DE29620595U1 - Socket for an integrated circuit - Google Patents

Socket for an integrated circuit

Info

Publication number
DE29620595U1
DE29620595U1 DE29620595U DE29620595U DE29620595U1 DE 29620595 U1 DE29620595 U1 DE 29620595U1 DE 29620595 U DE29620595 U DE 29620595U DE 29620595 U DE29620595 U DE 29620595U DE 29620595 U1 DE29620595 U1 DE 29620595U1
Authority
DE
Germany
Prior art keywords
socket
integrated circuit
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29620595U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE29620595U priority Critical patent/DE29620595U1/en
Priority to PCT/DE1997/002757 priority patent/WO1998024124A1/en
Publication of DE29620595U1 publication Critical patent/DE29620595U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
DE29620595U 1996-11-26 1996-11-26 Socket for an integrated circuit Expired - Lifetime DE29620595U1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE29620595U DE29620595U1 (en) 1996-11-26 1996-11-26 Socket for an integrated circuit
PCT/DE1997/002757 WO1998024124A1 (en) 1996-11-26 1997-11-25 Base for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29620595U DE29620595U1 (en) 1996-11-26 1996-11-26 Socket for an integrated circuit

Publications (1)

Publication Number Publication Date
DE29620595U1 true DE29620595U1 (en) 1998-01-02

Family

ID=8032496

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29620595U Expired - Lifetime DE29620595U1 (en) 1996-11-26 1996-11-26 Socket for an integrated circuit

Country Status (2)

Country Link
DE (1) DE29620595U1 (en)
WO (1) WO1998024124A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580613B2 (en) * 2001-07-17 2003-06-17 Infineon Technologies Ag Solder-free PCB assembly

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919058A1 (en) * 1979-05-10 1980-11-20 Siemens Ag Electronic appliance with printed circuit module - encapsulated with modules in recesses of precast plastic block
DE3509734A1 (en) * 1984-03-19 1985-09-19 Tektronix, Inc., Beaverton, Oreg. METHOD AND DEVICE FOR PRODUCING AN ELECTRICAL CONNECTION BETWEEN A SYSTEM OF AN INTEGRATED CIRCUIT AND AN ETCHED CIRCUIT BOARD
DE3439556A1 (en) * 1984-08-07 1986-02-20 Aavid Engineering Inc., Laconia, N.H. A HEAT SINKING COVER FOR A CARRIER RECEIVING AN ELECTRONIC CHIP
EP0255244A1 (en) * 1986-07-31 1988-02-03 Amp Incorporated Connector having contact modules for a substrate such as an IC chip carrier
DE3629567A1 (en) * 1986-08-30 1988-03-03 Bbc Brown Boveri & Cie Semiconductor block
US4906194A (en) * 1989-04-13 1990-03-06 Amp Incorporated High density connector for an IC chip carrier
EP0398506A2 (en) * 1989-05-17 1990-11-22 The Whitaker Corporation Electrical socket for tab IC's
US5058265A (en) * 1990-05-10 1991-10-22 Rockwell International Corporation Method for packaging a board of electronic components
DE4326207A1 (en) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanically floating multi-chip substrate
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
DE4310446C1 (en) * 1993-03-31 1994-05-05 Export Contor Ausenhandelsgese Power semiconductor circuit module - has mirror symmetrical configuration of power semiconductor carrier plates and heat sink elements
GB2272580A (en) * 1992-11-16 1994-05-18 Toshiba Kk Shield structure for use in microwave circuit device
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
DE4410467A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Heat sink arrangement with a thermally conductive plate for a plurality of integrated circuits on a substrate
US5473510A (en) * 1994-03-25 1995-12-05 Convex Computer Corporation Land grid array package/circuit board assemblies and methods for constructing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU598253B2 (en) * 1986-05-07 1990-06-21 Digital Equipment Corporation System for detachably mounting semi-conductors on conductor substrates
US4899208A (en) * 1987-12-17 1990-02-06 International Business Machines Corporation Power distribution for full wafer package
JPH0652762B2 (en) * 1991-01-22 1994-07-06 日本航空電子工業株式会社 socket
US5099393A (en) * 1991-03-25 1992-03-24 International Business Machines Corporation Electronic package for high density applications
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919058A1 (en) * 1979-05-10 1980-11-20 Siemens Ag Electronic appliance with printed circuit module - encapsulated with modules in recesses of precast plastic block
DE3509734A1 (en) * 1984-03-19 1985-09-19 Tektronix, Inc., Beaverton, Oreg. METHOD AND DEVICE FOR PRODUCING AN ELECTRICAL CONNECTION BETWEEN A SYSTEM OF AN INTEGRATED CIRCUIT AND AN ETCHED CIRCUIT BOARD
DE3439556A1 (en) * 1984-08-07 1986-02-20 Aavid Engineering Inc., Laconia, N.H. A HEAT SINKING COVER FOR A CARRIER RECEIVING AN ELECTRONIC CHIP
EP0255244A1 (en) * 1986-07-31 1988-02-03 Amp Incorporated Connector having contact modules for a substrate such as an IC chip carrier
DE3629567A1 (en) * 1986-08-30 1988-03-03 Bbc Brown Boveri & Cie Semiconductor block
US4906194A (en) * 1989-04-13 1990-03-06 Amp Incorporated High density connector for an IC chip carrier
EP0398506A2 (en) * 1989-05-17 1990-11-22 The Whitaker Corporation Electrical socket for tab IC's
US5058265A (en) * 1990-05-10 1991-10-22 Rockwell International Corporation Method for packaging a board of electronic components
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
DE4326207A1 (en) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanically floating multi-chip substrate
GB2272580A (en) * 1992-11-16 1994-05-18 Toshiba Kk Shield structure for use in microwave circuit device
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
DE4310446C1 (en) * 1993-03-31 1994-05-05 Export Contor Ausenhandelsgese Power semiconductor circuit module - has mirror symmetrical configuration of power semiconductor carrier plates and heat sink elements
DE4410467A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Heat sink arrangement with a thermally conductive plate for a plurality of integrated circuits on a substrate
US5473510A (en) * 1994-03-25 1995-12-05 Convex Computer Corporation Land grid array package/circuit board assemblies and methods for constructing the same

Also Published As

Publication number Publication date
WO1998024124A1 (en) 1998-06-04

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Legal Events

Date Code Title Description
R163 Identified publications notified
R207 Utility model specification

Effective date: 19980212

R156 Lapse of ip right after 3 years

Effective date: 20000901