DE3482719D1 - Halbleiterelement und herstellungsverfahren. - Google Patents
Halbleiterelement und herstellungsverfahren.Info
- Publication number
- DE3482719D1 DE3482719D1 DE8484302085T DE3482719T DE3482719D1 DE 3482719 D1 DE3482719 D1 DE 3482719D1 DE 8484302085 T DE8484302085 T DE 8484302085T DE 3482719 T DE3482719 T DE 3482719T DE 3482719 D1 DE3482719 D1 DE 3482719D1
- Authority
- DE
- Germany
- Prior art keywords
- contact
- raised
- mounting substrate
- metallised
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 4
- 239000004020 conductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01056—Barium [Ba]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08309131A GB2137807B (en) | 1983-04-05 | 1983-04-05 | A semiconductor component and method of manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3482719D1 true DE3482719D1 (de) | 1990-08-23 |
Family
ID=10540635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484302085T Expired - Fee Related DE3482719D1 (de) | 1983-04-05 | 1984-03-28 | Halbleiterelement und herstellungsverfahren. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4752816A (de) |
EP (1) | EP0121402B1 (de) |
JP (1) | JPS6024048A (de) |
AT (1) | ATE54776T1 (de) |
CA (1) | CA1209716A (de) |
DE (1) | DE3482719D1 (de) |
GB (1) | GB2137807B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4954458A (en) * | 1982-06-03 | 1990-09-04 | Texas Instruments Incorporated | Method of forming a three dimensional integrated circuit structure |
US4875750A (en) * | 1987-02-25 | 1989-10-24 | Siemens Aktiengesellschaft | Optoelectronic coupling element and method for its manufacture |
GB8712119D0 (en) * | 1987-05-22 | 1987-06-24 | British Telecomm | Device packaging |
GB2208943B (en) * | 1987-08-19 | 1991-07-31 | Plessey Co Plc | Alignment of fibre arrays |
US4892842A (en) * | 1987-10-29 | 1990-01-09 | Tektronix, Inc. | Method of treating an integrated circuit |
US5017986A (en) * | 1989-08-28 | 1991-05-21 | At&T Bell Laboratories | Optical device mounting apparatus |
US5332022A (en) * | 1992-09-08 | 1994-07-26 | Howmet Corporation | Composite casting method |
US6274391B1 (en) * | 1992-10-26 | 2001-08-14 | Texas Instruments Incorporated | HDI land grid array packaged device having electrical and optical interconnects |
US6380563B2 (en) * | 1998-03-30 | 2002-04-30 | Micron Technology, Inc. | Opto-electric mounting apparatus |
US6713788B2 (en) | 1998-03-30 | 2004-03-30 | Micron Technology, Inc. | Opto-electric mounting apparatus |
US7086134B2 (en) * | 2000-08-07 | 2006-08-08 | Shipley Company, L.L.C. | Alignment apparatus and method for aligning stacked devices |
US6546173B2 (en) | 2001-02-20 | 2003-04-08 | Avanti Optics Corporation | Optical module |
US6956999B2 (en) | 2001-02-20 | 2005-10-18 | Cyberoptics Corporation | Optical device |
US6443631B1 (en) | 2001-02-20 | 2002-09-03 | Avanti Optics Corporation | Optical module with solder bond |
US6546172B2 (en) | 2001-02-20 | 2003-04-08 | Avanti Optics Corporation | Optical device |
US20040212802A1 (en) * | 2001-02-20 | 2004-10-28 | Case Steven K. | Optical device with alignment compensation |
GB2408111A (en) * | 2002-08-20 | 2005-05-18 | Cyberoptics Corp | Optical alignment mount with height adjustment |
FR2864699B1 (fr) * | 2003-12-24 | 2006-02-24 | Commissariat Energie Atomique | Assemblage d'un composant monte sur une surface de report |
JP2007310083A (ja) | 2006-05-17 | 2007-11-29 | Fuji Xerox Co Ltd | 光伝送モジュールおよびその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3388301A (en) * | 1964-12-09 | 1968-06-11 | Signetics Corp | Multichip integrated circuit assembly with interconnection structure |
DE2044494B2 (de) * | 1970-09-08 | 1972-01-13 | Siemens AG, 1000 Berlin u 8000 München | Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik |
CA923221A (en) * | 1971-01-19 | 1973-03-20 | E. Berner Warren | Substrate supported semiconductive stack and process for its manufacture |
GB1487945A (en) * | 1974-11-20 | 1977-10-05 | Ibm | Semiconductor integrated circuit devices |
JPS5845822B2 (ja) * | 1975-03-07 | 1983-10-12 | セイコーエプソン株式会社 | シユウセキカイロ |
JPS5412286A (en) * | 1977-06-28 | 1979-01-29 | Toshiba Corp | Semiconductor device |
US4161740A (en) * | 1977-11-07 | 1979-07-17 | Microwave Semiconductor Corp. | High frequency power transistor having reduced interconnection inductance and thermal resistance |
US4231154A (en) * | 1979-01-10 | 1980-11-04 | International Business Machines Corporation | Electronic package assembly method |
US4250520A (en) * | 1979-03-14 | 1981-02-10 | Rca Corporation | Flip chip mounted diode |
JPS5742175A (en) * | 1980-08-26 | 1982-03-09 | Fujitsu Ltd | Infrared ray detector |
CA1139412A (en) * | 1980-09-10 | 1983-01-11 | Northern Telecom Limited | Light emitting diodes with high external quantum efficiency |
US4446477A (en) * | 1981-08-21 | 1984-05-01 | Sperry Corporation | Multichip thin film module |
CA1200326A (en) * | 1982-11-26 | 1986-02-04 | Franco N. Sechi | High-power dual-gate field-effect transistor |
-
1983
- 1983-04-05 GB GB08309131A patent/GB2137807B/en not_active Expired
-
1984
- 1984-03-28 EP EP84302085A patent/EP0121402B1/de not_active Expired - Lifetime
- 1984-03-28 DE DE8484302085T patent/DE3482719D1/de not_active Expired - Fee Related
- 1984-03-28 AT AT84302085T patent/ATE54776T1/de active
- 1984-04-03 CA CA000451170A patent/CA1209716A/en not_active Expired
- 1984-04-05 JP JP59068368A patent/JPS6024048A/ja active Pending
-
1986
- 1986-12-30 US US06/947,887 patent/US4752816A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0121402A2 (de) | 1984-10-10 |
EP0121402A3 (en) | 1986-12-17 |
CA1209716A (en) | 1986-08-12 |
US4752816A (en) | 1988-06-21 |
JPS6024048A (ja) | 1985-02-06 |
ATE54776T1 (de) | 1990-08-15 |
GB2137807A (en) | 1984-10-10 |
EP0121402B1 (de) | 1990-07-18 |
GB2137807B (en) | 1987-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: GEC-MARCONI LTD., STANMORE, MIDDLESEX, GB |
|
8328 | Change in the person/name/address of the agent |
Free format text: PRINZ, E., DIPL.-ING. LEISER, G., DIPL.-ING. SCHWEPFINGER, K., DIPL.-ING. BUNKE, H., DIPL.-CHEM. DR.RER.NAT. DEGWERT, H., DIPL.-PHYS., PAT.-ANWAELTE, 8000 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |