DE3266519D1 - Exposure process for transferring a mask pattern to a wafer - Google Patents

Exposure process for transferring a mask pattern to a wafer

Info

Publication number
DE3266519D1
DE3266519D1 DE8282105096T DE3266519T DE3266519D1 DE 3266519 D1 DE3266519 D1 DE 3266519D1 DE 8282105096 T DE8282105096 T DE 8282105096T DE 3266519 T DE3266519 T DE 3266519T DE 3266519 D1 DE3266519 D1 DE 3266519D1
Authority
DE
Germany
Prior art keywords
wafer
transferring
mask pattern
exposure process
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282105096T
Other languages
English (en)
Inventor
Motoya Taniguchi
Mitsuyoshi Koizumi
Nobuyuki Akiyama
Yukio Kembo
Minoru Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3266519D1 publication Critical patent/DE3266519D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
DE8282105096T 1981-06-12 1982-06-11 Exposure process for transferring a mask pattern to a wafer Expired DE3266519D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56089545A JPS57204547A (en) 1981-06-12 1981-06-12 Exposing method

Publications (1)

Publication Number Publication Date
DE3266519D1 true DE3266519D1 (en) 1985-10-31

Family

ID=13973781

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282105096T Expired DE3266519D1 (en) 1981-06-12 1982-06-11 Exposure process for transferring a mask pattern to a wafer

Country Status (4)

Country Link
US (1) US4475223A (de)
EP (1) EP0077878B1 (de)
JP (1) JPS57204547A (de)
DE (1) DE3266519D1 (de)

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US8217304B2 (en) 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
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US6483071B1 (en) * 2000-05-16 2002-11-19 General Scanning Inc. Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
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JP2002175770A (ja) * 2000-12-08 2002-06-21 Hitachi Ltd 気体排気用試料室及びそれを用いた回路パターン形成装置
US6537844B1 (en) 2001-05-31 2003-03-25 Kabushiki Kaisha Toshiba Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server
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JP2004335855A (ja) * 2003-05-09 2004-11-25 Rohm Co Ltd 露光装置及び露光方法
US7414701B2 (en) * 2003-10-03 2008-08-19 Asml Holding N.V. Method and systems for total focus deviation adjustments on maskless lithography systems
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US7072024B2 (en) 2004-01-20 2006-07-04 Nikon Corporation Lithographic projection method and apparatus
US6980279B2 (en) 2004-01-22 2005-12-27 Nikon Corporation Interferometer system for measuring a height of wafer stage
US8046049B2 (en) 2004-02-23 2011-10-25 Biosense Webster, Inc. Robotically guided catheter
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US8215946B2 (en) 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
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CN104658950B (zh) * 2010-12-20 2018-01-19 Ev 集团 E·索尔纳有限责任公司 用于保持晶片的容纳装置及用于将晶片对齐的装置和方法
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JP6607923B2 (ja) * 2014-08-05 2019-11-20 インテヴァック インコーポレイテッド 注入マスク及びアライメント
JP2016143706A (ja) * 2015-01-30 2016-08-08 株式会社東芝 基板保持装置および半導体装置の製造方法
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KR101911766B1 (ko) * 2016-12-08 2018-10-26 한양대학교 산학협력단 반도체 기판용 진공 척 및 이를 이용한 검사 대상물의 검사 방법
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Also Published As

Publication number Publication date
EP0077878B1 (de) 1985-09-25
EP0077878A1 (de) 1983-05-04
JPS57204547A (en) 1982-12-15
US4475223A (en) 1984-10-02
JPS6349892B2 (de) 1988-10-06

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