DE3566589D1 - Stacked double density memory module using industry standard memory chips, double density memory board and method of forming a stacked double density memory module - Google Patents

Stacked double density memory module using industry standard memory chips, double density memory board and method of forming a stacked double density memory module

Info

Publication number
DE3566589D1
DE3566589D1 DE8585101921T DE3566589T DE3566589D1 DE 3566589 D1 DE3566589 D1 DE 3566589D1 DE 8585101921 T DE8585101921 T DE 8585101921T DE 3566589 T DE3566589 T DE 3566589T DE 3566589 D1 DE3566589 D1 DE 3566589D1
Authority
DE
Germany
Prior art keywords
chip
double density
density memory
memory module
industry standard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585101921T
Other languages
English (en)
Inventor
Wolfgang Friedrich Mueller
Ii Gwynne Wallace Spencer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3566589D1 publication Critical patent/DE3566589D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE8585101921T 1984-03-28 1985-02-22 Stacked double density memory module using industry standard memory chips, double density memory board and method of forming a stacked double density memory module Expired DE3566589D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59418484A 1984-03-28 1984-03-28

Publications (1)

Publication Number Publication Date
DE3566589D1 true DE3566589D1 (en) 1989-01-05

Family

ID=24377874

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585101921T Expired DE3566589D1 (en) 1984-03-28 1985-02-22 Stacked double density memory module using industry standard memory chips, double density memory board and method of forming a stacked double density memory module

Country Status (11)

Country Link
US (1) US4884237A (de)
EP (1) EP0157147B1 (de)
JP (1) JPS60208850A (de)
KR (1) KR890004820B1 (de)
AT (1) ATE39032T1 (de)
BR (1) BR8501293A (de)
CA (1) CA1229411A (de)
DE (1) DE3566589D1 (de)
HK (1) HK99289A (de)
IN (1) IN165548B (de)
SG (1) SG62489G (de)

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Also Published As

Publication number Publication date
EP0157147A2 (de) 1985-10-09
IN165548B (de) 1989-11-11
SG62489G (en) 1990-01-26
EP0157147A3 (en) 1987-09-09
BR8501293A (pt) 1985-11-19
KR850006980A (ko) 1985-10-25
JPH0131300B2 (de) 1989-06-26
EP0157147B1 (de) 1988-11-30
HK99289A (en) 1989-12-22
JPS60208850A (ja) 1985-10-21
ATE39032T1 (de) 1988-12-15
KR890004820B1 (ko) 1989-11-27
CA1229411A (en) 1987-11-17
US4884237A (en) 1989-11-28

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