DE29724458U1 - Lichtemittierende Vorrichtung und Anzeigegerät - Google Patents
Lichtemittierende Vorrichtung und AnzeigegerätInfo
- Publication number
- DE29724458U1 DE29724458U1 DE1997224458 DE29724458U DE29724458U1 DE 29724458 U1 DE29724458 U1 DE 29724458U1 DE 1997224458 DE1997224458 DE 1997224458 DE 29724458 U DE29724458 U DE 29724458U DE 29724458 U1 DE29724458 U1 DE 29724458U1
- Authority
- DE
- Germany
- Prior art keywords
- light
- emitting device
- phosphor
- emitting
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7767—Chalcogenides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
- H01J29/18—Luminescent screens
- H01J29/20—Luminescent screens characterised by the luminescent material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0025—Diffusing sheet or layer; Prismatic sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0051—Diffusing sheet or layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/45169—Platinum (Pt) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Description
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Claims (41)
1. Lichtemittierende Vorrichtung, umfassend ein lichtemittierendes Bauteil (102)
und einen Leuchtstoff (101), der in der Lage ist, einen Teil des von dem
lichtemittierenden Bauteil ausgesandten Lichts zu absorbieren und Licht einer
anderen Wellenlänge als der des absorbierten Lichtes auszusenden, wobei das
lichtemittierende Bauteil (102) einen Halbleiter aus einer Nitridverbindung der
Formel
IniGajAlkN
umfaßt, in der 0 ≦ i, 0 ≦ j, 0 k, und
i + j + k = 1
inklusive InGaN und GaN dotiert mit verschiedenen Verunreinigungen
und wobei der Leuchtstoff ein, zwei oder mehr Granaffluoreszenzstoffe der allgemeinen Formel
(Re1-rSmr)3(Al1-sGas)5O12 : Ce
enthält, in der 0 ≦ r ≦ 1 und 0 ≦ s ≦ 1
und Re mindestens ein Material ausgewählt aus Y und Gd ist
und mindestens ein in dem Leuchtstoff enthaltenes Material die Ungleichung r ≠ 0 erfüllt und wobei das lichtemittierende Bauteil (102) eine blaues Licht emittierende Diode (LED) ist, und wobei sich der Leuchtstoff in direktem oder indirektem Kontakt mit der blaues Licht emittierenden Diode befindet und wobei ein Hauptemissionspeak der lichtemittierenden Diode im Bereich von 400 nm bis 530 nm liegt und eine Hauptemissionswellenlänge des Leuchtstoffs so eingestellt ist, daß sie länger als der Hauptemissionspeak des lichtemittierenden Bauteils ist.
IniGajAlkN
umfaßt, in der 0 ≦ i, 0 ≦ j, 0 k, und
i + j + k = 1
inklusive InGaN und GaN dotiert mit verschiedenen Verunreinigungen
und wobei der Leuchtstoff ein, zwei oder mehr Granaffluoreszenzstoffe der allgemeinen Formel
(Re1-rSmr)3(Al1-sGas)5O12 : Ce
enthält, in der 0 ≦ r ≦ 1 und 0 ≦ s ≦ 1
und Re mindestens ein Material ausgewählt aus Y und Gd ist
und mindestens ein in dem Leuchtstoff enthaltenes Material die Ungleichung r ≠ 0 erfüllt und wobei das lichtemittierende Bauteil (102) eine blaues Licht emittierende Diode (LED) ist, und wobei sich der Leuchtstoff in direktem oder indirektem Kontakt mit der blaues Licht emittierenden Diode befindet und wobei ein Hauptemissionspeak der lichtemittierenden Diode im Bereich von 400 nm bis 530 nm liegt und eine Hauptemissionswellenlänge des Leuchtstoffs so eingestellt ist, daß sie länger als der Hauptemissionspeak des lichtemittierenden Bauteils ist.
2. Lichtemittierende Vorrichtung nach Anspruch 1, in der 0 ≦ s < 1 ist.
3. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der der Leuchtstoff ein Fluoreszenzmaterial der allgemeinen
Formel
(Y1-p-q-r Gdp Ceq Smr)3(Al1-s Gas)5O12
ist, in der 0 ≦ p ≦ 0,8, 0,003 ≦ q < 0,2, 0,0003 ≦ r ≦ 0,08 und 0 ≦ s ≦ 1
und in der p vorzugsweise kleiner als 0,7, und noch bevorzugter kleiner als 0,6 ist,
und in der r vorzugsweise im Bereich von 0,0007 ≦ r ≦ 0,02 liegt.
(Y1-p-q-r Gdp Ceq Smr)3(Al1-s Gas)5O12
ist, in der 0 ≦ p ≦ 0,8, 0,003 ≦ q < 0,2, 0,0003 ≦ r ≦ 0,08 und 0 ≦ s ≦ 1
und in der p vorzugsweise kleiner als 0,7, und noch bevorzugter kleiner als 0,6 ist,
und in der r vorzugsweise im Bereich von 0,0007 ≦ r ≦ 0,02 liegt.
4. Lichtemittierende Vorrichtung nach Anspruch 3, in der 0 ≦ s < 1.
5. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der die lichtemittierende Schicht des lichtemittierenden Bauteils
einen Halbleiter aus einer In enthaltenden Galliumnitridverbindung enthält, und
der Leuchtstoff ein Yttrium-Aluminium-Granat-Fluoreszenzmaterial ist, wobei
ein Teil des Aluminiums des Yttrium-Aluminium-Granat-Fluoreszenzmaterials
mit Gallium substituiert ist, so daß das Verhältnis von Ga : Al im Bereich von
1 : 1 bis 4 : 6 liegt und ein Teil des Yttriums mit Gadolinium substituiert ist, so
daß das Verhältnis von Y : Gd im Bereich von 9 : 1 bis 1 : 9 und bevorzugter im
Bereich von 4 : 1 bis 2 : 3 liegt.
6. Lichtemittierende Vorrichtung, umfassend ein lichtemittierendes Bauteil (102)
und einen Leuchtstoff (101), der in der Lage ist, einen Teil des von dem
lichtemittierenden Bauteil ausgesandten Lichts zu absorbieren und Licht einer
anderen Wellenlänge als der des absorbierten Lichtes auszusenden, wobei das
lichtemittierende Bauteil (102) einen Halbleiter aus einer Nitridverbindung der
Formel
IniGajAlkN
umfaßt, in der 0 ≦ i, 0 ≦ j, 0 ≦ k, und
i + j + k = 1
inklusive InGaN und GaN dotiert mit verschiedenen Verunreinigungen
und wobei der Leuchtstoff ein erstes Fluoreszenzmaterial der allgemeinen Formel
Y3(Al1-sGas)sO12 : Ce
enthält, in der 0 ≦ s ≦ 1 und ein zweites Fluoreszenzmaterial der allgemeinen Formel
Re3Al5O12 : Ce
enthält, in der Re mindestens ein Material ausgewählt aus Y und Gd ist
und wobei das lichtemittierende Bauteil (102) eine blaues Licht emittierende Diode (LED) ist, und wobei der Leuchtstoff in direktem oder indirektem Kontakt mit der blaues Licht emittierenden Diode steht und wobei ein Hauptemissionspeak der lichtemittierenden Diode im Bereich von 400 nm bis 530 nm liegt und eine Hauptemissionswellenlänge des Leuchtstoffs so eingestellt ist, daß sie länger als der Hauptemissionspeak des lichtemittierenden Bauteils ist.
IniGajAlkN
umfaßt, in der 0 ≦ i, 0 ≦ j, 0 ≦ k, und
i + j + k = 1
inklusive InGaN und GaN dotiert mit verschiedenen Verunreinigungen
und wobei der Leuchtstoff ein erstes Fluoreszenzmaterial der allgemeinen Formel
Y3(Al1-sGas)sO12 : Ce
enthält, in der 0 ≦ s ≦ 1 und ein zweites Fluoreszenzmaterial der allgemeinen Formel
Re3Al5O12 : Ce
enthält, in der Re mindestens ein Material ausgewählt aus Y und Gd ist
und wobei das lichtemittierende Bauteil (102) eine blaues Licht emittierende Diode (LED) ist, und wobei der Leuchtstoff in direktem oder indirektem Kontakt mit der blaues Licht emittierenden Diode steht und wobei ein Hauptemissionspeak der lichtemittierenden Diode im Bereich von 400 nm bis 530 nm liegt und eine Hauptemissionswellenlänge des Leuchtstoffs so eingestellt ist, daß sie länger als der Hauptemissionspeak des lichtemittierenden Bauteils ist.
7. Lichtemittierende Vorrichtung nach Anspruch 6, in der 0 ≦ s < 1 und
Re = Y.
Re = Y.
8. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der das lichtemittierende Bauteil (102) in einer Kugelschale
(105a) eines ersten Befestigungsanschlusses (105) eingebaut ist, die
Kugelschale (105a) mit Überzugsmaterial (101) zur Ummantelung des
lichtemittierenden Bauteils (102) gefüllt ist, das lichtemittierende Bauteil (102)
zwei Elektroden hat, deren eine mittels eines Anschlußdrahtes (103) mit einem
zweiten Befestigungsanschluß (106) verbunden ist, das lichtemittierende
Bauteil (102), die Kugelschale (105a) und das Überzugsmaterial (101) mit
einem Gießmaterial (104) abgedeckt sind, der erste Befestigungsanschluß
(105) und der zweite Befestigungsanschluß (106) teilweise mit dem
Gießmaterial (104) bedeckt sind, und der Leuchtstoff entweder in dem
Gießmaterial (104) oder in dem Überzugsmaterial (101) oder sowohl im
Überzugsmaterial (101) als auch im Gießmaterial (104) enthalten sein kann.
9. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der das Gießmaterial (104) ein transparentes Material, wie
Epoxyharz, Harnstoffharz, Silikonharz oder Glas, ist.
10. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der das Überzugsmaterial (101) ein transparentes Material, wie
Epoxyharz, Harnstoffharz, Silikonharz oder Glas ist.
11. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der das Gießmaterial (104) und das Überzugsmaterial (101)
gleich sind.
12. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der das Gießmaterial (104) ein Dispergiermittel, wie
Bariumtitanat, Titanoxid, Aluminiumoxid oder Siliciumdioxid, enthält.
13. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der das Gießmaterial (104) ein Färbemittel enthält.
14. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der das lichtemittierende Bauteil (202) in eine Vertiefung eines
Formgehäuses (204) eingebaut wird, das mit einem Beschichtungsmaterial
(201) zur Ummantelung des lichtemittierenden Bauteils (202) gefüllt ist, wobei
das lichtemittierende Bauteil (202) Elektroden aufweist, die durch
Anschlußdrähte (203) mit den Metallklemmen (205) verbunden sind, die an
gegenüberliegenden Seiten des Gehäuses (204) angebracht sind, und wobei
das Überzugsmaterial (201) den Leuchtstoff enthält.
15. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, umfassend eine im wesentlichen rechteckige Lichtleiterplatte (704),
die mit dem auf ihrer einen Stirnseite angebrachten lichtemittierenden Bauteil
(702) versehen ist, und mit Ausnahme einer Hauptfläche mit einem
reflektierenden Material (705) beschichtet ist.
16. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der der Leuchtstoff in einem auf der Stirnseite aufgebrachten
Überzugsmaterial (701) enthalten ist und in direktem Kontakt mit dem
lichtemittierenden Bauteil (702) steht.
17. Lichtemittierende Vorrichtung nach mindestens einem der vorhergehenden
Ansprüche, in der der Leuchtstoff (706) auf einer nicht mit reflektierendem
Material (705) versehenen Hauptfläche der Lichtleiterplatte (704) aufgebracht
ist.
18. LED Anzeigegerät, umfassend Vorrichtungen nach mindestens einem der
vorhergehenden Ansprüche, die in einer Matrix und in einem
Antriebsschaltkreis angeordnet sind, der das LED Anzeigegerät gemäß den ihm
eingegebenen Daten antreibt.
19. Lichtemittierende Vorrichtung (100) umfassend
ein lichtemittierendes Halbleiterbauteil (102), das ein erstes Licht mit einer er sten Wellenlänge emittiert, dessen Emissionsspektrum eine Peak-Wellenlänge λ von nicht mehr als 530 nm aufweist, und
ein Harz (101), das einen Leuchtstoff enthält, der zumindest einen Teil des ersten Lichts aus dem lichtemittierenden Halbleiterbauteil absorbiert und ein zweites Licht emittiert, wobei der Leuchtstoff ein Seltenerdmetall enthaltender Granat ist und eine gesteuerte Teilchenverteilung hat.
ein lichtemittierendes Halbleiterbauteil (102), das ein erstes Licht mit einer er sten Wellenlänge emittiert, dessen Emissionsspektrum eine Peak-Wellenlänge λ von nicht mehr als 530 nm aufweist, und
ein Harz (101), das einen Leuchtstoff enthält, der zumindest einen Teil des ersten Lichts aus dem lichtemittierenden Halbleiterbauteil absorbiert und ein zweites Licht emittiert, wobei der Leuchtstoff ein Seltenerdmetall enthaltender Granat ist und eine gesteuerte Teilchenverteilung hat.
20. Lichtemittierende Vorrichtung nach Anspruch 19, dadurch gekennzeichnet, daß
der Leuchtstoff YAG:Ce enthält.
21. Lichtemittierende Vorrichtung nach Anspruch 19 oder 20, dadurch gekenn
zeichnet, daß das Emissionsspektrum des zweiten Lichts wesentlich größer ist
als das des ersten Lichts.
22. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 21, dadurch
gekennzeichnet, daß das lichtemittierende Halbleiterbauteil blaues Licht
emittiert.
23. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 22, dadurch
gekennzeichnet, daß das den Leuchtstoff enthaltende Harz über oder auf dem
Halbleiterkörper (102) angeordnet ist.
24. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 22, dadurch
gekennzeichnet, daß das den Leuchtstoff enthaltende Harz zumindest einen
Teil des lichtemittierenden Halbleiterbauteils (102) und zumindest einen Teil der
elektrischen Verbindungen (103) des lichtemittierenden Halbleiterbauteils direkt
umhüllt.
25. Lichtemittierende Vorrichtung nach Anspruch 23 oder 24, dadurch
gekennzeichnet, daß das von dem lichtemittierenden Halbleiterbauteil emittierte
erste Licht durch den auf der Oberfläche auf der lichtemittierenden Seite eines
transparenten Harzes angeordneten Leuchtstoff ausgestrahlt wird.
26. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 22, dadurch
gekennzeichnet, daß das den Leuchtstoff enthaltende Harz auf mindestens
einen Teil der Oberfläche des lichtemittierenden Halbleiterbauteils (102)
aufgetragen ist.
27. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 26, dadurch
gekennzeichnet, daß das lichtemittierende Halbleiterbauteil (102) in einer sich
in der Querschnittsansicht öffnenden C-Form angeordnet ist und das erste Licht
aus der Öffnung durch die den Leuchtstoff enthaltende Harzschicht (101)
ausgestrahlt wird.
28. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 26, dadurch
gekennzeichnet, daß der Halbleiterkörper (102) in einem Gehäuse (204) angeordnet
ist und eine Öffnung in dem Gehäuse zumindest teilweise mit dem den
Leuchtstoff enthaltenden Harz (101) gefüllt ist.
29. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 28, dadurch
gekennzeichnet, daß die Peak-Wellenlänge des zweiten Lichts größer ist als die
erste Peak-Wellenlänge des ersten Lichts.
30. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 29, dadurch
gekennzeichnet, daß das den Leuchtstoff enthaltende Harz Epoxyharz, Harn
stoffharz oder Silizium enthält.
31. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 30, dadurch
gekennzeichnet, daß das den Leuchtstoff und/oder eine Formmasse (104)
enthaltende Harz (101) ein Dispergiermittel enthält.
32. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 31, dadurch
gekennzeichnet, daß der Leuchtstoff einen blauen Bereich des ersten Lichts
absorbiert und umwandelt.
33. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 32, dadurch
gekennzeichnet, daß das den Leuchtstoff enthaltende Harz eine Vielzahl von
verschiedenen Arten eines anorganischen Lumineszenzmaterials enthält.
34. LED-Display mit einer Vielzahl der lichtemittierenden Vorrichtungen nach einem
der Ansprüche 19 bis 33.
35. Lichtquelle insbesondere für Automobile und/oder Luftfahrzeuge mit mindestens
einer lichtemittierenden Vorrichtung nach einem der Ansprüche 19 bis 33.
36. Beleuchtung für Flüssigkristall-Displays mit mindestens einer lichtemittierenden
Vorrichtung nach einem der Ansprüche 19 bis 33.
37. Lichtemittierende Vorrichtung nach Anspruch 31, dadurch gekennzeichnet, daß
das Dispergiermittel Bariumtitanat, Titanoxid, Aluminiumoxid und/oder
Siliziumdioxid enthält.
38. Lichtemittierende Vorrichtung nach einem der Ansprüche 20 bis 33 und 37,
dadurch gekennzeichnet, daß das YAG:Ce Gd enthält.
39. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 33, 37 und 38,
dadurch gekennzeichnet, daß die Peak-Wellenlänge nicht kleiner als 400 nm
ist.
40. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 33 und 37 bis
39, dadurch gekennzeichnet, daß das Seltenerdmetall Ce ist.
41. Lichtemittierende Vorrichtung nach einem der Ansprüche 19 bis 33 und 37 bis
40, dadurch gekennzeichnet, daß der Leuchtstoff Granat enthält, der Y und Al
enthält und mindestens durch Ce aktiviert ist.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19858596 | 1996-07-29 | ||
JP24433996 | 1996-09-17 | ||
JP24538196 | 1996-09-18 | ||
JP35900496 | 1996-12-27 | ||
JP8101097 | 1997-03-31 | ||
EP20000102678 EP1017112A3 (de) | 1996-07-29 | 1997-07-29 | Lichtemittierende und Anzeige-Vorrichtung |
Publications (1)
Publication Number | Publication Date |
---|---|
DE29724458U1 true DE29724458U1 (de) | 2001-04-26 |
Family
ID=27524906
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1997224670 Expired - Lifetime DE29724670U1 (de) | 1996-07-29 | 1997-07-29 | Lichtemittierende Vorrichtung und Diode |
DE1997224458 Expired - Lifetime DE29724458U1 (de) | 1996-07-29 | 1997-07-29 | Lichtemittierende Vorrichtung und Anzeigegerät |
DE1997224764 Expired - Lifetime DE29724764U1 (de) | 1996-07-29 | 1997-07-29 | Lichtquellesystem |
DE1997224642 Expired - Lifetime DE29724642U1 (de) | 1996-07-29 | 1997-07-29 | Farbkonversions-Gußmaterial und Licht emittierende Vorrichtung |
DE1997602929 Expired - Lifetime DE69702929T4 (de) | 1996-07-29 | 1997-07-29 | Lichtemittierende vorrichtung und anzeigevorrichtung |
DE1997224773 Expired - Lifetime DE29724773U1 (de) | 1996-07-29 | 1997-07-29 | Lichtemittierende Vorrichtung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1997224670 Expired - Lifetime DE29724670U1 (de) | 1996-07-29 | 1997-07-29 | Lichtemittierende Vorrichtung und Diode |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1997224764 Expired - Lifetime DE29724764U1 (de) | 1996-07-29 | 1997-07-29 | Lichtquellesystem |
DE1997224642 Expired - Lifetime DE29724642U1 (de) | 1996-07-29 | 1997-07-29 | Farbkonversions-Gußmaterial und Licht emittierende Vorrichtung |
DE1997602929 Expired - Lifetime DE69702929T4 (de) | 1996-07-29 | 1997-07-29 | Lichtemittierende vorrichtung und anzeigevorrichtung |
DE1997224773 Expired - Lifetime DE29724773U1 (de) | 1996-07-29 | 1997-07-29 | Lichtemittierende Vorrichtung |
Country Status (19)
Country | Link |
---|---|
US (25) | US5998925A (de) |
EP (14) | EP2197054B1 (de) |
JP (19) | JP3503139B2 (de) |
KR (7) | KR100549902B1 (de) |
CN (11) | CN100424901C (de) |
AT (1) | ATE195831T1 (de) |
AU (1) | AU720234B2 (de) |
BR (7) | BRPI9715363B1 (de) |
CA (4) | CA2479842C (de) |
DE (6) | DE29724670U1 (de) |
DK (9) | DK2197055T3 (de) |
ES (9) | ES2576053T3 (de) |
GR (1) | GR3034493T3 (de) |
HK (12) | HK1021073A1 (de) |
MY (1) | MY125748A (de) |
PT (5) | PT936682E (de) |
SG (5) | SG115349A1 (de) |
TW (2) | TW383508B (de) |
WO (1) | WO1998005078A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7709852B2 (en) | 1996-09-20 | 2010-05-04 | Osram Gmbh | Wavelength-converting casting composition and light-emitting semiconductor component |
DE102009037186A1 (de) * | 2009-08-12 | 2011-02-17 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauteil |
US9196800B2 (en) | 1996-06-26 | 2015-11-24 | Osram Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
US10533729B2 (en) | 2012-02-27 | 2020-01-14 | Osram Gmbh | Light source with LED chip and luminophore layer |
Families Citing this family (1454)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3404064B2 (ja) * | 1993-03-09 | 2003-05-06 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
US6013199A (en) | 1997-03-04 | 2000-01-11 | Symyx Technologies | Phosphor materials |
US6153971A (en) * | 1995-09-21 | 2000-11-28 | Matsushita Electric Industrial Co., Ltd. | Light source with only two major light emitting bands |
US6041345A (en) * | 1996-03-08 | 2000-03-21 | Microsoft Corporation | Active stream format for holding multiple media streams |
US6600175B1 (en) | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
US20040239243A1 (en) * | 1996-06-13 | 2004-12-02 | Roberts John K. | Light emitting assembly |
TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US6613247B1 (en) | 1996-09-20 | 2003-09-02 | Osram Opto Semiconductors Gmbh | Wavelength-converting casting composition and white light-emitting semiconductor component |
DE19655445B3 (de) * | 1996-09-20 | 2016-09-22 | Osram Gmbh | Weißes Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionsschicht und Verwendung solcher Halbleiterbauelemente |
DE19655185B9 (de) * | 1996-09-20 | 2012-03-01 | Osram Gesellschaft mit beschränkter Haftung | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
JP3378465B2 (ja) * | 1997-05-16 | 2003-02-17 | 株式会社東芝 | 発光装置 |
US6623670B2 (en) | 1997-07-07 | 2003-09-23 | Asahi Rubber Inc. | Method of molding a transparent coating member for light-emitting diodes |
US6319425B1 (en) * | 1997-07-07 | 2001-11-20 | Asahi Rubber Inc. | Transparent coating member for light-emitting diodes and a fluorescent color light source |
US5847507A (en) * | 1997-07-14 | 1998-12-08 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
EP1014455B1 (de) | 1997-07-25 | 2006-07-12 | Nichia Corporation | Halbleitervorrichtung aus einer nitridverbindung |
US20030133292A1 (en) | 1999-11-18 | 2003-07-17 | Mueller George G. | Methods and apparatus for generating and modulating white light illumination conditions |
US7161313B2 (en) * | 1997-08-26 | 2007-01-09 | Color Kinetics Incorporated | Light emitting diode based products |
US7014336B1 (en) | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
US6806659B1 (en) * | 1997-08-26 | 2004-10-19 | Color Kinetics, Incorporated | Multicolored LED lighting method and apparatus |
US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
JPH11135838A (ja) * | 1997-10-20 | 1999-05-21 | Ind Technol Res Inst | 白色発光ダイオード及びその製造方法 |
WO1999033934A1 (fr) * | 1997-12-24 | 1999-07-08 | Hitachi Medical Corporation | Luminophores et detecteurs de rayonnement et unites de tomodensitometrie formes a partir de ces luminophores |
US6469322B1 (en) | 1998-02-06 | 2002-10-22 | General Electric Company | Green emitting phosphor for use in UV light emitting diodes |
US6252254B1 (en) | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
US6294800B1 (en) | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
JP3541709B2 (ja) * | 1998-02-17 | 2004-07-14 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
JP3900144B2 (ja) * | 1998-02-17 | 2007-04-04 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
FR2775250B1 (fr) * | 1998-02-24 | 2000-05-05 | Wilco International Sarl | Moyen d'eclairage pour aeronef compatible avec un systeme de vision nocturne |
US20080042554A1 (en) * | 1998-05-18 | 2008-02-21 | Kabushiki Kaisha Toshiba | Image display device and light emission device |
JP3645422B2 (ja) * | 1998-07-14 | 2005-05-11 | 東芝電子エンジニアリング株式会社 | 発光装置 |
JP2000081848A (ja) * | 1998-09-03 | 2000-03-21 | Semiconductor Energy Lab Co Ltd | 液晶表示装置を搭載した電子機器 |
US6335548B1 (en) * | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
ES2299260T5 (es) † | 1998-09-28 | 2011-12-20 | Koninklijke Philips Electronics N.V. | Sistema de iluminación. |
US6404125B1 (en) * | 1998-10-21 | 2002-06-11 | Sarnoff Corporation | Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
US6366018B1 (en) * | 1998-10-21 | 2002-04-02 | Sarnoff Corporation | Apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
US6299338B1 (en) | 1998-11-30 | 2001-10-09 | General Electric Company | Decorative lighting apparatus with light source and luminescent material |
JP2000208822A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体発光装置 |
DE19902750A1 (de) * | 1999-01-25 | 2000-08-03 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement zur Erzeugung von mischfarbiger elektromagnetischer Strahlung |
JP4296644B2 (ja) * | 1999-01-29 | 2009-07-15 | 豊田合成株式会社 | 発光ダイオード |
JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
US6351069B1 (en) | 1999-02-18 | 2002-02-26 | Lumileds Lighting, U.S., Llc | Red-deficiency-compensating phosphor LED |
US6680569B2 (en) | 1999-02-18 | 2004-01-20 | Lumileds Lighting U.S. Llc | Red-deficiency compensating phosphor light emitting device |
US6140669A (en) | 1999-02-20 | 2000-10-31 | Ohio University | Gallium nitride doped with rare earth ions and method and structure for achieving visible light emission |
KR100683877B1 (ko) | 1999-03-04 | 2007-02-15 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 레이저소자 |
JP3937644B2 (ja) * | 1999-03-25 | 2007-06-27 | セイコーエプソン株式会社 | 光源及び照明装置並びにその照明装置を用いた液晶装置 |
WO2000079605A1 (en) | 1999-06-23 | 2000-12-28 | Citizen Electronics Co., Ltd. | Light emitting diode |
JP3825318B2 (ja) | 1999-07-23 | 2006-09-27 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 発光物質装置、波長変換注入成形材および光源 |
JP2003505582A (ja) | 1999-07-23 | 2003-02-12 | パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツング | 光源用発光物質および発光物質を有する光源 |
US6515421B2 (en) * | 1999-09-02 | 2003-02-04 | General Electric Company | Control of leachable mercury in fluorescent lamps |
JP2001144331A (ja) | 1999-09-02 | 2001-05-25 | Toyoda Gosei Co Ltd | 発光装置 |
US6630691B1 (en) * | 1999-09-27 | 2003-10-07 | Lumileds Lighting U.S., Llc | Light emitting diode device comprising a luminescent substrate that performs phosphor conversion |
US6696703B2 (en) | 1999-09-27 | 2004-02-24 | Lumileds Lighting U.S., Llc | Thin film phosphor-converted light emitting diode device |
KR100683364B1 (ko) | 1999-09-27 | 2007-02-15 | 필립스 루미리즈 라이팅 캄파니 엘엘씨 | 완전한 형광 물질 변환에 의해 백색광을 생성하는 발광다이오드 소자 |
US6686691B1 (en) * | 1999-09-27 | 2004-02-03 | Lumileds Lighting, U.S., Llc | Tri-color, white light LED lamps |
US6299498B1 (en) * | 1999-10-27 | 2001-10-09 | Shin Lung Liu | White-light emitting diode structure and manufacturing method |
JP4197814B2 (ja) * | 1999-11-12 | 2008-12-17 | シャープ株式会社 | Led駆動方法およびled装置と表示装置 |
US20020176259A1 (en) | 1999-11-18 | 2002-11-28 | Ducharme Alfred D. | Systems and methods for converting illumination |
WO2001036864A2 (en) † | 1999-11-18 | 2001-05-25 | Color Kinetics | Systems and methods for generating and modulating illumination conditions |
EP1610593B2 (de) | 1999-11-18 | 2020-02-19 | Signify North America Corporation | Erzeugung von weissem Licht mit LED mit verschiedenen Spektrum |
TW500962B (en) * | 1999-11-26 | 2002-09-01 | Sanyo Electric Co | Surface light source and method for adjusting its hue |
US6357889B1 (en) | 1999-12-01 | 2002-03-19 | General Electric Company | Color tunable light source |
US6513949B1 (en) * | 1999-12-02 | 2003-02-04 | Koninklijke Philips Electronics N.V. | LED/phosphor-LED hybrid lighting systems |
US6350041B1 (en) * | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
US6666567B1 (en) | 1999-12-28 | 2003-12-23 | Honeywell International Inc. | Methods and apparatus for a light source with a raised LED structure |
JP2001177145A (ja) * | 1999-12-21 | 2001-06-29 | Toshiba Electronic Engineering Corp | 半導体発光素子およびその製造方法 |
US7576496B2 (en) * | 1999-12-22 | 2009-08-18 | General Electric Company | AC powered OLED device |
US6566808B1 (en) | 1999-12-22 | 2003-05-20 | General Electric Company | Luminescent display and method of making |
TW480879B (en) * | 2000-01-06 | 2002-03-21 | Dynascan Technology Corp | Method to compensate for the color no uniformity of color display |
KR20010080796A (ko) * | 2000-01-07 | 2001-08-25 | 허영덕 | 백색광용 형광체 및 그 제조방법, 그리고 이를 이용한백색광 발생방법 |
US6700322B1 (en) * | 2000-01-27 | 2004-03-02 | General Electric Company | Light source with organic layer and photoluminescent layer |
US7049761B2 (en) | 2000-02-11 | 2006-05-23 | Altair Engineering, Inc. | Light tube and power supply circuit |
US6522065B1 (en) | 2000-03-27 | 2003-02-18 | General Electric Company | Single phosphor for creating white light with high luminosity and high CRI in a UV led device |
US6538371B1 (en) * | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
US6409938B1 (en) | 2000-03-27 | 2002-06-25 | The General Electric Company | Aluminum fluoride flux synthesis method for producing cerium doped YAG |
WO2001075359A1 (en) * | 2000-04-03 | 2001-10-11 | Getinge/Castle, Inc. | High power led source and optical delivery system |
US6653765B1 (en) | 2000-04-17 | 2003-11-25 | General Electric Company | Uniform angular light distribution from LEDs |
US6603258B1 (en) * | 2000-04-24 | 2003-08-05 | Lumileds Lighting, U.S. Llc | Light emitting diode device that emits white light |
DE10020465A1 (de) * | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement |
JP4521929B2 (ja) * | 2000-04-26 | 2010-08-11 | 株式会社日立メディコ | 蛍光体及びそれを用いた放射線検出器及びx線ct装置 |
US7304325B2 (en) * | 2000-05-01 | 2007-12-04 | Toyoda Gosei Co., Ltd. | Group III nitride compound semiconductor light-emitting device |
US6604971B1 (en) | 2000-05-02 | 2003-08-12 | General Electric Company | Fabrication of LED lamps by controlled deposition of a suspension media |
US6501100B1 (en) | 2000-05-15 | 2002-12-31 | General Electric Company | White light emitting phosphor blend for LED devices |
US6466135B1 (en) | 2000-05-15 | 2002-10-15 | General Electric Company | Phosphors for down converting ultraviolet light of LEDs to blue-green light |
US6621211B1 (en) | 2000-05-15 | 2003-09-16 | General Electric Company | White light emitting phosphor blends for LED devices |
US6555958B1 (en) | 2000-05-15 | 2003-04-29 | General Electric Company | Phosphor for down converting ultraviolet light of LEDs to blue-green light |
JP2001332765A (ja) * | 2000-05-22 | 2001-11-30 | Iwasaki Electric Co Ltd | Led表示灯 |
JP4695819B2 (ja) | 2000-05-29 | 2011-06-08 | パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツング | Ledをベースとする白色発光照明ユニット |
DE10026435A1 (de) * | 2000-05-29 | 2002-04-18 | Osram Opto Semiconductors Gmbh | Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED |
JP2002057376A (ja) * | 2000-05-31 | 2002-02-22 | Matsushita Electric Ind Co Ltd | Ledランプ |
US6577073B2 (en) | 2000-05-31 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Led lamp |
JP4386693B2 (ja) * | 2000-05-31 | 2009-12-16 | パナソニック株式会社 | Ledランプおよびランプユニット |
US7320632B2 (en) * | 2000-06-15 | 2008-01-22 | Lednium Pty Limited | Method of producing a lamp |
AUPQ818100A0 (en) * | 2000-06-15 | 2000-07-06 | Arlec Australia Limited | Led lamp |
JP2002190622A (ja) * | 2000-12-22 | 2002-07-05 | Sanken Electric Co Ltd | 発光ダイオード用透光性蛍光カバー |
JP4926337B2 (ja) * | 2000-06-28 | 2012-05-09 | アバゴ・テクノロジーズ・ジェネラル・アイピー(シンガポール)プライベート・リミテッド | 光源 |
US6883926B2 (en) | 2000-07-25 | 2005-04-26 | General Electric Company | Light emitting semi-conductor device apparatus for display illumination |
DE10036940A1 (de) * | 2000-07-28 | 2002-02-07 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lumineszenz-Konversions-LED |
JP2002050797A (ja) | 2000-07-31 | 2002-02-15 | Toshiba Corp | 半導体励起蛍光体発光装置およびその製造方法 |
US6747406B1 (en) * | 2000-08-07 | 2004-06-08 | General Electric Company | LED cross-linkable phospor coating |
DE10041328B4 (de) * | 2000-08-23 | 2018-04-05 | Osram Opto Semiconductors Gmbh | Verpackungseinheit für Halbleiterchips |
JP2002076434A (ja) * | 2000-08-28 | 2002-03-15 | Toyoda Gosei Co Ltd | 発光装置 |
KR100406856B1 (ko) * | 2000-08-30 | 2003-11-21 | 가부시키가이샤 시티즌 덴시 | 표면 실장형 발광 다이오드 및 그 제조방법 |
US6614103B1 (en) | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
JP2002084002A (ja) * | 2000-09-06 | 2002-03-22 | Nippon Leiz Co Ltd | 光源装置 |
US6255129B1 (en) * | 2000-09-07 | 2001-07-03 | Highlink Technology Corporation | Light-emitting diode device and method of manufacturing the same |
US6525464B1 (en) * | 2000-09-08 | 2003-02-25 | Unity Opto Technology Co., Ltd. | Stacked light-mixing LED |
JP2002141556A (ja) | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
US6635987B1 (en) * | 2000-09-26 | 2003-10-21 | General Electric Company | High power white LED lamp structure using unique phosphor application for LED lighting products |
US7378982B2 (en) * | 2000-09-28 | 2008-05-27 | Abdulahi Mohamed | Electronic display with multiple pre-programmed messages |
JP3609709B2 (ja) * | 2000-09-29 | 2005-01-12 | 株式会社シチズン電子 | 発光ダイオード |
JP2002111072A (ja) * | 2000-09-29 | 2002-04-12 | Toyoda Gosei Co Ltd | 発光装置 |
US6998281B2 (en) * | 2000-10-12 | 2006-02-14 | General Electric Company | Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics |
US6650044B1 (en) | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
JP2002133925A (ja) * | 2000-10-25 | 2002-05-10 | Sanken Electric Co Ltd | 蛍光カバー及び半導体発光装置 |
US6476549B2 (en) * | 2000-10-26 | 2002-11-05 | Mu-Chin Yu | Light emitting diode with improved heat dissipation |
JP2002141559A (ja) * | 2000-10-31 | 2002-05-17 | Sanken Electric Co Ltd | 発光半導体チップ組立体及び発光半導体リードフレーム |
FI109632B (fi) | 2000-11-06 | 2002-09-13 | Nokia Corp | Valkoinen valaisu |
US6365922B1 (en) * | 2000-11-16 | 2002-04-02 | Harvatek Corp. | Focusing cup for surface mount optoelectronic diode package |
US6518600B1 (en) | 2000-11-17 | 2003-02-11 | General Electric Company | Dual encapsulation for an LED |
JP4683719B2 (ja) * | 2000-12-21 | 2011-05-18 | 株式会社日立メディコ | 酸化物蛍光体及びそれを用いた放射線検出器、並びにx線ct装置 |
AT410266B (de) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
KR100367854B1 (ko) * | 2000-12-28 | 2003-01-10 | 대주정밀화학 주식회사 | 툴리움을 포함하는 백색 발광다이오드용 알루미늄산이트륨황색 형광체 및 그 제조방법 |
US20020084745A1 (en) * | 2000-12-29 | 2002-07-04 | Airma Optoelectronics Corporation | Light emitting diode with light conversion by dielectric phosphor powder |
JP3819713B2 (ja) * | 2001-01-09 | 2006-09-13 | 日本碍子株式会社 | 半導体発光素子 |
JP2002280607A (ja) * | 2001-01-10 | 2002-09-27 | Toyoda Gosei Co Ltd | 発光装置 |
JP2002217459A (ja) * | 2001-01-16 | 2002-08-02 | Stanley Electric Co Ltd | 発光ダイオード及び該発光ダイオードを光源として用いた液晶表示器のバックライト装置 |
US6930737B2 (en) * | 2001-01-16 | 2005-08-16 | Visteon Global Technologies, Inc. | LED backlighting system |
US6703780B2 (en) * | 2001-01-16 | 2004-03-09 | General Electric Company | Organic electroluminescent device with a ceramic output coupler and method of making the same |
MY145695A (en) | 2001-01-24 | 2012-03-30 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
EP1244152A3 (de) * | 2001-01-26 | 2008-12-03 | Toyoda Gosei Co., Ltd. | Reflektierende lichtemittierende Diode, reflektierende optische Vorrichtung und Herstellungsverfahren |
JP2002232013A (ja) * | 2001-02-02 | 2002-08-16 | Rohm Co Ltd | 半導体発光素子 |
DE10105800B4 (de) * | 2001-02-07 | 2017-08-31 | Osram Gmbh | Hocheffizienter Leuchtstoff und dessen Verwendung |
JP4724924B2 (ja) * | 2001-02-08 | 2011-07-13 | ソニー株式会社 | 表示装置の製造方法 |
US6541800B2 (en) | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
JP4116260B2 (ja) | 2001-02-23 | 2008-07-09 | 株式会社東芝 | 半導体発光装置 |
US6611000B2 (en) | 2001-03-14 | 2003-08-26 | Matsushita Electric Industrial Co., Ltd. | Lighting device |
JP2002270899A (ja) * | 2001-03-14 | 2002-09-20 | Mitsubishi Electric Lighting Corp | 色温度可変led光源モジュール |
US6630786B2 (en) * | 2001-03-30 | 2003-10-07 | Candescent Technologies Corporation | Light-emitting device having light-reflective layer formed with, or/and adjacent to, material that enhances device performance |
US6844903B2 (en) * | 2001-04-04 | 2005-01-18 | Lumileds Lighting U.S., Llc | Blue backlight and phosphor layer for a color LCD |
JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
JP4101468B2 (ja) * | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
JP2002314138A (ja) | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
JP2004526290A (ja) * | 2001-04-10 | 2004-08-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 照明系およびディスプレイデバイス |
JP2002309247A (ja) * | 2001-04-16 | 2002-10-23 | Nichia Chem Ind Ltd | 窒化ガリウム蛍光体及びその製造方法 |
WO2002086978A1 (fr) * | 2001-04-20 | 2002-10-31 | Nichia Corporation | Dispositif photoemetteur |
US6685852B2 (en) | 2001-04-27 | 2004-02-03 | General Electric Company | Phosphor blends for generating white light from near-UV/blue light-emitting devices |
US6686676B2 (en) | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
US6658373B2 (en) * | 2001-05-11 | 2003-12-02 | Field Diagnostic Services, Inc. | Apparatus and method for detecting faults and providing diagnostics in vapor compression cycle equipment |
US6616862B2 (en) * | 2001-05-21 | 2003-09-09 | General Electric Company | Yellow light-emitting halophosphate phosphors and light sources incorporating the same |
KR100419611B1 (ko) | 2001-05-24 | 2004-02-25 | 삼성전기주식회사 | 발광다이오드 및 이를 이용한 발광장치와 그 제조방법 |
US6596195B2 (en) | 2001-06-01 | 2003-07-22 | General Electric Company | Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same |
US7012588B2 (en) * | 2001-06-05 | 2006-03-14 | Eastman Kodak Company | Method for saving power in an organic electroluminescent display using white light emitting elements |
US6642652B2 (en) * | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
JP4114331B2 (ja) * | 2001-06-15 | 2008-07-09 | 豊田合成株式会社 | 発光装置 |
US6798136B2 (en) * | 2001-06-19 | 2004-09-28 | Gelcore Llc | Phosphor embedded die epoxy and lead frame modifications |
US6758587B2 (en) | 2001-06-25 | 2004-07-06 | Grote Industries, Inc. | Light emitting diode license lamp with reflector |
TWI287569B (en) * | 2001-06-27 | 2007-10-01 | Nantex Industry Co Ltd | Yttrium aluminium garnet fluorescent powder comprising at least two optical active center, its preparation and uses |
DE10133352A1 (de) * | 2001-07-16 | 2003-02-06 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
JP2003027057A (ja) * | 2001-07-17 | 2003-01-29 | Hitachi Ltd | 光源およびそれを用いた画像表示装置 |
JP2003031856A (ja) * | 2001-07-18 | 2003-01-31 | Okaya Electric Ind Co Ltd | 発光素子及びその製造方法 |
US20030015708A1 (en) | 2001-07-23 | 2003-01-23 | Primit Parikh | Gallium nitride based diodes with low forward voltage and low reverse current operation |
TW552726B (en) | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
KR100923804B1 (ko) | 2001-09-03 | 2009-10-27 | 파나소닉 주식회사 | 반도체발광소자, 발광장치 및 반도체발광소자의 제조방법 |
US6791283B2 (en) * | 2001-09-07 | 2004-09-14 | Opalec | Dual mode regulated light-emitting diode module for flashlights |
DE10146719A1 (de) * | 2001-09-20 | 2003-04-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
DE10147040A1 (de) * | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
DE20115914U1 (de) * | 2001-09-27 | 2003-02-13 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
CN100386888C (zh) * | 2001-10-01 | 2008-05-07 | 松下电器产业株式会社 | 发光元件及使用它的发光装置 |
KR100624403B1 (ko) * | 2001-10-06 | 2006-09-15 | 삼성전자주식회사 | 인체의 신경계 기반 정서 합성 장치 및 방법 |
JP2003124521A (ja) * | 2001-10-09 | 2003-04-25 | Rohm Co Ltd | ケース付半導体発光装置 |
JP3948650B2 (ja) * | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
US7011421B2 (en) * | 2001-10-18 | 2006-03-14 | Ilight Technologies, Inc. | Illumination device for simulating neon lighting through use of fluorescent dyes |
DE10153259A1 (de) * | 2001-10-31 | 2003-05-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
JP2003147351A (ja) * | 2001-11-09 | 2003-05-21 | Taiwan Lite On Electronics Inc | 白色光光源の製作方法 |
DE10241989A1 (de) * | 2001-11-30 | 2003-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US20030117794A1 (en) * | 2001-12-20 | 2003-06-26 | Tien-Rong Lu | Flat color-shift medium |
TW518773B (en) * | 2001-12-31 | 2003-01-21 | Solidlite Corp | Manufacturing method of white LED |
KR100497339B1 (ko) * | 2002-01-08 | 2005-06-23 | 주식회사 이츠웰 | 발광 다이오드 장치 및 이를 이용한 조명 기구, 표시 장치그리고 백라이트 장치 |
KR20030060281A (ko) * | 2002-01-08 | 2003-07-16 | 주식회사 이츠웰 | 발광 다이오드 장치 및 이를 이용한 디스플레이 |
WO2003062775A1 (en) * | 2002-01-17 | 2003-07-31 | Hutchinson Technology Inc. | Spectroscopy light source |
JP3973082B2 (ja) * | 2002-01-31 | 2007-09-05 | シチズン電子株式会社 | 両面発光ledパッケージ |
JP2003243700A (ja) * | 2002-02-12 | 2003-08-29 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
CN101420004B (zh) * | 2002-02-15 | 2012-07-04 | 三菱化学株式会社 | 光发射器件及使用其的照明器 |
US6881983B2 (en) * | 2002-02-25 | 2005-04-19 | Kopin Corporation | Efficient light emitting diodes and lasers |
JP4113017B2 (ja) * | 2002-03-27 | 2008-07-02 | シチズンホールディングス株式会社 | 光源装置および表示装置 |
TW558065U (en) * | 2002-03-28 | 2003-10-11 | Solidlite Corp | Purplish pink light emitting diode |
US6762432B2 (en) * | 2002-04-01 | 2004-07-13 | Micrel, Inc. | Electrical field alignment vernier |
JP4172196B2 (ja) * | 2002-04-05 | 2008-10-29 | 豊田合成株式会社 | 発光ダイオード |
US6911079B2 (en) * | 2002-04-19 | 2005-06-28 | Kopin Corporation | Method for reducing the resistivity of p-type II-VI and III-V semiconductors |
JP3956972B2 (ja) * | 2002-04-25 | 2007-08-08 | 日亜化学工業株式会社 | 蛍光物質を用いた発光装置 |
CA2427559A1 (en) * | 2002-05-15 | 2003-11-15 | Sumitomo Electric Industries, Ltd. | White color light emitting device |
US8232725B1 (en) * | 2002-05-21 | 2012-07-31 | Imaging Systems Technology | Plasma-tube gas discharge device |
KR100449503B1 (ko) * | 2002-05-29 | 2004-09-22 | 서울반도체 주식회사 | 백색 칩 발광 다이오드 및 그 제조 방법 |
KR100449502B1 (ko) * | 2002-05-29 | 2004-09-22 | 서울반도체 주식회사 | 백색 발광 다이오드 및 그 제작 방법 |
KR100632659B1 (ko) * | 2002-05-31 | 2006-10-11 | 서울반도체 주식회사 | 백색 발광 다이오드 |
KR20050004298A (ko) * | 2002-06-11 | 2005-01-12 | 아끼덴끼 가부시끼가이샤 | 자전거의 전조등 및 전조등 전기 회로 |
US20030230977A1 (en) * | 2002-06-12 | 2003-12-18 | Epstein Howard C. | Semiconductor light emitting device with fluoropolymer lens |
CA2489237A1 (en) * | 2002-06-13 | 2003-12-24 | Cree, Inc. | Semiconductor emitter comprising a saturated phosphor |
US6972516B2 (en) * | 2002-06-14 | 2005-12-06 | University Of Cincinnati | Photopump-enhanced electroluminescent devices |
KR20080064904A (ko) * | 2002-06-14 | 2008-07-09 | 레드니엄 테크놀로지 피티와이 리미티드 | Led 패키징 방법 및 패키징된 led |
US6734091B2 (en) | 2002-06-28 | 2004-05-11 | Kopin Corporation | Electrode for p-type gallium nitride-based semiconductors |
US7002180B2 (en) | 2002-06-28 | 2006-02-21 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting device |
WO2003107442A2 (en) | 2002-06-17 | 2003-12-24 | Kopin Corporation | Electrode for p-type gallium nitride-based semiconductors |
US6841802B2 (en) | 2002-06-26 | 2005-01-11 | Oriol, Inc. | Thin film light emitting diode |
TW558775B (en) * | 2002-06-27 | 2003-10-21 | Solidlite Corp | Package of compound type LED |
US6955985B2 (en) | 2002-06-28 | 2005-10-18 | Kopin Corporation | Domain epitaxy for thin film growth |
US6809471B2 (en) | 2002-06-28 | 2004-10-26 | General Electric Company | Phosphors containing oxides of alkaline-earth and Group-IIIB metals and light sources incorporating the same |
EP1535299B1 (de) * | 2002-07-16 | 2009-11-18 | odelo GmbH | Weiss-led-scheinwerfer |
JP4118742B2 (ja) * | 2002-07-17 | 2008-07-16 | シャープ株式会社 | 発光ダイオードランプおよび発光ダイオード表示装置 |
WO2004010472A2 (en) * | 2002-07-19 | 2004-01-29 | Microsemi Corporation | Process for fabricating, and light emitting device resulting from, a homogenously mixed powder/pelletized compound |
JP3923867B2 (ja) * | 2002-07-26 | 2007-06-06 | 株式会社アドバンスト・ディスプレイ | 面状光源装置及びそれを用いた液晶表示装置 |
EP2290715B1 (de) * | 2002-08-01 | 2019-01-23 | Nichia Corporation | Lichtemittierendes Halbleiterbauelement, Verfahren zu seiner Herstellung und Lichtemissionsvorrichtung damit |
JP2004071807A (ja) * | 2002-08-06 | 2004-03-04 | Sharp Corp | 照明装置、カメラ装置及び携帯機器 |
US20040032728A1 (en) * | 2002-08-19 | 2004-02-19 | Robert Galli | Optical assembly for LED chip package |
AU2002368183A1 (en) * | 2002-08-21 | 2004-03-11 | Seoul Semiconductor Co., Ltd. | White light emitting device |
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
KR100499129B1 (ko) | 2002-09-02 | 2005-07-04 | 삼성전기주식회사 | 발광 다이오드 및 그 제조방법 |
US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
US7775685B2 (en) | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
CN1318540C (zh) * | 2002-09-13 | 2007-05-30 | 北京有色金属研究总院<Del/> | 一种蓝光激发的白色led用荧光粉及其制造方法 |
WO2004027884A1 (en) | 2002-09-19 | 2004-04-01 | Cree, Inc. | Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor |
US7460196B2 (en) * | 2002-09-25 | 2008-12-02 | Lg Displays Co., Ltd. | Backlight device for liquid crystal display and method of fabricating the same |
JP4263453B2 (ja) * | 2002-09-25 | 2009-05-13 | パナソニック株式会社 | 無機酸化物及びこれを用いた発光装置 |
US6815241B2 (en) * | 2002-09-25 | 2004-11-09 | Cao Group, Inc. | GaN structures having low dislocation density and methods of manufacture |
JP4201167B2 (ja) * | 2002-09-26 | 2008-12-24 | シチズン電子株式会社 | 白色発光装置の製造方法 |
CN1233046C (zh) * | 2002-09-29 | 2005-12-21 | 光宝科技股份有限公司 | 一种制作白光发光二极管光源的方法 |
JP2004127988A (ja) * | 2002-09-30 | 2004-04-22 | Toyoda Gosei Co Ltd | 白色発光装置 |
JP2004131567A (ja) * | 2002-10-09 | 2004-04-30 | Hamamatsu Photonics Kk | 発光体と、これを用いた電子線検出器、走査型電子顕微鏡及び質量分析装置 |
US7009199B2 (en) * | 2002-10-22 | 2006-03-07 | Cree, Inc. | Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current |
US7554258B2 (en) | 2002-10-22 | 2009-06-30 | Osram Opto Semiconductors Gmbh | Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body |
RU2219622C1 (ru) | 2002-10-25 | 2003-12-20 | Закрытое акционерное общество "Светлана-Оптоэлектроника" | Полупроводниковый источник белого света |
TW586246B (en) * | 2002-10-28 | 2004-05-01 | Super Nova Optoelectronics Cor | Manufacturing method of white light LED and the light-emitting device thereof |
JP4040955B2 (ja) * | 2002-11-06 | 2008-01-30 | 株式会社小糸製作所 | 車両用前照灯及びその製造方法 |
JP5138145B2 (ja) * | 2002-11-12 | 2013-02-06 | 日亜化学工業株式会社 | 蛍光体積層構造及びそれを用いる光源 |
KR20040044701A (ko) * | 2002-11-21 | 2004-05-31 | 삼성전기주식회사 | 발광소자 패키지 및 그 제조방법 |
US7595113B2 (en) * | 2002-11-29 | 2009-09-29 | Shin-Etsu Chemical Co., Ltd. | LED devices and silicone resin composition therefor |
JP2004186168A (ja) * | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
JP4072632B2 (ja) * | 2002-11-29 | 2008-04-09 | 豊田合成株式会社 | 発光装置及び発光方法 |
TW559627B (en) * | 2002-12-03 | 2003-11-01 | Lite On Technology Corp | Method for producing bright white light diode with fluorescent powder |
US6897486B2 (en) * | 2002-12-06 | 2005-05-24 | Ban P. Loh | LED package die having a small footprint |
US7692206B2 (en) * | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
US6744196B1 (en) * | 2002-12-11 | 2004-06-01 | Oriol, Inc. | Thin film LED |
US6975369B1 (en) * | 2002-12-12 | 2005-12-13 | Gelcore, Llc | Liquid crystal display with color backlighting employing light emitting diodes |
AU2003283731A1 (en) * | 2002-12-13 | 2004-07-09 | Koninklijke Philips Electronics N.V. | Illumination system comprising a radiation source and a fluorescent material |
DE10259945A1 (de) * | 2002-12-20 | 2004-07-01 | Tews, Walter, Dipl.-Chem. Dr.rer.nat.habil. | Leuchtstoffe mit verlängerter Fluoreszenzlebensdauer |
TW591811B (en) * | 2003-01-02 | 2004-06-11 | Epitech Technology Corp Ltd | Color mixing light emitting diode |
TWI351548B (en) * | 2003-01-15 | 2011-11-01 | Semiconductor Energy Lab | Manufacturing method of liquid crystal display dev |
KR100639647B1 (ko) * | 2003-01-20 | 2006-11-01 | 우베 고산 가부시키가이샤 | 광 변환용 세라믹스 복합 재료 및 그 용도 |
DE102004003135A1 (de) * | 2003-02-20 | 2004-09-02 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Beschichteter Leuchtstoff und lichtemittierende Vorrichtung mit derartigem Leuchtstoff |
DE10307282A1 (de) * | 2003-02-20 | 2004-09-02 | Osram Opto Semiconductors Gmbh | Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung |
KR20050113200A (ko) * | 2003-02-26 | 2005-12-01 | 크리, 인코포레이티드 | 복합 백색 광원 및 그 제조 방법 |
TWI289937B (en) * | 2003-03-04 | 2007-11-11 | Topco Scient Co Ltd | White light LED |
US20040173807A1 (en) * | 2003-03-04 | 2004-09-09 | Yongchi Tian | Garnet phosphors, method of making the same, and application to semiconductor LED chips for manufacturing lighting devices |
TWI246780B (en) * | 2003-03-10 | 2006-01-01 | Toyoda Gosei Kk | Solid-state component device and manufacturing method thereof |
TW200507226A (en) * | 2003-03-12 | 2005-02-16 | Lednium Pty Ltd | A lamp and a process for producing a lamp |
CN100509994C (zh) * | 2003-03-13 | 2009-07-08 | 日亚化学工业株式会社 | 发光膜、发光装置、发光膜的制造方法以及发光装置的制造方法 |
WO2004081140A1 (ja) * | 2003-03-13 | 2004-09-23 | Nichia Corporation | 発光膜、発光装置、発光膜の製造方法および発光装置の製造方法 |
US7038370B2 (en) * | 2003-03-17 | 2006-05-02 | Lumileds Lighting, U.S., Llc | Phosphor converted light emitting device |
US7276025B2 (en) * | 2003-03-20 | 2007-10-02 | Welch Allyn, Inc. | Electrical adapter for medical diagnostic instruments using LEDs as illumination sources |
KR20050118210A (ko) * | 2003-03-28 | 2005-12-15 | 오스람 옵토 세미컨덕터스 게엠베하 | 입자 또는 물질의 표면 상에 코팅을 형성시키는 방법 및이에 의한 생성물 |
US20040196318A1 (en) * | 2003-04-01 | 2004-10-07 | Su Massharudin Bin | Method of depositing phosphor on light emitting diode |
US20040252488A1 (en) * | 2003-04-01 | 2004-12-16 | Innovalight | Light-emitting ceiling tile |
US7279832B2 (en) * | 2003-04-01 | 2007-10-09 | Innovalight, Inc. | Phosphor materials and illumination devices made therefrom |
US7278766B2 (en) * | 2003-04-04 | 2007-10-09 | Honeywell International Inc. | LED based light guide for dual mode aircraft formation lighting |
JP2004311822A (ja) * | 2003-04-09 | 2004-11-04 | Solidlite Corp | 赤紫色発光ダイオード |
DE10316769A1 (de) * | 2003-04-10 | 2004-10-28 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoffbassierte LED und zugehöriger Leuchtstoff |
US6903380B2 (en) * | 2003-04-11 | 2005-06-07 | Weldon Technologies, Inc. | High power light emitting diode |
US20040207311A1 (en) * | 2003-04-18 | 2004-10-21 | Jung-Pin Cheng | White light emitting device |
KR20040090667A (ko) * | 2003-04-18 | 2004-10-26 | 삼성전기주식회사 | 디스플레이용 라이트 유닛 |
US7368179B2 (en) * | 2003-04-21 | 2008-05-06 | Sarnoff Corporation | Methods and devices using high efficiency alkaline earth metal thiogallate-based phosphors |
US7125501B2 (en) * | 2003-04-21 | 2006-10-24 | Sarnoff Corporation | High efficiency alkaline earth metal thiogallate-based phosphors |
KR20040092512A (ko) * | 2003-04-24 | 2004-11-04 | (주)그래픽테크노재팬 | 방열 기능을 갖는 반사판이 구비된 반도체 발광장치 |
EP2270887B1 (de) | 2003-04-30 | 2020-01-22 | Cree, Inc. | Hochleistungs-lichtemitter-verkapselungen mit kompakter optik |
KR100691143B1 (ko) * | 2003-04-30 | 2007-03-09 | 삼성전기주식회사 | 다층 형광층을 가진 발광 다이오드 소자 |
US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
US7528421B2 (en) | 2003-05-05 | 2009-05-05 | Lamina Lighting, Inc. | Surface mountable light emitting diode assemblies packaged for high temperature operation |
US7777235B2 (en) | 2003-05-05 | 2010-08-17 | Lighting Science Group Corporation | Light emitting diodes with improved light collimation |
US7157745B2 (en) | 2004-04-09 | 2007-01-02 | Blonder Greg E | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
US7633093B2 (en) * | 2003-05-05 | 2009-12-15 | Lighting Science Group Corporation | Method of making optical light engines with elevated LEDs and resulting product |
US7108386B2 (en) | 2003-05-12 | 2006-09-19 | Illumitech Inc. | High-brightness LED-phosphor coupling |
US7176501B2 (en) | 2003-05-12 | 2007-02-13 | Luxpia Co, Ltd | Tb,B-based yellow phosphor, its preparation method, and white semiconductor light emitting device incorporating the same |
US6982045B2 (en) * | 2003-05-17 | 2006-01-03 | Phosphortech Corporation | Light emitting device having silicate fluorescent phosphor |
JP2004352928A (ja) * | 2003-05-30 | 2004-12-16 | Mitsubishi Chemicals Corp | 発光装置及び照明装置 |
JP3977774B2 (ja) * | 2003-06-03 | 2007-09-19 | ローム株式会社 | 光半導体装置 |
US7122841B2 (en) | 2003-06-04 | 2006-10-17 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting devices |
US7521667B2 (en) | 2003-06-23 | 2009-04-21 | Advanced Optical Technologies, Llc | Intelligent solid state lighting |
US7145125B2 (en) | 2003-06-23 | 2006-12-05 | Advanced Optical Technologies, Llc | Integrating chamber cone light using LED sources |
US7075225B2 (en) * | 2003-06-27 | 2006-07-11 | Tajul Arosh Baroky | White light emitting device |
US7462983B2 (en) * | 2003-06-27 | 2008-12-09 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | White light emitting device |
JP2005026688A (ja) * | 2003-06-30 | 2005-01-27 | Osram Opto Semiconductors Gmbh | 放射放出半導体チップ、該半導体チップの作製方法および該半導体チップの明るさの調整設定方法 |
US7088038B2 (en) * | 2003-07-02 | 2006-08-08 | Gelcore Llc | Green phosphor for general illumination applications |
US7663597B2 (en) | 2003-07-16 | 2010-02-16 | Honeywood Technologies, Llc | LCD plateau power conservation |
US7583260B2 (en) * | 2003-07-16 | 2009-09-01 | Honeywood Technologies, Llc | Color preservation for spatially varying power conservation |
US7580033B2 (en) * | 2003-07-16 | 2009-08-25 | Honeywood Technologies, Llc | Spatial-based power savings |
US7714831B2 (en) * | 2003-07-16 | 2010-05-11 | Honeywood Technologies, Llc | Background plateau manipulation for display device power conservation |
US7602388B2 (en) * | 2003-07-16 | 2009-10-13 | Honeywood Technologies, Llc | Edge preservation for spatially varying power conservation |
US7786988B2 (en) * | 2003-07-16 | 2010-08-31 | Honeywood Technologies, Llc | Window information preservation for spatially varying power conservation |
US6987353B2 (en) * | 2003-08-02 | 2006-01-17 | Phosphortech Corporation | Light emitting device having sulfoselenide fluorescent phosphor |
US7112921B2 (en) * | 2003-08-02 | 2006-09-26 | Phosphortech Inc. | Light emitting device having selenium-based fluorescent phosphor |
US7109648B2 (en) * | 2003-08-02 | 2006-09-19 | Phosphortech Inc. | Light emitting device having thio-selenide fluorescent phosphor |
KR20050016804A (ko) * | 2003-08-04 | 2005-02-21 | 서울반도체 주식회사 | 발광 소자용 고휘도 형광체 구조 및 이를 사용하는 발광소자 |
US7026755B2 (en) * | 2003-08-07 | 2006-04-11 | General Electric Company | Deep red phosphor for general illumination applications |
CN100379041C (zh) * | 2003-08-07 | 2008-04-02 | 松下电器产业株式会社 | Led照明光源及其制造方法 |
US20050104072A1 (en) | 2003-08-14 | 2005-05-19 | Slater David B.Jr. | Localized annealing of metal-silicon carbide ohmic contacts and devices so formed |
TWI233697B (en) * | 2003-08-28 | 2005-06-01 | Genesis Photonics Inc | AlInGaN light-emitting diode with wide spectrum and solid-state white light device |
EP1659335A4 (de) * | 2003-08-28 | 2010-05-05 | Mitsubishi Chem Corp | Lichtabgabevorrichtung und -phosphor |
JP2007504644A (ja) * | 2003-08-29 | 2007-03-01 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 色混合照明システム |
US7029935B2 (en) * | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
US7183587B2 (en) * | 2003-09-09 | 2007-02-27 | Cree, Inc. | Solid metal block mounting substrates for semiconductor light emitting devices |
US7502392B2 (en) | 2003-09-12 | 2009-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Laser oscillator |
JP3813144B2 (ja) * | 2003-09-12 | 2006-08-23 | ローム株式会社 | 発光制御回路 |
US7204607B2 (en) * | 2003-09-16 | 2007-04-17 | Matsushita Electric Industrial Co., Ltd. | LED lamp |
TW200512949A (en) * | 2003-09-17 | 2005-04-01 | Nanya Plastics Corp | A method to provide emission of white color light by the principle of secondary excitation and its product |
US7915085B2 (en) | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
JP2005089671A (ja) * | 2003-09-19 | 2005-04-07 | Shin Etsu Chem Co Ltd | 硬化性シリコーン樹脂組成物 |
JP4378242B2 (ja) * | 2003-09-25 | 2009-12-02 | 株式会社小糸製作所 | 車両用灯具 |
KR100808705B1 (ko) * | 2003-09-30 | 2008-02-29 | 가부시끼가이샤 도시바 | 발광장치 |
US7135129B2 (en) | 2003-10-22 | 2006-11-14 | Yano Tech (Shanghai) Limited | Inorganic fluorescent material used for solid-state light source |
US7252787B2 (en) * | 2003-10-29 | 2007-08-07 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
US7442326B2 (en) | 2003-10-29 | 2008-10-28 | Lumination Llc | Red garnet phosphors for use in LEDs |
US7094362B2 (en) * | 2003-10-29 | 2006-08-22 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
KR100558446B1 (ko) * | 2003-11-19 | 2006-03-10 | 삼성전기주식회사 | 파장변환용 몰딩 화합물 수지 태블릿 제조방법과 이를이용한 백색 발광다이오드 제조방법 |
JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
JP4654670B2 (ja) * | 2003-12-16 | 2011-03-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US7066623B2 (en) * | 2003-12-19 | 2006-06-27 | Soo Ghee Lee | Method and apparatus for producing untainted white light using off-white light emitting diodes |
TWI229462B (en) * | 2003-12-22 | 2005-03-11 | Solidlite Corp | Improved method of white light LED |
DE10360546A1 (de) * | 2003-12-22 | 2005-07-14 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff |
KR100610249B1 (ko) * | 2003-12-23 | 2006-08-09 | 럭스피아 주식회사 | 황색 발광 형광체 및 그것을 채용한 백색 반도체 발광장치 |
JP4231418B2 (ja) * | 2004-01-07 | 2009-02-25 | 株式会社小糸製作所 | 発光モジュール及び車両用灯具 |
CN100470855C (zh) * | 2004-01-07 | 2009-03-18 | 松下电器产业株式会社 | Led照明光源 |
US7183588B2 (en) * | 2004-01-08 | 2007-02-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emission device |
JP2005209794A (ja) * | 2004-01-21 | 2005-08-04 | Koito Mfg Co Ltd | 発光モジュール及び灯具 |
WO2005073621A1 (ja) * | 2004-01-29 | 2005-08-11 | Matsushita Electric Industrial Co., Ltd. | Led照明光源 |
TWI250664B (en) * | 2004-01-30 | 2006-03-01 | South Epitaxy Corp | White light LED |
US20050179046A1 (en) * | 2004-02-13 | 2005-08-18 | Kopin Corporation | P-type electrodes in gallium nitride-based light-emitting devices |
US20050179042A1 (en) * | 2004-02-13 | 2005-08-18 | Kopin Corporation | Monolithic integration and enhanced light extraction in gallium nitride-based light-emitting devices |
CN100530707C (zh) * | 2004-02-20 | 2009-08-19 | 皇家飞利浦电子股份有限公司 | 包含辐射源和荧光材料的照明系统 |
US7250715B2 (en) * | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
EP1566426B1 (de) | 2004-02-23 | 2015-12-02 | Philips Lumileds Lighting Company LLC | Lichtemittierende vorrichtung, enthaltend einen wellenlängenkonvertierenden leuchtstoff |
US10575376B2 (en) | 2004-02-25 | 2020-02-25 | Lynk Labs, Inc. | AC light emitting diode and AC LED drive methods and apparatus |
US10499465B2 (en) | 2004-02-25 | 2019-12-03 | Lynk Labs, Inc. | High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same |
WO2011143510A1 (en) | 2010-05-12 | 2011-11-17 | Lynk Labs, Inc. | Led lighting system |
CN100391020C (zh) * | 2004-02-26 | 2008-05-28 | 松下电器产业株式会社 | Led光源 |
TWI262609B (en) * | 2004-02-27 | 2006-09-21 | Dowa Mining Co | Phosphor and manufacturing method thereof, and light source, LED using said phosphor |
DE102004029412A1 (de) * | 2004-02-27 | 2005-10-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips |
TWI229465B (en) | 2004-03-02 | 2005-03-11 | Genesis Photonics Inc | Single chip white light component |
US7592192B2 (en) | 2004-03-05 | 2009-09-22 | Konica Minolta Holdings, Inc. | White light emitting diode (white LED) and method of manufacturing white LED |
US7573072B2 (en) * | 2004-03-10 | 2009-08-11 | Lumination Llc | Phosphor and blends thereof for use in LEDs |
DE102004012028A1 (de) * | 2004-03-11 | 2005-10-06 | Lite-On Technology Co. | Phosphoreszierendes Material, sowie dieses verwendende, weißes Licht emittierende Vorrichtung |
AU2005225984A1 (en) * | 2004-03-12 | 2005-10-06 | Avery Dennison Corporation | Emergency information sign |
CN100410703C (zh) * | 2004-03-12 | 2008-08-13 | 艾利丹尼森公司 | 具有被动磷光光源的照明系统 |
US20050201078A1 (en) * | 2004-03-12 | 2005-09-15 | Hannington Michael E. | Lighting system with a passive phosphorescent light source |
DE602005023713D1 (de) * | 2004-03-12 | 2010-11-04 | Avery Dennison Corp | Notinformations-beleuchtungssystem |
US6924233B1 (en) * | 2004-03-19 | 2005-08-02 | Agilent Technologies, Inc. | Phosphor deposition methods |
US20050205874A1 (en) * | 2004-03-19 | 2005-09-22 | Ru-Shi Liu | Phosphor material and white light-emitting device using the same |
JP2005272697A (ja) * | 2004-03-25 | 2005-10-06 | Shin Etsu Chem Co Ltd | 硬化性シリコーン樹脂組成物、光半導体用封止材および光半導体装置 |
US20070194693A1 (en) * | 2004-03-26 | 2007-08-23 | Hajime Saito | Light-Emitting Device |
JP2005310756A (ja) * | 2004-03-26 | 2005-11-04 | Koito Mfg Co Ltd | 光源モジュールおよび車両用前照灯 |
US7355284B2 (en) | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
DE102004015570A1 (de) * | 2004-03-30 | 2005-11-10 | J.S. Technology Co., Ltd. | Weiß-Licht-LED-Anordnung |
WO2005097938A1 (ja) * | 2004-03-31 | 2005-10-20 | Nippon Electric Glass Co., Ltd. | 蛍光体及び発光ダイオード |
US7514867B2 (en) | 2004-04-19 | 2009-04-07 | Panasonic Corporation | LED lamp provided with optical diffusion layer having increased thickness and method of manufacturing thereof |
US7462086B2 (en) * | 2004-04-21 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Phosphor for phosphor-converted semiconductor light emitting device |
KR100900372B1 (ko) * | 2004-04-27 | 2009-06-02 | 파나소닉 주식회사 | 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치 |
CN100401516C (zh) * | 2004-04-28 | 2008-07-09 | 宏齐科技股份有限公司 | 白光发光二极管组件的制作方法 |
TWI228841B (en) * | 2004-04-29 | 2005-03-01 | Lite On Technology Corp | Luminescence method and apparatus for color temperature adjustable white light |
US7819549B2 (en) | 2004-05-05 | 2010-10-26 | Rensselaer Polytechnic Institute | High efficiency light source using solid-state emitter and down-conversion material |
US7837348B2 (en) | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
KR100655894B1 (ko) * | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
US7315119B2 (en) * | 2004-05-07 | 2008-01-01 | Avago Technologies Ip (Singapore) Pte Ltd | Light-emitting device having a phosphor particle layer with specific thickness |
US11158768B2 (en) | 2004-05-07 | 2021-10-26 | Bruce H. Baretz | Vacuum light emitting diode |
KR100658700B1 (ko) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Rgb 발광소자와 형광체를 조합한 발광장치 |
US7077978B2 (en) * | 2004-05-14 | 2006-07-18 | General Electric Company | Phosphors containing oxides of alkaline-earth and group-IIIB metals and white-light sources incorporating same |
TWI241034B (en) * | 2004-05-20 | 2005-10-01 | Lighthouse Technology Co Ltd | Light emitting diode package |
US7339332B2 (en) * | 2004-05-24 | 2008-03-04 | Honeywell International, Inc. | Chroma compensated backlit display |
CN101163775B (zh) * | 2004-05-27 | 2011-12-28 | 皇家飞利浦电子股份有限公司 | 包括一个辐射源和一种荧光材料的照明系统 |
US7456499B2 (en) * | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US7280288B2 (en) * | 2004-06-04 | 2007-10-09 | Cree, Inc. | Composite optical lens with an integrated reflector |
KR100665299B1 (ko) * | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광물질 |
US8318044B2 (en) * | 2004-06-10 | 2012-11-27 | Seoul Semiconductor Co., Ltd. | Light emitting device |
KR100665298B1 (ko) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광장치 |
JP4583076B2 (ja) | 2004-06-11 | 2010-11-17 | スタンレー電気株式会社 | 発光素子 |
US7065534B2 (en) * | 2004-06-23 | 2006-06-20 | Microsoft Corporation | Anomaly detection in data perspectives |
KR100800207B1 (ko) | 2004-06-24 | 2008-02-01 | 우베 고산 가부시키가이샤 | 백색 발광 다이오드 장치 |
KR20060000313A (ko) * | 2004-06-28 | 2006-01-06 | 루미마이크로 주식회사 | 대입경 형광 분말을 포함하는 색변환 발광 장치 그의 제조방법 및 그에 사용되는 수지 조성물 |
DE102004064150B4 (de) * | 2004-06-29 | 2010-04-29 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz |
WO2006005062A2 (en) * | 2004-06-30 | 2006-01-12 | Cree, Inc. | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices |
WO2006008935A1 (ja) | 2004-06-30 | 2006-01-26 | Mitsubishi Chemical Corporation | 蛍光体、及び、それを用いた発光素子、並びに、画像表示装置、照明装置 |
US7255469B2 (en) * | 2004-06-30 | 2007-08-14 | 3M Innovative Properties Company | Phosphor based illumination system having a light guide and an interference reflector |
US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
US20060006366A1 (en) * | 2004-07-06 | 2006-01-12 | Vladimir Abramov | Wave length shifting compositions for white emitting diode systems |
KR101209488B1 (ko) | 2004-07-06 | 2012-12-07 | 라이트스케이프 머티어리얼스, 인코포레이티드 | 효율적인, 녹색 발광 인광체 및 적색 발광 인광체와의 조합 |
US8508119B2 (en) * | 2004-07-13 | 2013-08-13 | Fujikura Ltd. | Phosphor and an incandescent lamp color light emitting diode lamp using the same |
US8417215B2 (en) * | 2004-07-28 | 2013-04-09 | Koninklijke Philips Electronics N.V. | Method for positioning of wireless medical devices with short-range radio frequency technology |
JP4422653B2 (ja) * | 2004-07-28 | 2010-02-24 | Dowaエレクトロニクス株式会社 | 蛍光体およびその製造方法、並びに光源 |
US7267787B2 (en) * | 2004-08-04 | 2007-09-11 | Intematix Corporation | Phosphor systems for a white light emitting diode (LED) |
US7311858B2 (en) * | 2004-08-04 | 2007-12-25 | Intematix Corporation | Silicate-based yellow-green phosphors |
US8017035B2 (en) * | 2004-08-04 | 2011-09-13 | Intematix Corporation | Silicate-based yellow-green phosphors |
FR2874021B1 (fr) | 2004-08-09 | 2006-09-29 | Saint Gobain Cristaux Detecteu | Materiau scintillateur dense et rapide a faible luminescence retardee |
US7750352B2 (en) | 2004-08-10 | 2010-07-06 | Pinion Technologies, Inc. | Light strips for lighting and backlighting applications |
US7259401B2 (en) * | 2004-08-23 | 2007-08-21 | Lite-On Technology Corporation | Reflection-type optoelectronic semiconductor device |
US20060044806A1 (en) * | 2004-08-25 | 2006-03-02 | Abramov Vladimir S | Light emitting diode system packages |
DE102005042778A1 (de) * | 2004-09-09 | 2006-04-13 | Toyoda Gosei Co., Ltd., Nishikasugai | Optische Festkörpervorrichtung |
CA2579196C (en) * | 2004-09-10 | 2010-06-22 | Color Kinetics Incorporated | Lighting zone control methods and apparatus |
JP4667803B2 (ja) | 2004-09-14 | 2011-04-13 | 日亜化学工業株式会社 | 発光装置 |
US7217583B2 (en) * | 2004-09-21 | 2007-05-15 | Cree, Inc. | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
DE102004045950A1 (de) * | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
US7372198B2 (en) | 2004-09-23 | 2008-05-13 | Cree, Inc. | Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor |
TWI256149B (en) * | 2004-09-27 | 2006-06-01 | Advanced Optoelectronic Tech | Light apparatus having adjustable color light and manufacturing method thereof |
US20060067073A1 (en) * | 2004-09-30 | 2006-03-30 | Chu-Chi Ting | White led device |
JP4060841B2 (ja) * | 2004-10-06 | 2008-03-12 | 住友ゴム工業株式会社 | 生タイヤビード部成型方法、及びそれに用いる生タイヤビード部成型装置 |
KR100485673B1 (ko) | 2004-10-11 | 2005-04-27 | 씨엠에스테크놀로지(주) | 백색 발광장치 |
KR101267284B1 (ko) * | 2004-10-15 | 2013-08-07 | 미쓰비시 가가꾸 가부시키가이샤 | 형광체, 및 그것을 사용한 발광 장치, 그리고 화상 표시장치, 조명 장치 |
US7733002B2 (en) | 2004-10-19 | 2010-06-08 | Nichia Corporation | Semiconductor light emitting device provided with an alkaline earth metal boric halide phosphor for luminescence conversion |
KR100899584B1 (ko) * | 2004-10-21 | 2009-05-27 | 우베 고산 가부시키가이샤 | 발광 다이오드 소자, 발광 다이오드용 기판 및 발광다이오드 소자의 제조 방법 |
US20060097385A1 (en) | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
DE102005028748A1 (de) * | 2004-10-25 | 2006-05-04 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes Halbleiterbauelement und Bauelementgehäuse |
US8134292B2 (en) * | 2004-10-29 | 2012-03-13 | Ledengin, Inc. | Light emitting device with a thermal insulating and refractive index matching material |
US8816369B2 (en) | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
US7772609B2 (en) * | 2004-10-29 | 2010-08-10 | Ledengin, Inc. (Cayman) | LED package with structure and materials for high heat dissipation |
US9929326B2 (en) | 2004-10-29 | 2018-03-27 | Ledengin, Inc. | LED package having mushroom-shaped lens with volume diffuser |
US7670872B2 (en) * | 2004-10-29 | 2010-03-02 | LED Engin, Inc. (Cayman) | Method of manufacturing ceramic LED packages |
US8324641B2 (en) * | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
US7473933B2 (en) * | 2004-10-29 | 2009-01-06 | Ledengin, Inc. (Cayman) | High power LED package with universal bonding pads and interconnect arrangement |
JP4757477B2 (ja) * | 2004-11-04 | 2011-08-24 | 株式会社 日立ディスプレイズ | 光源ユニット、それを用いた照明装置及びそれを用いた表示装置 |
US7462317B2 (en) | 2004-11-10 | 2008-12-09 | Enpirion, Inc. | Method of manufacturing an encapsulated package for a magnetic device |
US7426780B2 (en) | 2004-11-10 | 2008-09-23 | Enpirion, Inc. | Method of manufacturing a power module |
US7481562B2 (en) | 2004-11-18 | 2009-01-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Device and method for providing illuminating light using quantum dots |
US7866853B2 (en) * | 2004-11-19 | 2011-01-11 | Fujikura Ltd. | Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light |
WO2006061747A2 (en) | 2004-12-07 | 2006-06-15 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a radiation source and a luminescent material |
US7402831B2 (en) * | 2004-12-09 | 2008-07-22 | 3M Innovative Properties Company | Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission |
US7745814B2 (en) | 2004-12-09 | 2010-06-29 | 3M Innovative Properties Company | Polychromatic LED's and related semiconductor devices |
US7719015B2 (en) * | 2004-12-09 | 2010-05-18 | 3M Innovative Properties Company | Type II broadband or polychromatic LED's |
US20060125716A1 (en) * | 2004-12-10 | 2006-06-15 | Wong Lye Y | Light-emitting diode display with compartment |
JP4582095B2 (ja) | 2004-12-17 | 2010-11-17 | 宇部興産株式会社 | 光変換構造体およびそれを利用した発光装置 |
JP4591071B2 (ja) * | 2004-12-20 | 2010-12-01 | 日亜化学工業株式会社 | 半導体装置 |
US7322732B2 (en) | 2004-12-23 | 2008-01-29 | Cree, Inc. | Light emitting diode arrays for direct backlighting of liquid crystal displays |
US8277686B2 (en) | 2004-12-27 | 2012-10-02 | Ube Industries, Ltd. | Sialon phosphor particles and production method thereof |
JP2006209076A (ja) * | 2004-12-27 | 2006-08-10 | Nichia Chem Ind Ltd | 導光体およびそれを用いた面発光装置 |
TWI245440B (en) * | 2004-12-30 | 2005-12-11 | Ind Tech Res Inst | Light emitting diode |
US8125137B2 (en) | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
CN101103088A (zh) * | 2005-01-10 | 2008-01-09 | 皇家飞利浦电子股份有限公司 | 包含陶瓷发光转换器的照明系统 |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7646033B2 (en) * | 2005-01-11 | 2010-01-12 | Semileds Corporation | Systems and methods for producing white-light light emitting diodes |
US8680534B2 (en) | 2005-01-11 | 2014-03-25 | Semileds Corporation | Vertical light emitting diodes (LED) having metal substrate and spin coated phosphor layer for producing white light |
US8012774B2 (en) * | 2005-01-11 | 2011-09-06 | SemiLEDs Optoelectronics Co., Ltd. | Coating process for a light-emitting diode (LED) |
US7195944B2 (en) * | 2005-01-11 | 2007-03-27 | Semileds Corporation | Systems and methods for producing white-light emitting diodes |
TWI249861B (en) * | 2005-01-12 | 2006-02-21 | Lighthouse Technology Co Ltd | Wavelength converting substance and light emitting device and encapsulating material comprising the same |
US7304694B2 (en) | 2005-01-12 | 2007-12-04 | Cree, Inc. | Solid colloidal dispersions for backlighting of liquid crystal displays |
US7777247B2 (en) * | 2005-01-14 | 2010-08-17 | Cree, Inc. | Semiconductor light emitting device mounting substrates including a conductive lead extending therein |
KR100588209B1 (ko) | 2005-01-19 | 2006-06-08 | 엘지전자 주식회사 | 백색 발광 소자 및 그의 제조 방법 |
US7602116B2 (en) * | 2005-01-27 | 2009-10-13 | Advanced Optoelectronic Technology, Inc. | Light apparatus capable of emitting light of multiple wavelengths using nanometer fluorescent material, light device and manufacturing method thereof |
EP1686630A3 (de) | 2005-01-31 | 2009-03-04 | Samsung Electronics Co., Ltd. | Leuchtdiode mit diffus reflektierender Oberfläche |
EP1845146B1 (de) * | 2005-01-31 | 2015-03-04 | Ube Industries, Ltd. | Rot emittierender nitrid-leuchtstoff und herstellungsverfahren dafür |
KR101139891B1 (ko) * | 2005-01-31 | 2012-04-27 | 렌슬러 폴리테크닉 인스티튜트 | 확산 반사면을 구비한 발광 다이오드 소자 |
KR20060088228A (ko) * | 2005-02-01 | 2006-08-04 | 어드밴스드 옵토일렉트로닉 테크놀로지 인코포레이티드 | 나노미터 형광 물질을 이용하여 다수 파장의 빛을 방출할수 있는 발광 장치, 발광 소자 및 그의 제조 방법 |
US7358542B2 (en) * | 2005-02-02 | 2008-04-15 | Lumination Llc | Red emitting phosphor materials for use in LED and LCD applications |
US20070114562A1 (en) * | 2005-11-22 | 2007-05-24 | Gelcore, Llc | Red and yellow phosphor-converted LEDs for signal applications |
US7497973B2 (en) | 2005-02-02 | 2009-03-03 | Lumination Llc | Red line emitting phosphor materials for use in LED applications |
US7648649B2 (en) * | 2005-02-02 | 2010-01-19 | Lumination Llc | Red line emitting phosphors for use in led applications |
DE102005008834A1 (de) * | 2005-02-16 | 2006-08-24 | Aspre Ag | Display zur Erstellung von durch auffallendes Licht erkennbaren farbigen Bildern und Texten |
TW201403859A (zh) | 2005-02-18 | 2014-01-16 | Nichia Corp | 具備控制配光特性用之透鏡之發光裝置 |
JP4669713B2 (ja) * | 2005-02-18 | 2011-04-13 | 株式会社リコー | 画像読取装置及び画像形成装置 |
CN101124293A (zh) * | 2005-02-21 | 2008-02-13 | 皇家飞利浦电子股份有限公司 | 包含辐射源和发光材料的照明系统 |
CN1684279A (zh) * | 2005-02-25 | 2005-10-19 | 炬鑫科技股份有限公司 | 发光元件 |
US20060193131A1 (en) * | 2005-02-28 | 2006-08-31 | Mcgrath William R | Circuit devices which include light emitting diodes, assemblies which include such circuit devices, and methods for directly replacing fluorescent tubes |
EP1854863A4 (de) * | 2005-02-28 | 2012-02-22 | Mitsubishi Chem Corp | Leuchtstoff und sein herstellungsverfahren und seine verwendung |
US7439668B2 (en) * | 2005-03-01 | 2008-10-21 | Lumination Llc | Oxynitride phosphors for use in lighting applications having improved color quality |
JP4866558B2 (ja) * | 2005-03-10 | 2012-02-01 | シチズン電子株式会社 | 画像撮影用照明装置 |
CN100454590C (zh) * | 2005-03-11 | 2009-01-21 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管、发光二极管模组及背光系统 |
US7274045B2 (en) * | 2005-03-17 | 2007-09-25 | Lumination Llc | Borate phosphor materials for use in lighting applications |
JP5652426B2 (ja) * | 2005-03-18 | 2015-01-14 | 三菱化学株式会社 | 蛍光体混合物、発光装置、画像表示装置、及び照明装置 |
JP5286639B2 (ja) * | 2005-03-18 | 2013-09-11 | 三菱化学株式会社 | 蛍光体混合物、発光装置、画像表示装置、及び照明装置 |
US8269410B2 (en) | 2005-03-18 | 2012-09-18 | Mitsubishi Chemical Corporation | Light-emitting device, white light-emitting device, illuminator, and image display |
TWI249867B (en) | 2005-03-24 | 2006-02-21 | Lighthouse Technology Co Ltd | Light-emitting diode package, cold cathode fluorescence lamp and photoluminescence material thereof |
US7276183B2 (en) | 2005-03-25 | 2007-10-02 | Sarnoff Corporation | Metal silicate-silica-based polymorphous phosphors and lighting devices |
US7316497B2 (en) * | 2005-03-29 | 2008-01-08 | 3M Innovative Properties Company | Fluorescent volume light source |
JP2006278980A (ja) * | 2005-03-30 | 2006-10-12 | Sanyo Electric Co Ltd | 半導体発光装置 |
KR20080009198A (ko) * | 2005-03-31 | 2008-01-25 | 도와 일렉트로닉스 가부시키가이샤 | 형광체, 형광체 시트 및 그 제조 방법, 및 상기 형광체를이용한 발광 장치 |
KR101142519B1 (ko) * | 2005-03-31 | 2012-05-08 | 서울반도체 주식회사 | 적색 형광체 및 녹색 형광체를 갖는 백색 발광다이오드를채택한 백라이트 패널 |
US7791561B2 (en) | 2005-04-01 | 2010-09-07 | Prysm, Inc. | Display systems having screens with optical fluorescent materials |
US7474286B2 (en) | 2005-04-01 | 2009-01-06 | Spudnik, Inc. | Laser displays using UV-excitable phosphors emitting visible colored light |
US20060221022A1 (en) * | 2005-04-01 | 2006-10-05 | Roger Hajjar | Laser vector scanner systems with display screens having optical fluorescent materials |
US7733310B2 (en) | 2005-04-01 | 2010-06-08 | Prysm, Inc. | Display screens having optical fluorescent materials |
EP1872625A4 (de) * | 2005-04-06 | 2014-05-07 | Koninkl Philips Nv | Weisslicht-beleuchtungsvorrichtung mit justierbarer korrelierter farbtemperatur |
DE102006016548B9 (de) | 2005-04-15 | 2021-12-16 | Osram Gmbh | Blau bis Gelb-Orange emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff |
US7489073B2 (en) * | 2005-04-15 | 2009-02-10 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Blue to yellow-orange emitting phosphor, and light source having such a phosphor |
JP4972957B2 (ja) * | 2005-04-18 | 2012-07-11 | 三菱化学株式会社 | 蛍光体、及びそれを用いた発光装置、並びに画像表示装置、照明装置 |
US20060255712A1 (en) * | 2005-04-19 | 2006-11-16 | Masatsugu Masuda | Light emitting apparatus, liquid crystal display apparatus and lighting apparatus |
US7329371B2 (en) * | 2005-04-19 | 2008-02-12 | Lumination Llc | Red phosphor for LED based lighting |
JP4843990B2 (ja) * | 2005-04-22 | 2011-12-21 | 日亜化学工業株式会社 | 蛍光体およびそれを用いた発光装置 |
GB2425449B (en) * | 2005-04-26 | 2007-05-23 | City Greening Engineering Comp | Irrigation system |
US8000005B2 (en) | 2006-03-31 | 2011-08-16 | Prysm, Inc. | Multilayered fluorescent screens for scanning beam display systems |
US7994702B2 (en) | 2005-04-27 | 2011-08-09 | Prysm, Inc. | Scanning beams displays based on light-emitting screens having phosphors |
US8089425B2 (en) | 2006-03-03 | 2012-01-03 | Prysm, Inc. | Optical designs for scanning beam display systems using fluorescent screens |
JP4535928B2 (ja) * | 2005-04-28 | 2010-09-01 | シャープ株式会社 | 半導体発光装置 |
US7690167B2 (en) * | 2005-04-28 | 2010-04-06 | Antonic James P | Structural support framing assembly |
KR100704492B1 (ko) * | 2005-05-02 | 2007-04-09 | 한국화학연구원 | 형광체를 이용한 백색 발광 다이오드의 제조 방법 |
JP4738049B2 (ja) * | 2005-05-02 | 2011-08-03 | ユニ・チャーム株式会社 | 吸収性物品 |
US7602408B2 (en) | 2005-05-04 | 2009-10-13 | Honeywood Technologies, Llc | Luminance suppression power conservation |
US7760210B2 (en) * | 2005-05-04 | 2010-07-20 | Honeywood Technologies, Llc | White-based power savings |
TWI260799B (en) * | 2005-05-06 | 2006-08-21 | Harvatek Corp | Multi-wavelength white light light-emitting diode |
DE102005023134A1 (de) * | 2005-05-19 | 2006-11-23 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Lumineszenzkonversions-LED |
EP1888711B1 (de) | 2005-05-24 | 2012-11-14 | Seoul Semiconductor Co., Ltd. | Lichtemittierende vorrichtung und phosphor aus erdalkalisulfid dafür |
TWI475093B (zh) | 2005-05-24 | 2015-03-01 | Mitsubishi Chem Corp | 螢光體及其應用 |
US7632000B2 (en) * | 2005-05-25 | 2009-12-15 | Samsung Electronics Co., Ltd. | Backlight assembly and liquid crystal display device having the same |
TW200704283A (en) | 2005-05-27 | 2007-01-16 | Lamina Ceramics Inc | Solid state LED bridge rectifier light engine |
JP2007049114A (ja) * | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
US7753553B2 (en) * | 2005-06-02 | 2010-07-13 | Koniklijke Philips Electronics N.V. | Illumination system comprising color deficiency compensating luminescent material |
US8718437B2 (en) | 2006-03-07 | 2014-05-06 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
US8215815B2 (en) | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
KR101017917B1 (ko) * | 2005-06-07 | 2011-03-04 | 가부시키가이샤후지쿠라 | 발광소자 실장용 기판, 발광소자 모듈, 조명장치, 표시장치및 교통 신호기 |
US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
WO2006131924A2 (en) | 2005-06-07 | 2006-12-14 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus |
JP2006343500A (ja) * | 2005-06-08 | 2006-12-21 | Olympus Corp | 光源装置及び投影光学装置 |
US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
JP5124978B2 (ja) * | 2005-06-13 | 2013-01-23 | 日亜化学工業株式会社 | 発光装置 |
US20060290133A1 (en) * | 2005-06-13 | 2006-12-28 | Westrim, Inc. | Postbound album |
US7980743B2 (en) | 2005-06-14 | 2011-07-19 | Cree, Inc. | LED backlighting for displays |
KR101201266B1 (ko) * | 2005-06-14 | 2012-11-14 | 덴끼 가가꾸 고교 가부시키가이샤 | 형광체 함유 수지 조성물 및 시트, 그것들을 사용한 발광소자 |
JP2006351773A (ja) * | 2005-06-15 | 2006-12-28 | Rohm Co Ltd | 半導体発光装置 |
KR100638868B1 (ko) * | 2005-06-20 | 2006-10-27 | 삼성전기주식회사 | 금속 반사 층을 형성한 엘이디 패키지 및 그 제조 방법 |
KR101266130B1 (ko) | 2005-06-23 | 2013-05-27 | 렌슬러 폴리테크닉 인스티튜트 | 단파장 led들 및 다운-컨버젼 물질들로 백색광을생성하기 위한 패키지 설계 |
JP5426160B2 (ja) | 2005-06-28 | 2014-02-26 | ソウル バイオシス カンパニー リミテッド | 交流用発光素子 |
US8896216B2 (en) | 2005-06-28 | 2014-11-25 | Seoul Viosys Co., Ltd. | Illumination system |
TWI422044B (zh) * | 2005-06-30 | 2014-01-01 | Cree Inc | 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置 |
DE102005038698A1 (de) * | 2005-07-08 | 2007-01-18 | Tridonic Optoelectronics Gmbh | Optoelektronische Bauelemente mit Haftvermittler |
JP2007027431A (ja) * | 2005-07-15 | 2007-02-01 | Toshiba Corp | 発光装置 |
KR100649679B1 (ko) * | 2005-07-19 | 2006-11-27 | 삼성전기주식회사 | 측면 발광형 엘이디 패키지 및 이를 이용한 백 라이트 유닛 |
US20070025106A1 (en) * | 2005-07-29 | 2007-02-01 | Korry Electronics Co. | Night vision compatible area light fixture |
TW200717866A (en) * | 2005-07-29 | 2007-05-01 | Toshiba Kk | Semiconductor light emitting device |
WO2007015732A2 (en) * | 2005-08-01 | 2007-02-08 | Intex Recreation Corp. | A method of varying the color of light emitted by a light-emitting device |
KR100533922B1 (ko) * | 2005-08-05 | 2005-12-06 | 알티전자 주식회사 | 황색 형광체 및 이를 이용한 백색 발광 장치 |
CN101238595B (zh) * | 2005-08-10 | 2012-07-04 | 宇部兴产株式会社 | 发光二极管用基板以及发光二极管 |
KR20080037707A (ko) * | 2005-08-11 | 2008-04-30 | 메르크 파텐트 게엠베하 | 규칙적으로 배열된 공동을 가진 광자 재료 |
US7329907B2 (en) | 2005-08-12 | 2008-02-12 | Avago Technologies, Ecbu Ip Pte Ltd | Phosphor-converted LED devices having improved light distribution uniformity |
US20070045641A1 (en) * | 2005-08-23 | 2007-03-01 | Yin Chua Janet B | Light source with UV LED and UV reflector |
KR100691273B1 (ko) * | 2005-08-23 | 2007-03-12 | 삼성전기주식회사 | 복합 형광체 분말, 이를 이용한 발광 장치 및 복합 형광체분말의 제조 방법 |
KR20080037734A (ko) | 2005-08-23 | 2008-04-30 | 가부시끼가이샤 도시바 | 발광 장치와 그를 이용한 백 라이트 및 액정 표시 장치 |
US7847302B2 (en) * | 2005-08-26 | 2010-12-07 | Koninklijke Philips Electronics, N.V. | Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature |
US20070052342A1 (en) * | 2005-09-01 | 2007-03-08 | Sharp Kabushiki Kaisha | Light-emitting device |
JP2007067326A (ja) * | 2005-09-02 | 2007-03-15 | Shinko Electric Ind Co Ltd | 発光ダイオード及びその製造方法 |
JP2007110090A (ja) * | 2005-09-13 | 2007-04-26 | Sony Corp | GaN系半導体発光素子、発光装置、画像表示装置、面状光源装置、及び、液晶表示装置組立体 |
EP1925037A4 (de) * | 2005-09-13 | 2011-10-26 | Showa Denko Kk | Lichtemittierende einrichtung |
JP4966530B2 (ja) | 2005-09-15 | 2012-07-04 | 国立大学法人 新潟大学 | 蛍光体 |
DE102005045649A1 (de) * | 2005-09-23 | 2007-03-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Lichtmodul und Lichtsystem |
WO2007037339A1 (ja) * | 2005-09-29 | 2007-04-05 | Kabushiki Kaisha Toshiba | 白色発光装置とその製造方法、およびそれを用いたバックライト並びに液晶表示装置 |
CN101278416B (zh) * | 2005-09-30 | 2011-01-12 | 日亚化学工业株式会社 | 发光装置以及使用该发光装置的背光光源单元 |
KR100724591B1 (ko) | 2005-09-30 | 2007-06-04 | 서울반도체 주식회사 | 발광 소자 및 이를 포함한 led 백라이트 |
WO2007041563A2 (en) * | 2005-09-30 | 2007-04-12 | The Regents Of The University Of California | Cerium based phosphor materials for solid-state lighting applications |
US7688172B2 (en) | 2005-10-05 | 2010-03-30 | Enpirion, Inc. | Magnetic device having a conductive clip |
US8701272B2 (en) | 2005-10-05 | 2014-04-22 | Enpirion, Inc. | Method of forming a power module with a magnetic device having a conductive clip |
US8139362B2 (en) * | 2005-10-05 | 2012-03-20 | Enpirion, Inc. | Power module with a magnetic device having a conductive clip |
US8631560B2 (en) | 2005-10-05 | 2014-01-21 | Enpirion, Inc. | Method of forming a magnetic device having a conductive clip |
KR100693463B1 (ko) * | 2005-10-21 | 2007-03-12 | 한국광기술원 | 2 이상의 물질을 포함하는 봉지층을 구비한 광 확산 발광다이오드 |
US7479660B2 (en) * | 2005-10-21 | 2009-01-20 | Perkinelmer Elcos Gmbh | Multichip on-board LED illumination device |
US7360934B2 (en) * | 2005-10-24 | 2008-04-22 | Sumitomo Electric Industries, Ltd. | Light supply unit, illumination unit, and illumination system |
KR100571882B1 (ko) * | 2005-10-27 | 2006-04-17 | 알티전자 주식회사 | 황색 형광체 및 이를 포함하는 백색 발광 장치 |
KR100771779B1 (ko) * | 2005-11-04 | 2007-10-30 | 삼성전기주식회사 | 황색 형광체 및 이를 이용한 백색 발광 장치 |
TWI291247B (en) * | 2005-11-11 | 2007-12-11 | Univ Nat Chiao Tung | Nanoparticle structure and manufacturing process of multi-wavelength light emitting devices |
KR101258397B1 (ko) * | 2005-11-11 | 2013-04-30 | 서울반도체 주식회사 | 구리 알칼리토 실리케이트 혼성 결정 형광체 |
US20070114561A1 (en) * | 2005-11-22 | 2007-05-24 | Comanzo Holly A | High efficiency phosphor for use in LEDs |
WO2007060573A1 (en) * | 2005-11-24 | 2007-05-31 | Koninklijke Philips Electronics N.V. | Display device with solid state fluorescent material |
US8116181B2 (en) * | 2005-11-28 | 2012-02-14 | Koninklijke Philips Electronics N.V. | Apparatus for and method for recording data on a rewritable optical record carrier |
US20070125984A1 (en) * | 2005-12-01 | 2007-06-07 | Sarnoff Corporation | Phosphors protected against moisture and LED lighting devices |
US20070128745A1 (en) * | 2005-12-01 | 2007-06-07 | Brukilacchio Thomas J | Phosphor deposition method and apparatus for making light emitting diodes |
US8906262B2 (en) | 2005-12-02 | 2014-12-09 | Lightscape Materials, Inc. | Metal silicate halide phosphors and LED lighting devices using the same |
CN100334185C (zh) * | 2005-12-09 | 2007-08-29 | 天津理工大学 | 稀土钇铝石榴石发光材料及气相制备法 |
JP5097713B2 (ja) * | 2005-12-14 | 2012-12-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 照明装置及び照明装置の製造方法 |
KR101055772B1 (ko) | 2005-12-15 | 2011-08-11 | 서울반도체 주식회사 | 발광장치 |
JP2007165728A (ja) * | 2005-12-15 | 2007-06-28 | Toshiba Discrete Technology Kk | 発光装置及び可視光通信用照明装置 |
JP2007165811A (ja) | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | 発光装置 |
US7768192B2 (en) | 2005-12-21 | 2010-08-03 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
DE102005061204A1 (de) * | 2005-12-21 | 2007-07-05 | Perkinelmer Elcos Gmbh | Beleuchtungsvorrichtung, Beleuchtungssteuergerät und Beleuchtungssystem |
EP1964104A4 (de) * | 2005-12-21 | 2012-01-11 | Cree Inc | Schild und beleuchtungsverfahren |
CN101460779A (zh) | 2005-12-21 | 2009-06-17 | 科锐Led照明技术公司 | 照明装置 |
US20070158660A1 (en) * | 2005-12-22 | 2007-07-12 | Acol Technologies S.A. | Optically active compositions and combinations of same with InGaN semiconductors |
US7614759B2 (en) | 2005-12-22 | 2009-11-10 | Cree Led Lighting Solutions, Inc. | Lighting device |
CN1988188A (zh) * | 2005-12-23 | 2007-06-27 | 香港应用科技研究院有限公司 | 具有荧光层结构的发光二极管晶粒及其制造方法 |
US7659544B2 (en) * | 2005-12-23 | 2010-02-09 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Light emitting device with at least two alternately driven light emitting diodes |
US7474287B2 (en) * | 2005-12-23 | 2009-01-06 | Hong Kong Applied Science And Technology | Light emitting device |
US7914197B2 (en) | 2005-12-27 | 2011-03-29 | Showa Denko K.K. | Light guide member, flat light source device, and display device |
US9351355B2 (en) | 2005-12-30 | 2016-05-24 | Seoul Semiconductor Co., Ltd. | Illumination system having color temperature control and method for controlling the same |
KR100728134B1 (ko) * | 2005-12-30 | 2007-06-13 | 김재조 | 발광 장치 |
JP2009530798A (ja) | 2006-01-05 | 2009-08-27 | イルミテックス, インコーポレイテッド | Ledから光を導くための独立した光学デバイス |
DE102006001195A1 (de) | 2006-01-10 | 2007-07-12 | Sms Demag Ag | Verfahren zum Gieß-Walzen mit erhöhter Gießgeschwindigkeit und daran anschließendem Warmwalzen von relativ dünnen Metall-,insbesondere Stahlwerkstoff-Strängen,und Gieß-Walz-Einrichtung |
CN100464233C (zh) * | 2006-01-17 | 2009-02-25 | 群康科技(深圳)有限公司 | 背光模块 |
KR100821684B1 (ko) * | 2006-01-17 | 2008-04-11 | 주식회사 에스티앤아이 | 백색 발광 다이오드 소자 |
WO2007083828A1 (ja) | 2006-01-19 | 2007-07-26 | Ube Industries, Ltd. | セラミックス複合体光変換部材およびそれを用いた発光装置 |
US8264138B2 (en) * | 2006-01-20 | 2012-09-11 | Cree, Inc. | Shifting spectral content in solid state light emitters by spatially separating lumiphor films |
US8441179B2 (en) | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
JP2007226190A (ja) * | 2006-01-30 | 2007-09-06 | Konica Minolta Holdings Inc | 映像表示装置およびヘッドマウントディスプレイ |
DE102006005042A1 (de) | 2006-02-03 | 2007-08-09 | Tridonic Optoelectronics Gmbh | Licht emittierende Vorrichtung mit nicht-aktiviertem Leuchtstoff |
RU2315135C2 (ru) * | 2006-02-06 | 2008-01-20 | Владимир Семенович Абрамов | Метод выращивания неполярных эпитаксиальных гетероструктур на основе нитридов элементов iii группы |
TWI317756B (en) * | 2006-02-07 | 2009-12-01 | Coretronic Corp | Phosphor, fluorescent gel, and light emitting diode device |
WO2007095173A2 (en) | 2006-02-14 | 2007-08-23 | Massachusetts Institute Of Technology | White light emitting devices |
US7884816B2 (en) | 2006-02-15 | 2011-02-08 | Prysm, Inc. | Correcting pyramidal error of polygon scanner in scanning beam display systems |
US8451195B2 (en) | 2006-02-15 | 2013-05-28 | Prysm, Inc. | Servo-assisted scanning beam display systems using fluorescent screens |
US20080000467A1 (en) * | 2006-02-16 | 2008-01-03 | Design Annex | Disposable charcoal lighting apparatus |
US20070194684A1 (en) * | 2006-02-21 | 2007-08-23 | Chen Yi-Yi | Light emitting diode structure |
KR100735453B1 (ko) * | 2006-02-22 | 2007-07-04 | 삼성전기주식회사 | 백색 발광 장치 |
JP5027427B2 (ja) * | 2006-02-23 | 2012-09-19 | パナソニック株式会社 | 発光ダイオードを用いた白色照明装置 |
JP4992250B2 (ja) * | 2006-03-01 | 2012-08-08 | 日亜化学工業株式会社 | 発光装置 |
US7737634B2 (en) | 2006-03-06 | 2010-06-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED devices having improved containment for liquid encapsulant |
US9874674B2 (en) | 2006-03-07 | 2018-01-23 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
JP2007250629A (ja) * | 2006-03-14 | 2007-09-27 | Toshiba Corp | 発光装置及びその製造方法、並びに蛍光パターン形成物 |
KR100746749B1 (ko) * | 2006-03-15 | 2007-08-09 | (주)케이디티 | 광 여기 시트 |
US7795600B2 (en) * | 2006-03-24 | 2010-09-14 | Goldeneye, Inc. | Wavelength conversion chip for use with light emitting diodes and method for making same |
JP5032043B2 (ja) * | 2006-03-27 | 2012-09-26 | 豊田合成株式会社 | フェラスメタルアルカリ土類金属ケイ酸塩混合結晶蛍光体およびこれを用いた発光装置 |
JP4980640B2 (ja) * | 2006-03-31 | 2012-07-18 | 三洋電機株式会社 | 照明装置 |
KR100875443B1 (ko) | 2006-03-31 | 2008-12-23 | 서울반도체 주식회사 | 발광 장치 |
US8969908B2 (en) | 2006-04-04 | 2015-03-03 | Cree, Inc. | Uniform emission LED package |
JP5068472B2 (ja) * | 2006-04-12 | 2012-11-07 | 昭和電工株式会社 | 発光装置の製造方法 |
EP2052589A4 (de) | 2006-04-18 | 2012-09-19 | Cree Inc | Beleuchtungsvorrichtung und beleuchtungsverfahren |
US9084328B2 (en) | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
US7821194B2 (en) | 2006-04-18 | 2010-10-26 | Cree, Inc. | Solid state lighting devices including light mixtures |
US8513875B2 (en) | 2006-04-18 | 2013-08-20 | Cree, Inc. | Lighting device and lighting method |
US7997745B2 (en) | 2006-04-20 | 2011-08-16 | Cree, Inc. | Lighting device and lighting method |
JP2009534866A (ja) | 2006-04-24 | 2009-09-24 | クリー, インコーポレイティッド | 横向き平面実装白色led |
FR2900382B1 (fr) * | 2006-04-26 | 2009-02-27 | Benotec Soc Par Actions Simpli | Chariot de manutention a au moins trois roues directrices |
US7888868B2 (en) * | 2006-04-28 | 2011-02-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED light source with light-directing structures |
WO2007130536A2 (en) | 2006-05-05 | 2007-11-15 | Cree Led Lighting Solutions, Inc. | Lighting device |
EP2549330B1 (de) | 2006-05-05 | 2017-08-30 | Prysm, Inc. | Phosphorzusammensetzungen und andere Leuchtstoffmaterialien für Anzeigesysteme und -vorrichtungen |
US20070262288A1 (en) * | 2006-05-09 | 2007-11-15 | Soshchin Naum | Inorganic fluorescent powder as a solid light source |
TWI357435B (en) | 2006-05-12 | 2012-02-01 | Lextar Electronics Corp | Light emitting diode and wavelength converting mat |
WO2007135707A1 (ja) | 2006-05-18 | 2007-11-29 | Nichia Corporation | 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法 |
JP4188404B2 (ja) | 2006-05-19 | 2008-11-26 | 三井金属鉱業株式会社 | 白色蛍光体および白色発光素子乃至装置 |
US7846391B2 (en) | 2006-05-22 | 2010-12-07 | Lumencor, Inc. | Bioanalytical instrumentation using a light source subsystem |
JP2009538531A (ja) * | 2006-05-23 | 2009-11-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明装置、および、製造方法 |
US8033692B2 (en) | 2006-05-23 | 2011-10-11 | Cree, Inc. | Lighting device |
US20070274093A1 (en) * | 2006-05-25 | 2007-11-29 | Honeywell International, Inc. | LED backlight system for LCD displays |
CN101077973B (zh) | 2006-05-26 | 2010-09-29 | 大连路明发光科技股份有限公司 | 硅酸盐荧光材料及其制造方法以及使用其的发光装置 |
WO2007139894A2 (en) | 2006-05-26 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Solid state light emitting device and method of making same |
CN100467170C (zh) * | 2006-05-28 | 2009-03-11 | 揭朝奎 | 可焊性粉末冶金轴承及生产工艺 |
US8596819B2 (en) | 2006-05-31 | 2013-12-03 | Cree, Inc. | Lighting device and method of lighting |
KR101044812B1 (ko) * | 2006-05-31 | 2011-06-27 | 가부시키가이샤후지쿠라 | 발광소자 실장용 기판과 그 제조방법, 발광소자 모듈과 그 제조방법, 표시장치, 조명장치 및 교통 신호기 |
US20070279914A1 (en) * | 2006-06-02 | 2007-12-06 | 3M Innovative Properties Company | Fluorescent volume light source with reflector |
US20070280622A1 (en) * | 2006-06-02 | 2007-12-06 | 3M Innovative Properties Company | Fluorescent light source having light recycling means |
JP4899651B2 (ja) * | 2006-06-07 | 2012-03-21 | ソニー株式会社 | 発光ダイオード点灯回路、照明装置及び液晶表示装置 |
US7863634B2 (en) * | 2006-06-12 | 2011-01-04 | 3M Innovative Properties Company | LED device with re-emitting semiconductor construction and reflector |
US7952110B2 (en) | 2006-06-12 | 2011-05-31 | 3M Innovative Properties Company | LED device with re-emitting semiconductor construction and converging optical element |
US20070284565A1 (en) * | 2006-06-12 | 2007-12-13 | 3M Innovative Properties Company | Led device with re-emitting semiconductor construction and optical element |
KR20090018631A (ko) * | 2006-06-12 | 2009-02-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 재발광 반도체 구성 및 수렴 광학 요소를 갖는 led 소자 |
US7902542B2 (en) | 2006-06-14 | 2011-03-08 | 3M Innovative Properties Company | Adapted LED device with re-emitting semiconductor construction |
JP5088320B2 (ja) * | 2006-06-21 | 2012-12-05 | 株式会社村田製作所 | 透光性セラミック、ならびに光学部品および光学装置 |
JP4282693B2 (ja) * | 2006-07-04 | 2009-06-24 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
JP4520437B2 (ja) * | 2006-07-26 | 2010-08-04 | 信越化学工業株式会社 | Led用蛍光物質入り硬化性シリコーン組成物およびその組成物を使用するled発光装置。 |
CN100590172C (zh) | 2006-07-26 | 2010-02-17 | 北京有色金属研究总院 | 一种含硅的led荧光粉及其制造方法和所制成的发光器件 |
US7943952B2 (en) | 2006-07-31 | 2011-05-17 | Cree, Inc. | Method of uniform phosphor chip coating and LED package fabricated using method |
US7804147B2 (en) | 2006-07-31 | 2010-09-28 | Cree, Inc. | Light emitting diode package element with internal meniscus for bubble free lens placement |
JP4957110B2 (ja) * | 2006-08-03 | 2012-06-20 | 日亜化学工業株式会社 | 発光装置 |
US20080029720A1 (en) * | 2006-08-03 | 2008-02-07 | Intematix Corporation | LED lighting arrangement including light emitting phosphor |
US20080029774A1 (en) * | 2006-08-04 | 2008-02-07 | Acol Technologies S.A. | Semiconductor light source packages with broadband and angular uniformity support |
WO2008022552A1 (fr) | 2006-08-15 | 2008-02-28 | Luming Science And Technology Group Co., Ltd. | Matériau luminescent à base de silicate avec pic multi-émission, son procédé de fabrication et son utilisation dans un dispositif d'éclairage |
TWI317562B (en) * | 2006-08-16 | 2009-11-21 | Ind Tech Res Inst | Light-emitting device |
US20080113877A1 (en) * | 2006-08-16 | 2008-05-15 | Intematix Corporation | Liquid solution deposition of composition gradient materials |
US7763478B2 (en) * | 2006-08-21 | 2010-07-27 | Cree, Inc. | Methods of forming semiconductor light emitting device packages by liquid injection molding |
WO2008024761A2 (en) | 2006-08-21 | 2008-02-28 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
JP5100059B2 (ja) * | 2006-08-24 | 2012-12-19 | スタンレー電気株式会社 | 蛍光体、その製造方法およびそれを用いた発光装置 |
KR101258227B1 (ko) | 2006-08-29 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
US7703942B2 (en) | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
US7910938B2 (en) | 2006-09-01 | 2011-03-22 | Cree, Inc. | Encapsulant profile for light emitting diodes |
US8425271B2 (en) | 2006-09-01 | 2013-04-23 | Cree, Inc. | Phosphor position in light emitting diodes |
JP5157909B2 (ja) | 2006-09-25 | 2013-03-06 | 宇部興産株式会社 | 光変換用セラミックス複合体およびそれを用いた発光装置 |
WO2008042703A1 (en) * | 2006-09-29 | 2008-04-10 | 3M Innovative Properties Company | Fluorescent volume light source having multiple fluorescent species |
WO2008042351A2 (en) | 2006-10-02 | 2008-04-10 | Illumitex, Inc. | Led system and method |
US20090275157A1 (en) * | 2006-10-02 | 2009-11-05 | Illumitex, Inc. | Optical device shaping |
KR101497104B1 (ko) * | 2006-10-03 | 2015-02-27 | 라이트스케이프 머티어리얼스, 인코포레이티드 | 금속 실리케이트 할라이드 형광체 및 이를 이용한 led 조명 디바이스 |
GB2442505A (en) * | 2006-10-04 | 2008-04-09 | Sharp Kk | A display with a primary light source for illuminating a nanophosphor re-emission material |
WO2008043519A1 (en) * | 2006-10-10 | 2008-04-17 | Lexedis Lighting Gmbh | Phosphor-converted light emitting diode |
TW200825571A (en) * | 2006-10-18 | 2008-06-16 | Koninkl Philips Electronics Nv | Illumination system and display device |
US9120975B2 (en) | 2006-10-20 | 2015-09-01 | Intematix Corporation | Yellow-green to yellow-emitting phosphors based on terbium-containing aluminates |
US8133461B2 (en) * | 2006-10-20 | 2012-03-13 | Intematix Corporation | Nano-YAG:Ce phosphor compositions and their methods of preparation |
US8529791B2 (en) | 2006-10-20 | 2013-09-10 | Intematix Corporation | Green-emitting, garnet-based phosphors in general and backlighting applications |
US8475683B2 (en) | 2006-10-20 | 2013-07-02 | Intematix Corporation | Yellow-green to yellow-emitting phosphors based on halogenated-aluminates |
KR20090082449A (ko) * | 2006-10-31 | 2009-07-30 | 티아이알 테크놀로지 엘피 | 광원 |
US8029155B2 (en) | 2006-11-07 | 2011-10-04 | Cree, Inc. | Lighting device and lighting method |
US10295147B2 (en) * | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
CN101182416B (zh) * | 2006-11-13 | 2010-09-22 | 北京有色金属研究总院 | 含二价金属元素的铝酸盐荧光粉及制造方法和发光器件 |
TWI496315B (zh) * | 2006-11-13 | 2015-08-11 | Cree Inc | 照明裝置、被照明的殼體及照明方法 |
US7769066B2 (en) | 2006-11-15 | 2010-08-03 | Cree, Inc. | Laser diode and method for fabricating same |
US8045595B2 (en) | 2006-11-15 | 2011-10-25 | Cree, Inc. | Self aligned diode fabrication method and self aligned laser diode |
US7813400B2 (en) | 2006-11-15 | 2010-10-12 | Cree, Inc. | Group-III nitride based laser diode and method for fabricating same |
US7889421B2 (en) | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
US7521862B2 (en) * | 2006-11-20 | 2009-04-21 | Philips Lumileds Lighting Co., Llc | Light emitting device including luminescent ceramic and light-scattering material |
WO2008063657A2 (en) * | 2006-11-21 | 2008-05-29 | Qd Vision, Inc. | Light emitting devices and displays with improved performance |
US7692263B2 (en) | 2006-11-21 | 2010-04-06 | Cree, Inc. | High voltage GaN transistors |
JP5367218B2 (ja) | 2006-11-24 | 2013-12-11 | シャープ株式会社 | 蛍光体の製造方法および発光装置の製造方法 |
US9441793B2 (en) | 2006-12-01 | 2016-09-13 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
EP2095011A1 (de) | 2006-12-04 | 2009-09-02 | Cree Led Lighting Solutions, Inc. | Beleuchtungsanordnung und beleuchtungsverfahren |
CN101622493A (zh) | 2006-12-04 | 2010-01-06 | 科锐Led照明科技公司 | 照明装置和照明方法 |
WO2008073794A1 (en) | 2006-12-07 | 2008-06-19 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
WO2008073400A1 (en) | 2006-12-11 | 2008-06-19 | The Regents Of The University Of California | Transparent light emitting diodes |
JP5028562B2 (ja) * | 2006-12-11 | 2012-09-19 | 株式会社ジャパンディスプレイイースト | 照明装置及びこの照明装置を用いた表示装置 |
US8013506B2 (en) | 2006-12-12 | 2011-09-06 | Prysm, Inc. | Organic compounds for adjusting phosphor chromaticity |
ES2346569T3 (es) * | 2006-12-12 | 2010-10-18 | Inverto Nv | Iluminacion con led que tiene temperatura de color (ct) continua y ajustable, mientras se mantiene un cri elevado. |
TWI359857B (en) * | 2006-12-25 | 2012-03-11 | Ind Tech Res Inst | White light illumination device |
KR100788556B1 (ko) * | 2007-01-03 | 2007-12-26 | 삼성에스디아이 주식회사 | 광흡수층을 갖는 액정 표시 장치용 연성 회로 기판 |
KR100788557B1 (ko) * | 2007-01-03 | 2007-12-26 | 삼성에스디아이 주식회사 | 광흡수층을 갖는 액정 표시 장치용 연성 회로 기판 |
JP4660507B2 (ja) * | 2007-01-03 | 2011-03-30 | 三星モバイルディスプレイ株式會社 | フレキシブル回路基板及びこれを有する液晶表示装置 |
JP2008186802A (ja) * | 2007-01-04 | 2008-08-14 | Toshiba Corp | バックライト装置、液晶表示装置 |
US8836212B2 (en) | 2007-01-11 | 2014-09-16 | Qd Vision, Inc. | Light emissive printed article printed with quantum dot ink |
US7800304B2 (en) * | 2007-01-12 | 2010-09-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Multi-chip packaged LED light source |
US7834367B2 (en) | 2007-01-19 | 2010-11-16 | Cree, Inc. | Low voltage diode with reduced parasitic resistance and method for fabricating |
TWI325186B (en) * | 2007-01-19 | 2010-05-21 | Harvatek Corp | Led chip package structure using ceramic material as a substrate |
US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US8232564B2 (en) | 2007-01-22 | 2012-07-31 | Cree, Inc. | Wafer level phosphor coating technique for warm light emitting diodes |
US9159888B2 (en) | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
CN101250408B (zh) * | 2007-01-22 | 2011-03-23 | 罗维鸿 | 暖白色发光二极管及其带橙黄辐射的荧光粉 |
US7781783B2 (en) * | 2007-02-07 | 2010-08-24 | SemiLEDs Optoelectronics Co., Ltd. | White light LED device |
US9061450B2 (en) | 2007-02-12 | 2015-06-23 | Cree, Inc. | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
US7709853B2 (en) * | 2007-02-12 | 2010-05-04 | Cree, Inc. | Packaged semiconductor light emitting devices having multiple optical elements |
US20080192458A1 (en) * | 2007-02-12 | 2008-08-14 | Intematix Corporation | Light emitting diode lighting system |
US20080197369A1 (en) * | 2007-02-20 | 2008-08-21 | Cree, Inc. | Double flip semiconductor device and method for fabrication |
KR101499269B1 (ko) * | 2007-02-22 | 2015-03-09 | 크리, 인코포레이티드 | 발광 장치, 발광 방법, 광 필터 및 광 필터링 방법 |
DE102007009820A1 (de) * | 2007-02-28 | 2008-09-04 | Osram Opto Semiconductors Gmbh | Optische Anordnung und optisches Verfahren |
US20080218998A1 (en) * | 2007-03-08 | 2008-09-11 | Quest William J | Device having multiple light sources and methods of use |
TWI390748B (zh) * | 2007-03-09 | 2013-03-21 | Light energy of the battery efficiency film | |
KR100818518B1 (ko) * | 2007-03-14 | 2008-03-31 | 삼성전기주식회사 | Led 패키지 |
US7712933B2 (en) | 2007-03-19 | 2010-05-11 | Interlum, Llc | Light for vehicles |
US8408773B2 (en) | 2007-03-19 | 2013-04-02 | Innotec Corporation | Light for vehicles |
US7687816B2 (en) * | 2007-03-20 | 2010-03-30 | International Business Machines Corporation | Light emitting diode |
CN101682709B (zh) * | 2007-03-20 | 2013-11-06 | Prysm公司 | 将广告或其它应用数据传送到显示系统并进行显示 |
TWI338957B (en) | 2007-03-23 | 2011-03-11 | Lite On Technology Corp | Light-emitting device with open-loop control and manufacturing method thereof |
KR100848872B1 (ko) * | 2007-03-29 | 2008-07-29 | 서울반도체 주식회사 | Rgb를 이용한 발광장치 |
TWI378138B (en) * | 2007-04-02 | 2012-12-01 | Univ Nat Chiao Tung | Green-emitting phosphors and process for producing the same |
DE102008017039A1 (de) | 2007-04-05 | 2008-10-09 | Koito Manufacturing Co., Ltd. | Leuchtstoff |
US7697183B2 (en) | 2007-04-06 | 2010-04-13 | Prysm, Inc. | Post-objective scanning beam systems |
US8169454B1 (en) | 2007-04-06 | 2012-05-01 | Prysm, Inc. | Patterning a surface using pre-objective and post-objective raster scanning systems |
US7964888B2 (en) | 2007-04-18 | 2011-06-21 | Cree, Inc. | Semiconductor light emitting device packages and methods |
WO2008134056A1 (en) * | 2007-04-26 | 2008-11-06 | Deak-Lam Inc. | Photon energy coversion structure |
WO2008135072A1 (de) * | 2007-05-04 | 2008-11-13 | Noctron Soparfi S.A. | Beleuchtungsvorrichtung sowie flüssigkristall-bildschirm mit einer solchen beleuchtungsvorrichtung |
DE102007026795A1 (de) * | 2007-05-04 | 2008-11-06 | Noctron Holding S.A. | Beleuchtungsvorrichtung sowie Flüssigkristall-Bildschirm mit einer solchen Beleuchtungsvorrichtung |
US7910944B2 (en) | 2007-05-04 | 2011-03-22 | Cree, Inc. | Side mountable semiconductor light emitting device packages and panels |
DE102007025573A1 (de) * | 2007-05-31 | 2008-12-04 | Noctron Holding S.A. | Flüssigkristall-Anzeigefeld |
WO2008137977A1 (en) | 2007-05-08 | 2008-11-13 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
US7781779B2 (en) * | 2007-05-08 | 2010-08-24 | Luminus Devices, Inc. | Light emitting devices including wavelength converting material |
TWI422785B (zh) | 2007-05-08 | 2014-01-11 | Cree Inc | 照明裝置及照明方法 |
WO2008137983A1 (en) | 2007-05-08 | 2008-11-13 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
CN101711325B (zh) * | 2007-05-08 | 2013-07-10 | 科锐公司 | 照明装置和照明方法 |
WO2008137974A1 (en) | 2007-05-08 | 2008-11-13 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
TWI349694B (en) * | 2007-05-14 | 2011-10-01 | Univ Nat Chiao Tung | A novel phosphor for white light-emitting diodes and fabrication of the same |
US8038822B2 (en) | 2007-05-17 | 2011-10-18 | Prysm, Inc. | Multilayered screens with light-emitting stripes for scanning beam display systems |
US20090001397A1 (en) * | 2007-05-29 | 2009-01-01 | Oree, Advanced Illumiation Solutions Inc. | Method and device for providing circumferential illumination |
KR100886785B1 (ko) * | 2007-06-04 | 2009-03-04 | 박기운 | 발광 장치 및 그 제조방법 및 백색계 발광 다이오드 |
US7999283B2 (en) | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
US8767215B2 (en) | 2007-06-18 | 2014-07-01 | Leddartech Inc. | Method for detecting objects with light |
CA2635155C (en) * | 2007-06-18 | 2015-11-24 | Institut National D'optique | Method for detecting objects with visible light |
US7942556B2 (en) * | 2007-06-18 | 2011-05-17 | Xicato, Inc. | Solid state illumination device |
DE102007028120A1 (de) | 2007-06-19 | 2008-12-24 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Chlorosilikat-Leuchtstoffs und damit hergestellter Leuchtstoff |
JP4925119B2 (ja) * | 2007-06-21 | 2012-04-25 | シャープ株式会社 | 酸化物蛍光体および発光装置 |
US8556430B2 (en) | 2007-06-27 | 2013-10-15 | Prysm, Inc. | Servo feedback control based on designated scanning servo beam in scanning beam display systems with light-emitting screens |
US7878657B2 (en) | 2007-06-27 | 2011-02-01 | Prysm, Inc. | Servo feedback control based on invisible scanning servo beam in scanning beam display systems with light-emitting screens |
TWI365546B (en) * | 2007-06-29 | 2012-06-01 | Ind Tech Res Inst | Light emitting diode device and fabrication method thereof |
CN101688115B (zh) | 2007-07-09 | 2013-03-27 | 夏普株式会社 | 荧光体粒子组以及使用其的发光装置 |
US7924478B2 (en) * | 2007-07-11 | 2011-04-12 | Samsung Electronics Co., Ltd. | Scanner module and image scanning apparatus employing the same |
KR101279034B1 (ko) * | 2007-07-11 | 2013-07-02 | 삼성전자주식회사 | 스캐너 모듈 및 이를 채용한 화상독취장치 |
US7852523B2 (en) * | 2007-07-11 | 2010-12-14 | Samsung Electronics Co., Ltd. | Scanner module and image scanning apparatus employing the same |
US10505083B2 (en) * | 2007-07-11 | 2019-12-10 | Cree, Inc. | Coating method utilizing phosphor containment structure and devices fabricated using same |
EP2015614B1 (de) | 2007-07-12 | 2010-12-15 | Koito Manufacturing Co., Ltd. | Lichtemittierende Vorrichtung |
US7847309B2 (en) * | 2007-07-16 | 2010-12-07 | GE Lighting Solutions, LLC | Red line emitting complex fluoride phosphors activated with Mn4+ |
CN101743488B (zh) | 2007-07-17 | 2014-02-26 | 科锐公司 | 具有内部光学特性结构的光学元件及其制造方法 |
WO2009014707A2 (en) | 2007-07-23 | 2009-01-29 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
TWI384052B (zh) * | 2007-07-25 | 2013-02-01 | Univ Nat Chiao Tung | 新穎螢光體與其製造方法 |
TWI363085B (en) * | 2007-07-26 | 2012-05-01 | Univ Nat Chiao Tung | A novel phosphor and fabrication of the same |
DE102007036226A1 (de) * | 2007-08-02 | 2009-02-05 | Perkinelmer Elcos Gmbh | Anbringungsstruktur für LEDs, LED-Baugruppe, LED-Baugruppensockel, Verfahren zum Ausbilden einer Anbringungsstruktur |
US8098375B2 (en) | 2007-08-06 | 2012-01-17 | Lumencor, Inc. | Light emitting diode illumination system |
US7863635B2 (en) * | 2007-08-07 | 2011-01-04 | Cree, Inc. | Semiconductor light emitting devices with applied wavelength conversion materials |
US7652301B2 (en) * | 2007-08-16 | 2010-01-26 | Philips Lumileds Lighting Company, Llc | Optical element coupled to low profile side emitting LED |
WO2009025469A2 (en) | 2007-08-22 | 2009-02-26 | Seoul Semiconductor Co., Ltd. | Non stoichiometric tetragonal copper alkaline earth silicate phosphors and method of preparing the same |
US8704265B2 (en) * | 2007-08-27 | 2014-04-22 | Lg Electronics Inc. | Light emitting device package and lighting apparatus using the same |
US8128249B2 (en) | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
KR101055769B1 (ko) | 2007-08-28 | 2011-08-11 | 서울반도체 주식회사 | 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치 |
US7791093B2 (en) * | 2007-09-04 | 2010-09-07 | Koninklijke Philips Electronics N.V. | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
US8866185B2 (en) * | 2007-09-06 | 2014-10-21 | SemiLEDs Optoelectronics Co., Ltd. | White light LED with multiple encapsulation layers |
US7851990B2 (en) * | 2007-09-06 | 2010-12-14 | He Shan Lide Electronic Enterprise Company Ltd. | Method for generating low color temperature light and light emitting device adopting the same |
US8133529B2 (en) | 2007-09-10 | 2012-03-13 | Enpirion, Inc. | Method of forming a micromagnetic device |
US7955868B2 (en) | 2007-09-10 | 2011-06-07 | Enpirion, Inc. | Method of forming a micromagnetic device |
US8018315B2 (en) | 2007-09-10 | 2011-09-13 | Enpirion, Inc. | Power converter employing a micromagnetic device |
US7920042B2 (en) | 2007-09-10 | 2011-04-05 | Enpirion, Inc. | Micromagnetic device and method of forming the same |
DE102007049005A1 (de) * | 2007-09-11 | 2009-03-12 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
DE202007019100U1 (de) * | 2007-09-12 | 2010-09-02 | Lumitech Produktion Und Entwicklung Gmbh | LED-Modul, LED-Leuchtmittel und LED-Leuchte für die energieeffiziente Wiedergabe von weißem Licht |
US8519437B2 (en) | 2007-09-14 | 2013-08-27 | Cree, Inc. | Polarization doping in nitride based diodes |
DE102007053286A1 (de) | 2007-09-20 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements |
JP5075552B2 (ja) * | 2007-09-25 | 2012-11-21 | 株式会社東芝 | 蛍光体およびそれを用いたledランプ |
JP2009081379A (ja) | 2007-09-27 | 2009-04-16 | Showa Denko Kk | Iii族窒化物半導体発光素子 |
KR100891020B1 (ko) * | 2007-09-28 | 2009-03-31 | 한국과학기술원 | 새로운 조성의 황색 발광 Ce3+부활 칼슘 실리케이트 황색형광체 및 그 제조방법 |
US20090117672A1 (en) | 2007-10-01 | 2009-05-07 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of fabrication thereof |
US8883528B2 (en) * | 2007-10-01 | 2014-11-11 | Intematix Corporation | Methods of producing light emitting device with phosphor wavelength conversion |
US11317495B2 (en) | 2007-10-06 | 2022-04-26 | Lynk Labs, Inc. | LED circuits and assemblies |
US11297705B2 (en) | 2007-10-06 | 2022-04-05 | Lynk Labs, Inc. | Multi-voltage and multi-brightness LED lighting devices and methods of using same |
WO2009049019A1 (en) * | 2007-10-10 | 2009-04-16 | Cree Led Lighting Solutions, Inc. | Lighting device and method of making |
US9012937B2 (en) * | 2007-10-10 | 2015-04-21 | Cree, Inc. | Multiple conversion material light emitting diode package and method of fabricating same |
CN100546058C (zh) * | 2007-10-15 | 2009-09-30 | 佛山市国星光电股份有限公司 | 功率发光二极管封装结构 |
US7984999B2 (en) * | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
US9086213B2 (en) | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
US7915627B2 (en) * | 2007-10-17 | 2011-03-29 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
KR101294849B1 (ko) * | 2007-10-23 | 2013-08-08 | 엘지디스플레이 주식회사 | 백라이트 어셈블리 |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
US8018139B2 (en) * | 2007-11-05 | 2011-09-13 | Enertron, Inc. | Light source and method of controlling light spectrum of an LED light engine |
US8119028B2 (en) * | 2007-11-14 | 2012-02-21 | Cree, Inc. | Cerium and europium doped single crystal phosphors |
TWI334047B (en) * | 2007-11-22 | 2010-12-01 | Au Optronics Corp | Liquid crystal display |
DE102007056562A1 (de) | 2007-11-23 | 2009-05-28 | Oerlikon Textile Gmbh & Co. Kg | Vorrichtung zur optischen Detektion von Verunreinigungen in längsbewegtem Garn |
JP5558665B2 (ja) * | 2007-11-27 | 2014-07-23 | パナソニック株式会社 | 発光装置 |
JP2009130301A (ja) * | 2007-11-27 | 2009-06-11 | Sharp Corp | 発光素子および発光素子の製造方法 |
KR100998233B1 (ko) * | 2007-12-03 | 2010-12-07 | 서울반도체 주식회사 | 슬림형 led 패키지 |
CN101453804B (zh) * | 2007-12-05 | 2010-04-07 | 亿镫光电科技股份有限公司 | 白光发光装置 |
TWI336015B (en) * | 2007-12-06 | 2011-01-11 | Au Optronics Corp | Liquid crystal display |
JP5330263B2 (ja) | 2007-12-07 | 2013-10-30 | 株式会社東芝 | 蛍光体およびそれを用いたled発光装置 |
US8230575B2 (en) | 2007-12-12 | 2012-07-31 | Innotec Corporation | Overmolded circuit board and method |
US8167674B2 (en) | 2007-12-14 | 2012-05-01 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US9431589B2 (en) * | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US8172447B2 (en) | 2007-12-19 | 2012-05-08 | Oree, Inc. | Discrete lighting elements and planar assembly thereof |
US20090159915A1 (en) * | 2007-12-19 | 2009-06-25 | Shaul Branchevsky | Led insert module and multi-layer lens |
US8182128B2 (en) * | 2007-12-19 | 2012-05-22 | Oree, Inc. | Planar white illumination apparatus |
US8118447B2 (en) | 2007-12-20 | 2012-02-21 | Altair Engineering, Inc. | LED lighting apparatus with swivel connection |
JP5003464B2 (ja) * | 2007-12-21 | 2012-08-15 | 三菱電機株式会社 | 光伝送モジュール |
JP2009153712A (ja) | 2007-12-26 | 2009-07-16 | Olympus Corp | 光源装置およびそれを備えた内視鏡装置 |
US7815339B2 (en) | 2008-01-09 | 2010-10-19 | Innotec Corporation | Light module |
US8878219B2 (en) | 2008-01-11 | 2014-11-04 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
CN101482247A (zh) * | 2008-01-11 | 2009-07-15 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
US8940561B2 (en) * | 2008-01-15 | 2015-01-27 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
US8058088B2 (en) * | 2008-01-15 | 2011-11-15 | Cree, Inc. | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
US20090309114A1 (en) * | 2008-01-16 | 2009-12-17 | Luminus Devices, Inc. | Wavelength converting light-emitting devices and methods of making the same |
US8337029B2 (en) * | 2008-01-17 | 2012-12-25 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
US20090185113A1 (en) * | 2008-01-22 | 2009-07-23 | Industrial Technology Research Institute | Color Filter Module and Device of Having the Same |
CN101493216B (zh) * | 2008-01-24 | 2011-11-09 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管光源模组 |
US9151884B2 (en) * | 2008-02-01 | 2015-10-06 | 3M Innovative Properties Company | Fluorescent volume light source with active chromphore |
WO2009100358A1 (en) | 2008-02-08 | 2009-08-13 | Illumitex, Inc. | System and method for emitter layer shaping |
US8299487B2 (en) | 2008-02-18 | 2012-10-30 | Koito Manufacturing Co., Ltd. | White light emitting device and vehicle lamp using the same |
EP2247891B1 (de) * | 2008-02-21 | 2019-06-05 | Signify Holding B.V. | Glühlampenähnliche led-lichtquelle |
CN101953230B (zh) | 2008-02-21 | 2013-03-27 | 日东电工株式会社 | 具有半透明陶瓷板的发光装置 |
CN101514801A (zh) * | 2008-02-22 | 2009-08-26 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
US8163203B2 (en) | 2008-02-27 | 2012-04-24 | The Regents Of The University Of California | Yellow emitting phosphors based on Ce3+-doped aluminate and via solid solution for solid-state lighting applications |
JP2009206459A (ja) * | 2008-02-29 | 2009-09-10 | Sharp Corp | 色変換部材およびそれを用いた発光装置 |
EP2260341A2 (de) * | 2008-03-05 | 2010-12-15 | Oree, Advanced Illumination Solutions INC. | Beleuchtungsvorrichtung und verfahren zu ihrer bildung |
US8637883B2 (en) | 2008-03-19 | 2014-01-28 | Cree, Inc. | Low index spacer layer in LED devices |
KR101995369B1 (ko) | 2008-04-03 | 2019-07-02 | 삼성 리서치 아메리카 인코포레이티드 | 양자점들을 포함하는 발광 소자 |
TWI521266B (zh) * | 2008-04-03 | 2016-02-11 | 友達光電股份有限公司 | 液晶顯示器 |
US9525148B2 (en) | 2008-04-03 | 2016-12-20 | Qd Vision, Inc. | Device including quantum dots |
US8692532B2 (en) | 2008-04-16 | 2014-04-08 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
US9246390B2 (en) | 2008-04-16 | 2016-01-26 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
US8541991B2 (en) | 2008-04-16 | 2013-09-24 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
US8686698B2 (en) | 2008-04-16 | 2014-04-01 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
JP2011519159A (ja) * | 2008-04-23 | 2011-06-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 発光装置 |
DE102009018603B9 (de) | 2008-04-25 | 2021-01-14 | Samsung Electronics Co., Ltd. | Leuchtvorrichtung und Herstellungsverfahren derselben |
US20090268461A1 (en) * | 2008-04-28 | 2009-10-29 | Deak David G | Photon energy conversion structure |
DE102008021438A1 (de) | 2008-04-29 | 2009-12-31 | Schott Ag | Konversionsmaterial insbesondere für eine, eine Halbleiterlichtquelle umfassende weiße oder farbige Lichtquelle, Verfahren zu dessen Herstellung sowie dieses Konversionsmaterial umfassende Lichtquelle |
DE202008005987U1 (de) * | 2008-04-30 | 2009-09-03 | Ledon Lighting Jennersdorf Gmbh | LED-Modul mit kalottenförmiger Farbkonversionsschicht |
DE102008021658A1 (de) | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Vorrichtung mit Volumenstrukturierung |
US9287469B2 (en) | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
JP2011524064A (ja) | 2008-05-06 | 2011-08-25 | キユーデイー・ビジヨン・インコーポレーテツド | 量子閉じ込め半導体ナノ粒子を含有する固体照明装置 |
DE102008022888A1 (de) * | 2008-05-08 | 2009-11-19 | Lok-F Gmbh | Leuchtvorrichtung |
TWI362769B (en) | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
JP2009277887A (ja) * | 2008-05-15 | 2009-11-26 | Shin Etsu Chem Co Ltd | 発光装置 |
WO2009143283A1 (en) * | 2008-05-20 | 2009-11-26 | Lightscape Materials, Inc. | Silicate-based phosphors and led lighting devices using the same |
JP2010526425A (ja) * | 2008-05-20 | 2010-07-29 | パナソニック株式会社 | 半導体発光装置、並びに、これを用いた光源装置及び照明システム |
US8360599B2 (en) | 2008-05-23 | 2013-01-29 | Ilumisys, Inc. | Electric shock resistant L.E.D. based light |
US8461613B2 (en) | 2008-05-27 | 2013-06-11 | Interlight Optotech Corporation | Light emitting device |
DE102008025318A1 (de) * | 2008-05-27 | 2009-12-10 | Setrinx S.A.R.L. | Leuchtchip und Leuchtvorrichtung mit einem solchen |
US7868340B2 (en) | 2008-05-30 | 2011-01-11 | Bridgelux, Inc. | Method and apparatus for generating white light from solid state light emitting devices |
US8097081B2 (en) | 2008-06-05 | 2012-01-17 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
US8871024B2 (en) * | 2008-06-05 | 2014-10-28 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
US20090301388A1 (en) * | 2008-06-05 | 2009-12-10 | Soraa Inc. | Capsule for high pressure processing and method of use for supercritical fluids |
US9157167B1 (en) | 2008-06-05 | 2015-10-13 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
US7906766B2 (en) * | 2008-06-16 | 2011-03-15 | Northrop Grumman Systems Corporation | Systems and methods for simulating a vehicle exhaust plume |
KR101448153B1 (ko) * | 2008-06-25 | 2014-10-08 | 삼성전자주식회사 | 발광 다이오드용 멀티칩 패키지 및 멀티칩 패키지 방식의발광 다이오드 소자 |
US20090321758A1 (en) * | 2008-06-25 | 2009-12-31 | Wen-Huang Liu | Led with improved external light extraction efficiency |
US8240875B2 (en) | 2008-06-25 | 2012-08-14 | Cree, Inc. | Solid state linear array modules for general illumination |
US20090320745A1 (en) * | 2008-06-25 | 2009-12-31 | Soraa, Inc. | Heater device and method for high pressure processing of crystalline materials |
EP2304312A4 (de) * | 2008-06-25 | 2015-03-25 | Mario W Cardullo | Uv-lichtquelle zur erzeugung von sichtbarem licht |
WO2010005914A1 (en) * | 2008-07-07 | 2010-01-14 | Soraa, Inc. | High quality large area bulk non-polar or semipolar gallium based substrates and methods |
US9404197B2 (en) | 2008-07-07 | 2016-08-02 | Soraa, Inc. | Large area, low-defect gallium-containing nitride crystals, method of making, and method of use |
US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US8297786B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
JP2010027704A (ja) * | 2008-07-16 | 2010-02-04 | Stanley Electric Co Ltd | 蛍光体セラミック板を用いた発光装置の製造方法 |
TW201005075A (en) * | 2008-07-24 | 2010-02-01 | Univ Nat Chiao Tung | White-emitting phosphors and lighting apparatus thereof |
US7869112B2 (en) * | 2008-07-25 | 2011-01-11 | Prysm, Inc. | Beam scanning based on two-dimensional polygon scanner for display and other applications |
US7946729B2 (en) | 2008-07-31 | 2011-05-24 | Altair Engineering, Inc. | Fluorescent tube replacement having longitudinally oriented LEDs |
US8979999B2 (en) * | 2008-08-07 | 2015-03-17 | Soraa, Inc. | Process for large-scale ammonothermal manufacturing of gallium nitride boules |
US8430958B2 (en) * | 2008-08-07 | 2013-04-30 | Soraa, Inc. | Apparatus and method for seed crystal utilization in large-scale manufacturing of gallium nitride |
US10036099B2 (en) | 2008-08-07 | 2018-07-31 | Slt Technologies, Inc. | Process for large-scale ammonothermal manufacturing of gallium nitride boules |
US20100033077A1 (en) * | 2008-08-08 | 2010-02-11 | Glory Science Co., Ltd. | Light emitting device and method of manufacturing the light emitting device |
DE102008038249A1 (de) * | 2008-08-18 | 2010-02-25 | Osram Gesellschaft mit beschränkter Haftung | alpha-Sialon-Leuchtstoff |
CN101577301B (zh) * | 2008-09-05 | 2011-12-21 | 佛山市国星光电股份有限公司 | 白光led的封装方法及使用该方法制作的led器件 |
US20120181919A1 (en) * | 2008-08-27 | 2012-07-19 | Osram Sylvania Inc. | Luminescent Ceramic Composite Converter and Method of Making the Same |
US8164710B2 (en) * | 2008-09-04 | 2012-04-24 | Seoul Semiconductor Co., Ltd. | Backlight assembly and liquid crystal display apparatus having the same |
US20100058837A1 (en) * | 2008-09-05 | 2010-03-11 | Quest William J | Device having multiple light sources and methods of use |
US20100060198A1 (en) * | 2008-09-05 | 2010-03-11 | Lite-On It Corporation | LED Lamp and Method for Producing a LED Lamp |
US8143769B2 (en) * | 2008-09-08 | 2012-03-27 | Intematix Corporation | Light emitting diode (LED) lighting device |
GB0816557D0 (en) | 2008-09-10 | 2008-10-15 | Merck Patent Gmbh | Electro-optical switching element and electro-optical display |
US8256924B2 (en) | 2008-09-15 | 2012-09-04 | Ilumisys, Inc. | LED-based light having rapidly oscillating LEDs |
EP2163593A1 (de) | 2008-09-15 | 2010-03-17 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Herstellung von nitridbasiertem Phosphor |
US8342712B2 (en) | 2008-09-30 | 2013-01-01 | Disney Enterprises, Inc. | Kinetic flame device |
US9054086B2 (en) | 2008-10-02 | 2015-06-09 | Enpirion, Inc. | Module having a stacked passive element and method of forming the same |
US8153473B2 (en) | 2008-10-02 | 2012-04-10 | Empirion, Inc. | Module having a stacked passive element and method of forming the same |
US8266793B2 (en) | 2008-10-02 | 2012-09-18 | Enpirion, Inc. | Module having a stacked magnetic device and semiconductor device and method of forming the same |
US8339802B2 (en) | 2008-10-02 | 2012-12-25 | Enpirion, Inc. | Module having a stacked magnetic device and semiconductor device and method of forming the same |
DE102008051256B4 (de) * | 2008-10-10 | 2018-05-24 | Ivoclar Vivadent Ag | Halbleiter-Strahlungsquelle |
US8075165B2 (en) | 2008-10-14 | 2011-12-13 | Ledengin, Inc. | Total internal reflection lens and mechanical retention and locating device |
US20100098377A1 (en) * | 2008-10-16 | 2010-04-22 | Noam Meir | Light confinement using diffusers |
JPWO2010044239A1 (ja) | 2008-10-17 | 2012-03-15 | 株式会社小糸製作所 | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
US8444292B2 (en) | 2008-10-24 | 2013-05-21 | Ilumisys, Inc. | End cap substitute for LED-based tube replacement light |
US8901823B2 (en) | 2008-10-24 | 2014-12-02 | Ilumisys, Inc. | Light and light sensor |
US7938562B2 (en) | 2008-10-24 | 2011-05-10 | Altair Engineering, Inc. | Lighting including integral communication apparatus |
US8324817B2 (en) | 2008-10-24 | 2012-12-04 | Ilumisys, Inc. | Light and light sensor |
US8653984B2 (en) | 2008-10-24 | 2014-02-18 | Ilumisys, Inc. | Integration of LED lighting control with emergency notification systems |
US8214084B2 (en) | 2008-10-24 | 2012-07-03 | Ilumisys, Inc. | Integration of LED lighting with building controls |
US8022631B2 (en) * | 2008-11-03 | 2011-09-20 | General Electric Company | Color control of light sources employing phosphors |
US20100109025A1 (en) * | 2008-11-05 | 2010-05-06 | Koninklijke Philips Electronics N.V. | Over the mold phosphor lens for an led |
US20100117106A1 (en) * | 2008-11-07 | 2010-05-13 | Ledengin, Inc. | Led with light-conversion layer |
JP4868427B2 (ja) * | 2008-11-13 | 2012-02-01 | 国立大学法人名古屋大学 | 半導体発光装置 |
JP2010116522A (ja) * | 2008-11-14 | 2010-05-27 | Mitsubishi Plastics Inc | 蓄光フィルム及び発光装置 |
TWI384591B (zh) * | 2008-11-17 | 2013-02-01 | Everlight Electronics Co Ltd | 發光二極體電路板 |
US9052416B2 (en) | 2008-11-18 | 2015-06-09 | Cree, Inc. | Ultra-high efficacy semiconductor light emitting devices |
US8853712B2 (en) | 2008-11-18 | 2014-10-07 | Cree, Inc. | High efficacy semiconductor light emitting devices employing remote phosphor configurations |
US8004172B2 (en) | 2008-11-18 | 2011-08-23 | Cree, Inc. | Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same |
US8220971B2 (en) | 2008-11-21 | 2012-07-17 | Xicato, Inc. | Light emitting diode module with three part color matching |
US8456082B2 (en) | 2008-12-01 | 2013-06-04 | Ifire Ip Corporation | Surface-emission light source with uniform illumination |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
US8987156B2 (en) | 2008-12-12 | 2015-03-24 | Soraa, Inc. | Polycrystalline group III metal nitride with getter and method of making |
US9589792B2 (en) | 2012-11-26 | 2017-03-07 | Soraa, Inc. | High quality group-III metal nitride crystals, methods of making, and methods of use |
US8878230B2 (en) * | 2010-03-11 | 2014-11-04 | Soraa, Inc. | Semi-insulating group III metal nitride and method of manufacture |
US9543392B1 (en) | 2008-12-12 | 2017-01-10 | Soraa, Inc. | Transparent group III metal nitride and method of manufacture |
US20100147210A1 (en) * | 2008-12-12 | 2010-06-17 | Soraa, Inc. | high pressure apparatus and method for nitride crystal growth |
USRE47114E1 (en) | 2008-12-12 | 2018-11-06 | Slt Technologies, Inc. | Polycrystalline group III metal nitride with getter and method of making |
US7834372B2 (en) * | 2008-12-16 | 2010-11-16 | Jinhui Zhai | High luminous flux warm white solid state lighting device |
US8507300B2 (en) * | 2008-12-24 | 2013-08-13 | Ledengin, Inc. | Light-emitting diode with light-conversion layer |
JP2010171379A (ja) * | 2008-12-25 | 2010-08-05 | Seiko Instruments Inc | 発光デバイス |
KR101493708B1 (ko) * | 2008-12-26 | 2015-02-16 | 삼성전자주식회사 | 백색 발광 장치 |
US8698463B2 (en) | 2008-12-29 | 2014-04-15 | Enpirion, Inc. | Power converter with a dynamically configurable controller based on a power conversion mode |
US9548714B2 (en) | 2008-12-29 | 2017-01-17 | Altera Corporation | Power converter with a dynamically configurable controller and output filter |
US8390193B2 (en) | 2008-12-31 | 2013-03-05 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
US8556452B2 (en) | 2009-01-15 | 2013-10-15 | Ilumisys, Inc. | LED lens |
US8362710B2 (en) | 2009-01-21 | 2013-01-29 | Ilumisys, Inc. | Direct AC-to-DC converter for passive component minimization and universal operation of LED arrays |
US8664880B2 (en) | 2009-01-21 | 2014-03-04 | Ilumisys, Inc. | Ballast/line detection circuit for fluorescent replacement lamps |
US20100181582A1 (en) * | 2009-01-22 | 2010-07-22 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof |
TWI449996B (zh) * | 2009-01-23 | 2014-08-21 | Au Optronics Corp | 高色彩飽合度之顯示裝置及其使用之色彩調整方法 |
US8242462B2 (en) | 2009-01-23 | 2012-08-14 | Lumencor, Inc. | Lighting design of high quality biomedical devices |
JP2010171342A (ja) * | 2009-01-26 | 2010-08-05 | Sony Corp | 色変換部材およびその製造方法、発光装置、表示装置 |
US20110100291A1 (en) * | 2009-01-29 | 2011-05-05 | Soraa, Inc. | Plant and method for large-scale ammonothermal manufacturing of gallium nitride boules |
JP2010177620A (ja) * | 2009-02-02 | 2010-08-12 | Showa Denko Kk | 発光装置の製造方法 |
WO2010088658A1 (en) * | 2009-02-02 | 2010-08-05 | Ringdale, Inc. | Phosphor composite coated diffuser device and method |
US20100208470A1 (en) * | 2009-02-10 | 2010-08-19 | Yosi Shani | Overlapping illumination surfaces with reduced linear artifacts |
KR101077264B1 (ko) * | 2009-02-17 | 2011-10-27 | (주)포인트엔지니어링 | 광소자용 기판, 이를 갖는 광소자 패키지 및 이의 제조 방법 |
US8123981B2 (en) * | 2009-02-19 | 2012-02-28 | Nitto Denko Corporation | Method of fabricating translucent phosphor ceramics |
US8137587B2 (en) | 2009-02-19 | 2012-03-20 | Nitto Denko Corporation | Method of manufacturing phosphor translucent ceramics and light emitting devices |
JP2012518698A (ja) * | 2009-02-25 | 2012-08-16 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Uv光を発する放電ランプ |
US8686455B2 (en) | 2009-03-03 | 2014-04-01 | Ube Industries, Ltd. | Composite substrate for formation of light-emitting device, light-emitting diode device and manufacturing method thereof |
US8541931B2 (en) * | 2009-03-17 | 2013-09-24 | Intematix Corporation | LED based lamp including reflective hood to reduce variation in illuminance |
TWM374153U (en) * | 2009-03-19 | 2010-02-11 | Intematix Technology Ct Corp | Light emitting device applied to AC drive |
TWI405838B (zh) * | 2009-03-27 | 2013-08-21 | Chunghwa Picture Tubes Ltd | 紅光螢光材料及其製造方法、及白光發光裝置 |
US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
KR100984126B1 (ko) | 2009-03-30 | 2010-09-28 | 서울대학교산학협력단 | 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 |
TW201037059A (en) * | 2009-04-01 | 2010-10-16 | Chunghwa Picture Tubes Ltd | Red light fluorescent material and manufacturing method thereof, and white light luminescent device |
US9000664B2 (en) * | 2009-04-06 | 2015-04-07 | Sharp Kabushiki Kaisha | Phosphor particle group, light emitting apparatus using the same, and liquid crystal display television |
US8598793B2 (en) | 2011-05-12 | 2013-12-03 | Ledengin, Inc. | Tuning of emitter with multiple LEDs to a single color bin |
US7985000B2 (en) * | 2009-04-08 | 2011-07-26 | Ledengin, Inc. | Lighting apparatus having multiple light-emitting diodes with individual light-conversion layers |
US8384097B2 (en) | 2009-04-08 | 2013-02-26 | Ledengin, Inc. | Package for multiple light emitting diodes |
CN102414850B (zh) * | 2009-04-21 | 2014-07-09 | 皇家飞利浦电子股份有限公司 | 具有磷光体的照明装置 |
US8192048B2 (en) * | 2009-04-22 | 2012-06-05 | 3M Innovative Properties Company | Lighting assemblies and systems |
KR101004713B1 (ko) * | 2009-04-22 | 2011-01-04 | 주식회사 에피밸리 | 디스플레이의 디밍 제어방법 |
KR101753740B1 (ko) | 2009-04-28 | 2017-07-04 | 삼성전자주식회사 | 광학 재료, 광학 부품 및 방법 |
DE102009020569B4 (de) | 2009-05-08 | 2019-02-21 | Schott Ag | Leuchtstoffe auf Basis Eu2+-(co-) dotierter Yttrium-Aluminium-Granat-Kristalle und deren Verwendung |
WO2010132517A2 (en) * | 2009-05-12 | 2010-11-18 | David Gershaw | Led retrofit for miniature bulbs |
US8328406B2 (en) | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
US8330381B2 (en) | 2009-05-14 | 2012-12-11 | Ilumisys, Inc. | Electronic circuit for DC conversion of fluorescent lighting ballast |
US8227276B2 (en) * | 2009-05-19 | 2012-07-24 | Intematix Corporation | Manufacture of light emitting devices with phosphor wavelength conversion |
US8227269B2 (en) * | 2009-05-19 | 2012-07-24 | Intematix Corporation | Manufacture of light emitting devices with phosphor wavelength conversion |
US8597963B2 (en) * | 2009-05-19 | 2013-12-03 | Intematix Corporation | Manufacture of light emitting devices with phosphor wavelength conversion |
US8440500B2 (en) * | 2009-05-20 | 2013-05-14 | Interlight Optotech Corporation | Light emitting device |
US9250044B1 (en) | 2009-05-29 | 2016-02-02 | Soraa Laser Diode, Inc. | Gallium and nitrogen containing laser diode dazzling devices and methods of use |
US8509275B1 (en) | 2009-05-29 | 2013-08-13 | Soraa, Inc. | Gallium nitride based laser dazzling device and method |
US9800017B1 (en) | 2009-05-29 | 2017-10-24 | Soraa Laser Diode, Inc. | Laser device and method for a vehicle |
KR101800345B1 (ko) * | 2009-06-01 | 2017-11-22 | 닛토덴코 가부시키가이샤 | 발광 세라믹 및 이를 이용한 발광 디바이스 |
WO2010141235A1 (en) * | 2009-06-01 | 2010-12-09 | Nitto Denko Corporation | Light-emitting divice comprising a dome-shaped ceramic phosphor |
US8299695B2 (en) | 2009-06-02 | 2012-10-30 | Ilumisys, Inc. | Screw-in LED bulb comprising a base having outwardly projecting nodes |
US8921876B2 (en) | 2009-06-02 | 2014-12-30 | Cree, Inc. | Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements |
WO2010148109A1 (en) | 2009-06-16 | 2010-12-23 | The Regents Of The University Of California | Oxyfluoride phosphors and white light emitting diodes including the oxyfluoride phosphor for solid-state lighting applications |
US8651692B2 (en) * | 2009-06-18 | 2014-02-18 | Intematix Corporation | LED based lamp and light emitting signage |
US8426871B2 (en) * | 2009-06-19 | 2013-04-23 | Honeywell International Inc. | Phosphor converting IR LEDs |
EP2446715A4 (de) | 2009-06-23 | 2013-09-11 | Ilumisys Inc | Beleuchtungsvorrichtung mit leds und schaltstromsteuerungssystem |
US8727597B2 (en) | 2009-06-24 | 2014-05-20 | Oree, Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
DE102009030205A1 (de) * | 2009-06-24 | 2010-12-30 | Litec-Lp Gmbh | Leuchtstoffe mit Eu(II)-dotierten silikatischen Luminophore |
KR101055762B1 (ko) * | 2009-09-01 | 2011-08-11 | 서울반도체 주식회사 | 옥시오소실리케이트 발광체를 갖는 발광 물질을 채택한 발광 장치 |
WO2010151600A1 (en) | 2009-06-27 | 2010-12-29 | Michael Tischler | High efficiency leds and led lamps |
US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
CN102473803B (zh) | 2009-07-28 | 2014-09-10 | A·V·维什尼科夫 | 用于固体白光源的无机发光材料 |
JP5444919B2 (ja) * | 2009-07-29 | 2014-03-19 | ソニー株式会社 | 照明装置、及び液晶表示装置 |
DE102009035100A1 (de) * | 2009-07-29 | 2011-02-03 | Osram Opto Semiconductors Gmbh | Leuchtdiode und Konversionselement für eine Leuchtdiode |
JP2009260390A (ja) * | 2009-08-05 | 2009-11-05 | Osram-Melco Ltd | 可変色発光ダイオード素子 |
KR101172143B1 (ko) * | 2009-08-10 | 2012-08-07 | 엘지이노텍 주식회사 | 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 led 소자 |
US8197105B2 (en) * | 2009-08-13 | 2012-06-12 | Intematix Corporation | LED-based lamps |
WO2011020098A1 (en) | 2009-08-14 | 2011-02-17 | Qd Vision, Inc. | Lighting devices, an optical component for a lighting device, and methods |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
JP5406639B2 (ja) * | 2009-08-31 | 2014-02-05 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
JP5406638B2 (ja) * | 2009-08-31 | 2014-02-05 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
US9909058B2 (en) * | 2009-09-02 | 2018-03-06 | Lg Innotek Co., Ltd. | Phosphor, phosphor manufacturing method, and white light emitting device |
KR101163902B1 (ko) | 2010-08-10 | 2012-07-09 | 엘지이노텍 주식회사 | 발광 소자 |
TWI385782B (zh) * | 2009-09-10 | 2013-02-11 | Lextar Electronics Corp | 白光發光元件 |
WO2011037877A1 (en) | 2009-09-25 | 2011-03-31 | Cree, Inc. | Lighting device with low glare and high light level uniformity |
US7977641B2 (en) * | 2009-09-29 | 2011-07-12 | General Electric Company | Scintillator, associated detecting device and method |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
US9175418B2 (en) | 2009-10-09 | 2015-11-03 | Soraa, Inc. | Method for synthesis of high quality large area bulk gallium based crystals |
DE102009049056A1 (de) | 2009-10-12 | 2011-04-14 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zur Beschichtung eines Silikat-Leuchtstoffs |
TWI403005B (zh) * | 2009-10-12 | 2013-07-21 | Intematix Technology Ct Corp | 發光二極體及其製作方法 |
US8089086B2 (en) * | 2009-10-19 | 2012-01-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light source |
US20110090669A1 (en) * | 2009-10-20 | 2011-04-21 | Tsung-Ting Sun | Led lighting device and light source module for the same |
US8440104B2 (en) * | 2009-10-21 | 2013-05-14 | General Electric Company | Kimzeyite garnet phosphors |
US9435493B2 (en) | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
CN101760197B (zh) * | 2009-10-27 | 2013-08-07 | 上海祥羚光电科技发展有限公司 | 一种白光led用黄色荧光粉及其制备方法 |
US8535565B2 (en) | 2009-10-30 | 2013-09-17 | The Regents Of The University Of California | Solid solution phosphors based on oxyfluoride and white light emitting diodes including the phosphors for solid state white lighting applications |
KR101924080B1 (ko) * | 2009-11-11 | 2018-11-30 | 삼성 리서치 아메리카 인코포레이티드 | 양자점을 포함하는 디바이스 |
KR101020998B1 (ko) * | 2009-11-12 | 2011-03-09 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
JP4888853B2 (ja) | 2009-11-12 | 2012-02-29 | 学校法人慶應義塾 | 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置 |
TWI531088B (zh) * | 2009-11-13 | 2016-04-21 | 首爾偉傲世有限公司 | 具有分散式布拉格反射器的發光二極體晶片 |
US8963178B2 (en) | 2009-11-13 | 2015-02-24 | Seoul Viosys Co., Ltd. | Light emitting diode chip having distributed bragg reflector and method of fabricating the same |
US8779685B2 (en) | 2009-11-19 | 2014-07-15 | Intematix Corporation | High CRI white light emitting devices and drive circuitry |
JP5565793B2 (ja) * | 2009-12-08 | 2014-08-06 | 学校法人立命館 | 深紫外発光素子及びその製造方法 |
EP2511590A4 (de) * | 2009-12-08 | 2014-03-26 | Sharp Kk | Beleuchtungsvorrichtung, anzeigevorrichtung sowie fernsehempfangsvorrichtung |
US8466611B2 (en) | 2009-12-14 | 2013-06-18 | Cree, Inc. | Lighting device with shaped remote phosphor |
US8536615B1 (en) | 2009-12-16 | 2013-09-17 | Cree, Inc. | Semiconductor device structures with modulated and delta doping and related methods |
US8604461B2 (en) | 2009-12-16 | 2013-12-10 | Cree, Inc. | Semiconductor device structures with modulated doping and related methods |
US8303141B2 (en) * | 2009-12-17 | 2012-11-06 | Ledengin, Inc. | Total internal reflection lens with integrated lamp cover |
JP5707697B2 (ja) | 2009-12-17 | 2015-04-30 | 日亜化学工業株式会社 | 発光装置 |
CN101847680A (zh) * | 2009-12-21 | 2010-09-29 | 深圳市成光兴实业发展有限公司 | 采用丝网印刷工艺的白光led荧光粉膜层及制作方法 |
KR101646255B1 (ko) * | 2009-12-22 | 2016-08-05 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 패키지 및 발광 소자 제조방법 |
KR20110076447A (ko) * | 2009-12-29 | 2011-07-06 | 삼성전자주식회사 | 발광 장치 및 이를 포함하는 표시 장치 |
CN101760196B (zh) * | 2009-12-29 | 2012-11-21 | 四川大学 | 一种白光led用黄色荧光粉的合成方法 |
CN101797698B (zh) * | 2009-12-30 | 2012-01-18 | 马勒三环气门驱动(湖北)有限公司 | 气门轴向尺寸的控制方法 |
US9480133B2 (en) | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
EP2468836A4 (de) | 2010-01-08 | 2014-07-30 | Sharp Kk | Phosphor, lichtemittierende vorrichtung und flüssigkristallanzeigevorrichtung damit |
KR101768010B1 (ko) * | 2010-02-04 | 2017-08-14 | 닛토덴코 가부시키가이샤 | 발광 세라믹 적층체 및 이를 제조하는 방법 |
US9631782B2 (en) * | 2010-02-04 | 2017-04-25 | Xicato, Inc. | LED-based rectangular illumination device |
US20120305973A1 (en) * | 2010-02-08 | 2012-12-06 | Yoshihiko Chosa | Light-emitting device and surface light source device using the same |
KR20110094996A (ko) * | 2010-02-18 | 2011-08-24 | 엘지이노텍 주식회사 | 발광소자 패키지, 그 제조방법 및 조명시스템 |
WO2011105666A1 (ko) * | 2010-02-24 | 2011-09-01 | Shim Hyun-Seop | 엘이디 색변환용 유브이 코팅 조성물 |
GB2478287A (en) | 2010-03-01 | 2011-09-07 | Merck Patent Gmbh | Electro-optical switching element and electro-optical display |
US8716038B2 (en) * | 2010-03-02 | 2014-05-06 | Micron Technology, Inc. | Microelectronic workpiece processing systems and associated methods of color correction |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
US8632196B2 (en) | 2010-03-03 | 2014-01-21 | Cree, Inc. | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
JP5769290B2 (ja) * | 2010-03-03 | 2015-08-26 | 国立研究開発法人産業技術総合研究所 | 照明装置 |
US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
US8104908B2 (en) * | 2010-03-04 | 2012-01-31 | Xicato, Inc. | Efficient LED-based illumination module with high color rendering index |
US20110220920A1 (en) * | 2010-03-09 | 2011-09-15 | Brian Thomas Collins | Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices |
EP2548235B1 (de) * | 2010-03-16 | 2019-05-08 | Signify Holding B.V. | Beleuchtungsvorrichtung |
US8324798B2 (en) * | 2010-03-19 | 2012-12-04 | Nitto Denko Corporation | Light emitting device using orange-red phosphor with co-dopants |
JP5749327B2 (ja) | 2010-03-19 | 2015-07-15 | 日東電工株式会社 | 発光装置用ガーネット系蛍光体セラミックシート |
KR101666442B1 (ko) * | 2010-03-25 | 2016-10-17 | 엘지이노텍 주식회사 | 발광 다이오드 및 이를 포함하는 발광 소자 패키지 |
WO2011119958A1 (en) | 2010-03-26 | 2011-09-29 | Altair Engineering, Inc. | Inside-out led bulb |
US9057493B2 (en) | 2010-03-26 | 2015-06-16 | Ilumisys, Inc. | LED light tube with dual sided light distribution |
US8541958B2 (en) | 2010-03-26 | 2013-09-24 | Ilumisys, Inc. | LED light with thermoelectric generator |
WO2011122655A1 (ja) * | 2010-03-30 | 2011-10-06 | 三菱化学株式会社 | 発光装置 |
WO2011125422A1 (ja) | 2010-03-31 | 2011-10-13 | 宇部興産株式会社 | 光変換用セラミック複合体、その製造方法、及びそれを備えた発光装置 |
US8322884B2 (en) | 2010-03-31 | 2012-12-04 | Abl Ip Holding Llc | Solid state lighting with selective matching of index of refraction |
WO2011123538A2 (en) | 2010-03-31 | 2011-10-06 | Osram Sylvania Inc. | Phosphor and leds containing same |
US8858022B2 (en) | 2011-05-05 | 2014-10-14 | Ledengin, Inc. | Spot TIR lens system for small high-power emitter |
US9345095B2 (en) | 2010-04-08 | 2016-05-17 | Ledengin, Inc. | Tunable multi-LED emitter module |
US9080729B2 (en) | 2010-04-08 | 2015-07-14 | Ledengin, Inc. | Multiple-LED emitter for A-19 lamps |
US8395312B2 (en) * | 2010-04-19 | 2013-03-12 | Bridgelux, Inc. | Phosphor converted light source having an additional LED to provide long wavelength light |
TWI394827B (zh) * | 2010-04-20 | 2013-05-01 | China Glaze Co Ltd | 螢光材料與白光發光裝置 |
TWI374179B (en) * | 2010-05-07 | 2012-10-11 | Chi Mei Corp | Fluorescent substance and light-emitting device |
JP4809508B1 (ja) | 2010-05-14 | 2011-11-09 | パナソニック株式会社 | Ledモジュール、ledランプおよび照明装置 |
JP2011242536A (ja) * | 2010-05-17 | 2011-12-01 | Canon Inc | 表示装置 |
WO2011143792A1 (zh) * | 2010-05-20 | 2011-11-24 | 大连路明发光科技股份有限公司 | 可剥离型光转换发光膜 |
US8684559B2 (en) | 2010-06-04 | 2014-04-01 | Cree, Inc. | Solid state light source emitting warm light with high CRI |
US8596821B2 (en) | 2010-06-08 | 2013-12-03 | Cree, Inc. | LED light bulbs |
JP5323131B2 (ja) | 2010-06-09 | 2013-10-23 | 信越化学工業株式会社 | 蛍光粒子及び発光ダイオード並びにこれらを用いた照明装置及び液晶パネル用バックライト装置 |
CN102277164B (zh) * | 2010-06-10 | 2013-11-06 | 奇美实业股份有限公司 | 荧光粉体及发光装置 |
US8807799B2 (en) | 2010-06-11 | 2014-08-19 | Intematix Corporation | LED-based lamps |
US8888318B2 (en) | 2010-06-11 | 2014-11-18 | Intematix Corporation | LED spotlight |
US9564320B2 (en) | 2010-06-18 | 2017-02-07 | Soraa, Inc. | Large area nitride crystal and method for making it |
JP4962661B2 (ja) | 2010-06-22 | 2012-06-27 | 東洋紡績株式会社 | 液晶表示装置、偏光板および偏光子保護フィルム |
US9142715B2 (en) | 2010-06-24 | 2015-09-22 | Seoul Viosys Co., Ltd. | Light emitting diode |
US9371973B2 (en) | 2010-06-28 | 2016-06-21 | Shenzhen Liown Electronics Company Ltd. | Electronic lighting device and method for manufacturing same |
KR101372084B1 (ko) | 2010-06-29 | 2014-03-07 | 쿨레지 라이팅 인크. | 항복형 기판을 갖는 전자 장치 |
US8454193B2 (en) | 2010-07-08 | 2013-06-04 | Ilumisys, Inc. | Independent modules for LED fluorescent light tube replacement |
JP2012019062A (ja) * | 2010-07-08 | 2012-01-26 | Shin Etsu Chem Co Ltd | 発光半導体装置、実装基板及びそれらの製造方法 |
US8207663B2 (en) | 2010-07-09 | 2012-06-26 | Nitto Denko Corporation | Phosphor composition and light emitting device using the same |
EP2593714A2 (de) | 2010-07-12 | 2013-05-22 | iLumisys, Inc. | Leiterplattenhalterung für eine led-lichtröhre |
CN102782082A (zh) * | 2010-07-14 | 2012-11-14 | 日本电气硝子株式会社 | 荧光体复合部件、led器件和荧光体复合部件的制造方法 |
US8941135B2 (en) | 2010-07-15 | 2015-01-27 | Nitto Denko Corporation | Light emissive ceramic laminate and method of making same |
DE102010031755A1 (de) * | 2010-07-21 | 2012-02-09 | Merck Patent Gmbh | Aluminat-Leuchtstoffe |
US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
CN102339936B (zh) * | 2010-07-27 | 2015-04-29 | 展晶科技(深圳)有限公司 | 发光装置封装结构及其制造方法 |
WO2012015153A2 (en) | 2010-07-28 | 2012-02-02 | Seoul Opto Device Co., Ltd. | Light emitting diode having distributed bragg reflector |
US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
EP2610217A4 (de) | 2010-08-04 | 2016-02-24 | Ube Industries | Siliciumnitridpulver für siliciumnitridphosphor, caalsin3-phosphor damit, sr2si5n8-phosphor damit, (sr,ca-)alsin3-phosphor damit, la3si6n11-phosphor damit und verfahren zur herstellung dieser phosphore |
CN102376860A (zh) | 2010-08-05 | 2012-03-14 | 夏普株式会社 | 发光装置及其制造方法 |
US8946998B2 (en) | 2010-08-09 | 2015-02-03 | Intematix Corporation | LED-based light emitting systems and devices with color compensation |
US8852455B2 (en) | 2010-08-17 | 2014-10-07 | Intematix Corporation | Europium-activated, beta-SiAlON based green phosphors |
EP2606275A2 (de) | 2010-08-20 | 2013-06-26 | Research Triangle Institute, International | Farbabstimmbare beleuchtungsvorrichtungen und verfahren zur abstimmung der farbausgabe von beleuchtungsvorrichtungen |
US9441811B2 (en) | 2010-08-20 | 2016-09-13 | Research Triangle Institute | Lighting devices utilizing optical waveguides and remote light converters, and related methods |
US9101036B2 (en) | 2010-08-20 | 2015-08-04 | Research Triangle Institute | Photoluminescent nanofiber composites, methods for fabrication, and related lighting devices |
US20120051045A1 (en) | 2010-08-27 | 2012-03-01 | Xicato, Inc. | Led Based Illumination Module Color Matched To An Arbitrary Light Source |
EP2426186B1 (de) | 2010-09-03 | 2016-03-23 | Stcube, Inc. | Harzzusammensetzung zur umwandlung von led-licht und led-element damit |
TWI486254B (zh) | 2010-09-20 | 2015-06-01 | Nitto Denko Corp | 發光陶瓷層板及其製造方法 |
DE102010041236A1 (de) | 2010-09-23 | 2012-03-29 | Osram Ag | Optoelektronisches Halbleiterbauelement |
US8354784B2 (en) | 2010-09-28 | 2013-01-15 | Intematix Corporation | Solid-state light emitting devices with photoluminescence wavelength conversion |
US8614539B2 (en) | 2010-10-05 | 2013-12-24 | Intematix Corporation | Wavelength conversion component with scattering particles |
US8957585B2 (en) | 2010-10-05 | 2015-02-17 | Intermatix Corporation | Solid-state light emitting devices with photoluminescence wavelength conversion |
JP6069205B2 (ja) | 2010-10-05 | 2017-02-01 | インテマティックス・コーポレーションIntematix Corporation | フォトルミネッセンス波長変換を備える発光装置及び波長変換コンポーネント |
US8604678B2 (en) | 2010-10-05 | 2013-12-10 | Intematix Corporation | Wavelength conversion component with a diffusing layer |
US9546765B2 (en) | 2010-10-05 | 2017-01-17 | Intematix Corporation | Diffuser component having scattering particles |
US8610341B2 (en) | 2010-10-05 | 2013-12-17 | Intematix Corporation | Wavelength conversion component |
DE102010042217A1 (de) | 2010-10-08 | 2012-04-12 | Osram Ag | Optoelektronisches Halbleiterbauelement und Verfahren zu seiner Herstellung |
US8729559B2 (en) | 2010-10-13 | 2014-05-20 | Soraa, Inc. | Method of making bulk InGaN substrates and devices thereon |
US8846172B2 (en) | 2010-10-18 | 2014-09-30 | Nitto Denko Corporation | Light emissive ceramic laminate and method of making same |
WO2012053924A1 (ru) | 2010-10-22 | 2012-04-26 | Vishnyakov Anatoly Vasilyevich | Люминесцирующий материал для твердотельных источников белого света |
JP6369774B2 (ja) * | 2010-10-29 | 2018-08-08 | 株式会社光波 | 発光装置 |
WO2012058556A2 (en) | 2010-10-29 | 2012-05-03 | Altair Engineering, Inc. | Mechanisms for reducing risk of shock during installation of light tube |
JP5545866B2 (ja) * | 2010-11-01 | 2014-07-09 | シチズン電子株式会社 | 半導体発光装置 |
US8329484B2 (en) * | 2010-11-02 | 2012-12-11 | Tsmc Solid State Lighting Ltd. | Phosphor with Ce3+/Ce3+, Li+ doped luminescent materials |
CN102456294A (zh) * | 2010-11-02 | 2012-05-16 | 展晶科技(深圳)有限公司 | Led显示装置 |
DE102010050832A1 (de) * | 2010-11-09 | 2012-05-10 | Osram Opto Semiconductors Gmbh | Lumineszenzkonversionselement, Verfahren zu dessen Herstellung und optoelektronisches Bauteil mit Lumineszenzkonversionselement |
US8651681B2 (en) | 2010-11-10 | 2014-02-18 | Osram Sylvania Inc. | Luminescent ceramic converter and LED containing same |
US20150188002A1 (en) * | 2010-11-11 | 2015-07-02 | Auterra, Inc. | Light emitting devices having rare earth and transition metal activated phosphors and applications thereof |
WO2012066425A2 (en) | 2010-11-16 | 2012-05-24 | Saint-Gobain Cristaux Et Detecteurs | Scintillation compound including a rare earth element and a process of forming the same |
CN102097571A (zh) * | 2010-11-16 | 2011-06-15 | 深圳市瑞丰光电子股份有限公司 | 一种黄绿光二极管、背光源、手机及照明指示装置 |
KR20130122937A (ko) | 2010-11-18 | 2013-11-11 | 니폰 덴키 가라스 가부시키가이샤 | 파장 변환 소자 및 그것을 구비하는 광원 |
KR20120054484A (ko) * | 2010-11-19 | 2012-05-30 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 이의 제조방법 |
TWI460892B (zh) * | 2010-11-19 | 2014-11-11 | Advanced Optoelectronic Tech | 發光二極體封裝結構 |
US8343785B2 (en) * | 2010-11-30 | 2013-01-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nitridosilicate phosphor tunable light-emitting diodes by using UV and blue chips |
CN103097488B (zh) | 2010-11-30 | 2014-09-03 | 松下电器产业株式会社 | 荧光体及发光装置 |
KR101843760B1 (ko) | 2010-12-01 | 2018-05-14 | 닛토 덴코 가부시키가이샤 | 도펀트 농도 구배를 갖는 방사성 세라믹 재료들 및 그것을 제조하고 사용하는 방법들 |
US20120138874A1 (en) | 2010-12-02 | 2012-06-07 | Intematix Corporation | Solid-state light emitting devices and signage with photoluminescence wavelength conversion and photoluminescent compositions therefor |
US8556469B2 (en) | 2010-12-06 | 2013-10-15 | Cree, Inc. | High efficiency total internal reflection optic for solid state lighting luminaires |
US8870415B2 (en) | 2010-12-09 | 2014-10-28 | Ilumisys, Inc. | LED fluorescent tube replacement light with reduced shock hazard |
US9074126B2 (en) | 2010-12-16 | 2015-07-07 | Ube Industries, Ltd. | Ceramic composite for light conversion |
US8867295B2 (en) | 2010-12-17 | 2014-10-21 | Enpirion, Inc. | Power converter for a memory module |
US8772817B2 (en) | 2010-12-22 | 2014-07-08 | Cree, Inc. | Electronic device submounts including substrates with thermally conductive vias |
EP2655961A4 (de) | 2010-12-23 | 2014-09-03 | Qd Vision Inc | Optisches element mit quantenpunkten |
KR101340552B1 (ko) * | 2010-12-31 | 2013-12-11 | 제일모직주식회사 | 모바일 폰의 모듈 조립 방법 |
CN102140690B (zh) * | 2010-12-31 | 2013-05-01 | 陈哲艮 | 光致发光晶片及其制备方法和应用 |
US8865022B2 (en) | 2011-01-06 | 2014-10-21 | Shin-Etsu Chemical Co., Ltd. | Phosphor particles and making method |
US9617469B2 (en) | 2011-01-06 | 2017-04-11 | Shin-Etsu Chemical Co., Ltd. | Phosphor particles, making method, and light-emitting diode |
US8354684B2 (en) | 2011-01-09 | 2013-01-15 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in an interconnect structure |
JP5445473B2 (ja) | 2011-01-14 | 2014-03-19 | 信越化学工業株式会社 | 光学材料形成用シリコーン樹脂組成物及び光学材料 |
US8389957B2 (en) | 2011-01-14 | 2013-03-05 | Lumencor, Inc. | System and method for metered dosage illumination in a bioanalysis or other system |
US8466436B2 (en) | 2011-01-14 | 2013-06-18 | Lumencor, Inc. | System and method for metered dosage illumination in a bioanalysis or other system |
KR101210066B1 (ko) | 2011-01-31 | 2012-12-07 | 엘지이노텍 주식회사 | 광 변환 부재 및 이를 포함하는 표시장치 |
US9508904B2 (en) | 2011-01-31 | 2016-11-29 | Cree, Inc. | Structures and substrates for mounting optical elements and methods and devices for providing the same background |
US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
US9068701B2 (en) | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
JP5654378B2 (ja) * | 2011-02-18 | 2015-01-14 | パナソニックIpマネジメント株式会社 | 発光装置 |
TWI431813B (zh) * | 2011-02-24 | 2014-03-21 | Genesis Photonics Inc | Light emitting diode components |
JP6133791B2 (ja) * | 2011-02-24 | 2017-05-24 | 日東電工株式会社 | 蛍光体成分を有する発光複合材 |
TWM407494U (en) * | 2011-02-25 | 2011-07-11 | Unity Opto Technology Co Ltd | LED package structure |
JP5631509B2 (ja) * | 2011-03-01 | 2014-11-26 | オスラム ゲーエムベーハーOSRAM GmbH | 蛍光体エレメントを有する照明装置 |
US8278806B1 (en) | 2011-03-02 | 2012-10-02 | Osram Sylvania Inc. | LED reflector lamp |
JP2012182376A (ja) * | 2011-03-02 | 2012-09-20 | Stanley Electric Co Ltd | 波長変換部材および光源装置 |
WO2012125585A1 (en) | 2011-03-11 | 2012-09-20 | Intematix Corporation | Millisecond decay phosphors for ac led lighting applications |
EP3176838B1 (de) | 2011-03-15 | 2019-01-30 | Kabushiki Kaisha Toshiba | Weisslichtquelle |
US9004705B2 (en) | 2011-04-13 | 2015-04-14 | Intematix Corporation | LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion |
KR101337999B1 (ko) * | 2011-04-20 | 2013-12-06 | 조성매 | 단일상 형광체를 포함하는 백색 발광 다이오드 |
CN102563543B (zh) | 2011-05-09 | 2015-01-07 | 深圳市绎立锐光科技开发有限公司 | 基于光波长转换产生高亮度单色光的方法及光源 |
WO2013019299A2 (en) | 2011-05-11 | 2013-02-07 | Qd Vision, Inc. | Method for processing devices including quantum dots and devices |
US8513900B2 (en) | 2011-05-12 | 2013-08-20 | Ledengin, Inc. | Apparatus for tuning of emitter with multiple LEDs to a single color bin |
CN102305370B (zh) * | 2011-05-18 | 2013-04-17 | 福建华映显示科技有限公司 | 背光模块及选取暨配置背光模块的发光组件的方法 |
WO2012157663A1 (ja) * | 2011-05-18 | 2012-11-22 | 東洋紡株式会社 | 液晶表示装置、偏光板および偏光子保護フィルム |
WO2012157662A1 (ja) * | 2011-05-18 | 2012-11-22 | 東洋紡株式会社 | 三次元画像表示対応液晶表示装置に適した偏光板及び液晶表示装置 |
US8860056B2 (en) | 2011-12-01 | 2014-10-14 | Tsmc Solid State Lighting Ltd. | Structure and method for LED with phosphor coating |
US8747697B2 (en) * | 2011-06-07 | 2014-06-10 | Cree, Inc. | Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same |
TWI467808B (zh) * | 2011-06-27 | 2015-01-01 | Delta Electronics Inc | 發光二極體元件、其製作方法以及發光裝置 |
US8663501B2 (en) | 2011-06-29 | 2014-03-04 | General Electric Company | Green emitting phosphor |
JP5588520B2 (ja) | 2011-07-04 | 2014-09-10 | パナソニック株式会社 | プラズマディスプレイパネル |
EP2730637B1 (de) | 2011-07-05 | 2017-06-14 | Panasonic Corporation | Fluoreszierende seltenerd-aluminium-granatsubstanz und daraus hergestellte lichtemittierende vorrichtung |
US8492185B1 (en) | 2011-07-14 | 2013-07-23 | Soraa, Inc. | Large area nonpolar or semipolar gallium and nitrogen containing substrate and resulting devices |
KR20130009020A (ko) | 2011-07-14 | 2013-01-23 | 엘지이노텍 주식회사 | 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법 |
KR101305696B1 (ko) | 2011-07-14 | 2013-09-09 | 엘지이노텍 주식회사 | 표시장치 및 광학 부재 |
KR101893494B1 (ko) | 2011-07-18 | 2018-08-30 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
KR101262520B1 (ko) | 2011-07-18 | 2013-05-08 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
KR101241549B1 (ko) | 2011-07-18 | 2013-03-11 | 엘지이노텍 주식회사 | 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법 |
KR101294415B1 (ko) | 2011-07-20 | 2013-08-08 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
JP5396439B2 (ja) * | 2011-07-22 | 2014-01-22 | 学校法人慶應義塾 | 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置 |
JP5559108B2 (ja) * | 2011-08-05 | 2014-07-23 | 株式会社東芝 | 半導体発光装置 |
US20140168965A1 (en) * | 2011-08-16 | 2014-06-19 | Samsung Electronics Co., Ltd. | Led device having adjustable color temperature |
US9072171B2 (en) | 2011-08-24 | 2015-06-30 | Ilumisys, Inc. | Circuit board mount for LED light |
JP5899485B2 (ja) * | 2011-08-29 | 2016-04-06 | パナソニックIpマネジメント株式会社 | 樹脂塗布装置および樹脂塗布方法 |
KR101823930B1 (ko) | 2011-08-29 | 2018-01-31 | 삼성전자주식회사 | 발광소자 패키지 어레이 및 발광소자 패키지 제조 방법 |
CN105357796B (zh) | 2011-09-02 | 2019-02-15 | 西铁城电子株式会社 | 照明方法和发光装置 |
JP5252107B2 (ja) | 2011-09-02 | 2013-07-31 | 三菱化学株式会社 | 照明方法及び発光装置 |
WO2013036062A2 (en) * | 2011-09-08 | 2013-03-14 | Lg Innotek Co., Ltd. | Lighting module |
US8912021B2 (en) | 2011-09-12 | 2014-12-16 | SemiLEDs Optoelectronics Co., Ltd. | System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers |
US8410508B1 (en) | 2011-09-12 | 2013-04-02 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method |
US8492746B2 (en) | 2011-09-12 | 2013-07-23 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) dice having wavelength conversion layers |
US8841146B2 (en) | 2011-09-12 | 2014-09-23 | SemiLEDs Optoelectronics Co., Ltd. | Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics |
DE102011113802A1 (de) | 2011-09-20 | 2013-03-21 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen |
US10688527B2 (en) | 2011-09-22 | 2020-06-23 | Delta Electronics, Inc. | Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks |
TWI448806B (zh) | 2011-09-22 | 2014-08-11 | Delta Electronics Inc | 螢光劑裝置及其所適用之光源系統及投影設備 |
US10310363B2 (en) | 2011-09-22 | 2019-06-04 | Delta Electronics, Inc. | Phosphor device with spectrum of converted light comprising at least a color light |
JP5690696B2 (ja) | 2011-09-28 | 2015-03-25 | 富士フイルム株式会社 | 平版印刷版の製版方法 |
US20130088848A1 (en) | 2011-10-06 | 2013-04-11 | Intematix Corporation | Solid-state lamps with improved radial emission and thermal performance |
US8992051B2 (en) | 2011-10-06 | 2015-03-31 | Intematix Corporation | Solid-state lamps with improved radial emission and thermal performance |
US9115868B2 (en) | 2011-10-13 | 2015-08-25 | Intematix Corporation | Wavelength conversion component with improved protective characteristics for remote wavelength conversion |
JP6312596B2 (ja) | 2011-10-13 | 2018-04-18 | インテマティックス・コーポレーションIntematix Corporation | 固体発光デバイス及びランプのためのフォトルミネセンス波長変換コンポーネント |
US9365766B2 (en) | 2011-10-13 | 2016-06-14 | Intematix Corporation | Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion |
US9694158B2 (en) | 2011-10-21 | 2017-07-04 | Ahmad Mohamad Slim | Torque for incrementally advancing a catheter during right heart catheterization |
US10029955B1 (en) | 2011-10-24 | 2018-07-24 | Slt Technologies, Inc. | Capsule for high pressure, high temperature processing of materials and methods of use |
CN102495495B (zh) | 2011-10-28 | 2015-03-11 | 友达光电股份有限公司 | 具可透视性的显示装置及其使用的影像显示方法 |
KR101251815B1 (ko) * | 2011-11-07 | 2013-04-09 | 엘지이노텍 주식회사 | 광학 시트 및 이를 포함하는 표시장치 |
US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
US9864121B2 (en) | 2011-11-22 | 2018-01-09 | Samsung Electronics Co., Ltd. | Stress-resistant component for use with quantum dots |
US9247597B2 (en) | 2011-12-02 | 2016-01-26 | Lynk Labs, Inc. | Color temperature controlled and low THD LED lighting devices and systems and methods of driving the same |
EP2607449B1 (de) * | 2011-12-22 | 2014-04-02 | Shin-Etsu Chemical Co., Ltd. | Herstellung von Yttrium-Cer-Aluminium-Granatphosphor |
JP5712916B2 (ja) * | 2011-12-22 | 2015-05-07 | 信越化学工業株式会社 | イットリウムセリウムアルミニウムガーネット蛍光体及び発光装置 |
CN103173217B (zh) * | 2011-12-23 | 2017-03-01 | 李建立 | 耐温氮化物荧光材料及含有其的发光装置 |
US8482104B2 (en) | 2012-01-09 | 2013-07-09 | Soraa, Inc. | Method for growth of indium-containing nitride films |
US9103528B2 (en) | 2012-01-20 | 2015-08-11 | Lumencor, Inc | Solid state continuous white light source |
WO2013112542A1 (en) | 2012-01-25 | 2013-08-01 | Intematix Corporation | Long decay phosphors for lighting applications |
CN104106150A (zh) | 2012-02-08 | 2014-10-15 | 松下电器产业株式会社 | 发光装置 |
KR101419664B1 (ko) | 2012-02-08 | 2014-07-15 | 파나소닉 주식회사 | 이트륨알루미늄가넷 타입의 형광체 |
JP5893429B2 (ja) * | 2012-02-21 | 2016-03-23 | スタンレー電気株式会社 | メタンガスセンサ用蛍光体、メタンガスセンサ用光源及びメタンガスセンサ |
WO2013131002A1 (en) | 2012-03-02 | 2013-09-06 | Ilumisys, Inc. | Electrical connector header for an led-based light |
US11032884B2 (en) | 2012-03-02 | 2021-06-08 | Ledengin, Inc. | Method for making tunable multi-led emitter module |
CN104508082A (zh) | 2012-03-06 | 2015-04-08 | 日东电工株式会社 | 用于发光装置的陶瓷体 |
US9581311B2 (en) * | 2012-03-12 | 2017-02-28 | L-3 Communications Corporation | Backlight display using photoluminescent material tuned to improve NVIS compatibility |
US9068717B2 (en) * | 2012-03-12 | 2015-06-30 | L-3 Communications Corporation | Backlight display using photoluminescent material tuned to improve NVIS compatibility |
US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
US9897284B2 (en) | 2012-03-28 | 2018-02-20 | Ledengin, Inc. | LED-based MR16 replacement lamp |
EP2832816B1 (de) | 2012-03-30 | 2016-01-20 | Ube Industries, Ltd. | Keramikkomplex zur lichtumwandlung und lichtemittierende vorrichtung damit |
US9800016B1 (en) | 2012-04-05 | 2017-10-24 | Soraa Laser Diode, Inc. | Facet on a gallium and nitrogen containing laser diode |
US10559939B1 (en) | 2012-04-05 | 2020-02-11 | Soraa Laser Diode, Inc. | Facet on a gallium and nitrogen containing laser diode |
JP2015121569A (ja) * | 2012-04-16 | 2015-07-02 | シャープ株式会社 | 表示装置 |
WO2013156112A1 (en) | 2012-04-20 | 2013-10-24 | Merck Patent Gmbh | Electro-optical switching element and electro-optical display |
CN104247058B (zh) | 2012-04-26 | 2017-10-03 | 英特曼帝克司公司 | 用于在远程波长转换中实施色彩一致性的方法及设备 |
US8907809B2 (en) | 2012-05-03 | 2014-12-09 | Abl Ip Holding Llc | Visual perception and acuity disruption techniques and systems |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
CN104364346A (zh) | 2012-05-07 | 2015-02-18 | 帕夫莱·拉多万诺维奇 | 发光材料及其生产方法 |
CN103534824B (zh) | 2012-05-16 | 2016-05-25 | 松下知识产权经营株式会社 | 波长变换元件及其制造方法和使用波长变换元件的led元件及半导体激光发光装置 |
WO2013175773A1 (ja) | 2012-05-22 | 2013-11-28 | パナソニック株式会社 | 波長変換素子およびその製造方法ならびに波長変換素子を用いたled素子および半導体レーザ発光装置 |
JP5304939B1 (ja) * | 2012-05-31 | 2013-10-02 | 大日本印刷株式会社 | 光学積層体、偏光板、偏光板の製造方法、画像表示装置、画像表示装置の製造方法及び画像表示装置の視認性改善方法 |
EP2822045B1 (de) * | 2012-05-31 | 2018-04-11 | Panasonic Intellectual Property Management Co., Ltd. | Led-modul, beleuchtungsvorrichtung und lampe |
US10145026B2 (en) | 2012-06-04 | 2018-12-04 | Slt Technologies, Inc. | Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules |
US8877561B2 (en) | 2012-06-07 | 2014-11-04 | Cooledge Lighting Inc. | Methods of fabricating wafer-level flip chip device packages |
JP5789564B2 (ja) * | 2012-06-11 | 2015-10-07 | 学校法人慶應義塾 | 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置 |
DE112013002944T5 (de) | 2012-06-13 | 2015-02-19 | Innotec, Corp. | Flexibler Hohllichtleiter |
KR20130140462A (ko) | 2012-06-14 | 2013-12-24 | 삼성디스플레이 주식회사 | 포토루미네슨스 표시 장치 |
US9217561B2 (en) | 2012-06-15 | 2015-12-22 | Lumencor, Inc. | Solid state light source for photocuring |
WO2014006501A1 (en) | 2012-07-03 | 2014-01-09 | Yosi Shani | Planar remote phosphor illumination apparatus |
WO2014008463A1 (en) | 2012-07-06 | 2014-01-09 | Ilumisys, Inc. | Power supply assembly for led-based light tube |
US9271367B2 (en) | 2012-07-09 | 2016-02-23 | Ilumisys, Inc. | System and method for controlling operation of an LED-based light |
US8994056B2 (en) | 2012-07-13 | 2015-03-31 | Intematix Corporation | LED-based large area display |
JP2014130998A (ja) * | 2012-07-20 | 2014-07-10 | Mitsubishi Chemicals Corp | 発光装置、波長変換部材、蛍光体組成物、及び蛍光体混合物 |
JP2014170895A (ja) * | 2013-03-05 | 2014-09-18 | Mitsubishi Chemicals Corp | 波長変換部材及びこれを用いた発光装置 |
WO2014014079A1 (ja) * | 2012-07-20 | 2014-01-23 | 三菱化学株式会社 | 発光装置、波長変換部材、蛍光体組成物、及び蛍光体混合物 |
JP2014019860A (ja) | 2012-07-24 | 2014-02-03 | Shin Etsu Chem Co Ltd | 蛍光体前駆体の製造方法、蛍光体の製造方法及び波長変換部品 |
US9275912B1 (en) | 2012-08-30 | 2016-03-01 | Soraa, Inc. | Method for quantification of extended defects in gallium-containing nitride crystals |
JP6126103B2 (ja) | 2012-08-31 | 2017-05-10 | シチズン電子株式会社 | 照明方法及び発光装置 |
US9299555B1 (en) | 2012-09-28 | 2016-03-29 | Soraa, Inc. | Ultrapure mineralizers and methods for nitride crystal growth |
CN104662069B (zh) | 2012-09-28 | 2016-01-27 | 夏普株式会社 | 含荧光体密封材料的制造方法、含荧光体密封材料、发光装置的制造方法以及分配器 |
RU2533709C2 (ru) * | 2012-10-05 | 2014-11-20 | Общество с ограниченной ответственностью "Минерал" | Монокристаллический люминофорный материал для светодиодов белого света |
EP2733190B1 (de) * | 2012-11-16 | 2020-01-01 | LG Innotek Co., Ltd. | Phosphorzusammensetzung und lichtemittierende Vorrichtung damit |
DE102012220980A1 (de) | 2012-11-16 | 2014-05-22 | Osram Gmbh | Optoelektronisches halbleiterbauelement |
JP6140730B2 (ja) * | 2012-12-10 | 2017-05-31 | 株式会社エルム | 蛍光体層の作成方法 |
TWM450828U (zh) * | 2012-12-14 | 2013-04-11 | Litup Technology Co Ltd | 熱電分離的發光二極體模組和相關的散熱載板 |
US9437788B2 (en) * | 2012-12-19 | 2016-09-06 | Cree, Inc. | Light emitting diode (LED) component comprising a phosphor with improved excitation properties |
CN104918892B (zh) | 2012-12-20 | 2017-03-22 | 松下知识产权经营株式会社 | 稀土类铝石榴石型无机氧化物、荧光体以及使用了该荧光体的发光装置 |
JP6089686B2 (ja) * | 2012-12-25 | 2017-03-08 | 日亜化学工業株式会社 | 発光装置 |
US20140185269A1 (en) | 2012-12-28 | 2014-07-03 | Intermatix Corporation | Solid-state lamps utilizing photoluminescence wavelength conversion components |
US9474116B2 (en) | 2013-01-03 | 2016-10-18 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Minimized color shift lighting arrangement during dimming |
TW201429009A (zh) * | 2013-01-11 | 2014-07-16 | Ecocera Optronics Co Ltd | 發光二極體裝置及散熱基板的製造方法 |
TW201428087A (zh) | 2013-01-11 | 2014-07-16 | kai-xiong Cai | 發光裝置及其耐溫碳化物螢光材料 |
CN103943759B (zh) | 2013-01-21 | 2018-04-27 | 圣戈本陶瓷及塑料股份有限公司 | 包括发光含钆材料的物件及其形成工艺 |
US9217543B2 (en) | 2013-01-28 | 2015-12-22 | Intematix Corporation | Solid-state lamps with omnidirectional emission patterns |
DE102013100888A1 (de) * | 2013-01-29 | 2014-07-31 | Schott Ag | Licht-Konzentrator oder -Verteiler |
US8754435B1 (en) | 2013-02-19 | 2014-06-17 | Cooledge Lighting Inc. | Engineered-phosphor LED package and related methods |
US8933478B2 (en) | 2013-02-19 | 2015-01-13 | Cooledge Lighting Inc. | Engineered-phosphor LED packages and related methods |
CN106937446B (zh) | 2013-03-04 | 2020-01-07 | 西铁城电子株式会社 | 发光装置、照明方法、设计方法、驱动方法、制造方法 |
CN104968763B (zh) | 2013-03-08 | 2016-12-21 | 松下知识产权经营株式会社 | 稀土类铝石榴石型无机氧化物、荧光体以及使用了该荧光体的发光装置 |
US9754807B2 (en) * | 2013-03-12 | 2017-09-05 | Applied Materials, Inc. | High density solid state light source array |
US9285084B2 (en) | 2013-03-14 | 2016-03-15 | Ilumisys, Inc. | Diffusers for LED-based lights |
US9295855B2 (en) | 2013-03-15 | 2016-03-29 | Gary W. Jones | Ambient spectrum light conversion device |
US9234801B2 (en) | 2013-03-15 | 2016-01-12 | Ledengin, Inc. | Manufacturing method for LED emitter with high color consistency |
WO2014151263A1 (en) * | 2013-03-15 | 2014-09-25 | Intematix Corporation | Photoluminescence wavelength conversion components |
JP5698779B2 (ja) * | 2013-03-18 | 2015-04-08 | オリンパス株式会社 | 光源装置を有する内視鏡装置 |
JP5698780B2 (ja) * | 2013-03-18 | 2015-04-08 | オリンパス株式会社 | 光源装置およびそれを備えた内視鏡装置 |
JP5718398B2 (ja) * | 2013-03-18 | 2015-05-13 | オリンパス株式会社 | 内視鏡装置 |
CZ2013301A3 (cs) | 2013-04-22 | 2014-07-16 | Crytur Spol. S R. O. | Dioda emitující bílé světlo s monokrystalickým luminoforem a způsob výroby |
JP6286026B2 (ja) * | 2013-04-25 | 2018-02-28 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 発光ダイオードコンポーネント |
JP6102763B2 (ja) | 2013-04-26 | 2017-03-29 | 日亜化学工業株式会社 | 蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法 |
JP6167913B2 (ja) | 2013-04-26 | 2017-07-26 | 日亜化学工業株式会社 | 蛍光体及びそれを用いた発光装置 |
US8941295B2 (en) | 2013-04-29 | 2015-01-27 | Kai-Shon Tsai | Fluorescent material and illumination device |
US9231168B2 (en) | 2013-05-02 | 2016-01-05 | Industrial Technology Research Institute | Light emitting diode package structure |
JP2013179335A (ja) * | 2013-05-08 | 2013-09-09 | Mitsubishi Chemicals Corp | 白色発光素子 |
JPWO2014188847A1 (ja) * | 2013-05-21 | 2017-02-23 | セントラル硝子株式会社 | 広帯域発光材料及び白色光発光材料 |
WO2014192449A1 (ja) | 2013-05-28 | 2014-12-04 | シャープ株式会社 | 発光装置の製造方法 |
CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
WO2014203841A1 (ja) * | 2013-06-18 | 2014-12-24 | シャープ株式会社 | 発光装置 |
KR102098589B1 (ko) | 2013-07-04 | 2020-04-09 | 삼성전자주식회사 | 파장변환부재 및 그 제조방법과, 이를 구비한 반도체 발광장치 |
CN104332539B (zh) | 2013-07-22 | 2017-10-24 | 中国科学院福建物质结构研究所 | GaN基LED外延结构及其制造方法 |
TW201508207A (zh) * | 2013-08-27 | 2015-03-01 | Hon Hai Prec Ind Co Ltd | 車燈模組 |
US9863595B2 (en) | 2013-08-28 | 2018-01-09 | Sharp Kabushiki Kaisha | Light-emitting unit with optical plate reflecting excitation light and transmitting fluorescent light, and light-emitting device, illumination device, and vehicle headlight including the unit |
JP6139334B2 (ja) * | 2013-08-28 | 2017-05-31 | 東芝マテリアル株式会社 | 蛍光体およびその製造方法、並びにその蛍光体を用いたledランプ |
KR102106143B1 (ko) | 2013-09-02 | 2020-05-04 | 대주전자재료 주식회사 | 적색 형광체 및 이를 이용한 백색 발광 장치 |
EP3053987A4 (de) | 2013-09-30 | 2016-11-30 | Panasonic Ip Man Co Ltd | Phosphor, lichtemittierende vorrichtung damit, beleuchtungslichtquelle sowie beleuchtungsvorrichtung damit |
RU2672747C2 (ru) | 2013-10-08 | 2018-11-19 | Осрам Опто Семикондакторз Гмбх | Люминофор, способ получения люминофора и применение люминофора |
US9267650B2 (en) | 2013-10-09 | 2016-02-23 | Ilumisys, Inc. | Lens for an LED-based light |
JP6384893B2 (ja) * | 2013-10-23 | 2018-09-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
JP5620562B1 (ja) | 2013-10-23 | 2014-11-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
FR3012677B1 (fr) * | 2013-10-25 | 2015-12-25 | Commissariat Energie Atomique | Dispositif emissif lumineux, dispositif et procede d'ajustement d'une emission lumineuse d'une diode electroluminescente a phosphore |
US10069046B2 (en) | 2013-11-13 | 2018-09-04 | Lg Innotek Co., Ltd. | Bluish green phosphor and light emitting device package including the same |
WO2015077357A1 (en) | 2013-11-22 | 2015-05-28 | Nitto Denko Corporation | Light extraction element |
US9551468B2 (en) | 2013-12-10 | 2017-01-24 | Gary W. Jones | Inverse visible spectrum light and broad spectrum light source for enhanced vision |
US10288233B2 (en) | 2013-12-10 | 2019-05-14 | Gary W. Jones | Inverse visible spectrum light and broad spectrum light source for enhanced vision |
JP6222452B2 (ja) | 2013-12-17 | 2017-11-01 | 日本電気硝子株式会社 | 波長変換部材及び発光デバイス |
WO2015099115A1 (ja) | 2013-12-27 | 2015-07-02 | 三菱化学株式会社 | 発光装置及び発光装置の設計方法 |
CN105849920B (zh) | 2013-12-27 | 2020-11-06 | 西铁城电子株式会社 | 发光装置和发光装置的设计方法 |
JP2017504166A (ja) | 2014-01-22 | 2017-02-02 | イルミシス, インコーポレイテッドiLumisys, Inc. | アドレス指定されたledを有するledベース電灯 |
US9406654B2 (en) | 2014-01-27 | 2016-08-02 | Ledengin, Inc. | Package for high-power LED devices |
JP6528418B2 (ja) | 2014-01-29 | 2019-06-12 | 日亜化学工業株式会社 | 蛍光体及びこれを用いた発光装置 |
CN103779488A (zh) * | 2014-01-31 | 2014-05-07 | 芜湖市神龙新能源科技有限公司 | 一种白色led灯光电玻璃 |
JP6038824B2 (ja) | 2014-02-07 | 2016-12-07 | 信越化学工業株式会社 | 硬化性組成物、半導体装置、及びエステル結合含有有機ケイ素化合物 |
KR101501020B1 (ko) * | 2014-02-17 | 2015-03-13 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
KR102219263B1 (ko) | 2014-02-28 | 2021-02-24 | 대주전자재료 주식회사 | 산질화물계 적색 형광체 및 이를 이용한 백색 발광 장치 |
US9442245B2 (en) * | 2014-03-13 | 2016-09-13 | Norman Napaul Pepin | Light scaffold electric arc sound effect |
US9680067B2 (en) | 2014-03-18 | 2017-06-13 | GE Lighting Solutions, LLC | Heavily phosphor loaded LED packages having higher stability |
US9590148B2 (en) * | 2014-03-18 | 2017-03-07 | GE Lighting Solutions, LLC | Encapsulant modification in heavily phosphor loaded LED packages for improved stability |
JP2015199640A (ja) | 2014-04-01 | 2015-11-12 | 日本電気硝子株式会社 | 波長変換部材及びそれを用いてなる発光デバイス |
KR102213650B1 (ko) | 2014-04-18 | 2021-02-08 | 대주전자재료 주식회사 | 산질화물계 형광체 및 이를 이용한 백색 발광 장치 |
US9593812B2 (en) | 2014-04-23 | 2017-03-14 | Cree, Inc. | High CRI solid state lighting devices with enhanced vividness |
US9241384B2 (en) | 2014-04-23 | 2016-01-19 | Cree, Inc. | Solid state lighting devices with adjustable color point |
US9510400B2 (en) | 2014-05-13 | 2016-11-29 | Ilumisys, Inc. | User input systems for an LED-based light |
US9215761B2 (en) | 2014-05-15 | 2015-12-15 | Cree, Inc. | Solid state lighting devices with color point non-coincident with blackbody locus |
JP2016027613A (ja) | 2014-05-21 | 2016-02-18 | 日本電気硝子株式会社 | 波長変換部材及びそれを用いた発光装置 |
CN103980902A (zh) * | 2014-05-21 | 2014-08-13 | 烟台建塬光电技术有限公司 | 掺杂Ga、Bi的铝酸盐绿色荧光粉及其制备方法 |
US9318670B2 (en) | 2014-05-21 | 2016-04-19 | Intematix Corporation | Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements |
DE102014107321B4 (de) | 2014-05-23 | 2019-06-27 | Tailorlux Gmbh | Infrarot LED |
KR101476217B1 (ko) | 2014-05-28 | 2014-12-24 | 엘지전자 주식회사 | 황색 발광 형광체 및 이를 이용한 발광 소자 패키지 |
US9515056B2 (en) | 2014-06-06 | 2016-12-06 | Cree, Inc. | Solid state lighting device including narrow spectrum emitter |
US9192013B1 (en) | 2014-06-06 | 2015-11-17 | Cree, Inc. | Lighting devices with variable gamut |
JP6406109B2 (ja) | 2014-07-08 | 2018-10-17 | 日亜化学工業株式会社 | 蛍光体およびそれを用いた発光装置ならびに蛍光体の製造方法 |
KR101467808B1 (ko) | 2014-07-14 | 2014-12-03 | 엘지전자 주식회사 | 황색 발광 형광체 및 이를 이용한 발광 소자 패키지 |
US20160064630A1 (en) * | 2014-08-26 | 2016-03-03 | Texas Instruments Incorporated | Flip chip led package |
KR102275147B1 (ko) | 2014-09-12 | 2021-07-09 | 대주전자재료 주식회사 | 산질화물계 형광체 및 이를 이용한 발광 장치 |
US9528876B2 (en) | 2014-09-29 | 2016-12-27 | Innovative Science Tools, Inc. | Solid state broad band near-infrared light source |
RU2684998C2 (ru) * | 2014-09-30 | 2019-04-16 | ФОРД ГЛОУБАЛ ТЕКНОЛОДЖИЗ, ЭлЭлСи | Устройство подсветки и система освещения для транспортного средства (варианты) |
CN105567236B (zh) * | 2014-10-15 | 2018-07-20 | 有研稀土新材料股份有限公司 | 石榴石型荧光粉和制备方法及包含该荧光粉的装置 |
EP3224874B1 (de) | 2014-11-26 | 2019-04-24 | LedEngin, Inc. | Kompakter emitter für eine wärmedimmbare und farbeinstellbare lampe |
US9701411B2 (en) * | 2014-12-10 | 2017-07-11 | Airbus Operations Gmbh | Evacuation slide with a guidance marking |
JP6486099B2 (ja) * | 2014-12-19 | 2019-03-20 | シチズン電子株式会社 | Led発光モジュール |
JP6514510B2 (ja) * | 2015-01-14 | 2019-05-15 | 株式会社小糸製作所 | 車両用灯具 |
US9530944B2 (en) | 2015-01-27 | 2016-12-27 | Cree, Inc. | High color-saturation lighting devices with enhanced long wavelength illumination |
US9702524B2 (en) | 2015-01-27 | 2017-07-11 | Cree, Inc. | High color-saturation lighting devices |
US10274616B2 (en) | 2015-02-26 | 2019-04-30 | Saint-Gobain Cristaux & Detecteurs | Scintillation crystal including a co-doped rare earth silicate, a radiation detection apparatus including the scintillation crystal, and a process of forming the same |
US9530943B2 (en) | 2015-02-27 | 2016-12-27 | Ledengin, Inc. | LED emitter packages with high CRI |
US9681510B2 (en) | 2015-03-26 | 2017-06-13 | Cree, Inc. | Lighting device with operation responsive to geospatial position |
EP4273944A3 (de) * | 2015-04-02 | 2024-02-07 | Nichia Corporation | Lichtemittierende vorrichtung und verfahren zur seiner herstellung |
US9509217B2 (en) | 2015-04-20 | 2016-11-29 | Altera Corporation | Asymmetric power flow controller for a power converter and method of operating the same |
US9974138B2 (en) | 2015-04-21 | 2018-05-15 | GE Lighting Solutions, LLC | Multi-channel lamp system and method with mixed spectrum |
US9943042B2 (en) | 2015-05-18 | 2018-04-17 | Biological Innovation & Optimization Systems, LLC | Grow light embodying power delivery and data communications features |
US10161568B2 (en) | 2015-06-01 | 2018-12-25 | Ilumisys, Inc. | LED-based light with canted outer walls |
US9900957B2 (en) | 2015-06-11 | 2018-02-20 | Cree, Inc. | Lighting device including solid state emitters with adjustable control |
WO2016199406A1 (ja) | 2015-06-12 | 2016-12-15 | 株式会社 東芝 | 蛍光体およびその製造方法、ならびにledランプ |
JP6544082B2 (ja) * | 2015-06-30 | 2019-07-17 | 日亜化学工業株式会社 | 発光装置 |
CN106328008B (zh) * | 2015-06-30 | 2019-03-22 | 光宝光电(常州)有限公司 | 胶体填充至壳体的制法、发光二极管的数字显示器及制法 |
DE112016003272T5 (de) * | 2015-07-22 | 2018-04-05 | Panasonic Intellectual Property Management Co., Ltd. | Granatverbindung und Verfahren zu deren Herstellung, lichtemittierende Vorrichtung und Dekorgegenstand, bei denen die Granatverbindung verwendet wird, und Verfahren zur Verwendung der Granatverbindung |
CN106501994B (zh) * | 2015-09-08 | 2021-10-29 | 青岛海信电器股份有限公司 | 一种量子点发光器件、背光模组及显示装置 |
US9844116B2 (en) | 2015-09-15 | 2017-12-12 | Biological Innovation & Optimization Systems, LLC | Systems and methods for controlling the spectral content of LED lighting devices |
US9788387B2 (en) | 2015-09-15 | 2017-10-10 | Biological Innovation & Optimization Systems, LLC | Systems and methods for controlling the spectral content of LED lighting devices |
EP3875839A1 (de) | 2015-09-29 | 2021-09-08 | Cabatech, LLC | Leuchten für gartenbau |
JP2017107071A (ja) | 2015-12-10 | 2017-06-15 | 日本電気硝子株式会社 | 波長変換部材及び波長変換素子、並びにそれらを用いた発光装置 |
JP6681581B2 (ja) * | 2015-12-21 | 2020-04-15 | パナソニックIpマネジメント株式会社 | 発光装置、及び、照明装置 |
US10354938B2 (en) | 2016-01-12 | 2019-07-16 | Greentech LED | Lighting device using short thermal path cooling technology and other device cooling by placing selected openings on heat sinks |
US11021610B2 (en) | 2016-01-14 | 2021-06-01 | Basf Se | Perylene bisimides with rigid 2,2′-biphenoxy bridges |
US11050005B2 (en) | 2016-03-08 | 2021-06-29 | Panasonic Intellectual Property Management Co., Ltd. | Phosphor and light emitting device |
JP7030057B2 (ja) * | 2016-03-10 | 2022-03-04 | ルミレッズ ホールディング ベーフェー | Ledモジュール |
US10355175B2 (en) | 2016-03-10 | 2019-07-16 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting device |
US10054485B2 (en) | 2016-03-17 | 2018-08-21 | Raytheon Company | UV LED-phosphor based hyperspectral calibrator |
CN109155347B (zh) | 2016-05-20 | 2021-05-07 | 株式会社东芝 | 白色光源 |
JP2018003006A (ja) | 2016-06-24 | 2018-01-11 | パナソニック株式会社 | 蛍光体およびその製造方法、ならびに発光装置 |
JP6906277B2 (ja) | 2016-06-27 | 2021-07-21 | 日本電気硝子株式会社 | 波長変換部材及びそれを用いてなる発光デバイス |
JP6880528B2 (ja) | 2016-06-27 | 2021-06-02 | 日本電気硝子株式会社 | 波長変換部材及びそれを用いてなる発光デバイス |
WO2018042949A1 (ja) | 2016-08-29 | 2018-03-08 | パナソニックIpマネジメント株式会社 | 蛍光体及び発光装置 |
US10595376B2 (en) | 2016-09-13 | 2020-03-17 | Biological Innovation & Optimization Systems, LLC | Systems and methods for controlling the spectral content of LED lighting devices |
EP3513401A4 (de) * | 2016-09-14 | 2020-05-27 | Lutron Ketra, LLC | Beleuchtungsvorrichtung und verfahren zur einstellung periodischer änderungen der emulationsleistung |
JP2018058383A (ja) * | 2016-09-30 | 2018-04-12 | トヨタ自動車株式会社 | 車両下部構造 |
CN109803969B (zh) | 2016-10-06 | 2022-08-05 | 巴斯夫欧洲公司 | 2-苯基苯氧基取代的苝双酰亚胺化合物及其用途 |
US10219345B2 (en) | 2016-11-10 | 2019-02-26 | Ledengin, Inc. | Tunable LED emitter with continuous spectrum |
KR101961030B1 (ko) * | 2016-11-18 | 2019-03-22 | 효성화학 주식회사 | 휘도 향상 필름과 그 제조방법 |
EP3545043A1 (de) | 2016-11-28 | 2019-10-02 | Merck Patent GmbH | Zusammensetzung mit einem nanoskaligen lichtemittierenden material |
US10800967B2 (en) | 2016-12-07 | 2020-10-13 | Konoshima Chemical Co., Ltd. | Ceramic composition |
TW201828505A (zh) * | 2017-01-20 | 2018-08-01 | 聯京光電股份有限公司 | 光電封裝體及其製造方法 |
US10465869B2 (en) | 2017-01-30 | 2019-11-05 | Ideal Industries Lighting Llc | Skylight fixture |
US10451229B2 (en) | 2017-01-30 | 2019-10-22 | Ideal Industries Lighting Llc | Skylight fixture |
US10174438B2 (en) | 2017-03-30 | 2019-01-08 | Slt Technologies, Inc. | Apparatus for high pressure reaction |
DE102017108136B4 (de) | 2017-04-13 | 2019-03-14 | X-Fab Semiconductor Foundries Ag | Geometrisch geformte Bauelemente in einer Anordnung für einen Überführungsdruck (Transfer Print) und zugehörige Verfahren |
JP6917179B2 (ja) * | 2017-04-18 | 2021-08-11 | スタンレー電気株式会社 | 白色発光装置 |
CN108805169B (zh) * | 2017-05-04 | 2021-06-01 | 宏达国际电子股份有限公司 | 影像处理方法、非暂态电脑可读取媒体以及影像处理系统 |
JP6863071B2 (ja) * | 2017-05-19 | 2021-04-21 | 日亜化学工業株式会社 | 希土類アルミニウム・ガリウム酸塩の組成を有する蛍光体及び発光装置 |
DE102017116936A1 (de) * | 2017-07-26 | 2019-01-31 | Ledvance Gmbh | Verbindung eines elektrischen Leitelements mit einer Leiterplatte eines Leuchtmittels |
US11079077B2 (en) | 2017-08-31 | 2021-08-03 | Lynk Labs, Inc. | LED lighting system and installation methods |
CN111149432B (zh) * | 2017-09-20 | 2023-05-12 | 美题隆精密光学(上海)有限公司 | 具有无机粘结剂的荧光轮 |
JP7022367B2 (ja) | 2017-09-27 | 2022-02-18 | 日本電気硝子株式会社 | 波長変換材料に用いられるガラス、波長変換材料、波長変換部材及び発光デバイス |
JP7002275B2 (ja) * | 2017-10-03 | 2022-02-21 | 株式会社小糸製作所 | 車両用灯具 |
KR102428755B1 (ko) * | 2017-11-24 | 2022-08-02 | 엘지디스플레이 주식회사 | 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛 |
JP7268315B2 (ja) | 2017-12-12 | 2023-05-08 | 日本電気硝子株式会社 | 波長変換部材及びその製造方法、並びに発光装置 |
KR20200100702A (ko) | 2017-12-19 | 2020-08-26 | 바스프 에스이 | 시아노아릴 치환된 벤즈(오티)오크산텐 화합물 |
CN108264234A (zh) * | 2018-01-11 | 2018-07-10 | 武汉理工大学 | 一种嵌有GYAGG:Ce微晶相的闪烁微晶玻璃及其制备方法 |
US20190219874A1 (en) * | 2018-01-16 | 2019-07-18 | Huizhou China Star Optoelectronics Technology Co., Ltd. | Backlight module and display device |
US11072555B2 (en) | 2018-03-02 | 2021-07-27 | Coorstek Kk | Glass member |
US10575374B2 (en) | 2018-03-09 | 2020-02-25 | Ledengin, Inc. | Package for flip-chip LEDs with close spacing of LED chips |
WO2019179981A1 (en) | 2018-03-20 | 2019-09-26 | Basf Se | Yellow light emitting device |
US20210118855A1 (en) * | 2018-05-17 | 2021-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
EP3588187A1 (de) | 2018-06-22 | 2020-01-01 | Sunland Optics Srl | Ein bild-projektions-system |
IT201900009681A1 (it) | 2019-06-20 | 2020-12-20 | Tlpicoglass Srl | Sistema di proiezione di immagini |
WO2020012923A1 (ja) | 2018-07-12 | 2020-01-16 | パナソニックIpマネジメント株式会社 | 光源装置、プロジェクタ及び車両 |
JP6975863B2 (ja) * | 2018-08-07 | 2021-12-01 | 三井金属鉱業株式会社 | 光拡散部材、並びにこれを用いた光拡散構造体及び発光構造体 |
DE102018213377A1 (de) * | 2018-08-09 | 2020-02-13 | Robert Bosch Gmbh | Spektrometer und Verfahren zur Kalibrierung des Spektrometers |
DE112019004568T5 (de) | 2018-09-12 | 2021-05-27 | Panasonic Intellectual Property Management Co., Ltd. | Wellenlängenumwandlungselement, lichtquellenvorrichtung, bei der dieses verwendet wird, projektor und fahrzeug |
DE102018217889B4 (de) | 2018-10-18 | 2023-09-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Gelber Leuchtstoff und Konversions-LED |
RU192820U1 (ru) * | 2018-11-13 | 2019-10-02 | Василий Сергеевич Евтеев | Свето-информационное устройство |
MX2021005768A (es) * | 2018-11-15 | 2021-10-13 | Dean Levin | Dispositivo de decantación de fluidos con emisión de luz y método de ratamiento de un fluido con luz. |
CN111286330A (zh) | 2018-12-06 | 2020-06-16 | 松下知识产权经营株式会社 | 荧光体及使用了它的半导体发光装置 |
US11421843B2 (en) | 2018-12-21 | 2022-08-23 | Kyocera Sld Laser, Inc. | Fiber-delivered laser-induced dynamic light system |
US11239637B2 (en) | 2018-12-21 | 2022-02-01 | Kyocera Sld Laser, Inc. | Fiber delivered laser induced white light system |
JP2020106831A (ja) | 2018-12-27 | 2020-07-09 | 日本電気硝子株式会社 | 波長変換部材及び発光装置 |
US11466384B2 (en) | 2019-01-08 | 2022-10-11 | Slt Technologies, Inc. | Method of forming a high quality group-III metal nitride boule or wafer using a patterned substrate |
US11884202B2 (en) | 2019-01-18 | 2024-01-30 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system |
JP7145096B2 (ja) | 2019-02-12 | 2022-09-30 | 信越化学工業株式会社 | 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法 |
CN113544236A (zh) | 2019-04-18 | 2021-10-22 | 日本电气硝子株式会社 | 波长转换部件及其制造方法、以及发光装置 |
JPWO2020213456A1 (de) | 2019-04-18 | 2020-10-22 | ||
US11313671B2 (en) | 2019-05-28 | 2022-04-26 | Mitutoyo Corporation | Chromatic confocal range sensing system with enhanced spectrum light source configuration |
RU2720046C1 (ru) * | 2019-07-17 | 2020-04-23 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" | Светодиодная гетероструктура с квантовыми ямами комбинированного профиля |
KR102230355B1 (ko) | 2019-09-27 | 2021-03-22 | 강원대학교산학협력단 | 백색 발광 소재의 제조방법 |
RU195810U1 (ru) * | 2019-09-27 | 2020-02-05 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" (ТУСУР) | Светоизлучающий диод |
US11561338B2 (en) | 2019-09-30 | 2023-01-24 | Nichia Corporation | Light-emitting module |
US11112555B2 (en) | 2019-09-30 | 2021-09-07 | Nichia Corporation | Light-emitting module with a plurality of light guide plates and a gap therein |
JP2021059686A (ja) | 2019-10-09 | 2021-04-15 | パナソニックIpマネジメント株式会社 | 蛍光体およびそれを使用した半導体発光装置 |
US11721549B2 (en) | 2020-02-11 | 2023-08-08 | Slt Technologies, Inc. | Large area group III nitride crystals and substrates, methods of making, and methods of use |
EP4104201A1 (de) | 2020-02-11 | 2022-12-21 | SLT Technologies, Inc. | Verbessertes gruppe-iii-nitrid-substrat, verfahren zu seiner herstellung und verwendungsverfahren |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
CN111944350B (zh) * | 2020-08-27 | 2022-01-25 | 兰州大学 | 基于YAG Ce的暖白色荧光汽车涂漆及其制备方法 |
JP2023539329A (ja) * | 2020-09-01 | 2023-09-13 | ゼネラル・エレクトリック・カンパニイ | 暗視機器に適合するデバイス |
US11444225B2 (en) | 2020-09-08 | 2022-09-13 | Dominant Opto Technologies Sdn Bhd | Light emitting diode package having a protective coating |
US11329206B2 (en) | 2020-09-28 | 2022-05-10 | Dominant Opto Technologies Sdn Bhd | Lead frame and housing sub-assembly for use in a light emitting diode package and method for manufacturing the same |
KR20230104135A (ko) | 2020-11-19 | 2023-07-07 | 니폰 덴키 가라스 가부시키가이샤 | 파장 변환 부재 및 그 제조 방법 |
US20240060624A1 (en) | 2021-01-26 | 2024-02-22 | Solutia Inc. | Light systems having a diffusive pvb interlayer |
JP2022158107A (ja) | 2021-04-01 | 2022-10-17 | 日本電気硝子株式会社 | 波長変換部材及び発光デバイス |
CN117716521A (zh) | 2021-07-29 | 2024-03-15 | 松下知识产权经营株式会社 | 发光装置及电子设备 |
Family Cites Families (258)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US215074A (en) * | 1879-05-06 | Improvement in stamp-mills | ||
US362048A (en) * | 1887-04-26 | watkins | ||
US5816677A (en) | 1905-03-01 | 1998-10-06 | Canon Kabushiki Kaisha | Backlight device for display apparatus |
US2557049A (en) * | 1946-05-03 | 1951-06-12 | Turner Of Indiana | Power-driven posthole digger |
US2924732A (en) * | 1957-07-05 | 1960-02-09 | Westinghouse Electric Corp | Area-type light source |
BE624851A (de) | 1961-05-08 | |||
NL135101C (de) | 1964-05-14 | |||
GB1112992A (en) * | 1964-08-18 | 1968-05-08 | Texas Instruments Inc | Three-dimensional integrated circuits and methods of making same |
US3342308A (en) * | 1966-08-09 | 1967-09-19 | Sperry Rand Corp | Corn processing machine elevator unit structure |
US3560649A (en) | 1967-05-23 | 1971-02-02 | Tektronix Inc | Cathode ray tube with projection means |
US3560849A (en) | 1967-08-15 | 1971-02-02 | Aai Corp | Liquid temperature controlled test chamber and transport apparatus for electrical circuit assemblies |
US3554776A (en) * | 1967-11-24 | 1971-01-12 | Allied Chem | Novel perylenetetracarboxylic diimide compositions |
US3623857A (en) * | 1968-03-22 | 1971-11-30 | Johns Manville | Glass melting pot |
US3510732A (en) * | 1968-04-22 | 1970-05-05 | Gen Electric | Solid state lamp having a lens with rhodamine or fluorescent material dispersed therein |
SE364160B (de) * | 1969-05-26 | 1974-02-11 | Western Electric Co | |
US3699478A (en) * | 1969-05-26 | 1972-10-17 | Bell Telephone Labor Inc | Display system |
BE757125A (fr) | 1969-10-06 | 1971-03-16 | Rca Corp | Procede photographique pour former l'ecran luminescent d'un tube a rayons cathodiques |
US3691482A (en) * | 1970-01-19 | 1972-09-12 | Bell Telephone Labor Inc | Display system |
US3652956A (en) * | 1970-01-23 | 1972-03-28 | Bell Telephone Labor Inc | Color visual display |
US3699476A (en) * | 1971-03-05 | 1972-10-17 | Rca Corp | Crystal controlled digital logic gate oscillator |
JPS4717684U (de) | 1971-03-27 | 1972-10-30 | ||
JPS4839866U (de) | 1971-09-13 | 1973-05-18 | ||
DE2244397C3 (de) | 1971-09-21 | 1974-07-18 | Tovarna Motornih Vozil Tomos, Koper (Jugoslawien) | Schalteinrichtung für ein mehrstufiges Keilriemenwechselgetriebe |
JPS48102585A (de) * | 1972-04-04 | 1973-12-22 | ||
JPS491221A (de) | 1972-04-17 | 1974-01-08 | ||
JPS5240959B2 (de) | 1972-08-07 | 1977-10-15 | ||
JPS4979379A (de) | 1972-12-06 | 1974-07-31 | ||
JPS4985068U (de) * | 1972-11-10 | 1974-07-23 | ||
FR2248663B1 (de) | 1972-12-13 | 1978-08-11 | Radiotechnique Compelec | |
JPS5531825Y2 (de) | 1972-12-27 | 1980-07-29 | ||
JPS49106283A (de) | 1973-02-09 | 1974-10-08 | ||
JPS49112577A (de) | 1973-02-23 | 1974-10-26 | ||
US3819974A (en) * | 1973-03-12 | 1974-06-25 | D Stevenson | Gallium nitride metal-semiconductor junction light emitting diode |
JPS5640994B2 (de) | 1973-03-22 | 1981-09-25 | ||
US3842306A (en) | 1973-06-21 | 1974-10-15 | Gen Electric | Alumina coatings for an electric lamp |
JPS5043913A (de) * | 1973-08-20 | 1975-04-21 | ||
JPS5079379A (de) | 1973-11-13 | 1975-06-27 | ||
JPS5079379U (de) * | 1973-11-24 | 1975-07-09 | ||
US3882502A (en) | 1974-01-17 | 1975-05-06 | Us Navy | Crt multiple-scan display apparatus and method providing target discrimination |
JPS5713156B2 (de) * | 1974-02-28 | 1982-03-15 | ||
US4123161A (en) * | 1974-06-18 | 1978-10-31 | Pappas George J | Apparatus for and method of examining light |
JPS5240959A (en) | 1975-09-29 | 1977-03-30 | Toshiba Corp | Color picture tube |
JPS5245181A (en) | 1975-10-07 | 1977-04-09 | Matsushita Electric Works Ltd | Chain |
US4001628A (en) | 1976-02-25 | 1977-01-04 | Westinghouse Electric Corporation | Low-pressure fluorescent discharge device which utilizes both inorganic and organic phosphors |
US4143297A (en) * | 1976-03-08 | 1979-03-06 | Brown, Boveri & Cie Aktiengesellschaft | Information display panel with zinc sulfide powder electroluminescent layers |
JPS537153U (de) | 1976-07-05 | 1978-01-21 | ||
JPS537153A (en) | 1976-07-09 | 1978-01-23 | Fujitsu Ltd | Program loop detection-recording system |
GB1589964A (en) | 1976-09-03 | 1981-05-20 | Johnson Matthey Co Ltd | Luminescent materials |
NL7707008A (nl) * | 1977-06-24 | 1978-12-28 | Philips Nv | Luminescentiescherm. |
JPS5441660A (en) | 1977-09-09 | 1979-04-03 | Matsushita Electric Works Ltd | Timer |
JPS5332545Y2 (de) | 1977-09-13 | 1978-08-11 | ||
FR2407588A1 (fr) | 1977-10-28 | 1979-05-25 | Cit Alcatel | Procede de realisation de barres d'alimentation |
NL7806828A (nl) * | 1978-06-26 | 1979-12-28 | Philips Nv | Luminescentiescherm. |
JPS555533U (de) * | 1978-06-26 | 1980-01-14 | ||
JPS583420B2 (ja) | 1978-06-27 | 1983-01-21 | 株式会社リコー | マトリクス駆動回路 |
JPS556687A (en) * | 1978-06-29 | 1980-01-18 | Handotai Kenkyu Shinkokai | Traffic use display |
US4271408A (en) * | 1978-10-17 | 1981-06-02 | Stanley Electric Co., Ltd. | Colored-light emitting display |
DE3117571A1 (de) * | 1981-05-04 | 1982-11-18 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Lumineszenz-halbleiterbauelement |
CA1192919A (en) | 1981-12-21 | 1985-09-03 | Bernard J. Finn | Vehicle wheel suspension |
JPS5930107U (ja) | 1982-08-19 | 1984-02-24 | スタンレー電気株式会社 | カラ−フイルタ−付導光板 |
NL8203543A (nl) | 1982-09-13 | 1984-04-02 | Oce Nederland Bv | Kopieerapparaat. |
JPS5950445A (ja) | 1982-09-16 | 1984-03-23 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 電子写真材料 |
JPS5950455U (ja) * | 1982-09-24 | 1984-04-03 | 三洋電機株式会社 | 発光ダイオ−ド装置 |
JPS5967673A (ja) * | 1982-10-12 | 1984-04-17 | Toyo Commun Equip Co Ltd | 面照明用発光ダイオ−ド |
NL8205044A (nl) * | 1982-12-30 | 1984-07-16 | Philips Nv | Lagedrukkwikdampontladingslamp. |
JPS6073580A (ja) * | 1983-09-29 | 1985-04-25 | 東芝ライテック株式会社 | 表示装置 |
JPS6081878A (ja) | 1983-10-11 | 1985-05-09 | Shinyoushiya:Kk | 複合形発光ダイオ−ドの発光光色制御方法 |
US4550256A (en) | 1983-10-17 | 1985-10-29 | At&T Bell Laboratories | Visual display system utilizing high luminosity single crystal garnet material |
JPS60185457A (ja) | 1984-03-05 | 1985-09-20 | Canon Inc | フアクシミリ装置 |
US4857228A (en) * | 1984-04-24 | 1989-08-15 | Sunstone Inc. | Phosphors and methods of preparing the same |
JPS60185457U (ja) * | 1984-05-19 | 1985-12-09 | セイレイ工業株式会社 | 枝打機のエンジンストツプセンサ−配置構造 |
JPS61158606A (ja) | 1984-12-28 | 1986-07-18 | 株式会社小糸製作所 | 照明装置 |
NL8502025A (nl) * | 1985-07-15 | 1987-02-02 | Philips Nv | Lagedrukkwikdampontladingslamp. |
JPS6220237U (de) * | 1985-07-23 | 1987-02-06 | ||
JPS62109185U (de) * | 1985-12-27 | 1987-07-11 | ||
NL8600023A (nl) * | 1986-01-08 | 1987-08-03 | Philips Nv | Lagedrukkwikdampontladingslamp. |
JPS62167398A (ja) | 1986-01-17 | 1987-07-23 | 花王株式会社 | 高密度粒状洗剤組成物 |
JPS62189770A (ja) | 1986-02-15 | 1987-08-19 | Fumio Inaba | 接合型半導体発光素子 |
JPS62232827A (ja) | 1986-03-31 | 1987-10-13 | 松下電器産業株式会社 | 照光素子付操作パネル駆動回路 |
DE3856230T2 (de) | 1987-04-20 | 1998-12-10 | Fuji Photo Film Co Ltd | Kassette, Vorrichtung und Wischverfahren für ein stimulierbares Phosphorblatt |
JPH079998B2 (ja) * | 1988-01-07 | 1995-02-01 | 科学技術庁無機材質研究所長 | 立方晶窒化ほう素のP−n接合型発光素子 |
JPS63291980A (ja) | 1987-05-25 | 1988-11-29 | Canon Inc | 強誘電性液晶素子 |
JPS63299186A (ja) * | 1987-05-29 | 1988-12-06 | Hitachi Ltd | 発光素子 |
US4929965A (en) * | 1987-09-02 | 1990-05-29 | Alps Electric Co. | Optical writing head |
JPH01189695A (ja) * | 1988-01-25 | 1989-07-28 | Yokogawa Electric Corp | Led表示装置 |
DE3804293A1 (de) * | 1988-02-12 | 1989-08-24 | Philips Patentverwaltung | Anordnung mit einer elektrolumineszenz- oder laserdiode |
JP2594609B2 (ja) | 1988-04-08 | 1997-03-26 | 富士通株式会社 | 表示パネルのバック照明構造 |
JPH01260707A (ja) | 1988-04-11 | 1989-10-18 | Idec Izumi Corp | 白色発光装置 |
JPH0218973A (ja) * | 1988-07-07 | 1990-01-23 | Shibasoku Co Ltd | 発光ダイオード試験装置 |
US5043716A (en) * | 1988-07-14 | 1991-08-27 | Adaptive Micro Systems, Inc. | Electronic display with lens matrix |
JPH0291980A (ja) | 1988-09-29 | 1990-03-30 | Toshiba Lighting & Technol Corp | 固体発光素子 |
JP2770350B2 (ja) | 1988-10-20 | 1998-07-02 | 富士通株式会社 | 液晶表示装置 |
US5034965A (en) | 1988-11-11 | 1991-07-23 | Matsushita Electric Industrial Co., Ltd. | Efficient coding method and its decoding method |
JPH02202073A (ja) * | 1989-01-31 | 1990-08-10 | Hitachi Chem Co Ltd | 電子部品 |
JP2704181B2 (ja) * | 1989-02-13 | 1998-01-26 | 日本電信電話株式会社 | 化合物半導体単結晶薄膜の成長方法 |
JPH02271304A (ja) * | 1989-04-12 | 1990-11-06 | Seiko Epson Corp | 表示体用照明装置 |
US4992704A (en) * | 1989-04-17 | 1991-02-12 | Basic Electronics, Inc. | Variable color light emitting diode |
JPH0324692A (ja) | 1989-06-21 | 1991-02-01 | Fuji Electric Co Ltd | 自動貸出機の制御装置 |
JPH0324692U (de) | 1989-07-18 | 1991-03-14 | ||
US5221984A (en) | 1989-09-18 | 1993-06-22 | Kabushiki Kaisha Toshiba | Optical data transmission device with parallel channel paths for arrayed optical elements |
JPH03152898A (ja) | 1989-11-09 | 1991-06-28 | Hitachi Maxell Ltd | 分散型el素子 |
US5118985A (en) * | 1989-12-29 | 1992-06-02 | Gte Products Corporation | Fluorescent incandescent lamp |
JP2995664B2 (ja) * | 1990-05-17 | 1999-12-27 | 小糸工業株式会社 | 情報表示装置 |
NL9001193A (nl) * | 1990-05-23 | 1991-12-16 | Koninkl Philips Electronics Nv | Straling-emitterende halfgeleiderinrichting en werkwijze ter vervaardiging van een dergelijke halfgeleiderinrichting. |
US5368673A (en) | 1990-06-28 | 1994-11-29 | Daihen Corporation | Joining method for joining electrically ceramic bodies and a joining apparatus and joining agent for use in the joining method |
JP2506223B2 (ja) | 1990-06-28 | 1996-06-12 | トリニティ工業株式会社 | 自動塗装装置 |
JPH0463162A (ja) | 1990-06-29 | 1992-02-28 | Suzuki Motor Corp | 塗装装置 |
US5257049A (en) | 1990-07-03 | 1993-10-26 | Agfa-Gevaert N.V. | LED exposure head with overlapping electric circuits |
JPH0480286A (ja) | 1990-07-23 | 1992-03-13 | Matsushita Electron Corp | 蛍光高圧水銀灯 |
JP2924125B2 (ja) | 1990-07-30 | 1999-07-26 | 東レ株式会社 | 不織布用ポリエステル繊維 |
DE9013615U1 (de) * | 1990-09-28 | 1990-12-06 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De | |
JPH0463162U (de) * | 1990-10-02 | 1992-05-29 | ||
JPH0463163U (de) | 1990-10-04 | 1992-05-29 | ||
KR940002570B1 (ko) * | 1990-11-02 | 1994-03-25 | 삼성전관 주식회사 | 백색발광 형광체 |
JPH04175265A (ja) * | 1990-11-07 | 1992-06-23 | Sumitomo Electric Ind Ltd | 着色透光性yag焼結体及びその製造方法 |
JP2593960B2 (ja) * | 1990-11-29 | 1997-03-26 | シャープ株式会社 | 化合物半導体発光素子とその製造方法 |
JP3160914B2 (ja) | 1990-12-26 | 2001-04-25 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体レーザダイオード |
JPH04234481A (ja) * | 1990-12-28 | 1992-08-24 | Matsushita Electron Corp | 蛍光高圧水銀灯 |
FR2677139B1 (fr) * | 1991-05-31 | 1994-03-18 | Hughes Aircraft Cy | Substance luminescence emettant dans le rouge lointain, pour tubes cathodiques. |
US5202777A (en) * | 1991-05-31 | 1993-04-13 | Hughes Aircraft Company | Liquid crystal light value in combination with cathode ray tube containing a far-red emitting phosphor |
JPH0543913A (ja) | 1991-08-08 | 1993-02-23 | Mitsubishi Materials Corp | 相手攻撃性のきわめて低いFe基焼結合金製バルブシ−ト |
JPH0563068A (ja) | 1991-08-30 | 1993-03-12 | Shin Etsu Handotai Co Ltd | ウエーハバスケツト |
JPH0579379A (ja) | 1991-09-19 | 1993-03-30 | Hitachi Ltd | 制御方法 |
JP2666228B2 (ja) * | 1991-10-30 | 1997-10-22 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
US5306662A (en) * | 1991-11-08 | 1994-04-26 | Nichia Chemical Industries, Ltd. | Method of manufacturing P-type compound semiconductor |
JP2540791B2 (ja) | 1991-11-08 | 1996-10-09 | 日亜化学工業株式会社 | p型窒化ガリウム系化合物半導体の製造方法。 |
JPH05152609A (ja) * | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | 発光ダイオード |
JPH05142424A (ja) | 1991-11-26 | 1993-06-11 | Nec Kansai Ltd | 平面発光板 |
US5208462A (en) | 1991-12-19 | 1993-05-04 | Allied-Signal Inc. | Wide bandwidth solid state optical source |
DE69218387T2 (de) * | 1992-01-07 | 1997-09-18 | Philips Electronics Nv | Niederdruckquecksilberentladungslampe |
JPH0560368U (ja) * | 1992-01-27 | 1993-08-10 | 恵助 山下 | 箸 |
JPH0563068U (ja) | 1992-01-31 | 1993-08-20 | シャープ株式会社 | 樹脂封止型発光体 |
JPH05226676A (ja) | 1992-02-14 | 1993-09-03 | Sharp Corp | 半導体装置 |
JP3047600B2 (ja) | 1992-03-04 | 2000-05-29 | 株式会社イナックス | 濾過装置付き気泡浴槽装置の制御方法 |
JPH0613659A (ja) * | 1992-04-30 | 1994-01-21 | Takiron Co Ltd | 発光ダイオードの輝度調整装置 |
JPH05331584A (ja) | 1992-06-02 | 1993-12-14 | Toyota Motor Corp | 高弾性・高強度アルミニウム合金 |
JP3365787B2 (ja) * | 1992-06-18 | 2003-01-14 | シャープ株式会社 | Ledチップ実装部品 |
JP2917742B2 (ja) | 1992-07-07 | 1999-07-12 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子とその製造方法 |
JPH0629576A (ja) * | 1992-07-09 | 1994-02-04 | Sharp Corp | 発光表示素子 |
JPH0627327A (ja) | 1992-07-13 | 1994-02-04 | Seiko Epson Corp | 照明装置 |
EP1313153A3 (de) | 1992-07-23 | 2005-05-04 | Toyoda Gosei Co., Ltd. | Lichtemittierende Vorrichtung aus einer Verbindung der Galliumnitridgruppe |
WO1994003931A1 (fr) * | 1992-08-07 | 1994-02-17 | Asahi Kasei Kogyo Kabushiki Kaisha | Dispositif semi-conducteur a base de nitrure et fabrication |
JPH0669546A (ja) * | 1992-08-21 | 1994-03-11 | Asahi Chem Ind Co Ltd | 発光ダイオード |
US5334855A (en) * | 1992-08-24 | 1994-08-02 | Motorola, Inc. | Diamond/phosphor polycrystalline led and display |
JPH0682633A (ja) | 1992-09-03 | 1994-03-25 | Chuo Musen Kk | 面光源 |
JP2842739B2 (ja) * | 1992-09-14 | 1999-01-06 | 富士通株式会社 | 面光源ユニット及び液晶表示装置 |
DE69322607T2 (de) * | 1992-09-23 | 1999-06-17 | Koninkl Philips Electronics Nv | Quecksilberniederdruckentladungslampe |
JPH06139973A (ja) | 1992-10-26 | 1994-05-20 | Matsushita Electric Ind Co Ltd | 平板型画像表示装置 |
JP3284208B2 (ja) | 1992-11-17 | 2002-05-20 | 東ソー株式会社 | バックライト |
JP2560963B2 (ja) | 1993-03-05 | 1996-12-04 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子 |
US5578839A (en) * | 1992-11-20 | 1996-11-26 | Nichia Chemical Industries, Ltd. | Light-emitting gallium nitride-based compound semiconductor device |
US5317348A (en) * | 1992-12-01 | 1994-05-31 | Knize Randall J | Full color solid state laser projector system |
JP2711205B2 (ja) | 1993-01-20 | 1998-02-10 | 鐘紡株式会社 | 複合発泡ポリエステルシート |
JP3467788B2 (ja) | 1993-02-09 | 2003-11-17 | 東ソー株式会社 | バックライト |
JP2932467B2 (ja) | 1993-03-12 | 1999-08-09 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子 |
JPH07321407A (ja) | 1993-04-05 | 1995-12-08 | Fuji Electric Co Ltd | 樹脂封止形レーザーダイオード装置 |
JPH06296043A (ja) * | 1993-04-08 | 1994-10-21 | Matsushita Electric Ind Co Ltd | 発光ダイオード |
JPH06314826A (ja) * | 1993-04-28 | 1994-11-08 | Victor Co Of Japan Ltd | 発光ダイオードアレイ |
JPH0742152A (ja) | 1993-07-29 | 1995-02-10 | Hitachi Constr Mach Co Ltd | パイルハンマ |
US5514179A (en) * | 1993-08-10 | 1996-05-07 | Brennan; H. George | Modular facial implant system |
JP2584562Y2 (ja) | 1993-09-01 | 1998-11-05 | ダイハツ工業株式会社 | ラックアンドピニオン式ステアリングのラックガイド |
JPH0799345A (ja) | 1993-09-28 | 1995-04-11 | Nichia Chem Ind Ltd | 発光ダイオード |
JPH07114904A (ja) | 1993-10-18 | 1995-05-02 | Hitachi Ltd | バックライト光源用蛍光放電灯 |
JPH07120754A (ja) * | 1993-10-26 | 1995-05-12 | Fujikura Ltd | 照光モジュール |
JPH0732638U (ja) | 1993-11-15 | 1995-06-16 | ミネベア株式会社 | 面状光源装置 |
JPH07176794A (ja) * | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | 面状光源 |
JP3190774B2 (ja) * | 1993-12-24 | 2001-07-23 | 株式会社東芝 | Ledランプ用リードフレーム及びled表示装置 |
JP2606025Y2 (ja) * | 1993-12-24 | 2000-09-11 | 日亜化学工業株式会社 | 発光ダイオード素子 |
JPH07193281A (ja) | 1993-12-27 | 1995-07-28 | Mitsubishi Materials Corp | 指向性の少ない赤外可視変換発光ダイオード |
US6784511B1 (en) * | 1994-01-20 | 2004-08-31 | Fuji Electric Co., Ltd. | Resin-sealed laser diode device |
US5505986A (en) | 1994-02-14 | 1996-04-09 | Planar Systems, Inc. | Multi-source reactive deposition process for the preparation of blue light emitting phosphor layers for AC TFEL devices |
JPH07225378A (ja) * | 1994-02-15 | 1995-08-22 | Asahi Optical Co Ltd | Lcd照明装置 |
JPH07235207A (ja) | 1994-02-21 | 1995-09-05 | Copal Co Ltd | バックライト |
JPH07248495A (ja) | 1994-03-14 | 1995-09-26 | Hitachi Ltd | 液晶表示装置 |
JPH07253594A (ja) * | 1994-03-15 | 1995-10-03 | Fujitsu Ltd | 表示装置 |
JPH07263748A (ja) | 1994-03-22 | 1995-10-13 | Toyoda Gosei Co Ltd | 3族窒化物半導体発光素子及びその製造方法 |
US5640216A (en) * | 1994-04-13 | 1997-06-17 | Hitachi, Ltd. | Liquid crystal display device having video signal driving circuit mounted on one side and housing |
JP3329573B2 (ja) | 1994-04-18 | 2002-09-30 | 日亜化学工業株式会社 | Ledディスプレイ |
JPH07307491A (ja) * | 1994-05-11 | 1995-11-21 | Mitsubishi Cable Ind Ltd | Led集合体モジュールおよびその作製方法 |
JP2979961B2 (ja) | 1994-06-14 | 1999-11-22 | 日亜化学工業株式会社 | フルカラーledディスプレイ |
JP3116727B2 (ja) | 1994-06-17 | 2000-12-11 | 日亜化学工業株式会社 | 面状光源 |
JP3227059B2 (ja) * | 1994-06-21 | 2001-11-12 | 株式会社小糸製作所 | 車輌用灯具 |
JPH0863119A (ja) | 1994-08-01 | 1996-03-08 | Motorola Inc | 単色ledを用いた全色画像表示装置 |
JPH0854839A (ja) * | 1994-08-09 | 1996-02-27 | Sony Corp | カラー画像表示装置 |
JPH0864860A (ja) * | 1994-08-17 | 1996-03-08 | Mitsubishi Materials Corp | 色純度の高い赤外可視変換青色発光ダイオード |
JP3309939B2 (ja) | 1994-09-09 | 2002-07-29 | 日亜化学工業株式会社 | 発光ダイオード |
JPH08130329A (ja) * | 1994-10-31 | 1996-05-21 | Nichia Chem Ind Ltd | Led照明 |
US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
JP3127195B2 (ja) * | 1994-12-06 | 2001-01-22 | シャープ株式会社 | 発光デバイスおよびその製造方法 |
US5710628A (en) * | 1994-12-12 | 1998-01-20 | Visible Genetics Inc. | Automated electrophoresis and fluorescence detection apparatus and method |
JPH08170077A (ja) | 1994-12-19 | 1996-07-02 | Hitachi Ltd | 蛍光体、その製造方法、発光スクリーン及びそれを用いた陰極線管 |
JP2735057B2 (ja) | 1994-12-22 | 1998-04-02 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
WO1996024156A1 (en) * | 1995-01-30 | 1996-08-08 | Philips Electronics N.V. | Lighting unit |
JP3542677B2 (ja) | 1995-02-27 | 2004-07-14 | セイコーエプソン株式会社 | 樹脂封止型半導体装置およびその製造方法 |
JPH08321918A (ja) * | 1995-03-22 | 1996-12-03 | Canon Inc | 導光体、該導光体を有する照明装置及び該照明装置を有する情報処理装置 |
US5623181A (en) * | 1995-03-23 | 1997-04-22 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
JPH08293825A (ja) * | 1995-04-21 | 1996-11-05 | Fujitsu Ltd | スペースダイバーシティ受信装置 |
US5630741A (en) * | 1995-05-08 | 1997-05-20 | Advanced Vision Technologies, Inc. | Fabrication process for a field emission display cell structure |
US5594751A (en) | 1995-06-26 | 1997-01-14 | Optical Concepts, Inc. | Current-apertured vertical cavity laser |
US5825113A (en) * | 1995-07-05 | 1998-10-20 | Electric Power Research Institute, Inc. | Doubly salient permanent magnet machine with field weakening (or boosting) capability |
JPH0927642A (ja) * | 1995-07-13 | 1997-01-28 | Clarion Co Ltd | 照明装置 |
JP3120703B2 (ja) * | 1995-08-07 | 2000-12-25 | 株式会社村田製作所 | 導電性ペースト及び積層セラミック電子部品 |
JPH0964325A (ja) * | 1995-08-23 | 1997-03-07 | Sony Corp | 固体撮像素子とその製造方法 |
US5798537A (en) * | 1995-08-31 | 1998-08-25 | Kabushiki Kaisha Toshiba | Blue light-emitting device |
US5949751A (en) * | 1995-09-07 | 1999-09-07 | Pioneer Electronic Corporation | Optical recording medium and a method for reproducing information recorded from same |
JPH09116225A (ja) * | 1995-10-20 | 1997-05-02 | Hitachi Ltd | 半導体発光素子 |
JP3612693B2 (ja) * | 1995-10-31 | 2005-01-19 | 岩崎電気株式会社 | 発光ダイオード配列体及び発光ダイオード |
JPH09130546A (ja) * | 1995-11-01 | 1997-05-16 | Iwasaki Electric Co Ltd | 線状光源用発光ダイオード |
JP3476611B2 (ja) * | 1995-12-14 | 2003-12-10 | 日亜化学工業株式会社 | 多色発光素子及びそれを用いた表示装置 |
US5870797A (en) * | 1996-02-23 | 1999-02-16 | Anderson; Kent George | Vacuum cleaning system |
US6600175B1 (en) * | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
US5949182A (en) * | 1996-06-03 | 1999-09-07 | Cornell Research Foundation, Inc. | Light-emitting, nanometer scale, micromachined silicon tips |
KR20040111701A (ko) | 1996-06-26 | 2004-12-31 | 지멘스 악티엔게젤샤프트 | 발광 변환 소자를 포함하는 발광 반도체 소자 |
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
US5684309A (en) * | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
JPH1036835A (ja) | 1996-07-29 | 1998-02-10 | Nichia Chem Ind Ltd | フォトルミネセンス蛍光体 |
TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US6608332B2 (en) | 1996-07-29 | 2003-08-19 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device and display |
IE820328L (en) * | 1996-08-15 | 1983-08-16 | Eaton Corp | Illumination system |
US6004001A (en) * | 1996-09-12 | 1999-12-21 | Vdo Adolf Schindling Ag | Illumination for a display |
US5781363A (en) * | 1996-10-15 | 1998-07-14 | International Business Machines Corporation | Servo-free velocity estimator for coil driven actuator arm in a data storage drive |
US5966393A (en) | 1996-12-13 | 1999-10-12 | The Regents Of The University Of California | Hybrid light-emitting sources for efficient and cost effective white lighting and for full-color applications |
JP4271747B2 (ja) * | 1997-07-07 | 2009-06-03 | 株式会社朝日ラバー | 発光ダイオード用透光性被覆材及び蛍光カラー光源 |
US5847507A (en) * | 1997-07-14 | 1998-12-08 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
JPH1139917A (ja) * | 1997-07-22 | 1999-02-12 | Hewlett Packard Co <Hp> | 高演色性光源 |
US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
JP3541709B2 (ja) | 1998-02-17 | 2004-07-14 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
US6501091B1 (en) * | 1998-04-01 | 2002-12-31 | Massachusetts Institute Of Technology | Quantum dot white and colored light emitting diodes |
US6105200A (en) * | 1998-04-21 | 2000-08-22 | Cooper; Byron W. | Can top cleaning device |
US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US6798537B1 (en) * | 1999-01-27 | 2004-09-28 | The University Of Delaware | Digital color halftoning with generalized error diffusion vector green-noise masks |
US6575930B1 (en) * | 1999-03-12 | 2003-06-10 | Medrad, Inc. | Agitation devices and dispensing systems incorporating such agitation devices |
US6513949B1 (en) * | 1999-12-02 | 2003-02-04 | Koninklijke Philips Electronics N.V. | LED/phosphor-LED hybrid lighting systems |
US6538371B1 (en) | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
AU1142001A (en) * | 2000-10-19 | 2002-04-29 | Dsm N.V. | Protein hydrolysates |
JP2002270020A (ja) * | 2001-03-08 | 2002-09-20 | Casio Comput Co Ltd | 光源装置 |
US6536371B2 (en) * | 2001-08-01 | 2003-03-25 | One World Technologies, Inc. | Rotary direction indicator |
WO2004049155A2 (en) | 2002-11-27 | 2004-06-10 | Sap Aktiengesellschaft | Avoiding data loss when refreshing a data warehouse |
EP1681728B1 (de) * | 2003-10-15 | 2018-11-21 | Nichia Corporation | Lichtemittierende vorrichtung |
US7318651B2 (en) * | 2003-12-18 | 2008-01-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Flash module with quantum dot light conversion |
US7083302B2 (en) * | 2004-03-24 | 2006-08-01 | J. S. Technology Co., Ltd. | White light LED assembly |
KR100655894B1 (ko) * | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
US7546032B2 (en) | 2004-09-30 | 2009-06-09 | Casio Computer Co., Ltd. | Electronic camera having light-emitting unit |
JP4679183B2 (ja) * | 2005-03-07 | 2011-04-27 | シチズン電子株式会社 | 発光装置及び照明装置 |
JP5240959B2 (ja) | 2005-11-16 | 2013-07-17 | 国立大学法人 香川大学 | 薬剤とその製造方法 |
JP4839866B2 (ja) | 2006-02-02 | 2011-12-21 | トヨタ自動車株式会社 | 車両側部構造 |
EP2000173A2 (de) | 2006-03-29 | 2008-12-10 | Tti Ellebeau, Inc. | Iontophoresevorrichtung |
JP4717684B2 (ja) | 2006-03-30 | 2011-07-06 | 富士通テレコムネットワークス株式会社 | コンデンサ充電装置 |
US20080144821A1 (en) | 2006-10-26 | 2008-06-19 | Marvell International Ltd. | Secure video distribution |
KR100930171B1 (ko) | 2006-12-05 | 2009-12-07 | 삼성전기주식회사 | 백색 발광장치 및 이를 이용한 백색 광원 모듈 |
JP5079379B2 (ja) | 2007-04-16 | 2012-11-21 | 長谷川香料株式会社 | 二次沈殿が抑制された精製クロロゲン酸類の製法 |
WO2008143315A1 (ja) | 2007-05-22 | 2008-11-27 | Nec San-Ei Instruments, Ltd. | データ記録再生装置 |
US8119028B2 (en) | 2007-11-14 | 2012-02-21 | Cree, Inc. | Cerium and europium doped single crystal phosphors |
WO2010023840A1 (en) * | 2008-08-28 | 2010-03-04 | Panasonic Corporation | Semiconductor light emitting device and backlight source, backlight source system, display device, and electronic device using the same |
JP5331584B2 (ja) | 2009-06-12 | 2013-10-30 | 株式会社フジクラ | 圧力センサアレイ、圧力センサアレイパッケージ、並びに圧力センサモジュール及び電子部品 |
JP5441660B2 (ja) | 2009-12-15 | 2014-03-12 | 日本特殊陶業株式会社 | キャパシタの製造方法及びキャパシタ内蔵配線基板 |
JP5343885B2 (ja) | 2010-02-16 | 2013-11-13 | 住友電装株式会社 | 防水機能付き端子金具及び防水コネクタ |
WO2012070118A1 (ja) | 2010-11-24 | 2012-05-31 | トヨタ自動車株式会社 | 車両用動力伝達装置 |
-
1997
- 1997-07-28 TW TW86110739A patent/TW383508B/zh not_active IP Right Cessation
- 1997-07-29 CN CNB2006100958374A patent/CN100424901C/zh not_active Expired - Lifetime
- 1997-07-29 EP EP10158422.5A patent/EP2197054B1/de not_active Expired - Lifetime
- 1997-07-29 DK DK10158429.0T patent/DK2197055T3/en active
- 1997-07-29 BR BRPI9715363A patent/BRPI9715363B1/pt active IP Right Grant
- 1997-07-29 CN CNB200610095836XA patent/CN100449807C/zh not_active Expired - Lifetime
- 1997-07-29 CN CNB031549357A patent/CN1249823C/zh not_active Expired - Lifetime
- 1997-07-29 EP EP10158437.3A patent/EP2194590B1/de not_active Expired - Lifetime
- 1997-07-29 EP EP20100158449 patent/EP2197056A3/de not_active Withdrawn
- 1997-07-29 BR BR9715361A patent/BR9715361B1/pt active IP Right Grant
- 1997-07-29 AU AU36355/97A patent/AU720234B2/en not_active Expired
- 1997-07-29 DE DE1997224670 patent/DE29724670U1/de not_active Expired - Lifetime
- 1997-07-29 DE DE1997224458 patent/DE29724458U1/de not_active Expired - Lifetime
- 1997-07-29 DE DE1997224764 patent/DE29724764U1/de not_active Expired - Lifetime
- 1997-07-29 JP JP50869398A patent/JP3503139B2/ja not_active Expired - Lifetime
- 1997-07-29 DK DK00101746.6T patent/DK1017111T3/en active
- 1997-07-29 WO PCT/JP1997/002610 patent/WO1998005078A1/ja not_active Application Discontinuation
- 1997-07-29 ES ES10158437.3T patent/ES2576053T3/es not_active Expired - Lifetime
- 1997-07-29 CA CA 2479842 patent/CA2479842C/en not_active Expired - Lifetime
- 1997-07-29 KR KR1020027001340A patent/KR100549902B1/ko not_active IP Right Cessation
- 1997-07-29 EP EP10158429.0A patent/EP2197055B1/de not_active Expired - Lifetime
- 1997-07-29 CN CNB2006100958389A patent/CN100424902C/zh not_active Expired - Lifetime
- 1997-07-29 BR BRPI9710792-1A patent/BR9710792B1/pt active IP Right Grant
- 1997-07-29 PT PT97933047T patent/PT936682E/pt unknown
- 1997-07-29 DK DK10158422.5T patent/DK2197054T3/en active
- 1997-07-29 ES ES10158455.5T patent/ES2569616T3/es not_active Expired - Lifetime
- 1997-07-29 ES ES00101746.6T patent/ES2553570T3/es not_active Expired - Lifetime
- 1997-07-29 ES ES10184754.9T patent/ES2545981T3/es not_active Expired - Lifetime
- 1997-07-29 PT PT4001378T patent/PT1429398E/pt unknown
- 1997-07-29 DK DK10158416.7T patent/DK2197053T3/en active
- 1997-07-29 ES ES97933047T patent/ES2148997T5/es not_active Expired - Lifetime
- 1997-07-29 DK DK10184754.9T patent/DK2276080T3/en active
- 1997-07-29 CN CNB2006100069515A patent/CN100382349C/zh not_active Expired - Lifetime
- 1997-07-29 ES ES10158429.0T patent/ES2569615T3/es not_active Expired - Lifetime
- 1997-07-29 PT PT101584167T patent/PT2197053E/pt unknown
- 1997-07-29 DE DE1997224642 patent/DE29724642U1/de not_active Expired - Lifetime
- 1997-07-29 DK DK04001378.1T patent/DK1429398T3/en active
- 1997-07-29 KR KR10-2002-7001342A patent/KR100524117B1/ko not_active IP Right Cessation
- 1997-07-29 EP EP10184754.9A patent/EP2276080B2/de not_active Expired - Lifetime
- 1997-07-29 ES ES04001378.1T patent/ES2550823T3/es not_active Expired - Lifetime
- 1997-07-29 CN CNB031595952A patent/CN1240144C/zh not_active Expired - Lifetime
- 1997-07-29 SG SG200006374A patent/SG115349A1/en unknown
- 1997-07-29 EP EP10158416.7A patent/EP2197053B1/de not_active Revoked
- 1997-07-29 CN CNB031549381A patent/CN1249825C/zh not_active Expired - Lifetime
- 1997-07-29 SG SG2010071520A patent/SG182857A1/en unknown
- 1997-07-29 ES ES10158416.7T patent/ES2544690T3/es not_active Expired - Lifetime
- 1997-07-29 MY MYPI9703464 patent/MY125748A/en unknown
- 1997-07-29 EP EP10158455.5A patent/EP2197057B1/de not_active Expired - Lifetime
- 1997-07-29 AT AT97933047T patent/ATE195831T1/de active
- 1997-07-29 KR KR10-2002-7001341A patent/KR100434871B1/ko not_active IP Right Cessation
- 1997-07-29 KR KR10-2002-7012950A patent/KR100491481B1/ko not_active IP Right Cessation
- 1997-07-29 DK DK10158437.3T patent/DK2194590T3/en active
- 1997-07-29 EP EP20020017698 patent/EP1271664B1/de not_active Expired - Lifetime
- 1997-07-29 CN CNB031549365A patent/CN1249824C/zh not_active Expired - Lifetime
- 1997-07-29 SG SG2010071504A patent/SG182856A1/en unknown
- 1997-07-29 CN CN97196762A patent/CN1133218C/zh not_active Expired - Lifetime
- 1997-07-29 CN CNB031549373A patent/CN1253949C/zh not_active Expired - Lifetime
- 1997-07-29 DE DE1997602929 patent/DE69702929T4/de not_active Expired - Lifetime
- 1997-07-29 PT PT101847549T patent/PT2276080E/pt unknown
- 1997-07-29 EP EP20000114764 patent/EP1045458A3/de not_active Withdrawn
- 1997-07-29 SG SG2010071512A patent/SG182008A1/en unknown
- 1997-07-29 US US08/902,725 patent/US5998925A/en not_active Expired - Lifetime
- 1997-07-29 EP EP04001377.3A patent/EP1429397B1/de not_active Expired - Lifetime
- 1997-07-29 KR KR1020057007162A patent/KR100549906B1/ko not_active IP Right Cessation
- 1997-07-29 CA CA 2479538 patent/CA2479538C/en not_active Expired - Lifetime
- 1997-07-29 EP EP97933047A patent/EP0936682B9/de not_active Expired - Lifetime
- 1997-07-29 CA CA 2481364 patent/CA2481364C/en not_active Expired - Lifetime
- 1997-07-29 BR BR9715365A patent/BR9715365B1/pt active IP Right Grant
- 1997-07-29 BR BRPI9715263-3B1A patent/BR9715263B1/pt active IP Right Grant
- 1997-07-29 PT PT101746T patent/PT1017111E/pt unknown
- 1997-07-29 EP EP20000102678 patent/EP1017112A3/de not_active Withdrawn
- 1997-07-29 BR BRPI9715264A patent/BRPI9715264B1/pt active IP Right Grant
- 1997-07-29 EP EP04001378.1A patent/EP1429398B1/de not_active Expired - Lifetime
- 1997-07-29 EP EP00101746.6A patent/EP1017111B1/de not_active Expired - Lifetime
- 1997-07-29 CA CA002262136A patent/CA2262136C/en not_active Expired - Lifetime
- 1997-07-29 KR KR10-1999-7000775A patent/KR100517271B1/ko not_active IP Right Cessation
- 1997-07-29 DK DK97933047T patent/DK0936682T4/da active
- 1997-07-29 CN CNB031549349A patent/CN1249822C/zh not_active Expired - Lifetime
- 1997-07-29 DK DK10158455.5T patent/DK2197057T3/en active
- 1997-07-29 ES ES10158422.5T patent/ES2576052T3/es not_active Expired - Lifetime
- 1997-07-29 DE DE1997224773 patent/DE29724773U1/de not_active Expired - Lifetime
- 1997-07-29 SG SG10201502321UA patent/SG10201502321UA/en unknown
- 1997-07-29 BR BRPI9715362-1A patent/BR9715362B1/pt not_active IP Right Cessation
-
1999
- 1999-04-28 US US09/300,315 patent/US6069440A/en not_active Expired - Lifetime
- 1999-11-22 JP JP33129399A patent/JP3700502B2/ja not_active Expired - Lifetime
- 1999-12-10 US US09/458,024 patent/US6614179B1/en not_active Expired - Lifetime
-
2000
- 2000-01-05 HK HK00100057A patent/HK1021073A1/xx not_active IP Right Cessation
- 2000-04-07 TW TW86110739A01 patent/TWI156177B/zh not_active IP Right Cessation
- 2000-09-28 GR GR20000402181T patent/GR3034493T3/el unknown
- 2000-10-19 HK HK10111272.4A patent/HK1144980A1/zh not_active IP Right Cessation
- 2000-10-19 HK HK10111270.6A patent/HK1144978A1/zh not_active IP Right Cessation
- 2000-10-19 HK HK10111271.5A patent/HK1144979A1/xx not_active IP Right Cessation
- 2000-10-19 HK HK10111274.2A patent/HK1144982A1/zh not_active IP Right Cessation
- 2000-10-19 HK HK11103547.9A patent/HK1149851A1/xx not_active IP Right Cessation
- 2000-10-19 HK HK00106629.6A patent/HK1027668A1/xx not_active IP Right Cessation
-
2001
- 2001-01-22 HK HK01100541A patent/HK1030095A1/xx not_active IP Right Cessation
- 2001-10-29 JP JP2001330406A patent/JP2002198573A/ja active Pending
-
2002
- 2002-09-24 JP JP2002278066A patent/JP3729166B2/ja not_active Expired - Lifetime
-
2003
- 2003-07-01 US US10/609,402 patent/US7362048B2/en not_active Expired - Fee Related
- 2003-07-01 US US10/609,503 patent/US7071616B2/en not_active Expired - Fee Related
- 2003-07-02 HK HK03104689.5A patent/HK1052409B/zh not_active IP Right Cessation
- 2003-10-03 US US10/677,382 patent/US7026756B2/en not_active Expired - Fee Related
-
2004
- 2004-06-10 US US10/864,544 patent/US7126274B2/en not_active Expired - Fee Related
- 2004-10-25 KR KR1020040085497A patent/KR100559346B1/ko not_active IP Right Cessation
- 2004-11-09 HK HK04108781A patent/HK1066097A1/xx not_active IP Right Cessation
- 2004-11-09 HK HK04108775A patent/HK1066095A1/xx not_active IP Right Cessation
- 2004-11-09 HK HK04108776A patent/HK1066096A1/xx not_active IP Right Cessation
-
2005
- 2005-05-19 JP JP2005147093A patent/JP2005317985A/ja active Pending
- 2005-08-23 US US11/208,729 patent/US7215074B2/en not_active Expired - Fee Related
-
2006
- 2006-07-19 JP JP2006196344A patent/JP4124248B2/ja not_active Expired - Lifetime
-
2007
- 2007-01-16 US US11/653,275 patent/US7329988B2/en not_active Expired - Fee Related
- 2007-03-05 US US11/682,014 patent/US7531960B2/en not_active Expired - Fee Related
-
2008
- 2008-01-07 JP JP2008000269A patent/JP5214253B2/ja not_active Expired - Lifetime
- 2008-02-08 US US12/028,062 patent/US7682848B2/en not_active Expired - Fee Related
-
2009
- 2009-03-18 JP JP2009065948A patent/JP4530094B2/ja not_active Expired - Lifetime
- 2009-08-27 US US12/548,620 patent/US7969090B2/en not_active Expired - Fee Related
- 2009-08-27 US US12/548,618 patent/US7915631B2/en not_active Expired - Fee Related
- 2009-08-27 US US12/548,621 patent/US7901959B2/en not_active Expired - Fee Related
- 2009-08-27 US US12/548,614 patent/US8148177B2/en not_active Expired - Fee Related
- 2009-09-14 US US12/559,042 patent/US8610147B2/en not_active Expired - Fee Related
- 2009-10-07 US US12/575,162 patent/US7968866B2/en not_active Expired - Fee Related
- 2009-10-07 US US12/575,155 patent/US8754428B2/en not_active Expired - Fee Related
-
2010
- 2010-01-19 US US12/689,681 patent/US20100117516A1/en not_active Abandoned
- 2010-07-01 US US12/829,182 patent/US7855092B2/en not_active Expired - Fee Related
- 2010-07-07 US US12/831,586 patent/US7943941B2/en not_active Expired - Fee Related
- 2010-10-14 JP JP2010231162A patent/JP5177199B2/ja not_active Expired - Lifetime
- 2010-11-09 US US12/942,792 patent/US8309375B2/en not_active Expired - Fee Related
- 2010-11-16 US US12/947,470 patent/US8679866B2/en not_active Expired - Fee Related
-
2011
- 2011-08-15 US US13/210,027 patent/US8685762B2/en not_active Expired - Fee Related
-
2012
- 2012-08-29 JP JP2012189084A patent/JP5177317B2/ja not_active Expired - Lifetime
-
2013
- 2013-01-15 JP JP2013004210A patent/JP5725045B2/ja not_active Expired - Lifetime
- 2013-11-26 US US14/091,107 patent/US9130130B2/en not_active Expired - Fee Related
- 2013-12-24 JP JP2013265770A patent/JP5610056B2/ja not_active Expired - Lifetime
-
2014
- 2014-06-27 JP JP2014132376A patent/JP5821154B2/ja not_active Expired - Lifetime
- 2014-06-27 JP JP2014132379A patent/JP2014212336A/ja not_active Withdrawn
- 2014-06-27 JP JP2014132374A patent/JP5692445B2/ja not_active Expired - Lifetime
- 2014-06-27 JP JP2014132371A patent/JP5664815B2/ja not_active Expired - Lifetime
-
2015
- 2015-12-08 JP JP2015239461A patent/JP5953514B2/ja not_active Expired - Lifetime
-
2016
- 2016-03-28 JP JP2016063289A patent/JP6101943B2/ja not_active Expired - Lifetime
- 2016-04-27 JP JP2016089711A patent/JP2016178320A/ja not_active Withdrawn
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9196800B2 (en) | 1996-06-26 | 2015-11-24 | Osram Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
US7709852B2 (en) | 1996-09-20 | 2010-05-04 | Osram Gmbh | Wavelength-converting casting composition and light-emitting semiconductor component |
US8071996B2 (en) | 1996-09-20 | 2011-12-06 | Osram Gmbh | Wavelength-converting casting composition and light-emitting semiconductor component |
DE102009037186A1 (de) * | 2009-08-12 | 2011-02-17 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauteil |
US9012926B2 (en) | 2009-08-12 | 2015-04-21 | Osram Opto Semiconductor Gmbh | Radiation-emitting semiconductor component |
US10533729B2 (en) | 2012-02-27 | 2020-01-14 | Osram Gmbh | Light source with LED chip and luminophore layer |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE29724458U1 (de) | Lichtemittierende Vorrichtung und Anzeigegerät | |
EP0907969B1 (de) | Lichtabstrahlendes halbleiterbauelement mit lumineszenzkonversionselement | |
DE19638667C2 (de) | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement | |
DE102004016232B4 (de) | Weisses Licht emittierende Vorrichtung | |
EP1116419B1 (de) | Leuchtstoffanordnung wellenlängenkonvertierende vergussmasse und lichtquelle | |
EP1501909B1 (de) | Wellenlängenkonvertierende reaktionsharzmasse und leuchtdiodenbauelement | |
EP1259990B1 (de) | Verfahren zur herstellung eines lichtabstrahlenden halbleiterkörpers mit lumineszenzkonversionselement | |
WO2009094976A1 (de) | Beleuchtungseinrichtung zur hinterleuchtung eines displays sowie ein display mit einer solchen beleuchtungseinrichtung | |
DE102004060708B4 (de) | Rotes Fluoreszenzmaterial und Weißlicht emittierende Dioden, die rotes Fluoreszenzmaterial verwenden | |
EP2283525A2 (de) | Leuchtchip und leuchtvorrichtung mit einem solchen | |
DE19655445B3 (de) | Weißes Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionsschicht und Verwendung solcher Halbleiterbauelemente | |
DE19655185B9 (de) | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20010531 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20010813 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20030626 |
|
R081 | Change of applicant/patentee |
Owner name: NICHIA CORP., ANAN-SHI, JP Free format text: FORMER OWNER: NICHIA CHEMICAL INDUSTRIES, LTD., ANAN, TOKUSHIMA, JP Effective date: 20040203 |
|
R152 | Utility model maintained after payment of third maintenance fee after eight years |
Effective date: 20050624 |
|
R071 | Expiry of right |