DE3463574D1 - Buckling beam test probe contactor assembly with spring biased stripper plate - Google Patents
Buckling beam test probe contactor assembly with spring biased stripper plateInfo
- Publication number
- DE3463574D1 DE3463574D1 DE8484105934T DE3463574T DE3463574D1 DE 3463574 D1 DE3463574 D1 DE 3463574D1 DE 8484105934 T DE8484105934 T DE 8484105934T DE 3463574 T DE3463574 T DE 3463574T DE 3463574 D1 DE3463574 D1 DE 3463574D1
- Authority
- DE
- Germany
- Prior art keywords
- stripper plate
- spring biased
- test probe
- contactor assembly
- beam test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/509,519 US4518910A (en) | 1983-06-30 | 1983-06-30 | Buckling beam twist probe contactor assembly with spring biased stripper plate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3463574D1 true DE3463574D1 (en) | 1987-06-11 |
Family
ID=24026955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484105934T Expired DE3463574D1 (en) | 1983-06-30 | 1984-05-25 | Buckling beam test probe contactor assembly with spring biased stripper plate |
Country Status (4)
Country | Link |
---|---|
US (1) | US4518910A (de) |
EP (1) | EP0130350B1 (de) |
JP (1) | JPS6011170A (de) |
DE (1) | DE3463574D1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4622514A (en) * | 1984-06-15 | 1986-11-11 | Ibm | Multiple mode buckling beam probe assembly |
US4866375A (en) * | 1984-06-22 | 1989-09-12 | Malloy James T | Universal test fixture |
JPH0515108Y2 (de) * | 1985-05-31 | 1993-04-21 | ||
JPS61275668A (ja) * | 1985-05-31 | 1986-12-05 | Yokowo Mfg Co Ltd | 回路基板等の検査装置 |
JPH0515107Y2 (de) * | 1985-05-31 | 1993-04-21 | ||
JPS61275669A (ja) * | 1985-05-31 | 1986-12-05 | Yokowo Mfg Co Ltd | 回路基板等の検査装置 |
JPH0515109Y2 (de) * | 1985-05-31 | 1993-04-21 | ||
JPS61197575U (de) * | 1985-05-31 | 1986-12-10 | ||
JPS61275667A (ja) * | 1985-05-31 | 1986-12-05 | Yokowo Mfg Co Ltd | 回路基板等の検査装置 |
US4878018A (en) * | 1986-02-28 | 1989-10-31 | Malloy James T | Electrical testing device |
US4816754A (en) * | 1986-04-29 | 1989-03-28 | International Business Machines Corporation | Contactor and probe assembly for electrical test apparatus |
US5033977A (en) * | 1987-10-13 | 1991-07-23 | Minnesota Mining & Manufacturing Co. | Electrical connector and fixture for four-sided integrated circuit device |
JPH0754816B2 (ja) * | 1988-03-11 | 1995-06-07 | 東京エレクトロン株式会社 | プローブカード |
US4901013A (en) * | 1988-08-19 | 1990-02-13 | American Telephone And Telegraph Company, At&T Bell Laboratories | Apparatus having a buckling beam probe assembly |
DE4012839B4 (de) * | 1989-04-26 | 2004-02-26 | Atg Test Systems Gmbh & Co.Kg | Verfahren und Prüfvorrichtung zum Prüfen von elektrischen oder elektronischen Prüflingen |
US4987365A (en) * | 1989-04-28 | 1991-01-22 | Hewlett-Packard Company | Method and apparatus for testing integrated circuits |
US5153472A (en) * | 1991-07-19 | 1992-10-06 | International Business Machines Corporation | Probe positioning actuator |
US5597317A (en) * | 1995-08-11 | 1997-01-28 | W. L. Gore & Associates, Inc. | Surface mating electrical connector |
US6419500B1 (en) | 1999-03-08 | 2002-07-16 | Kulicke & Soffa Investment, Inc. | Probe assembly having floatable buckling beam probes and apparatus for abrading the same |
US6799976B1 (en) * | 1999-07-28 | 2004-10-05 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
US6710609B2 (en) * | 2002-07-15 | 2004-03-23 | Nanonexus, Inc. | Mosaic decal probe |
US7247035B2 (en) * | 2000-06-20 | 2007-07-24 | Nanonexus, Inc. | Enhanced stress metal spring contactor |
US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US7349223B2 (en) | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7579848B2 (en) | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
US20050068054A1 (en) * | 2000-05-23 | 2005-03-31 | Sammy Mok | Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies |
US20060066328A1 (en) * | 2004-09-30 | 2006-03-30 | Probelogic, Inc. | Buckling beam probe test assembly |
JP6407128B2 (ja) * | 2015-11-18 | 2018-10-17 | 三菱電機株式会社 | 半導体装置の評価装置および半導体装置の評価方法 |
CN113396019B (zh) * | 2019-03-12 | 2022-06-28 | 阿尔卑斯阿尔派株式会社 | 电磁驱动装置以及操作装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3806801A (en) * | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
US4063172A (en) * | 1976-06-01 | 1977-12-13 | International Business Machines Corporation | Multiple site, differential displacement, surface contacting assembly |
DE3273554D1 (en) * | 1981-06-30 | 1986-11-06 | Ibm | Contact probe assembly for integrated circuits |
-
1983
- 1983-06-30 US US06/509,519 patent/US4518910A/en not_active Expired - Fee Related
-
1984
- 1984-02-20 JP JP59028822A patent/JPS6011170A/ja active Granted
- 1984-05-25 EP EP84105934A patent/EP0130350B1/de not_active Expired
- 1984-05-25 DE DE8484105934T patent/DE3463574D1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US4518910A (en) | 1985-05-21 |
JPS6011170A (ja) | 1985-01-21 |
JPH0145030B2 (de) | 1989-10-02 |
EP0130350A1 (de) | 1985-01-09 |
EP0130350B1 (de) | 1987-05-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |