DE2710211A1 - Electronic control circuits cast in silicone rubber or epoxy! resin - have accessible components e.g. terminals protected by removable silicone rubber hoods prior to casting - Google Patents

Electronic control circuits cast in silicone rubber or epoxy! resin - have accessible components e.g. terminals protected by removable silicone rubber hoods prior to casting

Info

Publication number
DE2710211A1
DE2710211A1 DE19772710211 DE2710211A DE2710211A1 DE 2710211 A1 DE2710211 A1 DE 2710211A1 DE 19772710211 DE19772710211 DE 19772710211 DE 2710211 A DE2710211 A DE 2710211A DE 2710211 A1 DE2710211 A1 DE 2710211A1
Authority
DE
Germany
Prior art keywords
silicone rubber
components
cast
resin
casting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19772710211
Other languages
German (de)
Inventor
Rolf Ing Grad Gehrlein
Guenter Ing Grad Hofmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19772710211 priority Critical patent/DE2710211A1/en
Publication of DE2710211A1 publication Critical patent/DE2710211A1/en
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/064Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/069Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1031Surface mounted metallic connector elements
    • H05K2201/10318Surface mounted metallic pins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0548Masks
    • H05K2203/0557Non-printed masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304Protecting a component during manufacturing

Abstract

Electronic control circuits which have their components attached to a connection plate and cast in epoxy resin or silicone rubber has the connectors or other components which are to be accessible above the level of the cast resin protected by a hood made of silicone rubber which, in the case of silicone rubber casting resin, is provided with a sepn. or release layer. The above components may be sockets, pins, switches potentiometers, etc.

Description

Die Erfindung betrifft ein Verfahren zur HerstellungThe invention relates to a method of manufacture

von vergossenen elektrischen Schaltungen mit zugänglichen Bauteilen.of encapsulated electrical circuits with accessible components.

Es ist bekannt, Schaltungen mit elektrischen Bauteilen beispielsweise mit einem Kunststoff in einem Gehäuse zu vergießen. Diejenigen Bauteile, die nach dem Vergießen zugänglich sein müssen, wie etwa Stecker, Buchsen, Schalter, Potentiometer etc. sind dabei ausserhalb der Vergußmasse angeordnet. Eine solche Anordnung weist aber den Nachteil eines erhöhten Platzbedarfs, eines vermehrten Montageaufwandes und einer geringeren mechanischen Festigkeit auf.It is known, for example, circuits with electrical components to encapsulate with a plastic in a housing. Those components that are after must be accessible for potting, such as plugs, sockets, switches, potentiometers etc. are arranged outside the potting compound. Such an arrangement exhibits but the disadvantage of an increased space requirement, an increased installation effort and a lower mechanical strength.

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zur Herstellung von vergossenen elektrischSn Schaltungen aufzuzeigen, bei denen zumindest teilweise unterhalb des Niveaus der Vergußmasse liegende Bauteile zugänglich sind.The invention is based on the object of a method for production of encapsulated electricalSn circuits, in which at least partially Components located below the level of the potting compound are accessible.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die sich zumindest teilweise unterhalb des Niveaus der Vergußmasse befindlicher; zugänglich zu haltenden Bauteile vor dem Vergießen mit einem Schutzstecker abgedeckt werden.This object is achieved according to the invention in that the at least partially located below the level of the potting compound; accessible to be kept Components are covered with a protective plug before potting.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß für die nach dem Vergießen zugänglichen elektrischen Bauteile ein erhöhter mechanischer Schutz gewährleistet ist.The advantages achieved with the invention are in particular: that for the electrical components accessible after casting an increased mechanical Protection is guaranteed.

Ein Ausführungsbeispiel nach der Erfindung ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben.An embodiment according to the invention is shown in the drawing and is described in more detail below.

Ein einseitig offenes Gehäuse 1 besitzt im Inneren beliebig ausgebildete Stützelemente 2 als Abstandshalter, auf denen eine Schaltungsplatte 3 mit diskreten und integrierten Bauteilen 4 aufliegt. Zum Schutz dieser elektrischen Bauteile 4 vor mechanischen und thermischen Beanspruchungen, vor Feuchtigkeit etc. wird das Gehäuse 1 beispielsweise mit einem geeigneten Kunststoff ausgegossen. Diejenigen Bauteile 4, die nach dem Vergießen von außen zugänglich sein müssen, wie etwa Stecker, Buchsen, Schalter, Potentiometer etc.A housing 1 that is open on one side has any interior design Support elements 2 as spacers, on which a circuit board 3 with discrete and integrated components 4 rests. To protect this electrical Components 4 against mechanical and thermal loads, moisture, etc. the housing 1 is poured, for example, with a suitable plastic. Those Components 4 that must be accessible from the outside after potting, such as connectors, Sockets, switches, potentiometers etc.

sind auf der der offenen Seite des Gehäuses 1 zugewandten Seite der Schaltungsplatte 3 angeordnet. Da sie nach dem Vergießen aber zumindest teilweise unterhalb des Niveaus 5 der Vergußmasse 6 liegen, sind sie während des Vergießens mit einem geeignet ausgebildeten Schutzstecker 7 abgedeckt. Nach dem Aushärten der Vergußmasse 6 werden die Schutzstecker 7 abgezogen und die betreffenden Bauteile 4 sind nun von außen zugänglich.are on the side facing the open side of the housing 1 Circuit board 3 arranged. Since they are at least partially after potting are below the level 5 of the potting compound 6, they are during potting covered with a suitably designed protective plug 7. After the Potting compound 6, the protective plugs 7 are removed and the relevant components 4 are now accessible from the outside.

In der Zeichnung ist als zugängliches Bauteil 4 als Beispiel ein Steckkontakt 8 dargestellt, der während des Vergießens mit einem entsprechenden Schutzstecker 7 vorzugsweise aus Silikonkautschuk abgedeckt ist. Nach dem Aushärten der Vergußmasse 6, vorzugsweise aus Epoxydharz, wird der Schutzstecker 7 abgezogen und der Steckkontakt 8 ist in seiner Vertiefung gegen mechanische Beschädigung geschützt. Anschließend kann auf den Steckkontakt 8 ein nicht dargestellter Stecker beispielsweise zur Zuführung einer Versorgungsspannung aufgesteckt werden, der vorzugsweise die gleichen Dimensionen wie der Schutzstecker 7 aufweist, so daß dieser Stecker in der vom Schutzstecker 7 bewirkten Aussparung in der Vergußmasse 6 eine gute mechanische Halterung erfährt.In the drawing, the accessible component 4 is a plug contact as an example 8 shown, the during potting with a corresponding protective plug 7 is preferably covered from silicone rubber. After the casting compound has hardened 6, preferably made of epoxy resin, the protective plug 7 is removed and the plug contact 8 is protected against mechanical damage in its recess. Afterward a connector (not shown) can be attached to the plug contact 8, for example for feeding a supply voltage, which preferably has the same dimensions as the protective plug 7, so that this plug in the from the protective plug 7 caused recess in the potting compound 6 experiences good mechanical retention.

In einer weiteren vorteilhaften Ausbildung der Erfindung ist vorgesehen, daß sowohl der Schutzstecker 7 als auch die Vergußmasse 6 aus Silikonkautschuk bestehen. Um zu verhindern, daß der Schutz stecker 7 nach dem Vergießen an der Vergußmasse 6 haftet, wird die Oberfläche des Schutzsteckers7mit einem geeigneten Trennmittel versehen.In a further advantageous embodiment of the invention it is provided that both the protective plug 7 and the potting compound 6 are made of silicone rubber. In order to prevent the protection plug 7 after potting the sealing compound 6 adheres, the surface of the protective plug 7 with a suitable Release agent provided.

Claims (4)

Verfahren zur Herstellung von vergossenen elektrischen Schaltungen mit zugänglichen Bauteilen Patentansprüche: 1. Verfahren zur Herstellung von vergossenen elektrischen Schaltungen mit zugänglichen Bauteilen, dadurch gekennzeichnet, daß die sch zumindest teilweise unterhalb des Niveaus (5) der Vergußmasse (6) befindlichen, zugänglich zu haltenden Bauteile (8) vor dem Vergießen mit einem Schutzstecker (7) abgedeckt werden.Process for the production of encapsulated electrical circuits with accessible components Patent claims: 1. Process for the production of encapsulated electrical circuits with accessible components, characterized in that the sch at least partially below the level (5) of the casting compound (6), Components to be kept accessible (8) before potting with a protective plug (7) to be covered. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der Schutzstecker (7) aus einem geeigneten wärmebeständigen und von der Vergußmasse (6) nicht benetzbaren Material besteht.2. The method according to claim 1, characterized in that the protective plug (7) from a suitable heat-resistant and non-wettable by the casting compound (6) Material. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Schutzstecker (7) aus Silikonkautschuk und die Vergußmasse (6) aus epoxydharz besteht.3. The method according to claim 1 or 2, characterized in that the Protective plug (7) made of silicone rubber and the potting compound (6) made of epoxy resin. 4. Verfahren nach Anspruch 1 oder einem der folgenden, dadurch gekennzeichnet, daß der Schutzstecker (7) und die Vergußmasse (6) aus Silikonkautschuk bestehen und daß ein Trennmittel vorgesehen ist.4. The method according to claim 1 or one of the following, characterized in that that the protective plug (7) and the potting compound (6) are made of silicone rubber and that a release agent is provided.
DE19772710211 1977-03-09 1977-03-09 Electronic control circuits cast in silicone rubber or epoxy! resin - have accessible components e.g. terminals protected by removable silicone rubber hoods prior to casting Ceased DE2710211A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772710211 DE2710211A1 (en) 1977-03-09 1977-03-09 Electronic control circuits cast in silicone rubber or epoxy! resin - have accessible components e.g. terminals protected by removable silicone rubber hoods prior to casting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772710211 DE2710211A1 (en) 1977-03-09 1977-03-09 Electronic control circuits cast in silicone rubber or epoxy! resin - have accessible components e.g. terminals protected by removable silicone rubber hoods prior to casting

Publications (1)

Publication Number Publication Date
DE2710211A1 true DE2710211A1 (en) 1978-09-14

Family

ID=6003156

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772710211 Ceased DE2710211A1 (en) 1977-03-09 1977-03-09 Electronic control circuits cast in silicone rubber or epoxy! resin - have accessible components e.g. terminals protected by removable silicone rubber hoods prior to casting

Country Status (1)

Country Link
DE (1) DE2710211A1 (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058757A1 (en) * 1981-02-20 1982-09-01 Siemens Aktiengesellschaft Method of sealing an electrical unit, in particular a relay
FR2529731A1 (en) * 1982-07-02 1984-01-06 France Etat WATERPROOF PUSH BUTTON
EP1367876A1 (en) * 2002-05-31 2003-12-03 Festo Ag & Co. Wiring carrier including manufacturing process and electrical device equipped with the same
EP1383368A2 (en) * 2002-07-19 2004-01-21 Weidmüller Interface GmbH & Co. Modul for electronic device, especially field bus modul
WO2004098247A2 (en) 2003-04-28 2004-11-11 Motorola, Inc. Electronic control module for a removable connector and methods of assembling same
WO2009083315A1 (en) * 2007-12-28 2009-07-09 Robert Bosch Gmbh Electronic unit with a housing
WO2011028750A1 (en) * 2009-09-02 2011-03-10 Rosemount Inc. Wireless process communication adapter with improved encapsulation
US7956738B2 (en) 2004-06-28 2011-06-07 Rosemount Inc. Process field device with radio frequency communication
WO2011113645A1 (en) * 2010-03-17 2011-09-22 Robert Bosch Gmbh Control device
US8049361B2 (en) 2008-06-17 2011-11-01 Rosemount Inc. RF adapter for field device with loop current bypass
US8145180B2 (en) 2004-05-21 2012-03-27 Rosemount Inc. Power generation for process devices
US8160535B2 (en) 2004-06-28 2012-04-17 Rosemount Inc. RF adapter for field device
US8538560B2 (en) 2004-04-29 2013-09-17 Rosemount Inc. Wireless power and communication unit for process field devices
US8626087B2 (en) 2009-06-16 2014-01-07 Rosemount Inc. Wire harness for field devices used in a hazardous locations
US8694060B2 (en) 2008-06-17 2014-04-08 Rosemount Inc. Form factor and electromagnetic interference protection for process device wireless adapters
US8787848B2 (en) 2004-06-28 2014-07-22 Rosemount Inc. RF adapter for field device with low voltage intrinsic safety clamping
US8847571B2 (en) 2008-06-17 2014-09-30 Rosemount Inc. RF adapter for field device with variable voltage drop
US8929948B2 (en) 2008-06-17 2015-01-06 Rosemount Inc. Wireless communication adapter for field devices
US9310794B2 (en) 2011-10-27 2016-04-12 Rosemount Inc. Power supply for industrial process field device
US10761524B2 (en) 2010-08-12 2020-09-01 Rosemount Inc. Wireless adapter with process diagnostics

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058757A1 (en) * 1981-02-20 1982-09-01 Siemens Aktiengesellschaft Method of sealing an electrical unit, in particular a relay
FR2529731A1 (en) * 1982-07-02 1984-01-06 France Etat WATERPROOF PUSH BUTTON
EP0099278A1 (en) * 1982-07-02 1984-01-25 ETAT-FRANCAIS représenté par le Délégué Général pour l' Armement Tight key-switch
EP1367876A1 (en) * 2002-05-31 2003-12-03 Festo Ag & Co. Wiring carrier including manufacturing process and electrical device equipped with the same
EP1383368A3 (en) * 2002-07-19 2008-04-02 Weidmüller Interface GmbH & Co. Modul for electronic device, especially field bus modul
EP1383368A2 (en) * 2002-07-19 2004-01-21 Weidmüller Interface GmbH & Co. Modul for electronic device, especially field bus modul
EP1618770A4 (en) * 2003-04-28 2009-01-07 Motorola Inc Electronic control module for a removable connector and methods of assembling same
EP1618770A2 (en) * 2003-04-28 2006-01-25 Motorola, Inc. Electronic control module for a removable connector and methods of assembling same
WO2004098247A2 (en) 2003-04-28 2004-11-11 Motorola, Inc. Electronic control module for a removable connector and methods of assembling same
US8538560B2 (en) 2004-04-29 2013-09-17 Rosemount Inc. Wireless power and communication unit for process field devices
US8145180B2 (en) 2004-05-21 2012-03-27 Rosemount Inc. Power generation for process devices
US7956738B2 (en) 2004-06-28 2011-06-07 Rosemount Inc. Process field device with radio frequency communication
US8160535B2 (en) 2004-06-28 2012-04-17 Rosemount Inc. RF adapter for field device
US8787848B2 (en) 2004-06-28 2014-07-22 Rosemount Inc. RF adapter for field device with low voltage intrinsic safety clamping
WO2009083315A1 (en) * 2007-12-28 2009-07-09 Robert Bosch Gmbh Electronic unit with a housing
US8694060B2 (en) 2008-06-17 2014-04-08 Rosemount Inc. Form factor and electromagnetic interference protection for process device wireless adapters
US8929948B2 (en) 2008-06-17 2015-01-06 Rosemount Inc. Wireless communication adapter for field devices
US8847571B2 (en) 2008-06-17 2014-09-30 Rosemount Inc. RF adapter for field device with variable voltage drop
US8049361B2 (en) 2008-06-17 2011-11-01 Rosemount Inc. RF adapter for field device with loop current bypass
US8626087B2 (en) 2009-06-16 2014-01-07 Rosemount Inc. Wire harness for field devices used in a hazardous locations
US9674976B2 (en) 2009-06-16 2017-06-06 Rosemount Inc. Wireless process communication adapter with improved encapsulation
WO2011028750A1 (en) * 2009-09-02 2011-03-10 Rosemount Inc. Wireless process communication adapter with improved encapsulation
CN102812788A (en) * 2010-03-17 2012-12-05 罗伯特·博世有限公司 Control device
WO2011113645A1 (en) * 2010-03-17 2011-09-22 Robert Bosch Gmbh Control device
US10761524B2 (en) 2010-08-12 2020-09-01 Rosemount Inc. Wireless adapter with process diagnostics
US9310794B2 (en) 2011-10-27 2016-04-12 Rosemount Inc. Power supply for industrial process field device

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