DE3583200D1 - Leiterrahmen fuer integrierte schaltung, verwendbar fuer ein simultanes verbindungsverfahren. - Google Patents
Leiterrahmen fuer integrierte schaltung, verwendbar fuer ein simultanes verbindungsverfahren.Info
- Publication number
- DE3583200D1 DE3583200D1 DE8585901776T DE3583200T DE3583200D1 DE 3583200 D1 DE3583200 D1 DE 3583200D1 DE 8585901776 T DE8585901776 T DE 8585901776T DE 3583200 T DE3583200 T DE 3583200T DE 3583200 D1 DE3583200 D1 DE 3583200D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- connection method
- circuit used
- ladder frame
- simultaneous connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/592,144 US4722060A (en) | 1984-03-22 | 1984-03-22 | Integrated-circuit leadframe adapted for a simultaneous bonding operation |
PCT/US1985/000449 WO1985004520A1 (en) | 1984-03-22 | 1985-03-19 | Integrated-circuit leadframe adapted for a simultaneous bonding operation |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3583200D1 true DE3583200D1 (de) | 1991-07-18 |
Family
ID=24369488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585901776T Expired - Fee Related DE3583200D1 (de) | 1984-03-22 | 1985-03-19 | Leiterrahmen fuer integrierte schaltung, verwendbar fuer ein simultanes verbindungsverfahren. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4722060A (de) |
EP (1) | EP0177559B1 (de) |
JP (1) | JPH0785499B2 (de) |
KR (1) | KR930002811B1 (de) |
DE (1) | DE3583200D1 (de) |
WO (1) | WO1985004520A1 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4743956A (en) * | 1986-12-15 | 1988-05-10 | Thomson Components-Moster Corporation | Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging |
IT1202657B (it) * | 1987-03-09 | 1989-02-09 | Sgs Microelettronica Spa | Procedimento di fabbricazione di un dispositivo modulare di potenza a semiconduttore e dispositivo con esso ottenento |
IT1221258B (it) * | 1988-06-22 | 1990-06-27 | Sgs Thomson Microelectronics | Contenitore plastico a cavita' per dispositivi semiconduttore |
EP0387450B1 (de) * | 1988-12-27 | 1996-10-23 | MITSUI TOATSU CHEMICALS, Inc. | Verfahren zur Herstellung einer Buchse für eine integrierte Schaltung |
EP0509065A1 (de) * | 1990-08-01 | 1992-10-21 | Staktek Corporation | Gehäuse für integrierte schaltung von ultrahoher dichte, verfahren und gerät |
US5367766A (en) * | 1990-08-01 | 1994-11-29 | Staktek Corporation | Ultra high density integrated circuit packages method |
US5446620A (en) * | 1990-08-01 | 1995-08-29 | Staktek Corporation | Ultra high density integrated circuit packages |
US5475920A (en) * | 1990-08-01 | 1995-12-19 | Burns; Carmen D. | Method of assembling ultra high density integrated circuit packages |
US5377077A (en) * | 1990-08-01 | 1994-12-27 | Staktek Corporation | Ultra high density integrated circuit packages method and apparatus |
JP2936769B2 (ja) * | 1991-03-28 | 1999-08-23 | 日本電気株式会社 | 半導体装置用リードフレーム |
JP3484705B2 (ja) * | 1991-07-18 | 2004-01-06 | ソニー株式会社 | 半導体ウエハ |
US5448450A (en) * | 1991-08-15 | 1995-09-05 | Staktek Corporation | Lead-on-chip integrated circuit apparatus |
US5274911A (en) * | 1991-10-21 | 1994-01-04 | American Shizuki Corporation | Electronic components with leads partly solder coated |
US5702985A (en) * | 1992-06-26 | 1997-12-30 | Staktek Corporation | Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method |
US5484959A (en) * | 1992-12-11 | 1996-01-16 | Staktek Corporation | High density lead-on-package fabrication method and apparatus |
US6205654B1 (en) * | 1992-12-11 | 2001-03-27 | Staktek Group L.P. | Method of manufacturing a surface mount package |
US5369056A (en) * | 1993-03-29 | 1994-11-29 | Staktek Corporation | Warp-resistent ultra-thin integrated circuit package fabrication method |
US5801437A (en) * | 1993-03-29 | 1998-09-01 | Staktek Corporation | Three-dimensional warp-resistant integrated circuit module method and apparatus |
US5644161A (en) * | 1993-03-29 | 1997-07-01 | Staktek Corporation | Ultra-high density warp-resistant memory module |
US5444293A (en) * | 1993-09-22 | 1995-08-22 | Opl Limited | Structure and method for providing a lead frame with enhanced solder wetting leads |
JP2615412B2 (ja) * | 1994-03-10 | 1997-05-28 | 東京工業大学長 | Tab方式リード自動検査装置に用いるリード位置決め方法および装置 |
US5545921A (en) * | 1994-11-04 | 1996-08-13 | International Business Machines, Corporation | Personalized area leadframe coining or half etching for reduced mechanical stress at device edge |
US5621635A (en) * | 1995-03-03 | 1997-04-15 | National Semiconductor Corporation | Integrated circuit packaged power supply |
WO1997034364A1 (en) * | 1995-03-03 | 1997-09-18 | National Semiconductor Corporation | Integrated circuit packaged power supply |
US5547740A (en) * | 1995-03-23 | 1996-08-20 | Delco Electronics Corporation | Solderable contacts for flip chip integrated circuit devices |
US6025642A (en) * | 1995-08-17 | 2000-02-15 | Staktek Corporation | Ultra high density integrated circuit packages |
US5631571A (en) * | 1996-04-03 | 1997-05-20 | The United States Of America As Represented By The Secretary Of The Air Force | Infrared receiver wafer level probe testing |
US5945732A (en) | 1997-03-12 | 1999-08-31 | Staktek Corporation | Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package |
US5864776A (en) * | 1997-08-27 | 1999-01-26 | Mitsubishi Electric America, Inc. | Apparatus and method for detecting an error in the placement of a lead frame on a surface of a die mold |
JP4008629B2 (ja) * | 1999-09-10 | 2007-11-14 | 株式会社東芝 | 半導体装置、その設計方法、及びその設計プログラムを格納したコンピュータ読み取り可能な記録媒体 |
US6572387B2 (en) | 1999-09-24 | 2003-06-03 | Staktek Group, L.P. | Flexible circuit connector for stacked chip module |
JP4074419B2 (ja) * | 2000-03-14 | 2008-04-09 | シャープ株式会社 | 半導体レーザ装置のワイヤボンディング方法 |
JP4412828B2 (ja) * | 2000-08-03 | 2010-02-10 | Okiセミコンダクタ株式会社 | 半導体パッケージの測定用ソケット及びその測定方法 |
US6608763B1 (en) | 2000-09-15 | 2003-08-19 | Staktek Group L.P. | Stacking system and method |
US6462408B1 (en) | 2001-03-27 | 2002-10-08 | Staktek Group, L.P. | Contact member stacking system and method |
JP3872001B2 (ja) * | 2002-11-18 | 2007-01-24 | シャープ株式会社 | リードフレーム、それを用いた半導体装置の製造方法、それを用いた半導体装置、及び電子機器 |
US7387916B2 (en) * | 2004-12-02 | 2008-06-17 | Texas Instruments Incorporated | Sharp corner lead frame |
US7380721B2 (en) * | 2006-08-22 | 2008-06-03 | Honeywell International Inc. | Low-cost compact bar code sensor |
TW200836315A (en) * | 2007-02-16 | 2008-09-01 | Richtek Techohnology Corp | Electronic package structure and method thereof |
US8799845B2 (en) * | 2010-02-16 | 2014-08-05 | Deca Technologies Inc. | Adaptive patterning for panelized packaging |
US20140021491A1 (en) * | 2012-07-18 | 2014-01-23 | Carsem (M) Sdn. Bhd. | Multi-compound molding |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE557373A (de) * | 1956-05-09 | |||
US3586813A (en) * | 1967-08-31 | 1971-06-22 | Western Electric Co | Simultaneous multiple lead bonding |
DE1907075B2 (de) * | 1969-02-13 | 1974-07-04 | Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg | Verfahren zur Herstellung von Halbleiter-Kleingleichrichtern |
US3689684A (en) * | 1971-02-05 | 1972-09-05 | Du Pont | Lead frame connector and electronic packages containing same |
US3831131A (en) * | 1971-11-08 | 1974-08-20 | Bunker Ramo | Integrated circuit package connectors |
US3716761A (en) * | 1972-05-03 | 1973-02-13 | Microsystems Int Ltd | Universal interconnection structure for microelectronic devices |
US3765590A (en) * | 1972-05-08 | 1973-10-16 | Fairchild Camera Instr Co | Structure for simultaneously attaching a plurality of semiconductor dice to their respective package leads |
US3982979A (en) * | 1973-06-28 | 1976-09-28 | Western Electric Company, Inc. | Methods for mounting an article on an adherent site on a substrate |
US3859723A (en) * | 1973-11-05 | 1975-01-14 | Microsystems Int Ltd | Bonding method for multiple chip arrays |
US3916513A (en) * | 1974-05-03 | 1975-11-04 | Ampex | Forming interconnections between circuit layers |
JPS5314562A (en) * | 1976-07-26 | 1978-02-09 | Hitachi Ltd | Mounting method of semiconductor pellet to lead frame |
US4176443A (en) * | 1977-03-08 | 1979-12-04 | Sgs-Ates Componenti Elettronici S.P.A. | Method of connecting semiconductor structure to external circuits |
JPS53132975A (en) * | 1977-04-26 | 1978-11-20 | Toshiba Corp | Semiconductor device |
US4129682A (en) * | 1977-11-16 | 1978-12-12 | Monsanto Company | High density led lead frame |
US4155615A (en) * | 1978-01-24 | 1979-05-22 | Amp Incorporated | Multi-contact connector for ceramic substrate packages and the like |
US4355463A (en) * | 1980-03-24 | 1982-10-26 | National Semiconductor Corporation | Process for hermetically encapsulating semiconductor devices |
US4346952A (en) * | 1980-06-16 | 1982-08-31 | Amp Incorporated | Connector for a ceramic substrate |
NL8202154A (nl) * | 1982-05-26 | 1983-12-16 | Asm Fico Tooling | Geleiderframe. |
US4470648A (en) * | 1982-12-27 | 1984-09-11 | Ford Motor Company | Interconnection construction to thick film substrate |
-
1984
- 1984-03-22 US US06/592,144 patent/US4722060A/en not_active Expired - Lifetime
-
1985
- 1985-03-19 DE DE8585901776T patent/DE3583200D1/de not_active Expired - Fee Related
- 1985-03-19 KR KR1019850700312A patent/KR930002811B1/ko not_active IP Right Cessation
- 1985-03-19 JP JP60501511A patent/JPH0785499B2/ja not_active Expired - Fee Related
- 1985-03-19 EP EP85901776A patent/EP0177559B1/de not_active Expired - Lifetime
- 1985-03-19 WO PCT/US1985/000449 patent/WO1985004520A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JPS61501540A (ja) | 1986-07-24 |
US4722060A (en) | 1988-01-26 |
JPH0785499B2 (ja) | 1995-09-13 |
EP0177559A4 (de) | 1987-06-01 |
EP0177559B1 (de) | 1991-06-12 |
KR850700288A (ko) | 1985-12-26 |
WO1985004520A1 (en) | 1985-10-10 |
EP0177559A1 (de) | 1986-04-16 |
KR930002811B1 (ko) | 1993-04-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3583200D1 (de) | Leiterrahmen fuer integrierte schaltung, verwendbar fuer ein simultanes verbindungsverfahren. | |
DE3482064D1 (de) | Asynchrones wiederanlaufkennzeichnungsmethode fuer fehlerkorrektur. | |
DE3485096D1 (de) | Schnittstelle fuer ein nachrichtennetz. | |
DE3680723D1 (de) | Leiterrahmen fuer halbleiter. | |
DE228337T1 (de) | Herstellungsmethode fuer einen kuehlschlitz. | |
ES269404Y (es) | Un limpiaparabrisas. | |
IT8667369A1 (it) | Metodo per la pesatura a combinazioni. | |
DK120884D0 (da) | Fremgangsmaade til fremstilling af heptakis-(2,6-di-0-methyl)-beta-cyclodekstrin | |
ES281527Y (es) | Un limpiaparabrisas | |
IT8519790A0 (it) | Procedimento per effettuare la saldatura di componenti elettronici su un supporto. | |
DE3577967D1 (de) | Modul-schaltkreis. | |
DE3674286D1 (de) | Schnittstellenschaltung fuer ein floppydisk-laufwerk. | |
ES512548A0 (es) | Procedimiento para la obtencion de un adhesivo, de pegado rapido, a base de cianacrilatos. | |
IT8419122A0 (it) | Forme farmaceutiche a base di difosfonati. | |
DE3481376D1 (de) | Anpassungsverfahren fuer ein viersektorenfenster. | |
IT8423924V0 (it) | Riscaldamento per un autoveicolo. | |
NO162630C (no) | Trinnelement for trapper. | |
DK298883D0 (da) | Vindue, navnlig til indbygning i et skratag | |
FI852033A0 (fi) | Metod att tillvarataga alkalikemikalier ur en roekgas som innehaoller alkalimetallaongor. | |
FI850977A0 (fi) | Metod att anvaenda kolbraennare. | |
ES295760Y (es) | Un dispositivo de fijacion ciego. | |
DE3574742D1 (de) | Wiedergewinnungsverfahren fuer metalle. | |
DE3780580T2 (de) | Herstellungsverfahren fuer einen mos-baustein. | |
DE3581587D1 (de) | Herstellungsverfahren fuer indole. | |
DE3584670D1 (de) | Herstellungsverfahren fuer indol. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SGS-THOMSON MICROELECTRONICS INC. (N.D.GES.DES STA |
|
8339 | Ceased/non-payment of the annual fee |