DE3047884A1 - Printed circuit mfg. process - using ink jet printer for applying metal coating, lacquer or etching fluid to allow high prodn. rate - Google Patents

Printed circuit mfg. process - using ink jet printer for applying metal coating, lacquer or etching fluid to allow high prodn. rate

Info

Publication number
DE3047884A1
DE3047884A1 DE19803047884 DE3047884A DE3047884A1 DE 3047884 A1 DE3047884 A1 DE 3047884A1 DE 19803047884 DE19803047884 DE 19803047884 DE 3047884 A DE3047884 A DE 3047884A DE 3047884 A1 DE3047884 A1 DE 3047884A1
Authority
DE
Germany
Prior art keywords
mfg
writing
printed circuit
ink jet
rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19803047884
Other languages
German (de)
Inventor
Günter Dipl.-Ing. Dr. 8000 München Menzel
Ferdinand Dr.-Ing. 8035 Gauting Quella
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19803047884 priority Critical patent/DE3047884A1/en
Publication of DE3047884A1 publication Critical patent/DE3047884A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions

Abstract

The printed circuit mfg. process uses a standard high-speed printer using an ink jet printing head which is movable along at least two orthogonal coordinates and pref. along all three orthogonal coordinates. The printing head is used to apply metallised conductor paths, a lacquer coating, etching fluid, flux or solder directly onto the surface of the circuit board where required. The printing head may be of fine steel and it can be heated, or alternatively, the circuit board itself can be heated. Several different printing heads can be used, each providing a different function. The process allows a rapid mfg. rate for the circuit boards.

Description

Vorrichtung zur automatisierbaren Bearbeitung in derDevice for automatable processing in the

Halbleitertechnologies z. B. von Leiterplatten.Semiconductor technologies z. B. of printed circuit boards.

Die Erfindung betrifft eine Vorrichtung zur automatisierbaren Bearbeitung in der Halbleitertechnologie, z. B.The invention relates to a device for automatable processing in semiconductor technology, e.g. B.

von Leiterplatten, insbesondere zum Aufbringen von Strukturen auch metallischer Natur, Abdecklacken, Ätzmittel, Fluß- und Lötmittel. Bei der Erwähnung #von Halbleitertechnologie ist auch an die Bearbeitung von Substraten jeglicher Art, z. B. Keramik, Glas oder auch Silizium-Wafer und Chips gedacht.of printed circuit boards, especially for the application of structures, too metallic nature, masking lacquers, etchants, fluxes and soldering agents. When mentioning #of semiconductor technology is also applied to the processing of any substrates Kind, e.g. B. ceramics, glass or silicon wafers and chips.

In der Leiterplattenfertigung sind verschiedene Herstellungsverfahren üblich. Dazu zählt unter anderem die Fotoätztechnik, wobei die Leiterplatten bereits kaschiert sein können (z. B. mit Kupfer) oder bei denen diese Kupferschicht galvanisch oder chemisch aufgebracht wird.There are various manufacturing processes in circuit board production common. This includes, among other things, the photo-etching technique, with the circuit boards already can be laminated (e.g. with copper) or in which this copper layer is galvanic or is applied chemically.

Anschließend erfolgt die Belackung mit einem lichtempfindlichen Lack, oder das Aufbringen von lichtempfindlichen Resistfolien, dann die Belichtung über Masken und eventuell Entwickeln der belichteten Partien, ferner das Abspülen des unbelichteten Lackes und die Ätzung der unbelichteten Kupferpartien, dann das Abspülen des Ätzrückstandes, das Abstrippen des belichtetem Lackes und schließlich das Lotpunktsetzen. Dieses Verfahren umfaßt demnach mehrere aufwendige und zeitraubende Verfahrensschritte. Im Zuge der fortlaufend erhöhten Fertigungsgeschwindigkeiten und zur Vereinfachung der Produktionsschritte muS. deshalb nach neuen Fertigurigsverfahr#n gesucht werden.Then the lacquer is applied with a light-sensitive lacquer, or the application of photosensitive resist films, then the exposure over Masks and possibly developing the exposed areas, as well as rinsing off the unexposed lacquer and the etching of the unexposed copper areas, then rinsing the etching residue, the stripping of the exposed varnish and finally the setting of solder points. This process accordingly comprises several complex and time-consuming process steps. In the course of the continuously increased production speeds and for simplification the production steps must. therefore, a search should be made for new manufacturing processes.

Der Erfindung liegt die Aufgabe zugrunde, die eingangsgenannte Vorrichtung zu realisieren, um eine Verein- fachung des gesamten Verfahrens, eine Beschle#n1i"gt#in# der Produkt on, eine Flexibilität im Verfahren bezüglich der Leiterplattenherstellung und der Materialien, ferner eine. Miniaturisierung der Leiterbahnen und nicht zuletzt eine Materialeinsparung zu erreichen. Das Verfahren soll außerdem umweltfreundlich sein. Diese Aufgabe wird dadurch erreicht, daß ein an sich bekanntes Schreibwerk eines Tintendruckers Anwendung findet, das in x- und y-Richtung und erforderlichenfalls auch in z-R#ichtung beweglich ist. Es ist selbstverständlich möglich, daß das Schreibwerk fest angeordnet und die zu bearbeitenden Leiterplatten bewegt werden.The invention is based on the object of the aforementioned device to realize in order to simplification of the entire process, an acceleration # n1i "gt # in # the product on, a flexibility in the procedure regarding PCB manufacture and materials, furthermore a. Miniaturization of the conductor tracks and, last but not least, a saving in material. The procedure should also be environmentally friendly. This task is achieved in that a known writing of an ink printer is used in x and y-direction and if necessary also in z-direction is movable. It goes without saying possible that the writing unit is fixed and the printed circuit boards to be processed be moved.

Unter einem im Sinne der Erfindung verwendeten Tintenstrahldrucker soll im folgenden ein an sich zum Schnelldrucken auf Papier mittels computergesteuerter Schreibstationen (sogenannten Terminals) entwickeltes Druckgerät verstanden werden. Eine Übersicht über die bisher entwickelten Typen, ihren Aufbau und ihre Arbeitsweise findet man in der "Siemens-Zeitschrift" 51. Jahrgang, Heft 4, Seiten 219 bis 221 vom April 1977.Among an inkjet printer used in the context of the invention in the following is a per se for fast printing on paper by means of computer-controlled Writing stations (so-called terminals) developed printing device are understood. An overview of the types developed so far, their structure and how they work can be found in the "Siemens-Zeitschrift" 51st year, issue 4, pages 219 to 221 dated April 1977.

Abgesehen davon, daß eine Vorrichtung nach der Erfindung die in der Aufgabe festgehaltenen Anforderungen erfüllt, wird mit einer entsprechenden Vorrichtung erreicht, daß die Leiterbahndicken in verschieden beanspruchten Bereichen variiert werden können.Apart from the fact that a device according to the invention in the The task is fulfilled with a corresponding device achieved that the conductor track thickness varies in different stressed areas can be.

Nach einer Weiterbildung der Erfindung besteht der Schreibkopf des Schreibwerkes aus Edelstahl und ist beheizbar. Mit einen derartigen Schreibwerk können auch Metalle in flüssiger Form aufgespritzt werden. Außerdem kann die Viskosität eines flüssigen ?mediums durch die Konstanthaltung der schreikopftemperatur gesichert werden. Mit einem entsprechend ausgebildeten Schreibkopf lassen sich z. B. feinste Lotpunkte setzen. In Frage kommen vorzugsweise Lote mit Schmelzpunlften von ca. 60 ... 2500C. Die Piezokeramik des Schreibkopfes hält solchen Temperaturbelastungen stand.According to a development of the invention, the write head consists of Writing mechanism made of stainless steel and is heatable. With such writing Metals can also be sprayed on in liquid form. In addition, the viscosity of a liquid medium by keeping the head temperature constant will. With an appropriately designed write head z. B. finest Set plumb points. Solders with melting points of approx. 60 ... 2500C. The piezoceramic of the write head withstands such temperature loads was standing.

Nach einer weiteren Ausgestaltung der Erfindung sind die Leiterplatten erwärmt. Der Vorteil einer derartigen Ausbildung besteht in einer schnellen Aushärtung von Lacken, der raschen Verdampfung der Lösungsmittel für die metallorganischen Verbindung und einer größeren Haftung der aufgebrachten Leiterbahnen. Außerdem gewährleistet eine erwärmte Leiterplatte eine gute Benetzung bei der Aufbringung von Lot.According to a further embodiment of the invention, the circuit boards warmed up. The advantage of such a design is that it cures quickly of paints, the rapid evaporation of solvents for the organometallic Connection and greater adhesion of the applied conductor tracks. Also guaranteed a heated circuit board ensures good wetting when applying solder.

Um eine Vorrichtung nach der Brçindvmg möglichst umfassend einzusetzen, kann nach der Erfindung ein Schreibwerk mit mehreren Schreibköpfen Verwendung finden, wobei jeder Kopf eine andere Funktion hat. Dadurch wird eine besonders rationelle Fertigung gewährleistet, weil beispielsweise ein Kopl die Leiterbahn schreibt, ein weiterer Kopf die vorgesehenen Kontaktstellen mit Flußmittel besprüht und ein dritter Kopf die Lötpunkte setzt. Inzwischen können die Bauteile automatisch bestückt werden und anschließend mit einem weiteren Kopf verlötet werden.In order to use a device as comprehensively as possible after breaking, According to the invention, a writing unit with several writing heads can be used, each head has a different function. This makes a particularly rational one Manufacturing is guaranteed because, for example, a Kopl writes the conductor track another head sprayed the intended contact points with flux and a third Head that sets the solder points. The components can now be loaded automatically and then soldered to another head.

Daraufhin kann ein weiterer Kopf die fertigen, mit Bauteilen bestückten Leiterbahnen oder die gesamten Leiterplatten mit einem Schutzlack versehen.Another head can then populate the finished parts with components Apply a protective varnish to the conductor tracks or the entire circuit boards.

Im Rahmen der Erfindung können mit einem Schreibwerk auch metallorganische Verbindungen verspritzt werden. Dadurch bietet sich die Möglichkeit durch Verspritzen von metallorganischen Lösungen (z. B. huplerorganische Verbindungen) auf die noch nicht metallisierte Leiterplatte die vorgesehenen Leiterbahnen dIrekt aufzubringen. Mittels eines nachgeschalteten ->echnergesteuerten Laserstrahls können die Leiterbahnen ausgeheilt und damit ihr elektrischer tfiderstand reduziert werden.In the context of the invention, organometallic materials can also be used with a writing unit Connections are splashed. This offers the possibility of spraying from organometallic solutions (e.g. Huplerorganic compounds) to the still non-metallized printed circuit board to apply the intended conductor tracks directly. By means of a downstream -> computer-controlled laser beam, the conductor tracks healed and thus their electrical resistance can be reduced.

Die freie Prograrmierbarkeit des Schreibwerkes gestattet ferner eine rechnergesteuerte Auslegung #der Fors der Leiterbahnen, sowie (durch Hintereinanderschalten en mehrerer Schreibwerke) das Aufbringen der Leiterbahnen, das Aufbringen von Flußmittel sowie das Aufbringen von Lotpunkten (beheizter Schreibkopf) und das Einlöten von Bauteilen in einem Arbeitsgang.The free programmability of the writing mechanism allows further a computer-controlled design # of the Fors of the conductor tracks, as well as (by connecting one behind the other en several writing units) the application of the conductor tracks, the application of flux as well as the application of solder points (heated writing head) and the soldering of Components in one operation.

Die Erfindung bietet deshalb wesentliche Vorteile gegenüber der bisherigen, sehr zeitraubenden Methode, die Leiterbahnen in vielen aufeinanderfolgenden Prozeßschritten herzustellen.The invention therefore offers significant advantages over the previous, very time-consuming method, the conductor tracks in many successive process steps to manufacture.

Ein weiterer Vorteil der Erfindung besteht darin, daß die Zusammensetzung des Lotes, z. B. SnPb, nicht variiert.Another advantage of the invention is that the composition of the solder, e.g. B. SnPb, does not vary.

Im Gegensatz hierzu kann ein galvanisches Bad an einer Komponente verarmen.In contrast, an electroplating bath can be applied to a component impoverish.

Ein weiterer Vorteil ist durch die Materialeinsparung begründet, in dem keine galvanisch aufgebrachte Metallisierung abgeätzt werden muß.Another advantage is due to the material savings, in which no galvanically applied metallization has to be etched off.

Zum Korrosionsschutz können die bestückten Leiterbahnen in der oben beschriebenen Weise mit einem durch ein Schreibwerk verspritzten Schutzlack bedeckt werden.For corrosion protection, the assembled conductor tracks can be used in the above described manner covered with a sprayed by a writing unit protective varnish will.

Die Erfindung ist nicht auf das beschriebene Ausführungsbeispiel bezüglich der Leiterplattenherstellung beschränkt, sondern kann selbstverständlich auch beim Einsetzen von elektrischen Bauteilen verwendet werden, z. B.The invention is not related to the exemplary embodiment described limited to the production of printed circuit boards, but can of course also be used in Insertion of electrical components can be used, e.g. B.

durch Aufbringen der Lotpunkte. Die herstellbare Tröpfohengröße im /um-Bereich und kleiner erlaubt es auch, sehr kleine Bauteile, wie sie in der Halbleitertechnologie Verwendung finden, abzudecken. Das Aufbringen von metallorganischen Verbindungen ermöglicht auch in größeren Flächen, z. B. bei Lampen, Verspiegelungen herzustellen, beispielsweise durch Zersetzung von Platinglanz, einer metallorganischen Platinverbindung, durch Wärme.by applying the solder points. The manufacturable droplet size in / um range and smaller also allow very small components, such as those in semiconductor technology Find use to cover. The application of organometallic compounds also allows in larger areas, e.g. B. for lamps, to produce reflections, for example by the decomposition of platinum luster, an organometallic platinum compound Warmth.

5 Patentansprüche5 claims

Claims (5)

Patentansprüche.Claims. 1. Vorrichtung zur automatisierbaren Bearbeitung in der alble itertechnologie, z. B. von Leiterplatten, insbesondere zum Aufbringen von Strukturen auch metallischer Natur, Abdecklacken, Ätzmittel, Fluß- und Lötmittel, d a d u r c h g e k e n n z e i c h n e t , daß ein an sich bekanntes Schreibwerk eines Tintendruckers Anwendung findet, das in x- und y-Richtung und erforderlichenfalls auch in z-Richtung beweglich ist.1. Device for automatable processing in alble itertechnologie, z. B. of printed circuit boards, especially for the application of structures also metallic Nature, masking lacquers, etchants, fluxes and soldering agents E i c h n e t that a known writing unit of an ink printer is used finds that movable in the x and y directions and, if necessary, also in the z direction is. 2. Vorrichtung nach Anspruch 1, d a d u r c h g e -k e n n z e i c h n e t , daß der Schreibkopf des Schreibwerkes aus Edelstahl besteht und beheizbar ist.2. Apparatus according to claim 1, d a d u r c h g e -k e n n z e i c h n e t that the writing head of the writing mechanism is made of stainless steel and can be heated is. 3. Vorrichtung nach Anspruch 1, d a d u r c h g e -k e n n z e i c h n e t , daß die Leiterplatten erwärmt sind.3. Apparatus according to claim 1, d a d u r c h g e -k e n n z e i c Doesn't mean that the circuit boards are heated. 4. Vorrichtung nach Anspruch 1, d a d u r c h g e -k e n n z e i c h n e t , daß ein Schreibwerk mit mehreren Schreibköpfen Verwendung findet, wobei jeder Kopf eine andere Funktion haben kann.4. Apparatus according to claim 1, d a d u r c h g e -k e n n z e i c h n e t that a writing mechanism with several writing heads is used, whereby each head can have a different function. 5. Vorrichtung nach Anspruch 1, d a d u r c h g e -k e n n z e i c h n e t , daß mit dem Schreibwerk metallorganische Verbindungen verspritzt und anschließend durch Wärme zersetzt werden und dadurch metallische Leiterbahnen entstehen.5. The device according to claim 1, d a d u r c h g e -k e n n z e i c h n e t that organometallic compounds are sprayed with the writing and then are decomposed by heat and this creates metallic conductor tracks.
DE19803047884 1980-12-18 1980-12-18 Printed circuit mfg. process - using ink jet printer for applying metal coating, lacquer or etching fluid to allow high prodn. rate Withdrawn DE3047884A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19803047884 DE3047884A1 (en) 1980-12-18 1980-12-18 Printed circuit mfg. process - using ink jet printer for applying metal coating, lacquer or etching fluid to allow high prodn. rate

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Cited By (18)

* Cited by examiner, † Cited by third party
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US4560584A (en) * 1983-12-23 1985-12-24 Universal Instruments Corporation Method and apparatus for applying solder masking to a circuit board
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
US4736704A (en) * 1983-12-23 1988-04-12 Universal Instruments Corporation Apparatus for applying solder masking to a circuit board
DE3728337A1 (en) * 1987-08-25 1989-03-16 Goerlitz Computerbau Gmbh Method for producing etched printed circuit boards
DE4035080A1 (en) * 1990-11-05 1992-05-07 Abb Patent Gmbh METHOD AND DEVICE FOR PRODUCING PARTIAL METAL LAYERS
US5114744A (en) * 1989-08-21 1992-05-19 Hewlett-Packard Company Method for applying a conductive trace pattern to a substrate
US5132248A (en) * 1988-05-31 1992-07-21 The United States Of America As Represented By The United States Department Of Energy Direct write with microelectronic circuit fabrication
DE4228523A1 (en) * 1991-11-13 1993-05-19 Siemens Ag Symbol printing process for circuit boards - uses ink jet print head to provide component symbols at specific board locations
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
WO1996018285A1 (en) * 1994-12-09 1996-06-13 Wolfgang Stubenvoll Direct and selective process for applying protective layers
DE19817530A1 (en) * 1998-04-09 1999-10-14 Diagnostikforschung Inst Manufacture of thin film structures
WO1999053738A1 (en) * 1998-04-09 1999-10-21 Institut für Diagnostikforschung GmbH an der Freien Universität Berlin Method and device for producing thin-layer structures
DE19931110A1 (en) * 1999-07-06 2001-01-25 Ekra Eduard Kraft Gmbh Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder
GB2367788A (en) * 2000-10-16 2002-04-17 Seiko Epson Corp Etching using an ink jet print head
WO2005087497A2 (en) * 2004-03-12 2005-09-22 Siemens Aktiengesellschaft 3d-ink jet structuring of highly topographic surfaces
EP1665346A1 (en) * 2003-09-09 2006-06-07 CSG Solar AG Improved method of forming openings in an organic resin material
US7446051B2 (en) 2003-09-09 2008-11-04 Csg Solar Ag Method of etching silicon
US7592201B2 (en) 2003-09-09 2009-09-22 Csg Solar Ag Adjustments of masks by re-flow

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The business of ink jet printing, piro techno-economic study, Nov. 1978, S. 7-14 bis 7-16 *

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4560584A (en) * 1983-12-23 1985-12-24 Universal Instruments Corporation Method and apparatus for applying solder masking to a circuit board
US4736704A (en) * 1983-12-23 1988-04-12 Universal Instruments Corporation Apparatus for applying solder masking to a circuit board
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
DE3728337A1 (en) * 1987-08-25 1989-03-16 Goerlitz Computerbau Gmbh Method for producing etched printed circuit boards
US5132248A (en) * 1988-05-31 1992-07-21 The United States Of America As Represented By The United States Department Of Energy Direct write with microelectronic circuit fabrication
US5114744A (en) * 1989-08-21 1992-05-19 Hewlett-Packard Company Method for applying a conductive trace pattern to a substrate
DE4035080A1 (en) * 1990-11-05 1992-05-07 Abb Patent Gmbh METHOD AND DEVICE FOR PRODUCING PARTIAL METAL LAYERS
DE4228523A1 (en) * 1991-11-13 1993-05-19 Siemens Ag Symbol printing process for circuit boards - uses ink jet print head to provide component symbols at specific board locations
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
WO1996018285A1 (en) * 1994-12-09 1996-06-13 Wolfgang Stubenvoll Direct and selective process for applying protective layers
DE19817530C2 (en) * 1998-04-09 2002-10-24 Bundesrep Deutschland Process for the production of thin-film structures
DE19817530A1 (en) * 1998-04-09 1999-10-14 Diagnostikforschung Inst Manufacture of thin film structures
WO1999053738A1 (en) * 1998-04-09 1999-10-21 Institut für Diagnostikforschung GmbH an der Freien Universität Berlin Method and device for producing thin-layer structures
DE19931110A1 (en) * 1999-07-06 2001-01-25 Ekra Eduard Kraft Gmbh Print head for ejecting a hot liquid medium and method for producing a joint comprising metallic solder
GB2367788A (en) * 2000-10-16 2002-04-17 Seiko Epson Corp Etching using an ink jet print head
US7431860B2 (en) 2000-10-16 2008-10-07 Seiko Epson Corporation Etching process
EP1665346A1 (en) * 2003-09-09 2006-06-07 CSG Solar AG Improved method of forming openings in an organic resin material
EP1665346A4 (en) * 2003-09-09 2006-11-15 Csg Solar Ag Improved method of forming openings in an organic resin material
US7446051B2 (en) 2003-09-09 2008-11-04 Csg Solar Ag Method of etching silicon
US7585781B2 (en) 2003-09-09 2009-09-08 Csg Solar Ag Method of forming openings in an organic resin material
US7592201B2 (en) 2003-09-09 2009-09-22 Csg Solar Ag Adjustments of masks by re-flow
US7960206B2 (en) 2003-09-09 2011-06-14 Csg Solar Ag Adjustment of masks by re-flow
WO2005087497A2 (en) * 2004-03-12 2005-09-22 Siemens Aktiengesellschaft 3d-ink jet structuring of highly topographic surfaces
WO2005087497A3 (en) * 2004-03-12 2006-05-04 Siemens Ag 3d-ink jet structuring of highly topographic surfaces

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