DE3270561D1 - A method for manufacturing a plastic encapsulated semiconductor device - Google Patents

A method for manufacturing a plastic encapsulated semiconductor device

Info

Publication number
DE3270561D1
DE3270561D1 DE8282103521T DE3270561T DE3270561D1 DE 3270561 D1 DE3270561 D1 DE 3270561D1 DE 8282103521 T DE8282103521 T DE 8282103521T DE 3270561 T DE3270561 T DE 3270561T DE 3270561 D1 DE3270561 D1 DE 3270561D1
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor device
encapsulated semiconductor
plastic encapsulated
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282103521T
Other languages
English (en)
Inventor
Kenichi Tateno
Masami Yokozawa
Hiroyuki Fujii
Mikio Nishikawa
Michio Katoh
Fujio Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6489381A external-priority patent/JPS57178352A/ja
Priority claimed from JP6430781A external-priority patent/JPS5710325A/ja
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of DE3270561D1 publication Critical patent/DE3270561D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12188—All metal or with adjacent metals having marginal feature for indexing or weakened portion for severing
    • Y10T428/12194—For severing perpendicular to longitudinal dimension
DE8282103521T 1981-04-28 1982-04-26 A method for manufacturing a plastic encapsulated semiconductor device Expired DE3270561D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6489381A JPS57178352A (en) 1981-04-28 1981-04-28 Manufacture of resin sealing type semiconductor device and lead frame employed thereon
JP6430781A JPS5710325A (en) 1980-05-16 1981-04-30 Device for simultaneously and continuously supplying powdered solid or liquid into treating machine

Publications (1)

Publication Number Publication Date
DE3270561D1 true DE3270561D1 (en) 1986-05-22

Family

ID=26405427

Family Applications (2)

Application Number Title Priority Date Filing Date
DE198282103521T Pending DE63811T1 (de) 1981-04-28 1982-04-26 Verfahren zum herstellen einer in kunststoff verkapselten halbleiteranordnung und ein leitergitter dafuer.
DE8282103521T Expired DE3270561D1 (en) 1981-04-28 1982-04-26 A method for manufacturing a plastic encapsulated semiconductor device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE198282103521T Pending DE63811T1 (de) 1981-04-28 1982-04-26 Verfahren zum herstellen einer in kunststoff verkapselten halbleiteranordnung und ein leitergitter dafuer.

Country Status (4)

Country Link
US (2) US4451973A (de)
EP (1) EP0063811B1 (de)
CA (1) CA1200623A (de)
DE (2) DE63811T1 (de)

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
US4641418A (en) * 1982-08-30 1987-02-10 International Rectifier Corporation Molding process for semiconductor devices and lead frame structure therefor
JPS59130449A (ja) * 1983-01-17 1984-07-27 Nec Corp 絶縁型半導体素子用リードフレーム
JPS59135753A (ja) * 1983-01-25 1984-08-04 Toshiba Corp 半導体装置とその製造方法
IT1212780B (it) * 1983-10-21 1989-11-30 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.
JPS60186044A (ja) * 1983-12-12 1985-09-21 テキサス　インスツルメンツ　インコ−ポレイテツド 集積回路装置
JPS60128646A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
JPS60176259A (ja) * 1984-02-22 1985-09-10 Toshiba Corp 樹脂封止形半導体装置の製造方法
IT1180514B (it) * 1984-07-27 1987-09-23 Arcotroniks Italia Spa Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US5098630A (en) * 1985-03-08 1992-03-24 Olympus Optical Co., Ltd. Method of molding a solid state image pickup device
EP0206771B1 (de) * 1985-06-20 1992-03-11 Kabushiki Kaisha Toshiba Verkapselte Halbleiteranordnung
JPH0652732B2 (ja) * 1985-08-14 1994-07-06 三菱電機株式会社 パツシベ−シヨン膜の形成方法
US4721453A (en) * 1986-03-05 1988-01-26 Gte Communication Systems Corporation Apparatus for encapsulating semiconductors
EP0257681A3 (de) * 1986-08-27 1990-02-07 STMicroelectronics S.r.l. Verfahren zur Herstellung von in Kunststoff eingeschmolzenen Halbleiterbauelementen und damit hergestellte Bauelemente
US4857989A (en) * 1986-09-04 1989-08-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USRE37690E1 (en) * 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device
US4942452A (en) * 1987-02-25 1990-07-17 Hitachi, Ltd. Lead frame and semiconductor device
IT1214254B (it) * 1987-09-23 1990-01-10 Sgs Microelettonica S P A Dispositivo a semiconduttore in contenitore plastico o ceramico con "chips" fissati su entrambi i lati dell'isola centrale del "frame".
US4904539A (en) * 1987-09-30 1990-02-27 Amp Incorporated Continuous strip of electrical component assemblies and method of making same
JPH01179332A (ja) * 1987-12-31 1989-07-17 Sanken Electric Co Ltd 樹脂封止型電子装置の製造方法
US5049055A (en) * 1987-12-31 1991-09-17 Sanken Electric Co., Ltd. Mold assembly
US5133921A (en) * 1987-12-31 1992-07-28 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
US4952999A (en) * 1988-04-26 1990-08-28 National Semiconductor Corporation Method and apparatus for reducing die stress
US5049976A (en) * 1989-01-10 1991-09-17 National Semiconductor Corporation Stress reduction package and process
US4908935A (en) * 1989-03-22 1990-03-20 American Telephone And Telegraph Company, At&T Bell Laboratories Method for fabricating electronic devices
EP0400177A1 (de) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Verbindung eines Halbleiterbauelements mit einem Metallträger
US4991002A (en) * 1990-02-14 1991-02-05 Motorola Inc. Modular power device assembly
US5083368A (en) * 1990-02-14 1992-01-28 Motorola Inc. Method of forming modular power device assembly
US5019893A (en) * 1990-03-01 1991-05-28 Motorola, Inc. Single package, multiple, electrically isolated power semiconductor devices
JPH0419114A (ja) * 1990-05-15 1992-01-23 Mitsubishi Electric Corp インサート電極モールド体の製造方法
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5122858A (en) * 1990-09-10 1992-06-16 Olin Corporation Lead frame having polymer coated surface portions
IT1247649B (it) * 1990-10-31 1994-12-28 Sgs Thomson Microelectronics Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
MX9205128A (es) * 1991-09-30 1993-04-01 Motorola Inc Metodo para procesar un bloque de circuito integrado semiconductor.
US5804870A (en) * 1992-06-26 1998-09-08 Staktek Corporation Hermetically sealed integrated circuit lead-on package configuration
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5367196A (en) * 1992-09-17 1994-11-22 Olin Corporation Molded plastic semiconductor package including an aluminum alloy heat spreader
US5608267A (en) * 1992-09-17 1997-03-04 Olin Corporation Molded plastic semiconductor package including heat spreader
EP0665591A1 (de) * 1992-11-06 1995-08-02 Motorola, Inc. Verfahren zur herstellung einer Verpackung für Leistungsschaltungen
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
JP2927660B2 (ja) * 1993-01-25 1999-07-28 シャープ株式会社 樹脂封止型半導体装置の製造方法
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5748658A (en) * 1993-10-22 1998-05-05 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device and optical pickup head
JPH0846104A (ja) * 1994-05-31 1996-02-16 Motorola Inc 表面実装電子素子およびその製造方法
US5506753A (en) * 1994-09-26 1996-04-09 International Business Machines Corporation Method and apparatus for a stress relieved electronic module
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US5886400A (en) * 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
JP3345241B2 (ja) * 1995-11-30 2002-11-18 三菱電機株式会社 半導体装置
JP3305941B2 (ja) * 1996-01-22 2002-07-24 株式会社村田製作所 電子部品
US5938038A (en) 1996-08-02 1999-08-17 Dial Tool Industries, Inc. Parts carrier strip and apparatus for assembling parts in such a strip
US5945732A (en) 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6048744A (en) 1997-09-15 2000-04-11 Micron Technology, Inc. Integrated circuit package alignment feature
US6252772B1 (en) * 1999-02-10 2001-06-26 Micron Technology, Inc. Removable heat sink bumpers on a quad flat package
KR200168178Y1 (ko) * 1999-08-27 2000-02-15 광전자주식회사 파워 패키지 리드 프레임
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6373126B1 (en) * 2000-04-26 2002-04-16 Advanced Micro Devices, Inc. Method for reducing IC package delamination by use of internal baffles
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6469907B1 (en) 2000-10-23 2002-10-22 Team Pacific, Corporation Packaging for power and other circuitry
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US6991960B2 (en) * 2001-08-30 2006-01-31 Micron Technology, Inc. Method of semiconductor device package alignment and method of testing
DE10221085B4 (de) * 2002-05-11 2012-07-26 Robert Bosch Gmbh Baugruppe mit einer Verbindungseinrichtung zum Kontaktieren eines Halbleiter-Bauelements und Herstellungsverfahren
DE10247610A1 (de) * 2002-10-11 2004-04-29 Micronas Gmbh Elektronisches Bauelement mit einem Systemträger
US20040113240A1 (en) * 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
US7008825B1 (en) * 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7342297B1 (en) 2004-04-22 2008-03-11 National Semiconductor Corporation Sawn power package
US7005728B1 (en) 2004-06-03 2006-02-28 National Semiconductor Corporation Lead configuration for inline packages
US8334583B2 (en) * 2005-07-20 2012-12-18 Infineon Technologies Ag Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
US7602054B2 (en) * 2005-10-05 2009-10-13 Semiconductor Components Industries, L.L.C. Method of forming a molded array package device having an exposed tab and structure
US7588999B2 (en) * 2005-10-28 2009-09-15 Semiconductor Components Industries, Llc Method of forming a leaded molded array package
US20070126445A1 (en) * 2005-11-30 2007-06-07 Micron Technology, Inc. Integrated circuit package testing devices and methods of making and using same
ITTO20070489A1 (it) * 2007-07-05 2009-01-06 St Microelectronics Srl Procedimento e sistema di fabbricazione di un dispositivo a semiconduttore incapsulato
US20190097524A1 (en) * 2011-09-13 2019-03-28 Fsp Technology Inc. Circuit having snubber circuit in power supply device
NL2010379C2 (nl) * 2013-03-01 2014-09-03 Besi Netherlands B V Mal, drager met te omhullen elektronische componenten, drager met omhulde elektronische componenten, gesepareerd omhulde elektronisch component en werkwijze voor het omhullen van elektronische componenten.

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2965819A (en) * 1958-08-07 1960-12-20 Rosenbaum Jacob Heat dissipating electronic mounting apparatus
DE1070302B (de) * 1959-09-30
US3716764A (en) * 1963-12-16 1973-02-13 Texas Instruments Inc Process for encapsulating electronic components in plastic
US3391426A (en) * 1965-10-22 1968-07-09 Motorola Inc Molding apparatus
US3574815A (en) * 1966-07-13 1971-04-13 Motorola Inc Method of fabricating a plastic encapsulated semiconductor assembly
GB1158978A (en) * 1968-06-28 1969-07-23 Standard Telephones Cables Ltd Semiconductor Devices.
GB1275343A (en) * 1970-04-02 1972-05-24 Ferranti Ltd Improvements relating to lead frames for use with semiconductor devices
JPS493315B1 (de) * 1970-09-28 1974-01-25
US4003544A (en) * 1973-06-11 1977-01-18 Motorola, Inc. Gateless injection mold for encapsulating semiconductor devices
US3882807A (en) * 1974-04-08 1975-05-13 Texas Instruments Inc Method of separating dual inline packages from a strip
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
JPS5238885A (en) * 1975-09-22 1977-03-25 Nec Home Electronics Ltd Method for production of semiconductor device
NL189379C (nl) * 1977-05-05 1993-03-16 Richardus Henricus Johannes Fi Werkwijze voor inkapselen van micro-elektronische elementen.
US4234666A (en) * 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5655065A (en) * 1979-10-12 1981-05-15 Toshiba Corp Semiconductor lead frame
US4322737A (en) * 1979-11-20 1982-03-30 Intel Corporation Integrated circuit micropackaging
US4331740A (en) * 1980-04-14 1982-05-25 National Semiconductor Corporation Gang bonding interconnect tape process and structure for semiconductor device automatic assembly
JPS575351A (en) * 1980-06-12 1982-01-12 Nec Corp Semiconductor device
CA1195782A (en) * 1981-07-06 1985-10-22 Mikio Nishikawa Lead frame for plastic encapsulated semiconductor device

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US4451973A (en) 1984-06-05
CA1200623A (en) 1986-02-11
US4589010A (en) 1986-05-13
EP0063811B1 (de) 1986-04-16
DE63811T1 (de) 1983-04-28
EP0063811A1 (de) 1982-11-03

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