DE19983719T1 - Badsystem für Halbleiter Wafer und unter einem Winkel angeordnete Schallwandler - Google Patents

Badsystem für Halbleiter Wafer und unter einem Winkel angeordnete Schallwandler

Info

Publication number
DE19983719T1
DE19983719T1 DE19983719T DE19983719T DE19983719T1 DE 19983719 T1 DE19983719 T1 DE 19983719T1 DE 19983719 T DE19983719 T DE 19983719T DE 19983719 T DE19983719 T DE 19983719T DE 19983719 T1 DE19983719 T1 DE 19983719T1
Authority
DE
Germany
Prior art keywords
angle
semiconductor wafers
bath system
sound transducers
transducers arranged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19983719T
Other languages
English (en)
Inventor
Henry R Miranda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PCT Systems Inc
Original Assignee
PCT Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PCT Systems Inc filed Critical PCT Systems Inc
Publication of DE19983719T1 publication Critical patent/DE19983719T1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
DE19983719T 1998-11-14 1999-11-03 Badsystem für Halbleiter Wafer und unter einem Winkel angeordnete Schallwandler Ceased DE19983719T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/192,148 US6098643A (en) 1998-11-14 1998-11-14 Bath system for semiconductor wafers with obliquely mounted transducers
PCT/US1999/025874 WO2000029135A1 (en) 1998-11-14 1999-11-03 Bath system for semiconductor wafers with obliquely mounted sonic transducers

Publications (1)

Publication Number Publication Date
DE19983719T1 true DE19983719T1 (de) 2002-02-28

Family

ID=22708460

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19983719T Ceased DE19983719T1 (de) 1998-11-14 1999-11-03 Badsystem für Halbleiter Wafer und unter einem Winkel angeordnete Schallwandler

Country Status (4)

Country Link
US (1) US6098643A (de)
DE (1) DE19983719T1 (de)
GB (1) GB2358578B (de)
WO (1) WO2000029135A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19758267A1 (de) * 1997-12-31 1999-07-08 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Behandeln von Substraten
US6492284B2 (en) * 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6328814B1 (en) 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
US6955516B2 (en) * 2001-11-02 2005-10-18 Applied Materials, Inc. Single wafer dryer and drying methods
US6209555B1 (en) * 1999-04-27 2001-04-03 Imtec Acculine, Inc. Substrate cassette for ultrasonic cleaning
US6460551B1 (en) * 1999-10-29 2002-10-08 Applied Materials, Inc. Megasonic resonator for disk cleaning and method for use thereof
JP2002093765A (ja) * 2000-09-20 2002-03-29 Kaijo Corp 基板洗浄方法および基板洗浄装置
US6595224B2 (en) * 2001-06-20 2003-07-22 P.C.T. Systems, Inc. Bath system with sonic transducers on vertical and angled walls
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
US6845779B2 (en) * 2001-11-13 2005-01-25 Fsi International, Inc. Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
US6875289B2 (en) * 2002-09-13 2005-04-05 Fsi International, Inc. Semiconductor wafer cleaning systems and methods
US7238085B2 (en) 2003-06-06 2007-07-03 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
JP2006108512A (ja) * 2004-10-07 2006-04-20 Ses Co Ltd 基板処理装置
JP4591316B2 (ja) * 2005-11-07 2010-12-01 株式会社デンソー 超音波洗浄方法及び超音波洗浄装置
EP1935514B1 (de) * 2006-12-18 2009-07-15 Rena Sondermaschinen GmbH Vorrichtung und Verfahren zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben
US8539969B2 (en) * 2010-07-30 2013-09-24 Sematech, Inc. Gigasonic brush for cleaning surfaces
US11772134B2 (en) * 2017-09-29 2023-10-03 Taiwan Semiconductor Manufacturing Company, Ltd Sonic cleaning of brush

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2891176A (en) * 1955-07-13 1959-06-16 Branson Instr Compressional wave generating apparatus
US2987068A (en) * 1956-05-01 1961-06-06 Branson Instr Apparatus for ultrasonic cleaning
US2985003A (en) * 1957-01-11 1961-05-23 Gen Motors Corp Sonic washer
US3056589A (en) * 1958-06-23 1962-10-02 Bendix Corp Radially vibratile ceramic transducers
US3371233A (en) * 1965-06-28 1968-02-27 Edward G. Cook Multifrequency ultrasonic cleaning equipment
US4167424A (en) * 1976-05-12 1979-09-11 National Steel Corporation Treatment of metal strip with ultrasonic energy and apparatus therefor
GB1588312A (en) * 1977-03-15 1981-04-23 Thermoplastic Compounders Apparatus for and methods of cleaning containers
US4543130A (en) * 1984-08-28 1985-09-24 Rca Corporation Megasonic cleaning apparatus and method
US4736760A (en) * 1986-02-21 1988-04-12 Robert A. Coberly Apparatus for cleaning, rinsing and drying substrates
US4886082A (en) * 1986-07-02 1989-12-12 Brother Kogyo Kabushiki Kaisha Cleaning apparatus
US4836684A (en) * 1988-02-18 1989-06-06 Ultrasonic Power Corporation Ultrasonic cleaning apparatus with phase diversifier
US4909266A (en) * 1989-03-10 1990-03-20 Frank Massa Ultrasonic cleaning system
US5038808A (en) * 1990-03-15 1991-08-13 S&K Products International, Inc. High frequency ultrasonic system
JPH049619A (ja) * 1990-04-26 1992-01-14 Tokyo Electric Co Ltd 電子料金秤
JPH0449619A (ja) * 1990-06-18 1992-02-19 Shimada Phys & Chem Ind Co Ltd 超音波洗浄槽
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
JP2696017B2 (ja) * 1991-10-09 1998-01-14 三菱電機株式会社 洗浄装置及び洗浄方法
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US5383484A (en) * 1993-07-16 1995-01-24 Cfmt, Inc. Static megasonic cleaning system for cleaning objects
SE503240C2 (sv) * 1994-06-17 1996-04-22 Amugruppen Ab Anordning för rensning av huvuden till svetsrobotar
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
US5762084A (en) * 1994-07-15 1998-06-09 Ontrak Systems, Inc. Megasonic bath

Also Published As

Publication number Publication date
GB0111741D0 (en) 2001-07-04
GB2358578B (en) 2002-08-21
WO2000029135A1 (en) 2000-05-25
WO2000029135A9 (en) 2000-11-23
GB2358578A (en) 2001-08-01
US6098643A (en) 2000-08-08

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: H01L 21/302

8131 Rejection