DE3382817T2 - Verfahren und Apparat zur Einkapselung einer auf einem Leiterrahmen montierten Halbleitervorrichtung - Google Patents

Verfahren und Apparat zur Einkapselung einer auf einem Leiterrahmen montierten Halbleitervorrichtung

Info

Publication number
DE3382817T2
DE3382817T2 DE3382817T DE3382817T DE3382817T2 DE 3382817 T2 DE3382817 T2 DE 3382817T2 DE 3382817 T DE3382817 T DE 3382817T DE 3382817 T DE3382817 T DE 3382817T DE 3382817 T2 DE3382817 T2 DE 3382817T2
Authority
DE
Germany
Prior art keywords
encapsulating
semiconductor device
lead frame
device mounted
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3382817T
Other languages
English (en)
Other versions
DE3382817D1 (de
Inventor
John W Orcutt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE3382817D1 publication Critical patent/DE3382817D1/de
Publication of DE3382817T2 publication Critical patent/DE3382817T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
DE3382817T 1982-10-04 1983-10-04 Verfahren und Apparat zur Einkapselung einer auf einem Leiterrahmen montierten Halbleitervorrichtung Expired - Fee Related DE3382817T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/432,594 US4504435A (en) 1982-10-04 1982-10-04 Method for semiconductor device packaging

Publications (2)

Publication Number Publication Date
DE3382817D1 DE3382817D1 (de) 1998-01-29
DE3382817T2 true DE3382817T2 (de) 1998-05-28

Family

ID=23716804

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3382817T Expired - Fee Related DE3382817T2 (de) 1982-10-04 1983-10-04 Verfahren und Apparat zur Einkapselung einer auf einem Leiterrahmen montierten Halbleitervorrichtung
DE8383305898T Expired DE3379298D1 (en) 1982-10-04 1983-10-04 Method and apparatus for lead frame and semiconductor device encapsulation

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE8383305898T Expired DE3379298D1 (en) 1982-10-04 1983-10-04 Method and apparatus for lead frame and semiconductor device encapsulation

Country Status (5)

Country Link
US (1) US4504435A (de)
EP (1) EP0110518B1 (de)
JP (1) JPS5989424A (de)
DE (2) DE3382817T2 (de)
PT (1) PT77445B (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4641418A (en) * 1982-08-30 1987-02-10 International Rectifier Corporation Molding process for semiconductor devices and lead frame structure therefor
EP0305589B1 (de) * 1982-10-04 1997-12-17 Texas Instruments Incorporated Verfahren und Apparat zur Einkapselung einer auf einem Leiterrahmen montierten Halbleitervorrichtung
DE3320700A1 (de) * 1983-06-08 1984-12-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum kunststoffumhuellen von elektrischen bauelementen
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS6134749U (ja) * 1984-08-03 1986-03-03 富士通オ−トメ−シヨン株式会社 半導体装置用リ−ドフレ−ム連結体
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
DE3526303A1 (de) * 1985-07-23 1987-01-29 Siemens Ag Einrichtung zum vergiessen von elektrischen bauteilen
FR2598258B1 (fr) * 1986-04-30 1988-10-07 Aix Les Bains Composants Procede d'encapsulation de circuits integres.
US4741507A (en) * 1986-06-02 1988-05-03 Motorola Inc. Self-cleaning mold
EP0253664B1 (de) * 1986-07-16 1992-10-14 Canon Kabushiki Kaisha Halbleiterphotosensor und Verfahren zu dessen Herstellung
JP2724491B2 (ja) * 1989-02-01 1998-03-09 株式会社日立製作所 成形装置
JP2588283B2 (ja) * 1989-09-29 1997-03-05 株式会社東芝 樹脂封止型半導体装置
US5907184A (en) * 1998-03-25 1999-05-25 Micron Technology, Inc. Integrated circuit package electrical enhancement
US6173490B1 (en) * 1997-08-20 2001-01-16 National Semiconductor Corporation Method for forming a panel of packaged integrated circuits
US6130473A (en) * 1998-04-02 2000-10-10 National Semiconductor Corporation Lead frame chip scale package
DE19921867C2 (de) * 1999-05-11 2001-08-30 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauelements mit mindestens einem verkapselten Chip auf einem Substrat
US6257857B1 (en) * 2000-01-31 2001-07-10 Advanced Semiconductor Engineering, Inc. Molding apparatus for flexible substrate based package
JP2003077946A (ja) * 2001-08-31 2003-03-14 Hitachi Ltd 半導体装置の製造方法
US6666997B2 (en) * 2001-10-02 2003-12-23 Micron Technology, Inc. Method for removing cleaning compound flash from mold vents
US7264456B2 (en) * 2001-10-10 2007-09-04 Micron Technology, Inc. Leadframe and method for reducing mold compound adhesion problems
US20030116879A1 (en) * 2001-12-21 2003-06-26 Seaquist Closures Foreign, Inc. Compression molding process and article made by the process
US7838985B2 (en) * 2007-07-12 2010-11-23 Vishay General Semiconductor Llc Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers
US7915728B2 (en) * 2007-07-12 2011-03-29 Vishay General Semiconductor Llc Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4043027A (en) * 1963-12-16 1977-08-23 Texas Instruments Incorporated Process for encapsulating electronic components in plastic
US3795492A (en) * 1970-10-09 1974-03-05 Motorola Inc Lanced and relieved lead strips
US4003544A (en) * 1973-06-11 1977-01-18 Motorola, Inc. Gateless injection mold for encapsulating semiconductor devices
US3950140A (en) * 1973-06-11 1976-04-13 Motorola, Inc. Combination strip frame for semiconductive device and gate for molding
JPS5243366A (en) * 1975-10-01 1977-04-05 Hitachi Ltd Mold for resin molding
JPS5333260A (en) * 1976-09-10 1978-03-29 Sony Corp Device for molding plastic
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
JPS5480079A (en) * 1978-08-07 1979-06-26 Dai Ichi Seiko Co Ltd Method of forming semiconductor seal
JPS5643854A (en) * 1979-09-18 1981-04-22 Nec Corp Control system of received carrier detecting circuit
JPS5660210A (en) * 1979-10-23 1981-05-25 Mitsubishi Electric Corp Metal mold for resin sealing type semiconductor device
JPS5694635A (en) * 1979-12-27 1981-07-31 Toshiba Corp Metal-mold device for sealing by resin
JPS5775434A (en) * 1980-10-28 1982-05-12 Nec Corp Resin sealing metal mold for semiconductor device
JPS57187945A (en) * 1981-05-13 1982-11-18 Nec Home Electronics Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
PT77445B (en) 1986-02-14
PT77445A (en) 1983-11-01
US4504435A (en) 1985-03-12
EP0110518A3 (en) 1985-08-21
DE3382817D1 (de) 1998-01-29
EP0110518B1 (de) 1989-03-01
JPS5989424A (ja) 1984-05-23
DE3379298D1 (en) 1989-04-06
EP0110518A2 (de) 1984-06-13

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8339 Ceased/non-payment of the annual fee