DE3271762D1 - Dual-in-line package assembly - Google Patents

Dual-in-line package assembly

Info

Publication number
DE3271762D1
DE3271762D1 DE8282303406T DE3271762T DE3271762D1 DE 3271762 D1 DE3271762 D1 DE 3271762D1 DE 8282303406 T DE8282303406 T DE 8282303406T DE 3271762 T DE3271762 T DE 3271762T DE 3271762 D1 DE3271762 D1 DE 3271762D1
Authority
DE
Germany
Prior art keywords
dual
package assembly
line package
line
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282303406T
Other languages
English (en)
Inventor
Amir-Akbar Sadigh-Behzadi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Installation Products Inc
Original Assignee
Thomas and Betts Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomas and Betts Corp filed Critical Thomas and Betts Corp
Application granted granted Critical
Publication of DE3271762D1 publication Critical patent/DE3271762D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads
DE8282303406T 1981-07-02 1982-06-29 Dual-in-line package assembly Expired DE3271762D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/279,943 US4406508A (en) 1981-07-02 1981-07-02 Dual-in-line package assembly

Publications (1)

Publication Number Publication Date
DE3271762D1 true DE3271762D1 (en) 1986-07-24

Family

ID=23071000

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282303406T Expired DE3271762D1 (en) 1981-07-02 1982-06-29 Dual-in-line package assembly

Country Status (5)

Country Link
US (1) US4406508A (de)
EP (1) EP0070120B1 (de)
JP (1) JPS5810843A (de)
CA (1) CA1182539A (de)
DE (1) DE3271762D1 (de)

Families Citing this family (51)

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US4642734A (en) * 1981-09-10 1987-02-10 Research, Incorporated Integrated circuit chip switch
DE3300706C2 (de) * 1983-01-11 1986-08-28 Nixdorf Computer Ag, 4790 Paderborn Einrichtung für die Steckmontage eines elektrischen Schaltungsträgers auf einem elektrischen Gerät oder dergleichen sowie Verfahren zur Herstellung der Einrichtung
CA1216644A (en) * 1983-08-16 1987-01-13 Amir-Akbar Sadigh-Behzadi Electrical connecting device including socket therefor
US4527850A (en) * 1983-11-29 1985-07-09 Sealectro Corp. Zero insertion force socket
US4829818A (en) * 1983-12-27 1989-05-16 Honeywell Inc. Flow sensor housing
US4541676A (en) * 1984-03-19 1985-09-17 Itt Corporation Chip carrier test adapter
KR890004820B1 (ko) * 1984-03-28 1989-11-27 인터내셔널 비지네스 머신즈 코포레이션 배저장밀도의 메모리 모듈 및 보드와 그 형성방법
US4637670A (en) * 1984-04-23 1987-01-20 Amp Incorporated Dual in-line package carrier assembly
DE3418363A1 (de) * 1984-05-17 1985-11-21 Franz 8195 Moosham Fischer Hochprofil-ic-fassung
JPS619802U (ja) * 1984-06-20 1986-01-21 ロ−ム株式会社 小型抵抗器
US4696525A (en) * 1985-12-13 1987-09-29 Amp Incorporated Socket for stacking integrated circuit packages
US4727456A (en) * 1986-05-06 1988-02-23 Northern Telecom Limited Leadless electronic component carrier
US4829553A (en) * 1988-01-19 1989-05-09 Matsushita Electric Industrial Co., Ltd. Chip type component
US5053199A (en) * 1989-02-21 1991-10-01 Boehringer Mannheim Corporation Electronically readable information carrier
JPH02191304A (ja) * 1989-12-16 1990-07-27 Rohm Co Ltd チップ抵抗器の製造方法
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5350306A (en) * 1992-12-23 1994-09-27 Augat Inc. Stackable interconnection socket
US5318451A (en) * 1993-01-25 1994-06-07 Augat Inc. Stackable interconnection socket
US5330359A (en) * 1993-03-26 1994-07-19 The Whitaker Corporation Socket for stacking integrated circuit chips
US6323060B1 (en) 1999-05-05 2001-11-27 Dense-Pac Microsystems, Inc. Stackable flex circuit IC package and method of making same
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6262895B1 (en) 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7053478B2 (en) 2001-10-26 2006-05-30 Staktek Group L.P. Pitch change and chip scale stacking system
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US7026708B2 (en) * 2001-10-26 2006-04-11 Staktek Group L.P. Low profile chip scale stacking system and method
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US7310458B2 (en) 2001-10-26 2007-12-18 Staktek Group L.P. Stacked module systems and methods
US20060255446A1 (en) 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US20030234443A1 (en) 2001-10-26 2003-12-25 Staktek Group, L.P. Low profile stacking system and method
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US7202555B2 (en) 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US6914324B2 (en) 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US6841029B2 (en) * 2003-03-27 2005-01-11 Advanced Cardiovascular Systems, Inc. Surface modification of expanded ultra high molecular weight polyethylene (eUHMWPE) for improved bondability
US7542304B2 (en) 2003-09-15 2009-06-02 Entorian Technologies, Lp Memory expansion and integrated circuit stacking system and method
US7309914B2 (en) 2005-01-20 2007-12-18 Staktek Group L.P. Inverted CSP stacking system and method
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US7576995B2 (en) 2005-11-04 2009-08-18 Entorian Technologies, Lp Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
US7605454B2 (en) 2006-01-11 2009-10-20 Entorian Technologies, Lp Memory card and method for devising
US7508069B2 (en) 2006-01-11 2009-03-24 Entorian Technologies, Lp Managed memory component
US7508058B2 (en) 2006-01-11 2009-03-24 Entorian Technologies, Lp Stacked integrated circuit module
US7304382B2 (en) 2006-01-11 2007-12-04 Staktek Group L.P. Managed memory component
US7608920B2 (en) 2006-01-11 2009-10-27 Entorian Technologies, Lp Memory card and method for devising
US7468553B2 (en) 2006-10-20 2008-12-23 Entorian Technologies, Lp Stackable micropackages and stacked modules
US7417310B2 (en) 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction
WO2015029990A1 (ja) * 2013-08-30 2015-03-05 矢崎総業株式会社 電子部品と端子金具との接続構造

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1134565A (en) * 1966-02-03 1968-11-27 Amp Inc An electric circuit assembly
GB1152765A (en) * 1967-01-24 1969-05-21 Amp Inc An Electrical Circuit Assembly
US3660799A (en) * 1969-06-17 1972-05-02 Honeywell Inf Systems Connector device
US4356532A (en) * 1980-07-18 1982-10-26 Thomas & Betts Corporation Electronic package and accessory component assembly
US3611269A (en) * 1970-03-19 1971-10-05 Amp Inc Electrical circuit assembly
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US3951495A (en) * 1974-09-23 1976-04-20 Advanced Memory Systems, Inc. Leadless package receptacle
US4045105A (en) * 1974-09-23 1977-08-30 Advanced Memory Systems, Inc. Interconnected leadless package receptacle
US4018494A (en) * 1975-06-10 1977-04-19 Amp Incorporated Interconnection for electrically connecting two vertically stacked electronic packages
JPS5910066B2 (ja) * 1975-07-14 1984-03-06 松下電器産業株式会社 集積回路装置
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate
US4080026A (en) * 1976-10-28 1978-03-21 Richard Gianni Multi-level socket for an integrated circuit
US4116519A (en) * 1977-08-02 1978-09-26 Amp Incorporated Electrical connections for chip carriers
US4116518A (en) * 1977-08-31 1978-09-26 Ncr Corporation Clip for paralleling packaged integrated circuit chips
US4364620A (en) * 1980-09-05 1982-12-21 Mostek Corporation Socket for housing a plurality of integrated circuits

Also Published As

Publication number Publication date
CA1182539A (en) 1985-02-12
JPS5810843A (ja) 1983-01-21
US4406508A (en) 1983-09-27
EP0070120B1 (de) 1986-06-18
EP0070120A1 (de) 1983-01-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee