms, in particular less than 50 ohms. Printed circuit board assembly according to a of claims 1 or 2, wherein the organic adhesive composition contains at least one adhesive selected is selected from the group consisting of: acrylate adhesives, phenol-formaldehyde resin adhesives, Silicone adhesives, and polyurethane adhesives, preferably For example, the adhesive composition contains a urethane acrylate adhesive. Printed circuit board assembly according to a of the preceding claims, wherein the connection between the at least one electrically conductive conductor track and the at least one electronic component electrically conductive is and has a resistance of less than 100 ohms. Adhesive composition containing 0.05-10 Wt% carbon nanotubes (CNT). Adhesive composition according to claim 5, wherein the adhesive composition comprises at least one adhesive contains, which is selected from the group acrylate adhesives, phenol-formaldehyde resin adhesives, silicone adhesives, and polyurethane adhesives, preferably containing Adhesive composition a urethane acrylate adhesive. Adhesive composition according to one of claims 5 or 6, wherein the organic adhesive composition a resistance of less than 100 ohms, in particular less than 50 ohms. Method for applying at least one electronic Device on a printed circuit board comprising the following steps: a) Providing a printed circuit board with at least one electrical conductive trace or at least one electrical conductive area, wherein the circuit board is a polymer molding with 0.1-10 wt .-% carbon nanotubes (CNT), based on the Mass of the polymer phase (s), b) Provide at least an electronic component, and c) bonding, preferably thermally and / or electrically conductive bonding, of electronic component with the at least one electrically conductive Conductor or the at least one electrically conductive Area using the adhesive composition according to a of claims 5 to 7 and / or by making a bond, the carbon nanotubes (CNT) containing material, in particular a or a plurality of polymer phases containing nanotubes (CNT) and / or by making a solder joint. The method of claim 8, wherein the production the bond according to step c), aa) Supplying energy to at least one section, in particular a surface portion of the polymer molding or the electrically conductive path or the electrical conductive area, the section at least partially melts bb) Getting in touch or putting in contact Section of the electronic component with the at least partially molten portion of the polymer molding or the electrically conductive path or the electrically conductive range cc) forming or forming a bond, in particular an electrically conductive bond between the portion of the electronic component and the at least a portion of the polymer molding or the electrically conductive path or the electrically conductive Range. The method of claim 9, wherein the step of supplying energy to at least a portion of the polymer molded body or the electrically conductive sheet or the electrically conductive portion comprises i) heating a portion of the electronic component, which is in contact with the polymer molding or the electrically conductive sheet or the electrically conductive region or is designed for coming into contact with the polymer molding or the electrically conductive sheet or the electrically conductive region and hereby after heating is brought into contact, and / or ii) heating a portion of the polymer molded body or the electrically conductive sheet or the electrically conductive region. Method according to one of claims 9 or 10, wherein the step of supplying energy according to claim 9 or wherein the step of heating according to claim 10 is done using a laser. Method according to one of claims 8 to 11, wherein the bond containing one or more carbon nanotubes (CNT) Includes or consists of polymer phases. The method of claim 12, wherein the manufacturing the bond is such that the bond at least one carbon Nanotube (CNT) containing polymer phase comprises, preferably is assumed by a polymer material that before heating to produce the bond a content of 0.05-10 wt .-% Carbon nanotubes (CNT), preferably from 0.1-10% by weight Carbon nanotubes (CNT), preferably from 0.2-10% by weight of carbon Nanotubes (CNT), each based on the mass of the polymer material has. Use of an adhesive composition according to one of claims 5 to 7 for electrically conductive Connecting an electronic component with another electrically conductive component or molded part, in particular an electrical conductive trace or an electrically conductive Area on a track. Printed circuit board assembly comprising at least one Printed circuit board with at least one electrically conductive Conductor, wherein the circuit board is a polymer molding with 0.1-10 wt .-% carbon nanotubes (CNT), based on the Mass of the polymer phase / s, and having at least one electrical conductive trace a metal layer, preferably one Copper layer, includes. Printed circuit board arrangement according to claim 15, wherein at least one electronic component by an organic An adhesive composition according to any one of the claims 5-7 and / or by making a bond, the carbon Comprises nanotube (CNT) containing material, and / or by manufacturing a solder joint with at least one electrically conductive Conductor of the circuit board is connected. Method for producing a printed circuit board arrangement according to one of claims 15 or 16, comprising the steps: a) providing a polymer molding from at least one polymer phase containing carbon nanotubes (CNT), b) Thermal treatment of at least one surface of the polymer molding for producing the conductive structures on the surface of the polymer molding, wherein the thermal treatment heating to a temperature which is at least the melting temperature which corresponds to at least one polymer phase, and c) galvanizing the electrically conductive structures with a metal, preferably with copper. Method for producing a printed circuit board arrangement according to claim 17, wherein in an additional Step d) at least one electronic component or component using an adhesive composition according to a of claims 5-7 and / or by making a Binding comprising material containing carbon nanotubes (CNT), and / or by making a solder joint with at least one Conductor of the conductor plate connected, in particular electrically and / or thermally conductive is connected. Method according to one of the claims 17 or 18, wherein the plating in step c) by a bad Galvanization takes place.