DE3380977D1 - Sendeempfangsmodul fuer optische nachrichtenuebermittlung. - Google Patents

Sendeempfangsmodul fuer optische nachrichtenuebermittlung.

Info

Publication number
DE3380977D1
DE3380977D1 DE8383110609T DE3380977T DE3380977D1 DE 3380977 D1 DE3380977 D1 DE 3380977D1 DE 8383110609 T DE8383110609 T DE 8383110609T DE 3380977 T DE3380977 T DE 3380977T DE 3380977 D1 DE3380977 D1 DE 3380977D1
Authority
DE
Germany
Prior art keywords
receiver module
message transmission
optical message
send receiver
send
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8383110609T
Other languages
English (en)
Inventor
Hatsuo - Toshiba-Isog Takezawa
Satoshi Takebe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3380977D1 publication Critical patent/DE3380977D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
DE8383110609T 1982-10-26 1983-10-24 Sendeempfangsmodul fuer optische nachrichtenuebermittlung. Expired - Lifetime DE3380977D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57186688A JPS5977402A (ja) 1982-10-26 1982-10-26 光リンク

Publications (1)

Publication Number Publication Date
DE3380977D1 true DE3380977D1 (de) 1990-01-18

Family

ID=16192893

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383110609T Expired - Lifetime DE3380977D1 (de) 1982-10-26 1983-10-24 Sendeempfangsmodul fuer optische nachrichtenuebermittlung.

Country Status (4)

Country Link
US (1) US4625333A (de)
EP (1) EP0112458B1 (de)
JP (1) JPS5977402A (de)
DE (1) DE3380977D1 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0101872B1 (de) * 1982-07-19 1990-01-03 Kabushiki Kaisha Toshiba Sendeempfangsmodul für optische Nachrichtenübermittlung
JPS60252308A (ja) * 1984-05-30 1985-12-13 Hitachi Ltd 電気及び光学回路素子基板
JPS61126213U (de) * 1984-10-01 1986-08-08
JPS61126207U (de) * 1984-10-01 1986-08-08
NL8403535A (nl) * 1984-11-21 1986-06-16 Philips Nv Inrichting voor het optisch koppelen van een stralingsbron aan een optische transmissievezel.
DE3517388A1 (de) * 1985-05-14 1986-11-20 Allied Corp., Morristown, N.J. Anschlussteil fuer ein faser-optisches kabel
DE3637746A1 (de) * 1986-11-05 1988-05-11 Albatron Gmbh Opto-elektronischer wandler mit einem anschlussglied fuer einen lichtwellenleiter
US4844573A (en) * 1987-05-22 1989-07-04 Aster Corporation Electro-optical converter including ridgid support for optical fiber coupler, telephone set using the coupler and method of making same
US5011246A (en) * 1989-05-19 1991-04-30 E. I. Du Pont De Nemours And Company Housing for an opto-electronic device
US5002357A (en) * 1989-11-09 1991-03-26 Square D Company Optical fiber coupler
US5005939A (en) * 1990-03-26 1991-04-09 International Business Machines Corporation Optoelectronic assembly
US5202943A (en) * 1991-10-04 1993-04-13 International Business Machines Corporation Optoelectronic assembly with alignment member
US5594579A (en) * 1991-12-26 1997-01-14 Motorola, Inc. Radio permitting information transfer between radio frequency shielded sub-systems
US5432630A (en) * 1992-09-11 1995-07-11 Motorola, Inc. Optical bus with optical transceiver modules and method of manufacture
US5337398A (en) * 1992-11-30 1994-08-09 At&T Bell Laboratories Single in-line optical package
US5416624A (en) * 1993-05-17 1995-05-16 Siemens Aktiengesellschaft Bidirectional optical transmission and reception arrangement
US5493437A (en) * 1993-09-13 1996-02-20 Motorola External communication link for a credit card pager
US5528407A (en) * 1993-12-27 1996-06-18 Rohm Co., Ltd. Transceiver module for optical communication
US5418870A (en) * 1994-04-28 1995-05-23 Corning Incorporated Coaxial coupler with integrated source/ring detector
US5528408A (en) * 1994-10-12 1996-06-18 Methode Electronics, Inc. Small footprint optoelectronic transceiver with laser
US6220878B1 (en) 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
US5717533A (en) 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US5546281A (en) 1995-01-13 1996-08-13 Methode Electronics, Inc. Removable optoelectronic transceiver module with potting box
JP3587971B2 (ja) * 1997-09-26 2004-11-10 富士通株式会社 光通信ユニット
FI105606B (fi) * 1997-10-13 2000-09-15 Nokia Mobile Phones Ltd Optinen tiedonsiirtoyksikkö
US6203333B1 (en) 1998-04-22 2001-03-20 Stratos Lightwave, Inc. High speed interface converter module
US6179627B1 (en) 1998-04-22 2001-01-30 Stratos Lightwave, Inc. High speed interface converter module
US6873800B1 (en) 1999-05-26 2005-03-29 Jds Uniphase Corporation Hot pluggable optical transceiver in a small form pluggable package
US6213651B1 (en) 1999-05-26 2001-04-10 E20 Communications, Inc. Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
US7013088B1 (en) 1999-05-26 2006-03-14 Jds Uniphase Corporation Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers
US6952532B2 (en) 1999-05-27 2005-10-04 Jds Uniphase Corporation Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US6632030B2 (en) 1999-05-27 2003-10-14 E20 Communications, Inc. Light bending optical block for fiber optic modules
US7116912B2 (en) * 1999-05-27 2006-10-03 Jds Uniphase Corporation Method and apparatus for pluggable fiber optic modules
US20040069997A1 (en) * 1999-05-27 2004-04-15 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20010030789A1 (en) * 1999-05-27 2001-10-18 Wenbin Jiang Method and apparatus for fiber optic modules
US6220873B1 (en) 1999-08-10 2001-04-24 Stratos Lightwave, Inc. Modified contact traces for interface converter
US6925256B1 (en) * 2000-02-18 2005-08-02 Diplex Optical discriminator for transmitting and receiving in both optical fiber and free space applications
US6782161B2 (en) * 2001-02-05 2004-08-24 Derma Laser Inc. Laser diode apparatus provided with an aiming beam and injection method therefor
US20020131125A1 (en) * 2001-03-16 2002-09-19 Myers Michael H. Replicated-spectrum photonic transceiving
US6407846B1 (en) 2001-03-16 2002-06-18 All Optical Networks, Inc. Photonic wavelength shifting method
US6635866B2 (en) 2001-04-19 2003-10-21 Internation Business Machines Corporation Multi-functional fiber optic coupler
US6865345B2 (en) * 2001-08-28 2005-03-08 Agilent Technologies, Inc. Frequency translating devices and frequency translating measurement systems that utilize light-activated resistors
US7359646B2 (en) * 2001-09-14 2008-04-15 Finisar Corporation Transmitter and/or receiver arrangement of optical signal transmission
JP2007310083A (ja) * 2006-05-17 2007-11-29 Fuji Xerox Co Ltd 光伝送モジュールおよびその製造方法
JP4985772B2 (ja) * 2007-06-28 2012-07-25 富士通株式会社 光サブアセンブリの製造方法および光サブアセンブリ
US7731433B1 (en) * 2008-12-05 2010-06-08 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optoelectronic surface-mounted device and method for forming an optoelectronic surface-mounted device
US8457458B2 (en) * 2010-07-23 2013-06-04 Tyco Electronics Corporation Imaging interface for optical components
US9170387B2 (en) * 2011-09-29 2015-10-27 Corning Cable Systems Llc Optical component assemblies
TWI575271B (zh) * 2013-03-06 2017-03-21 鴻海精密工業股份有限公司 光通訊模組及用於該光通訊模組之點膠方法
JP6070741B2 (ja) * 2015-03-02 2017-02-01 住友電気工業株式会社 光モジュール
JP7182093B2 (ja) 2019-12-24 2022-12-02 矢崎総業株式会社 光コネクタ及び光コネクタ装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842263A (en) * 1973-02-01 1974-10-15 Gen Electric Molded opto-electronic transducer
JPS5642148B2 (de) * 1975-01-24 1981-10-02
US4427879A (en) * 1975-04-18 1984-01-24 Allied Corporation Optoelectronic connector assembly
DE2615389A1 (de) * 1975-04-18 1976-10-21 Bunker Ramo Optisch-elektronische verbindung
JPS53115071A (en) * 1977-03-18 1978-10-07 Omron Tateisi Electronics Co Photoelectric switch
FR2421443A1 (fr) * 1978-03-31 1979-10-26 Lignes Telegraph Telephon Convertisseur opto-electronique pour extremite de cable a fibres optiques
US4307934A (en) * 1978-05-08 1981-12-29 General Dynamics, Pomona Division Packaged fiber optic modules
NL7908536A (nl) * 1979-11-23 1981-06-16 Philips Nv Omhulling voor een fotodiode.
JPS56116677A (en) * 1980-02-20 1981-09-12 Matsushita Electric Ind Co Ltd Coupling structure for optical signal transmitter

Also Published As

Publication number Publication date
EP0112458A2 (de) 1984-07-04
EP0112458A3 (en) 1986-12-30
JPS5977402A (ja) 1984-05-02
EP0112458B1 (de) 1989-12-13
US4625333A (en) 1986-11-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee