DE3585635D1 - Absaugvorrichtung fuer schleusenkammer. - Google Patents

Absaugvorrichtung fuer schleusenkammer.

Info

Publication number
DE3585635D1
DE3585635D1 DE8585303334T DE3585635T DE3585635D1 DE 3585635 D1 DE3585635 D1 DE 3585635D1 DE 8585303334 T DE8585303334 T DE 8585303334T DE 3585635 T DE3585635 T DE 3585635T DE 3585635 D1 DE3585635 D1 DE 3585635D1
Authority
DE
Germany
Prior art keywords
extraction device
lock chamber
lock
extraction
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585303334T
Other languages
English (en)
Inventor
James W Ackley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24439170&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3585635(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Application granted granted Critical
Publication of DE3585635D1 publication Critical patent/DE3585635D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
DE8585303334T 1984-05-10 1985-05-10 Absaugvorrichtung fuer schleusenkammer. Expired - Fee Related DE3585635D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/609,052 US4534314A (en) 1984-05-10 1984-05-10 Load lock pumping mechanism

Publications (1)

Publication Number Publication Date
DE3585635D1 true DE3585635D1 (de) 1992-04-23

Family

ID=24439170

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585303334T Expired - Fee Related DE3585635D1 (de) 1984-05-10 1985-05-10 Absaugvorrichtung fuer schleusenkammer.

Country Status (4)

Country Link
US (1) US4534314A (de)
EP (1) EP0161927B1 (de)
JP (1) JPH0621356B2 (de)
DE (1) DE3585635D1 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62104438U (de) * 1985-12-23 1987-07-03
US4682508A (en) * 1986-03-06 1987-07-28 Finnigan Corporation Inlet valve for probe apparatus
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
CA1331163C (en) * 1986-04-18 1994-08-02 Applied Materials, Inc. Multiple-processing and contamination-free plasma etching system
US4676884A (en) * 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
US4717461A (en) * 1986-09-15 1988-01-05 Machine Technology, Inc. System and method for processing workpieces
JPH0689456B2 (ja) * 1986-10-01 1994-11-09 キヤノン株式会社 マイクロ波プラズマｃｖｄ法による機能性堆積膜形成装置
US4944860A (en) * 1988-11-04 1990-07-31 Eaton Corporation Platen assembly for a vacuum processing system
DE58909835D1 (de) * 1988-11-17 1998-08-20 Balzers Hochvakuum Transporteinrichtung und Vakuumkammer mit einer solchen Einrichtung sowie Verfahren zum Beschicken und Entleeren einer Bearbeitungskammer
US5042423A (en) * 1988-12-20 1991-08-27 Texas Instruments Incorporated Semiconductor wafer carrier design
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5098245A (en) * 1989-02-24 1992-03-24 U.S. Philips Corporation High speed wafer handler
US5259942A (en) * 1989-03-30 1993-11-09 Leybold Aktiengesellschaft Device for transferring a workpiece into and out from a vacuum chamber
DE3912297C2 (de) * 1989-04-14 1996-07-18 Leybold Ag Katodenzerstäubungsanlage
US5254170A (en) * 1989-08-07 1993-10-19 Asm Vt, Inc. Enhanced vertical thermal reactor system
US5002010A (en) * 1989-10-18 1991-03-26 Varian Associates, Inc. Vacuum vessel
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39824E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
DE4117969C2 (de) * 1991-05-31 2000-11-09 Balzers Ag Liechtenstein Vakuumkammer
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
EP1179611B1 (de) * 1992-10-06 2004-09-15 Unaxis Balzers Aktiengesellschaft Kammer für den Transport von Werkstücken
US5730801A (en) * 1994-08-23 1998-03-24 Applied Materials, Inc. Compartnetalized substrate processing chamber
US5901751A (en) * 1996-03-08 1999-05-11 Applied Materials, Inc. Restrictor shield having a variable effective throughout area
US7077159B1 (en) * 1998-12-23 2006-07-18 Applied Materials, Inc. Processing apparatus having integrated pumping system
US6328814B1 (en) 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
US6955516B2 (en) * 2001-11-02 2005-10-18 Applied Materials, Inc. Single wafer dryer and drying methods
US6413381B1 (en) 2000-04-12 2002-07-02 Steag Hamatech Ag Horizontal sputtering system
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
GB0229353D0 (en) * 2002-12-17 2003-01-22 Boc Group Plc Vacuum pumping system and method of operating a vacuum pumping arrangement
JP4395333B2 (ja) * 2003-06-20 2010-01-06 ユニ・チャームペットケア株式会社 ペットのトイレ用吸液シート
US6933511B2 (en) * 2003-11-18 2005-08-23 Atomic Energy Council Institute Of Nuclear Energy Research Ion implanting apparatus
US7500822B2 (en) * 2004-04-09 2009-03-10 Edwards Vacuum, Inc. Combined vacuum pump load-lock assembly
CH697552B1 (de) * 2004-11-12 2008-11-28 Oerlikon Trading Ag Vakuumbehandlungsanlage.
CN102131957A (zh) * 2008-08-28 2011-07-20 硅绝缘体技术有限公司 基于紫外线吸收的监测器和对氯化物气流的控制
US8936425B2 (en) * 2012-01-23 2015-01-20 Tera Autotech Corporation Ancillary apparatus and method for loading glass substrates into a bracket

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649339A (en) * 1969-09-05 1972-03-14 Eugene C Smith Apparatus and method for securing a high vacuum for particle coating process
US3856654A (en) * 1971-08-26 1974-12-24 Western Electric Co Apparatus for feeding and coating masses of workpieces in a controlled atmosphere
JPS5315466B2 (de) * 1973-04-28 1978-05-25
CH573985A5 (de) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
US3981791A (en) * 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
US4226208A (en) * 1977-08-04 1980-10-07 Canon Kabushiki Kaisha Vapor deposition apparatus
US4201152A (en) * 1978-02-27 1980-05-06 Varian Associates, Inc. Transfer and temperature monitoring apparatus
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US4306731A (en) * 1979-12-21 1981-12-22 Varian Associates, Inc. Wafer support assembly
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system

Also Published As

Publication number Publication date
JPS60250644A (ja) 1985-12-11
US4534314A (en) 1985-08-13
JPH0621356B2 (ja) 1994-03-23
EP0161927A2 (de) 1985-11-21
EP0161927B1 (de) 1992-03-18
EP0161927A3 (en) 1987-11-04

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8339 Ceased/non-payment of the annual fee