DE112007000037A5 - Fertigungsprozess für integrierte mikro-elektro-mechanische Bauelemente - Google Patents

Fertigungsprozess für integrierte mikro-elektro-mechanische Bauelemente Download PDF

Info

Publication number
DE112007000037A5
DE112007000037A5 DE112007000037T DE112007000037T DE112007000037A5 DE 112007000037 A5 DE112007000037 A5 DE 112007000037A5 DE 112007000037 T DE112007000037 T DE 112007000037T DE 112007000037 T DE112007000037 T DE 112007000037T DE 112007000037 A5 DE112007000037 A5 DE 112007000037A5
Authority
DE
Germany
Prior art keywords
electro
manufacturing process
mechanical components
integrated micro
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112007000037T
Other languages
English (en)
Inventor
Franz Dietz
Alida Würtz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Semiconductors GmbH and Co KG
Original Assignee
Atmel Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Germany GmbH filed Critical Atmel Germany GmbH
Publication of DE112007000037A5 publication Critical patent/DE112007000037A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
DE112007000037T 2006-01-26 2007-01-23 Fertigungsprozess für integrierte mikro-elektro-mechanische Bauelemente Withdrawn DE112007000037A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006003718.9 2006-01-26
DE102006003718A DE102006003718B4 (de) 2006-01-26 2006-01-26 Mikro-elektro-mechanisches Bauelement und Fertigungsprozess für integrierte mikro-elektro-mechanische Bauelemente
PCT/EP2007/000526 WO2007085405A1 (de) 2006-01-26 2007-01-23 Fertigungsprozess für integrierte mikro-elektro-mechanische bauelemente

Publications (1)

Publication Number Publication Date
DE112007000037A5 true DE112007000037A5 (de) 2008-07-17

Family

ID=38016766

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102006003718A Expired - Fee Related DE102006003718B4 (de) 2006-01-26 2006-01-26 Mikro-elektro-mechanisches Bauelement und Fertigungsprozess für integrierte mikro-elektro-mechanische Bauelemente
DE112007000037T Withdrawn DE112007000037A5 (de) 2006-01-26 2007-01-23 Fertigungsprozess für integrierte mikro-elektro-mechanische Bauelemente

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102006003718A Expired - Fee Related DE102006003718B4 (de) 2006-01-26 2006-01-26 Mikro-elektro-mechanisches Bauelement und Fertigungsprozess für integrierte mikro-elektro-mechanische Bauelemente

Country Status (3)

Country Link
US (1) US20090017305A1 (de)
DE (2) DE102006003718B4 (de)
WO (1) WO2007085405A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10669152B2 (en) 2015-10-14 2020-06-02 Agency For Science, Technology And Research Device arrangement

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4662746A (en) * 1985-10-30 1987-05-05 Texas Instruments Incorporated Spatial light modulator and method
DE68923589T2 (de) * 1988-08-12 1996-01-18 Texas Instruments Inc Infrarot-Detektor.
DE19509868A1 (de) * 1995-03-17 1996-09-19 Siemens Ag Mikromechanisches Halbleiterbauelement
US6097031A (en) * 1997-07-25 2000-08-01 Honeywell Inc. Dual bandwith bolometer
US20020071169A1 (en) * 2000-02-01 2002-06-13 Bowers John Edward Micro-electro-mechanical-system (MEMS) mirror device
DE10058861A1 (de) * 2000-11-27 2002-06-13 Siemens Ag Infrarotsensor für hochauflösende Infrarot-Detektoranordnungen und Verfahren zu seiner Herstellung
CN1463470A (zh) * 2001-04-13 2003-12-24 皇家菲利浦电子有限公司 制造电子器件的方法
US6943448B2 (en) * 2003-01-23 2005-09-13 Akustica, Inc. Multi-metal layer MEMS structure and process for making the same
US7081647B2 (en) * 2003-09-29 2006-07-25 Matsushita Electric Industrial Co., Ltd. Microelectromechanical system and method for fabricating the same
US7355780B2 (en) * 2004-09-27 2008-04-08 Idc, Llc System and method of illuminating interferometric modulators using backlighting

Also Published As

Publication number Publication date
US20090017305A1 (en) 2009-01-15
DE102006003718B4 (de) 2008-07-17
DE102006003718A1 (de) 2007-08-09
WO2007085405A1 (de) 2007-08-02

Similar Documents

Publication Publication Date Title
DE602006000742D1 (de) Herstellungsverfahren für piezoelektrisches Bauelement
FI20065404A0 (fi) Prosessi perusöljyn valmistamiseksi
DE602007005822D1 (de) Herstellungsverfahren für halbleiterbauelemente
ATE444347T1 (de) Hydrokonversionsverfahren für pflanzliches öl
DE602006004022D1 (de) Befestigungsanordnung für LED-Lampen
DE602006011118D1 (de) Interdigitalkondensator für integrierte Schaltung
DE602007006605D1 (de) Anzeigetafel-Herstellung
DE602007009840D1 (de) Kalibrierverfahren für einen turbolader
DE602007008787D1 (de) Spannvorrichtung
DK2073636T3 (da) Fremgangsmåde til fremstilling af oxymorphon
BRPI0923428A2 (pt) refinaria de gás integrada
DE602007000850D1 (de) Windschutzscheibe
DE602007009845D1 (de) Glasurzusammensetzung für glasauskleidung
BRPI0717646A2 (pt) Método de fabricação de filtro cerâmico
DE502006004265D1 (de) Steckteil für steckverbinderanordnung
FI20055665L (fi) Prosessi haarautuneen hiilivetykomponentin valmistamiseksi
ATE530371T1 (de) Quersperre für man-hydrodrive
FI20060071A0 (fi) Menetelmä monimateriaalikomponentin tai -rakenteen valmistamiseksi
DE602007007038D1 (de) Klebstoff für Elastomere
DE112007001674A5 (de) Spannvorrichtung
FI20055666A0 (fi) Prosessi hiilivetykomponentin valmistamiseksi
DE602007003671D1 (de) Montagestruktur für Fahrradteile
DE602006017336D1 (de) Prozessverbindung für prozessdiagnostik
DE502007004868D1 (de) Packung für zigaretten
DE602007001620D1 (de) Verbesserter Herstellungsprozess für Aripipirazol

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: ATMEL AUTOMOTIVE GMBH, 74072 HEILBRONN, DE

8125 Change of the main classification

Ipc: B81C 99/00 AFI20070123BHDE

8127 New person/name/address of the applicant

Owner name: DIETZ, FRANZ, 74257 UNTEREISESHEIM, DE

8127 New person/name/address of the applicant

Owner name: TELEFUNKEN SEMICONDUCTORS GMBH & CO. KG, 74072, DE

R084 Declaration of willingness to licence
R084 Declaration of willingness to licence

Effective date: 20110629

R120 Application withdrawn or ip right abandoned

Effective date: 20120110