DE102012212320A1 - Carrier device for receiving component e.g. LED, has carrier that is arranged with molding material with receiving area for receiving the component, and anchoring structure is designed so that molding material with carrier is anchored - Google Patents

Abstract

The carrier device has a molding material (12) which is arranged on the carrier (1). The molding material is provided with a receiving area (4) for receiving a component. An anchoring structure (7) is designed so that the molding material with the carrier is anchored. The anchoring structure is provided with copper structure, graining structure (8) and/or recess structure. An independent claim is included for a method for manufacturing component.

Description

The invention relates to a carrier device, components and a method for producing components.

In the manufacture of light-emitting diodes (LED) on a ceramic substrate or a printed circuit board substrate, the LED chips are placed on the substrate. The individual LEDs normally have no cavities, i. a surrounding frame on. A casting of individual LEDs is therefore not possible because the potting compound would run uncontrolled. Individual cavities for the LEDs, however, can be created with the help of high-viscosity casting compounds, which is however expensive.

Various embodiments enable a potting process for individual devices on a carrier, such as a ceramic substrate or a printed circuit board substrate.

A carrier device for carrying an electrical component or for carrying a plurality of components according to various embodiments may comprise: a carrier, a molding compound, which is arranged on the carrier, wherein the molding compound has at least one receiving area for receiving at least one electrical component, and at least an anchoring structure designed to anchor the molding compound to the carrier.

The carrier may comprise a ceramic carrier or a printed circuit board, wherein a printed circuit board is usually less expensive than a ceramic carrier.

Furthermore, the carrier device may comprise the at least one component or a plurality of components which is accommodated in the receiving region.

The molding compound has at least one receiving area in which an electrical component is to be arranged. The receiving area can therefore be cast individually, so that, for example, a layer thickness of a potting compound for each component can be controlled separately.

Furthermore, the carrier device can have a plurality of receiving regions and a plurality of anchoring structures. In this case, in each case one anchoring structure can be assigned to a respective receiving area.

Advantageously, the carrier device has as anchoring structure, for example, copper structures, roughenings and / or depressions, which are designed such that the molding compound is anchored to the ceramic carrier.

The adhesion of the molding compound to the carrier, for example a ceramic carrier or a printed circuit board, is improved by means of the anchoring structure (s). It may be mounted in or on the carrier, for example in or on the ceramic carrier or in or on the circuit board.

The at least one electrical component may comprise an opto-electrical component, for example a light-emitting component, for example a light-emitting diode.

The anchoring structure (s) can have at least one copper structure, and / or at least one roughening and / or at least one depression.

For example, the carrier device further comprises a potting compound, wherein the potting compound is arranged in a receiving area and the electrical component is cast in the receiving area.

The casting compound protects the component and can be cast separately for each electrical component.

In an advantageous manner, at least one surface of the receiving region has a reflector material.

By the reflector material in the or the receiving area (s), the light output of the light-emitting diodes can be increased. In particular, the reflector material can be mounted not only on the ceramic carrier but also on the sides of the receiving area or receiving areas.

In an advantageous manner, the receiving area has structures which are designed such that the contrast of a luminous image of the component is increased.

The contrast of the light image can be increased by the structures of the receiving area limit the emitted light.

Advantageously, the molding composition contains thermally conductive particles.

The molding compound can thus contribute to dissipate heat generated by the device and optionally by the wavelength converter.

Advantageously, the receiving area is designed so that it corresponds to a contour of the component.

The distance of the component to the molding compound of the receiving area and thus the thermal resistance between the component and the molding compound is kept as minimal. If the component is circular, the receiving area can also be circular. The contour may also relate to only one area of the component. The heat of the component and, if present, the wavelength converter can be derived in addition to the air that surrounds the component, in addition to the molding compound.

Furthermore, in various embodiments, a component is provided which is obtained by separating a receiving region of the described carrier device.

The carrier device has a molding compound with a receiving region, for example with a plurality of receiving regions, in which electrical components are arranged. In this way, a large amount of components can be produced with little effort. The components can be singulated by dividing the carrier device.

Furthermore, in various embodiments, a method of manufacturing components is provided. The method may include forming at least one anchoring structure on or in a carrier and / or in or on a molding compound, applying the molding compound to the carrier so that the molding compound has at least one receiving areas for receiving at least one electrical component, and wherein the anchoring structure is formed such that the molding compound is anchored to the carrier.

The method may further comprise applying a grid structure to the carrier, the grid structure having the receiving area; a loading of the carrier with the electrical component, wherein the electrical component is electrically coupled to the carrier; and a potting of the electrical component.

With the help of the grid structure, which has one or more receiving areas for the electrical component or for a plurality of electrical components, a large number of components can be produced with little effort. Since a separate receiving area can be provided for each component, it can be cast individually. The potting compound may be a converter or be clear silicone or filled silicone.

The anchoring structure (s) improve / improve the adhesion of the grid structure on the carrier, for example a ceramic carrier or a printed circuit board.

By way of example, the grid structure is anchored to the ceramic carrier by means of the anchoring structure (s), for example copper structure (s), roughening (s) or depression (s). Clearly, the lattice structure is thus formed by the molding compound.

The method may further comprise singulating the receiving areas.

In various embodiments, the carrier may comprise a ceramic carrier or a printed circuit board.

The at least one electrical component may comprise an opto-electrical component, for example a light-emitting component, for example a light-emitting diode.

For example, the grid structure is applied by dispensing, an injection molding process or a transfer molding process on the ceramic substrate.

The injection molding process and the transfer molding process are suitable for mass production. The injection molding process is called in English "injection molding", the transfer molding process "transfer molding.

For example, the grid structure is applied by a bonding process on the ceramic substrate.

The lattice structure can thus be manufactured separately, for example by means of an injection molding process or a transfer molding process and then applied with an adhesive process on the ceramic substrate.

Advantageously, the loading of the ceramic carrier with components takes place before the application of the grid structure.

The placement of components can be done without lattice structure, so that the receiving areas of the grid structure does not affect the loading by their presence.

In one embodiment, a plurality of receiving areas and a plurality of anchoring structures can be formed. In this case, an anchoring structure can each be assigned to a respective receiving area.

Advantageously, when separating the receiving areas, at least one side, for example all sides, of the receiving areas of the grid structure is removed.

The grid structure illustratively forms a frame around the component for the casting of the Component. After casting, the frame can be removed, reducing the size of the component.

Embodiments of the invention are illustrated in the figures and are explained in more detail below.

Show it

1 an embodiment of a ceramic carrier;

2 an embodiment of a support device;

3 an embodiment of a populated carrier device;

4 an embodiment of a divided carrier device; and

5 an embodiment of a component.

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. is used with reference to the orientation of the described figure (s). Because components of embodiments can be positioned in a number of different orientations, the directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various exemplary embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

As used herein, the terms "connected," "connected," and "coupled" are used to describe both direct and indirect connection, direct or indirect connection, and direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate. For the sake of clarity, not all elements of the figures are provided with their own reference numerals. This is especially true for elements that are identical to other elements. The description and reference numbers apply to all graphically identically represented elements in the same way.

1 shows an embodiment of a ceramic carrier 1 , Ceramic has a very good thermal conductivity and high temperature resistance. Light-emitting components such as light-emitting diodes (LED) can thus be operated permanently with higher currents and thus higher brightness levels without overheating. The lower LED chip temperatures have a favorable effect on the overall life of the LEDs. The ceramic carrier 1 may for example consist of aluminum oxide (Al ₂ O ₃ ), aluminum nitride (AlN) or beryllium oxides (BeO) and have a thickness of 200 microns to 1 mm, preferably 400 microns.

The ceramic carrier 1 has connecting elements 6 for the electrical connection of components 5 on, for example, metal contacts or metal pads or electrically conductive tracks. For every component 5 can have two connection elements 6 be provided, for example, a smaller and a larger. The connection elements 6 can be the same size It can also only one connection element 6 or more than two connection elements 6 per component 5 be provided. The connection elements 6 are arranged in a matrix shape along a first direction X and a second direction Y (which is, for example, perpendicular to the first direction X). Along the first direction X are lines with the connection elements 6 each of eight components 5 intended. Along the second direction Y are columns with the connection elements 6 each of six components 5 intended. Along the first directions X and the second direction Y, other numbers of components may also be used 5 be arranged.

For the ceramic carrier 1 Low temperature cofired ceramics, English "Low Temperature Cofired Ceramics, LTCC" can be used on which the connection elements 6 and other components can be produced.

2 shows an embodiment of a carrier device 16 in which a molding compound 12 on a ceramic carrier 1 as he related to 1 was applied was applied. The molding material 12 has a plurality of receiving areas 4 for recording components 5 on. Although the shooting areas 4 As rectangles are shown, they may also have any other shape such as squares, trapezoids, diamonds, polygons, ellipses or circles.

Two connection elements each 6 is a reception area 4 assigned. A reception area 4 can also have a different number of connection elements 6 be assigned. Like the connection elements 6 are the reception areas 4 arranged in a matrix shape along the first direction X and the second direction Y. They can also be arranged circular or honeycomb. The molding material 12 has such a lattice structure 8th on, at the receiving areas 4 represent the holes of the grid and the connecting elements of the grid in the first direction X and the second direction Y extend. Two adjacent in the first direction X or the second direction Y receiving areas 4 each share a common connecting element. For separating the receiving areas 4 , and thus the components, becomes the lattice structure 8th separated along the common connecting elements.

Each recording area 4 has a part of the ceramic carrier as the bottom 1 with the connecting elements arranged thereon 6 , The sides of the recording areas 4 be through the molding compound 12 educated. The molding material 12 forms so for each reception area 4 a frame on the ceramic carrier 1 , In one direction, up here, is the recording area 4 open.

The molding material 12 can by a dosing (dispensing) or an injection molding process or a transfer molding process directly on the ceramic carrier 1 be applied. It can also be produced separately, for example by an injection molding process or a transfer molding process, and then by means of an adhesive process on the ceramic substrate 1 be applied.

So that the molding material 12 better on the ceramic carrier 1 liable, anchoring structures 7 be provided. The anchoring structures 7 may be, for example, bodies where the ceramic carrier 1 is roughened. The roughening can be done for example by blasting, for example with sand or corundum, or by etching. As anchoring structure 7 can also depressions in the ceramic carrier 1 serve, for example, by drilling or in the manufacture of the ceramic carrier 1 were generated. Also areas where the ceramic carrier 1 metallic structures, such as connection elements 6 or conductor tracks may be used as anchoring structures 7 serve. The design of the anchoring structures 7 is to be chosen so that the molding material 12 thus better with the ceramic carrier 1 connected, that is, more difficult to separate from it. Although the anchoring structures 7 in connection with the ceramic carrier 1 You can also use the molding compound 12 or be provided in both.

The anchoring structures 7 can in the entire area in which the molding material 12 with the ceramic carrier 1 is connected, be arranged, which is possible without great effort, for example, by roughening. You can also, as in 2 shown for each recording area 4 be provided separately or only in places, for example, along the connecting elements of the grid, which in more complex, for example, in recesses in the ceramic carrier 1 makes sense.

The different types of anchoring structures 7 can be combined with each other. For example, on areas where the requirement for the adhesion of the molding compound 12 to the ceramic carrier 1 are high, such as at the corners of components 14 , in addition to roughening a recess may be provided. In this way it can be ensured that the molding compound 12 not from the ceramic carrier 1 solves. The anchoring structures 7 can be used for dispensing, injection molding, transfer molding and gluing processes.

3 shows an embodiment of a populated carrier device in which a carrier device 16 as related to 2 has been described, with components 5 is equipped. The components 5 be in a respective recording area 4 arranged and for example on the larger of the respective connection elements 6 positioned. They are connected to it electrically, for example by soldering, in particular in surface-mounted device (SMD), or wire bonding. Furthermore, they are with the respective smaller connection element 6 electrically connected, for example by wire bonding. It can also be more than a component 5 in a reception area 4 to be ordered. For example, light-emitting diodes, along with components that protect against electrostatic discharge (ESD), can be housed in a receptacle 4 be arranged.

The components 5 in the reception areas 4 are each of a frame of molding material 12 surrounded and can individually with potting compound 13 to be shed. The potting compound 13 fills the respective recording area 4 off and covers the component 5 from. It serves to protect the components 5 , for example, from moisture. The potting compound 13 can be a wavelength converter for the device 5 be. The wavelength converters allow a conversion of the wavelength of the light emitted by the component into another wavelength. For white-emitting LEDs, the wavelength converter may, for example, comprise a phosphor phosphor which converts the light of a blue LED.

By the separate casting of individual components 5 It is possible to carry out an individual adaptation of the potting compound.

In an alternative, the components can 5 first on the in 1 shown ceramic carrier 1 arranged and electrically connected to the connection elements 6 get connected. After loading the ceramic carrier 1 with the components 5 can be a prefabricated lattice structure 8th on the ceramic carrier 1 be attached. In this way, for example, the components 5 easier to be connected with wire bonds, as the space around the components 5 not by the molding compound 12 the reception areas 4 is restricted. Also, the components can 5 with higher temperatures, which may be the molding compound 12 affect the connection elements 6 be soldered.

4 shows an embodiment of a divided carrier device, in which in connection with 3 described carrier device 16 into individual components 14 is divided. The separation of the components 14 takes place by separating in the first direction X and the second direction Y along the common connection elements of the lattice structure 8th instead, leaving the shooting areas 4 with the components arranged and potted therein 5 be separated from each other. The separation can be done for example by sawing. The width D1 of the saw blade can be chosen so that a frame of molding material 12 around the reception area 4 stop. The width D2 of the saw blade can also be chosen so that at least one side or all sides of the receiving area 4 be removed. What remains is the molded component without molding compound 12 on the far side of the pickup area 4 , causing the components 14 get smaller. In 4 are for example components 14 with none, with one, with two, with three or with four sides of the reception area 4 shown by combinations of the widths D1 and D2. To improve the heat dissipation of the component 14 For example, the molding compound 12 with thermally conductive materials 11 be filled and the sides of the receiving area 4 that the component 5 are closest, are not removed by the separation process, so that heat over this to the molding compound 12 is derived.

5 shows an embodiment of a component 14 , which is shown as a plan view and as a cross section. The component 14 can be related by 4 described separation of the support device 16 to be obtained. In the reception area 4 can reflector material 9 be applied, which increases the light output. In particular, the reflector material 9 not just on the floor of the reception area 4 So on the ceramic carrier 1 and the connection elements 6 be arranged, but also on the sides of the receiving area 4 , The reflector material may be, for example, titanium dioxide (TiO ₂ ).

Next, the recording area 4 be structured so that the contrast of the illumination of the component improves. The structures 10 can be on the sides and also on the bottom of the receiving area 4 be attached. They can be designed freely according to optical or mechanical requirements and can be designed like a reflector for a lamp. In this way, the design of secondary optics, with which the light can be directed or brought into the desired shape, can be facilitated.

The molding material 12 can be thermally conductive particles 11 have, so that heat, by the device 5 and optionally a wavelength converter 3 arises through the molding compound 12 can be derived. The particles may be, for example, metal fiber, metal powder, metal balls, aluminum nitrite or carbon nanotubes.

Instead of a ceramic carrier 1 can in the embodiments, a circuit board 1 to be used. The circuit board 1 , Also known as a printed circuit board, may consist of an electrically insulating carrier material, for example made of fiber-reinforced plastic, such as FR4, and may be conductor tracks, for example for the connection elements 6 have, for example, may consist of copper. In order to improve the heat dissipation, electrically insulated metal cores, for example of aluminum in the substrate of the circuit board 1 to be ordered. Next can also be provided for this purpose plated holes made of copper, which use its high thermal conductivity, English "thermal vias". Also, the thickness of the tracks can be increased to achieve a higher thermal conductivity. The anchoring structures 7 can also with the circuit board 1 be used.

LIST OF REFERENCE NUMBERS

1

Ceramic carrier, printed circuit board 1

3

 Wavelength converter

4

 reception area

5

 module

6

 connecting element

7

 anchoring structure

8th

 lattice structure

9

 reflector material

10

 Structure for increasing the contrast

11

 thermally conductive particles

12

 molding compound

13

 potting compound

14

 component

16

 support device

Claims (21)

A carrier device, comprising: - a carrier ( 1 ), - a molding compound ( 12 ) on the support ( 1 ), the molding composition ( 12 ) at least one receiving area ( 4 ) for receiving at least one electronic component ( 5 ), and - at least one anchoring structure ( 7 ), which is designed such that the molding compound ( 12 ) with the carrier ( 1 ) is anchored. A support device according to claim 1, wherein the support ( 1 ) a ceramic carrier ( 1 ) or a printed circuit board. Carrier device according to claim 1 or 2, further comprising the at least one component ( 5 ), which in the receiving area ( 4 ) and with the carrier ( 1 ) is electrically coupled. Carrier device according to claim 3, wherein the at least one component ( 5 ) An opto-electrical component, in particular a light-emitting component, in particular a light-emitting diode. Carrier device according to one of claims 1 to 4, wherein the anchoring structure ( 7 ) have at least one copper structure, and / or at least one roughening and / or at least one depression. Carrier device according to one of claims 3 to 5, further comprising a potting compound ( 13 ) located in the reception area ( 4 ) is arranged and the component ( 5 ) in the reception area ( 4 ) sheds. Carrier device according to one of claims 1 to 6, wherein at least one surface of the receiving area ( 4 ) a reflector material ( 9 ) having. Carrier device according to one of claims 1 to 7, wherein the receiving area ( 4 ) Structures ( 10 ), which are designed such that a contrast of a luminous image of the component ( 5 ) is increased. Carrier device according to one of claims 1 to 8, wherein the molding compound ( 12 ) thermally conductive particles ( 11 ) contains. Carrier device according to one of claims 1 to 9, wherein the receiving area ( 4 ) is designed so that it corresponds to a contour of the component ( 5 ) corresponds. Carrier device according to one of claims 1 to 10, wherein a plurality of receiving areas ( 4 ), and wherein a plurality of anchoring structures ( 7 ) are provided. Method for producing components, comprising: - forming at least one anchoring structure ( 7 ) on or in a carrier ( 1 ) and / or in or on a molding compound ( 12 ), - applying the molding compound ( 12 ) on the support ( 1 ), so that the molding compound ( 12 ) at least one receiving area ( 4 ) for receiving at least one electrical component ( 5 ), and - wherein the anchoring structure ( 7 ) is formed such that the molding compound ( 12 ) with the carrier ( 1 ) is anchored. A method according to claim 12, further comprising: - applying a grid structure ( 8th ) on the carrier ( 1 ), the lattice structure ( 8th ) the recording area ( 4 ) having; - equipping the carrier ( 1 ) with the at least one electrical component ( 5 ), wherein the electrical component ( 5 ) with the carrier ( 1 ) is electrically coupled; and - casting the device ( 5 ). Method according to claim 12 or 13, wherein the carrier ( 1 ) a ceramic carrier ( 1 ) or a printed circuit board. Method according to claim 13 or 14, wherein the at least one component ( 5 ) An opto-electrical component, in particular a light-emitting component, in particular a light-emitting diode. Method according to one of claims 12 to 15, wherein the anchoring structure ( 7 ) has at least one copper structure, and / or at least one roughening and / or at least one depression. Method according to one of claims 13 to 16, wherein the lattice structure ( 8th ) by dispensing or an injection molding process or a transfer molding process on the support ( 1 ) is applied. Method according to one of claims 13 to 17, wherein the lattice structure ( 8th ) by an adhesive process on the support ( 1 ) is applied. Method according to one of claims 13 to 18, wherein the loading of the carrier ( 1 ) with components ( 5 ) before applying the grid structure ( 8th ) he follows. Method according to one of claims 12 to 19, wherein a plurality of receiving areas ( 4 ), and wherein a plurality of anchoring structures ( 7 ) are formed. The method of claim 20, further comprising: separating the receiving areas ( 4 ).

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