DE19741984A1 - Chip carrier for manufacturing a chip card - Google Patents

Abstract

the chip carrier has a coil substrate (18) with at least one coil arrangement (19). The coil substrate has connection material holding regions (12,13) formed on the substrate in the vicinity of the contact ends of the coil arrangement leaving the contact ends free. These regions hold connection material (11) for producing an electrically conducting connection between the coil arrangement's contact ends and chip module contact surfaces An Independent claim is also included for a method of manufacturing a chip card using the carrier

Description

The present invention relates to a chip carrier, in particular for Manufacture of chip cards, with a coil substrate that with at least a coil arrangement is provided, and a chip card with a such a chip carrier according to claim 12 and method for Her position of a chip card using such a chip carrier according to claims 16 and 18.

In the production of chip cards, especially so-called Kombikar ten, the coil arrangement contacted with a chip module for one contactless access to the chip as well as an outside on the chip Module-arranged contact surface arrangement for the person with contact Have access to the chip, and usually in a lamination process from several layers of laminate, it has proven to first produce a chip carrier or a card body, and to avoid damage to the sensitive chip module the chip module only after completion of the laminating process put card body into the card body and with this to contact.  

Frequently, the Her are necessary for the production of such chip cards steps distributed to different manufacturers, so that first of a manufacturer of the card body with the implemented coil arrangement is produced, and then the production of the combination card at a card manufacturer by completing the card body with the chip module - if necessary after applying a special one Design on the top layers of the card body - done. This is it necessary that the card manufacturer not only with the chip module Card body, but also a contact between the chip module and that implemented in the card body Performs coil arrangement. This contact turns out to be for the Card manufacturers as complex because of the special manufacturing equipment tion, in particular for the application of an electrically conductive connection material on the contact surfaces of the coil substrate or the chip module must be provided.

The object of the present invention is a chip carrier or Chip card or a method for producing such a chip card propose, with the aim of simplifying the card manufacturer the card manufacturing process and thus a cheaper Her enable the placement of chip cards.

This task is carried out by a chip carrier with the characteristics of Claim 1, or a chip card with the features of claim 12 or manufacturing method with the features of claims 16 or 18 solved.

In the chip carrier according to the invention, the coil substrate has Area of contact ends of the coil arrangement on the coil substrate trained connecting material releasing the contact ends areas to accommodate the connection material for the Establishing an electrically conductive connection between the con clocking the coil arrangement and contact areas of a chip module to serve.  

By means of the connecting material receiving areas, it is possible to Chip carrier for the subsequent card production through completion to prepare the chip carrier with the chip module so far that the connection material necessary for electrical contacting already is arranged on the chip carrier and thus already part of a for the card blank used is card manufacturing. As a result, it is no longer necessary for the card manufacturer, for the application of the To keep connection material special devices ready. Much more can the card manufacturer focus on the application of the chip module and the Establishing an electrically conductive connection between the chip limit module and the coil arrangement arranged in the chip carrier.

In addition, when the connector receiving areas in the Spu lens substrate itself, it will be for the card blank manufacturer ler possible to produce such prepared card blanks without the production of the blank card processed further separate components should be processed.

It proves to be particularly advantageous to have the connecting material areas as recesses in an otherwise flat top surface of the To form coil substrates, which is particularly easy to implement, if such card blanks are produced in the lamination process.

For this purpose, the coil substrate itself can be designed with multiple layers Coil layer and at least one on a surface of the coil layer arranged top layer.

When in the connector receiving areas with the contacts the connecting material already contacted to the coil arrangement is arranged, can also be dispensed with special, separate aids be to the connecting material before contacting the Secure chip module in the connection recordings.

If the connecting material is designed as a metallic, solder or weldable material can make contact between the connector  dungsmaterial and the contact ends of the coil assembly for example by remelting it in pieces into the connection material receiving areas of applied solder material.

If the connecting material is designed as essentially not metallic, adhesive material, such contacting simple application of the connecting material into the connecting material recording areas take place. The conductivity of the connec dungsmaterial by metallic or other conductive additives, such as for example carbon particles can be achieved. For example, you can such adhesive, conductive contacts by a conductive Rubber, a conductive silicone adhesive or also by a mechanical, metal spring element which is arranged in an adhesive become.

Another possibility is also metallic, if necessary solderable or weldable material with essentially non-metallic, to combine adhesive material, and then the captive liability of the solder material not by remelting, but by over to ensure the adhesive material ensures adhesion.

There is also the possibility of a connection material for a structural connection between the chip carrier and the appliqué the chip module and on the other hand different connection material al for the electrical contact between the chip carrier and the to provide applying chip module.

The connection material receiving areas can each be separately or also be coherent, so that the connecting material recording areas continuously merge.

There is also the possibility of connecting material reception che form in the peripheral area of a chip module receptacle, so that a spatial separation between the chip module receiving area and the connection material receiving areas, for example one  form a continuous ring channel around the chip module holder can, is trained.

There is also the possibility of such a separation between the Connection material receiving areas and the chip module holder not to be provided, and the connection material receiving areas and the Chip module holder contiguously as a common holder to train.

It proves to be particularly advantageous if the coil substrate is one Chip module receptacle assigned to connecting material receptacle areas has that release the contact ends of several coil assemblies. In In this case, it is possible for card manufacturers to make such a prepared card blank to provide that at Card manufacture a contacting of the chip module with several Coil arrangements are possible without it for the card manufacturer would be necessary, previously connecting material in the corresponding Ver to apply binding material receptacles.

In a chip card according to the invention with a chip carrier is provided, and at least one chip module with a chip arrangement arranged on a contact carrier, the chip module is inserted into the chip carrier such that the contact carrier with that arranged in the connecting material receiving areas th connecting material is contacted and the chip arrangement in the Intervening chip module holder.

A chip card constructed in this way enables simple manufacture a method flush with the surface of the chip card of the chip module.

An embodiment according to claim 13 is particularly advantageous, since so for example an electrical contact based on elastic Restoring forces of the connecting material can be carried out arise when joining the chip module and chip carrier and by  an adhesive connection between the chip module and the chip carrier in a permanent one that maintains electrical contact Preload can be converted.

Such a card structure proves to be particularly advantageous if it offers the possibility of using the chip arrangement of the chip module Contact carrier with several coil arrangements of the coil substrate to contact. This makes it possible to use one with only one Chipmo dul provided card that provide contactless access the chip of the chip module over two different frequency ranges enables so that access to one and the same chip card or to the chip implemented therein with fundamentally different access or Reading facilities is possible. So it is possible in a card too the different advantages of different transmission frequencies to use frequency ranges. With simultaneous contacting of the Chipmo duls with a high frequency and a low frequency coil are the Advantages of high frequency, so the high data transfer rate as the advantages of low frequency, i.e. the long range, can also be used, depending on which feature makes more sense for access seems.

If, in addition, as is the case with combination cards, the contact carrier ger of the chip module on its back with a contact area arrangement is a chip card created that even has three different transmission ranges. Furthermore, it is also possible to use a chip module as the chip module the one that already has a so-called "module-size coil", that is, a coil that fits on the chip arrangement of the chip module.

In the method according to the invention, two independent Process variants are differentiated, namely a Ver driving variant in which to use a chip card a chip module with one on a contact arrangement arranged chip arrangement with the chip arrangement is inserted into the chip module holder of the chip carrier, and then  ßend a thermal connection between the contact surfaces of the Contact carrier and in the connection material receiving areas arranged metallic connecting material under simultaneous Displacement of the connection material in the connection material ranges. It is particularly advantageous if the thermal Connection is carried out by remelting the connecting material.

An advantageous embodiment is the subject of claim 17.

In the second method variant according to the invention, the product development of a chip card using the chip explained above Carrier is a chip module with one arranged on a contact carrier Neten chip arrangement with the chip arrangement in the chip module holder of the chip carrier and at the same time there is a material fit, electrically non-conductive connection between the chip module and the Chip carrier and a non-positive, electrically conductive connection between contact surfaces of the contact carrier and that in the connector elastic material connection areas arranged material while displacing the connecting material in the connection material receiving areas.

A preferred embodiment of the chip carrier according to the invention and an embodiment of one using the chip carrier Chip card according to the invention are produced in the following Drawings explained in more detail. Show it:

Figure 1 shows a chip carrier during the application of connection material.

FIG. 2 shows a top view of the chip carrier shown in FIG. 1;

Fig. 3 is based on the chip carrier shown in FIGS . 1 and 2 manufactured chip card with a chip module in a chip module used.

Fig. 1 shows a partial longitudinal sectional view of a chip carrier 10 during application and contacting of bonding material 11 in connection material accommodation regions 12, 13 a in the present case from a plurality of connecting material accommodation regions 12, 13, 25, 26 integrally formed annular connecting material intake 14 (s. Fig. 2) .

To explain the structure of the chip carrier 10 , reference is also made below to FIG. 1 in addition to FIG. 2. The chip carrier 10 shown in FIGS . 1 and 2 has a coil substrate 18 formed in the present case from three material layers, namely a carrier layer 15 , a coil layer 16 and a cover layer 17 , the cover layer 17 here being one in comparison to the thickness of the others Material layers of the coil substrate has increased thickness.

As is clear from FIG. 2, which shows a top view of the chip carrier 10 , two coil arrangements 19 , 20 are arranged in the coil substrate 18 - here visible through a transparent cover layer 17 - which in the present exemplary embodiment are compared as high-frequency coils with one to low-frequency coils relatively small number of turns and conductor tracks 55 , 56 are ausgebil det with a relatively large conductor diameter. The coil assembly 19 is arranged along the periphery of the coil substrate 18 and is led with its coil contact ends 21, 22 in the compound material receiver 14 where they dung material accommodation regions in Verbin 12 and 15 open out, which, as shown in FIG. 1, the example of the bonding material receiving portion 12, are provided for contacting the connecting material 11 . Unlike the coil arrangement 19 , the coil arrangement 20 is arranged in the present case in a central region of the coil substrate 18 and is also inserted with its coil contact ends 23 , 24 into the connecting material receiving means 14 , where they open into connecting material receiving areas 13 and 14 , which, like that Connection material intake areas 12 and 15 serve to make contact with the connection material 11 .

As is particularly clear from Fig. 1, the depth t of the connec tion material receptacle 14 and the connecting material receptacle area 12 , 13 and 25 , 26 is greater than the thickness d of the cover layer 17. This is in the embodiment shown here, in which the coils orders 19 , 20 are formed as wire coils, a free contact access to contacting areas 27 to 30 of the coil contact ends 21 to 24 possible. It proves to be particularly advantageous if, as shown in the present case, the connecting material receiving areas 12 , 13 and 25 , 26 or the connecting material receptacle 14 are produced by appropriate milling of the chip carrier 10 , since at the same time this simplifies the contacting of flats 31 on the coil contact ends 21 to 24 are formed in the contacting areas 27 to 30 .

From Fig. 2 it can also be seen that the coil contact ends 21 to 24 are arranged in a meandering manner in their contacting areas 27 to 30 , so that due to this special arrangement an overall enlarged contact area is formed in the contacting areas 27 to 30 .

An application and contacting device 32 , as shown in FIG. 1, can be used for the application and contacting of the connecting material 11 , which in the present case is in the form of a solder ball. The application and contacting device 32 has a ball feed capillary 33 , at the end of which an application mouthpiece 34 is provided. Above the ball feed capillary 33 there is a connecting material reservoir, not shown here, with a separating device for the metered delivery of connec tion material 11 into the ball feed capillary 33. In the ball feed capillary 33 , an up and down movable pressure stamp 35 is provided, on the one hand for exercising serves mechanical pressure against the connecting material 11 when the connecting material 11 is applied in the connecting material area 12 (see FIG. 1), and secondly to act upon the applied connecting material 11 with thermal energy in order to contact the connecting material 11 with the contacting area 27 perform. After Kontaktie tion of the connecting material 11 with the various contacting areas 27 to 30 , the chip carrier 10 forms together with the connec tion material 11 a manageable unit, which subsequently serves as a blank card or semi-finished product for producing a chip card 35 ( Fig. 2).

To form the chip card 35 , the chip carrier 10 has a chip module receptacle 36 , which in the present case, as can also be seen from FIGS. 1 and 2, is provided in the chip carrier 10 as a separately formed depression, which is separated from the connecting material receiving areas 12 , 13 and 25 , 26 or the connecting material receptacle 14 is surrounded. Deviating from the illustration in FIGS . 1 and 2, however, it is also possible to design the chip module receptacle 36 in connection with the connection material receiving areas 12 , 13 and 25 , 26 or the connection material receptacle 14 .

The embodiment shown in FIGS . 1 and 2 with a separately formed chip module receptacle 36 offers the advantage that when producing the chip carrier 10 or the chip card 35 in laminating technology, the chip module receptacle in a simple manner by forming a corresponding window opening in the top layer 17 can be generated. In a corresponding manner, the connecting material receiving areas 12 , 13 and 25 , 26 or the connecting material receptacle 14 can also be formed, an insulating cover of the conductor material of the coil arrangements 19 , 20 possibly being removed by a suitable thermal application or the like in order to avoid the Form contacting areas 27 to 30 .

To produce the chip card 35 shown in FIG. 3, starting from the chip carrier 10 , the card manufacturer can now, as desired, first of all further laminate layers 37 , 38 provided with a surface design, such as printing, optionally supplemented and covered by surface layers 39 , 40 , Laminate onto the card blank, ie the chip carrier 10 , to form a card body 48 . At closing, a chip module 41 with a chip arrangement 43 arranged on a contact carrier 42 can be inserted into the chip module receptacle 36 such that the chip arrangement 43 engages in the chip module receptacle 36 and an externally arranged contact carrier surface 44 is flush with the surface of the outermost laminate layer, i.e. here the top area 39 , is.

If, as in the embodiment shown in FIG. 3, the connecting material 11 consists of a solder material that was previously spherical, as shown in FIG. 1, rich in the connecting material receiving areas 12 , 13 and 25 , 26 of the chip carrier 10 , can be applied the contacting of contact surfaces 45 of the contact carrier 42 with the connecting material 11 by a remelting of the connec tion material 11 . For this purpose, there is the possibility of applying heat to the connecting material 11 from above, as shown by the arrow 46 , through the contact carrier 42 , or else, as indicated by the arrow 47 , to apply thermal energy to the connecting material 11 from below, with sufficient transparency of the laminate layers, exposure to laser energy is particularly advantageous. In order to avoid that when the connecting material 11 is subjected to a thermal load in the direction of the arrow 46 , that is to say through the contact carrier 42 of the chip module 41 , warps or delaminations can form on the opposite surface of the card body 48 , as shown in FIG. 3 with a broken line Shown line course, a temperature shield can be provided by a material insert 53 which is arranged below the contacting areas 27 to 30 . Such a material insert 53 can be formed, for example, from an elastic, heat-resistant plastic.

Due to the possible displacement of the connecting material 11 in the connecting material receiving areas 12 , 13 and 25 , 26 as a result of the remelting, the chip module 41 can be brought into contact with the contact carrier 42 against the surface of the card body 48 , so that when one of the thicknesses of the contact carrier 42 is formed its depth corresponding recess 49 in the card body 48 the aforementioned flush arrangement of the chip module 41 in the card body 48 is easily achieved.

In addition to a metallic connection material, in particular with functional separation of the connection material, that is to say a connection in connection material for a cohesive, adhesive joining connection and on the other connection material for a non-positive, electrically conductive connection between the chip module and the chip carrier, an elastic connection material can be used as the conductive connection material Connection material, such as rubber or silicone with conductive additives, can be used. Mechanical springs can also be used as a conductive connection material. When using lumpy, elastic connecting material, the application / contacting device 32 can also be used for the thermally supported, captive application of elastic molded pieces.

Basically, regardless of the embodiment, the ver different connecting materials at essentially the same Places or at more or less distant from each other ordered places can be applied.

As is clear from FIG. 4, in which the chip card 35 is shown in plan view after completion, the contact carrier 42 of the chip module 41 is provided on the outwardly facing contact carrier surface 44 with a contact surface arrangement 50 which, in addition to the contactless access to the chip arrangement 43 of the chip module 41 via the coil arrangements 19 , 20 enables contact-based access. Furthermore, it is clear that in the present case the surface layer 39 is formed as a functional layer with an embossed area 51 , which enables an additional credit card function of the chip card 35 shown . In addition, the surface layer 39 has an image area 52 , which can be provided with a hologram representation, for example. Furthermore, in the present case, the chip card 35 is provided in its surface layer 40 opposite the surface layer 39 with a magnetic stripe 53 , which, in addition to the functions described above, enables data to be tapped independently of the chip module 41 .

When using a chip module without a contact Tapping-enabling contact surface arrangement on the contact carrier The chip module holder can also be flush with the card surface surface can be completed, e.g. by means of a plastic coating, especially made of PVC. It is also possible in addition to the chip module to provide a membrane keyboard or a membrane key that is on the Contact carrier surface of the chip module can be arranged. The Contact carrier surface can also be used to hold a hologram position or other representations or functional facilities to serve.

Claims (18)

1. Chip carrier, in particular for the production of a chip card, with a coil substrate which is provided with at least one coil arrangement, characterized in that the coil substrate ( 18 ) in the region of contact ends ( 21 , 22 , 23 , 24 ) of the coil arrangement ( 19 , 20th ) on the coil substrate from formed, the contact ends releasing connecting material receiving areas ( 12 , 13 , 25 , 26 ) for receiving connection material ( 11 ) for producing an electrically conductive connection between the contact ends of the coil arrangement and contact surfaces ( 45 ) of a chip module ( 41 ). 2. Chip carrier according to claim 1, characterized in that the connecting material receiving areas ( 12 , 13 , 25 , 26 ) are formed in the coil substrate ( 18 ). 3. Chip carrier according to claim 1 or 2, characterized in that the connecting material receiving areas ( 12 , 13 , 25 , 26 ) are formed as depressions in a flat top surface ( 17 ) of the coil substrate ( 18 ). 4. Chip carrier according to claim 3, characterized in that the coil substrate ( 18 ) is formed in several layers with a coil layer ( 16 ) and at least one, arranged on a surface of the coil layer top layer ( 17 ). 5. Chip carrier according to one or more of the preceding claims, characterized in that in the connecting material receiving areas ( 12 , 13 , 25 , 26 ) with the contact ends ( 21 , 22 , 23 , 24 ) of the coil arrangement ( 19 , 20 ) contacted connecting material ( 11 ) is arranged. 6. Chip carrier according to claim 5, characterized in that the connecting material ( 11 ) is designed as a metallic, solderable or weldable material. 7. Chip carrier according to claim 5, characterized, that the connecting material as essentially non-metallic, adhesive material is formed. 8. Chip carrier according to one or more of the preceding and workman surface, characterized in that the connecting material receiving areas ( 12 , 13 , 25 , 26 ) are designed to be coherent 9. Chip carrier according to one or more of the preceding claims, characterized in that the connecting material receiving areas ( 12 , 13 , 25 , 26 ) are formed in the peripheral area of a chip module receptacle ( 36 ). 10. Chip carrier according to claim 9, characterized in that the connecting material receiving areas ( 12 , 13 , 25 , 26 ) and the chip module holder ( 36 ) are formed contiguously. 11. Chip carrier according to one or more of the preceding claims, characterized in that the coil substrate ( 18 ) is assigned to a chip module receptacle ( 36 ) connecting material receiving areas ( 12 , 13 , 25 , 26 ), which has the contact ends ( 21 , 22 , 23rd , 24 ) release several coil arrangements ( 19 , 20 ). 12. Chip card ( 35 ) with a chip carrier ( 10 ) according to one or more of claims 1 to 11, and at least one chip module ( 41 ) with a on a contact carrier ( 42 ) arranged chip arrangement ( 43 ), the chip module in this way in the chip carrier is used that the contact carrier with the in the connecting material receiving areas ( 12 , 13 , 25 , 26 ) arranged connecting material ( 11 ) is contacted and the chip arrangement engages in a chip module receiving ( 36 ). 13. Chip card according to claim 12, characterized, that the verbin arranged in the connecting material receptacles is used for electrical contacting and next to the Connection material between the chip module and the chip carrier  Another connection material for a cohesive connection is provided between the chip module and the chip carrier. 14. Chip card according to claim 12 or 13, characterized in that the chip arrangement ( 43 ) of the chip module ( 41 ) on the con tact carrier ( 42 ) with a plurality of coil arrangements ( 19 , 20 ) of the spool lens substrate ( 18 ) is contacted. 15. Chip card according to one or more of claims 12 to 14, characterized in that the contact carrier ( 42 ) is provided on its back with a contact surface arrangement ( 50 ) for contact-based access. 16. A method for producing a chip card using a chip carrier according to one or more of claims 1 to 11, characterized in that a chip module ( 41 ) with an on a contact carrier ( 42 ) to ordered chip arrangement ( 43 ) with the chip arrangement in a chip module receptacle ( 36 ) of the chip carrier ( 10 ) is used and then a thermal connection between contact surfaces ( 45 ) of the contact carrier and the connecting material ( 11 , 13 , 25 , 26 ) arranged in the connecting material receiving areas ( 11 ) while simultaneously displacing the connecting material in the connecting material receiving areas he follows. 17. The method according to claim 16, characterized, that as a connecting material is a metallic connecting material or an adhesive material with an electrically conductive additional measure material is used.   18. A method for producing a chip card using a chip carrier according to one or more of claims 1 to 11, characterized in that a chip module ( 41 ) with an on a contact carrier ( 42 ) to ordered chip arrangement ( 43 ) with the chip arrangement in a chip module receptacle ( 36 ) of the chip carrier ( 10 ) is used and at the same time a cohesive, electrically non-conductive connection between the chip module and the chip carrier and a non-positive, electrically conductive connection between contact surfaces ( 45 ) of the contact carrier and the material-receiving areas in the connecting material ( 12 , 13 , 25 , 26 ) arranged elastic connecting material while simultaneously displacing the connecting material in the connecting material receiving areas, it follows.