DE3175044D1 - Test apparatus for testing runs of a circuit board with at least one test head comprising a plurality of flexible contacts - Google Patents
Test apparatus for testing runs of a circuit board with at least one test head comprising a plurality of flexible contactsInfo
- Publication number
- DE3175044D1 DE3175044D1 DE8181109373T DE3175044T DE3175044D1 DE 3175044 D1 DE3175044 D1 DE 3175044D1 DE 8181109373 T DE8181109373 T DE 8181109373T DE 3175044 T DE3175044 T DE 3175044T DE 3175044 D1 DE3175044 D1 DE 3175044D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- test
- flexible contacts
- test apparatus
- testing runs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP81109373A EP0078339B1 (de) | 1981-10-30 | 1981-10-30 | Tastkopfanordnung für Leiterzugüberprüfung mit mindestens einem, eine Vielzahl von federnden Kontakten aufweisenden Tastkopf |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3175044D1 true DE3175044D1 (en) | 1986-09-04 |
Family
ID=8187992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8181109373T Expired DE3175044D1 (en) | 1981-10-30 | 1981-10-30 | Test apparatus for testing runs of a circuit board with at least one test head comprising a plurality of flexible contacts |
Country Status (4)
Country | Link |
---|---|
US (1) | US4520314A (de) |
EP (1) | EP0078339B1 (de) |
JP (1) | JPS5883271A (de) |
DE (1) | DE3175044D1 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3414968C2 (de) * | 1984-04-19 | 1986-07-10 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Ermittlung der unbekannten Zuordnung von Feldkoordinaten der Kontaktnadeln eines Kontaktnadelfeldes eines Prüflingsadapters zu den Adressen der Kontaktnadeln in einem Verdrahtungs-Prüfautomaten |
US4842539A (en) * | 1988-08-01 | 1989-06-27 | Westinghouse Electric Corp. | Strand-to-strand short circuit tester |
JPH03122570A (ja) * | 1989-10-05 | 1991-05-24 | Takeda Sangyo Kk | プローブカード |
US5070297A (en) * | 1990-06-04 | 1991-12-03 | Texas Instruments Incorporated | Full wafer integrated circuit testing device |
GB2249639A (en) * | 1990-09-06 | 1992-05-13 | Digital Equipment Int | Testing printed circuit boards |
US5172050A (en) * | 1991-02-15 | 1992-12-15 | Motorola, Inc. | Micromachined semiconductor probe card |
US5177439A (en) * | 1991-08-30 | 1993-01-05 | U.S. Philips Corporation | Probe card for testing unencapsulated semiconductor devices |
US5293516A (en) * | 1992-01-28 | 1994-03-08 | International Business Machines Corporation | Multiprobe apparatus |
DE9314259U1 (de) * | 1992-09-29 | 1994-02-10 | Tektronix Inc | Sondenadapter für elektonische Bauelemente |
DE59309969D1 (de) * | 1993-05-28 | 2000-04-13 | Ibm | Verfahren zur Herstellung eines Plattenstapels aus direkt miteinander verbundenen Siliziumplatten |
US5326428A (en) * | 1993-09-03 | 1994-07-05 | Micron Semiconductor, Inc. | Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
US5625299A (en) * | 1995-02-03 | 1997-04-29 | Uhling; Thomas F. | Multiple lead analog voltage probe with high signal integrity over a wide band width |
US5659483A (en) * | 1996-07-12 | 1997-08-19 | National Center For Manufacturing Sciences | System and method for analyzing conductor formation processes |
US6245444B1 (en) | 1997-10-02 | 2001-06-12 | New Jersey Institute Of Technology | Micromachined element and method of fabrication thereof |
DE19808664C2 (de) * | 1998-03-02 | 2002-03-14 | Infineon Technologies Ag | Integrierte Schaltung und Verfahren zu ihrer Prüfung |
JP4685240B2 (ja) * | 1998-07-08 | 2011-05-18 | カプレス エイピーエス | 多探針プローブ |
US7304486B2 (en) | 1998-07-08 | 2007-12-04 | Capres A/S | Nano-drive for high resolution positioning and for positioning of a multi-point probe |
DE69931778T2 (de) * | 1999-09-15 | 2007-06-14 | Capres A/S | Mehrpunktesonde |
US6232669B1 (en) * | 1999-10-12 | 2001-05-15 | Advantest Corp. | Contact structure having silicon finger contactors and total stack-up structure using same |
JP2001174482A (ja) * | 1999-12-21 | 2001-06-29 | Toshiba Corp | 電気的特性評価用接触針、プローブ構造体、プローブカード、および電気的特性評価用接触針の製造方法 |
DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | Wafersonde |
US6977515B2 (en) * | 2001-09-20 | 2005-12-20 | Wentworth Laboratories, Inc. | Method for forming photo-defined micro electrical contacts |
US6906540B2 (en) * | 2001-09-20 | 2005-06-14 | Wentworth Laboratories, Inc. | Method for chemically etching photo-defined micro electrical contacts |
WO2003062837A1 (fr) * | 2002-01-25 | 2003-07-31 | Advantest Corporation | Carte sonde |
WO2003100445A2 (en) * | 2002-05-23 | 2003-12-04 | Cascade Microtech, Inc. | Probe for testing a device under test |
US7057404B2 (en) * | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
KR100960496B1 (ko) * | 2003-10-31 | 2010-06-01 | 엘지디스플레이 주식회사 | 액정표시소자의 러빙방법 |
WO2005050706A2 (en) | 2003-11-14 | 2005-06-02 | Wentworth Laboratories, Inc. | Die design with integrated assembly aid |
DE202004021093U1 (de) | 2003-12-24 | 2006-09-28 | Cascade Microtech, Inc., Beaverton | Aktiver Halbleiterscheibenmessfühler |
JP2005201813A (ja) * | 2004-01-16 | 2005-07-28 | Shinko Electric Ind Co Ltd | 半導体検査装置及びコンタクトの製造方法 |
KR20070058522A (ko) | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | 양측 프루빙 구조 |
US7609077B2 (en) * | 2006-06-09 | 2009-10-27 | Cascade Microtech, Inc. | Differential signal probe with integral balun |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7403028B2 (en) * | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7439751B2 (en) * | 2006-09-27 | 2008-10-21 | Taiwan Semiconductor Manufacturing Co, Ltd. | Apparatus and method for testing conductive bumps |
US7970971B2 (en) * | 2007-01-30 | 2011-06-28 | Finisar Corporation | Tapping systems and methods |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
JP2009081060A (ja) * | 2007-09-26 | 2009-04-16 | Nok Corp | 燃料電池用配線取付構造及び燃料電池用配線 |
TW201109677A (en) * | 2009-06-03 | 2011-03-16 | Camtek Ltd | Method and system for measuring electrical properties of an electric circuit |
DE102011008261A1 (de) | 2011-01-11 | 2012-07-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Schiene für die elektrische Kontaktierung eines elektrisch leitfähigen Substrates |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3806801A (en) * | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
US3851161A (en) * | 1973-05-07 | 1974-11-26 | Burroughs Corp | Continuity network testing and fault isolating |
US3906363A (en) * | 1974-09-09 | 1975-09-16 | Richard O Fowler | Circuit board continuity testing device |
US3963985A (en) * | 1974-12-12 | 1976-06-15 | International Business Machines Corporation | Probe device having probe heads and method of adjusting distances between probe heads |
US4063172A (en) * | 1976-06-01 | 1977-12-13 | International Business Machines Corporation | Multiple site, differential displacement, surface contacting assembly |
US4177425A (en) * | 1977-09-06 | 1979-12-04 | Seymour Lenz | Multiple contact electrical test probe assembly |
US4182937A (en) * | 1978-09-21 | 1980-01-08 | International Standard Electric Corp. | Mechanically biased semiconductor strain sensitive microphone |
-
1981
- 1981-10-30 EP EP81109373A patent/EP0078339B1/de not_active Expired
- 1981-10-30 DE DE8181109373T patent/DE3175044D1/de not_active Expired
-
1982
- 1982-09-20 JP JP57162409A patent/JPS5883271A/ja active Granted
- 1982-10-08 US US06/433,341 patent/US4520314A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH028273B2 (de) | 1990-02-23 |
EP0078339B1 (de) | 1986-07-30 |
US4520314A (en) | 1985-05-28 |
JPS5883271A (ja) | 1983-05-19 |
EP0078339A1 (de) | 1983-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |