DE3650421D1 - Verfahren und Gerät zum Entfernen elektronischer Bauelemente von einem Trägerband. - Google Patents

Verfahren und Gerät zum Entfernen elektronischer Bauelemente von einem Trägerband.

Info

Publication number
DE3650421D1
DE3650421D1 DE3650421T DE3650421T DE3650421D1 DE 3650421 D1 DE3650421 D1 DE 3650421D1 DE 3650421 T DE3650421 T DE 3650421T DE 3650421 T DE3650421 T DE 3650421T DE 3650421 D1 DE3650421 D1 DE 3650421D1
Authority
DE
Germany
Prior art keywords
electronic components
carrier tape
removing electronic
tape
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3650421T
Other languages
English (en)
Other versions
DE3650421T2 (de
Inventor
Koichi C O Fuji Machine M Asai
Mamoru C O Fuji Machine Tsuda
Yasuo C O Fuji Machine Mf Muto
Sinsuke C O Fuji Machin Suhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17199398&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3650421(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of DE3650421D1 publication Critical patent/DE3650421D1/de
Application granted granted Critical
Publication of DE3650421T2 publication Critical patent/DE3650421T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49819—Disassembling with conveying of work or disassembled work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49821—Disassembling by altering or destroying work part or connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53539—Means to assemble or disassemble including work conveyor
DE3650421T 1985-11-06 1986-11-05 Verfahren und Gerät zum Entfernen elektronischer Bauelemente von einem Trägerband. Expired - Fee Related DE3650421T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60249869A JPS62111825A (ja) 1985-11-06 1985-11-06 キヤリヤテ−プから電子部品を取り出す方法

Publications (2)

Publication Number Publication Date
DE3650421D1 true DE3650421D1 (de) 1995-11-23
DE3650421T2 DE3650421T2 (de) 1996-04-04

Family

ID=17199398

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3650421T Expired - Fee Related DE3650421T2 (de) 1985-11-06 1986-11-05 Verfahren und Gerät zum Entfernen elektronischer Bauelemente von einem Trägerband.

Country Status (4)

Country Link
US (1) US4740136A (de)
EP (1) EP0223505B1 (de)
JP (1) JPS62111825A (de)
DE (1) DE3650421T2 (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036571A (en) * 1986-09-25 1991-08-06 Illinois Tool Works, Inc. Carrier tape and cover applying and removal devices for same
JPH0770858B2 (ja) * 1987-01-19 1995-07-31 三洋電機株式会社 部品供給装置
JPS63277166A (ja) * 1987-05-09 1988-11-15 Hitachi Ltd チツプ電子部品供給装置
US4838452A (en) * 1987-11-27 1989-06-13 Universal Instruments Corporation Shutter system for electrical component supply tape feeder
JPH01145898A (ja) * 1987-12-02 1989-06-07 Matsushita Electric Ind Co Ltd 部品供給装置
JPH01182742A (ja) * 1988-01-13 1989-07-20 Mitsubishi Electric Corp 半導体装置の外観検査機
US5044875A (en) * 1988-02-16 1991-09-03 International Business Machines Corporation Method and apparatus for positioning components
US5084962A (en) * 1988-08-24 1992-02-04 Tdk Corporation Apparatus for and method of automatically mounting electronic component on printed circuit board
US4883300A (en) * 1988-10-13 1989-11-28 Intelmatec Corporation End effector for IC chip handling
US5289625A (en) * 1989-04-05 1994-03-01 Canon Kabushiki Kaisha Method for supplying articles and apparatus therefor
US5020959A (en) * 1989-04-14 1991-06-04 Universal Instruments Corporation Adjustable shutter for containment of electrical components in tape feeders
EP0392637A3 (de) * 1989-04-14 1990-11-14 UNIVERSAL INSTRUMENTS CORPORATION (Delaware Corp.) Einstellbare Verschlussvorrichtung zum Halten von kleinen elektronischen Bauelementen in Gurtzuführeinrichtungen
US5191693A (en) * 1989-12-29 1993-03-09 Canon Kabushiki Kaisha Tape type work conveying method and conveying apparatus
US5035316A (en) * 1990-01-22 1991-07-30 Universal Instruments Corporation Isolating a first component to be pickup from other components on a vibratory feeder
US5017078A (en) * 1990-01-24 1991-05-21 Molex Incorporated Method and apparatus for unloading components from tape carrier packaging
US5101975A (en) * 1990-10-31 1992-04-07 Novapak, Inc. Electronic component carrier
US5046610A (en) * 1990-01-29 1991-09-10 Christianson Systems, Inc. Electronic component carrier
JPH05506832A (ja) * 1990-01-29 1993-10-07 ノバパック、インコーポレーテッド 電子部品キャリヤ
GB9004781D0 (en) * 1990-03-02 1990-04-25 Glaxo Group Ltd Device
US6536427B2 (en) 1990-03-02 2003-03-25 Glaxo Group Limited Inhalation device
SK280967B6 (sk) 1990-03-02 2000-10-09 Glaxo Group Limited Inhalačný prístroj
MY105368A (en) * 1990-03-02 1994-09-30 Glaxo Group Ltd Inhalation device.
JP2767976B2 (ja) * 1990-05-25 1998-06-25 ソニー株式会社 電子部品取出装置
JPH07114319B2 (ja) * 1991-01-22 1995-12-06 松下電器産業株式会社 チップ形電子部品の供給装置
JP3023207B2 (ja) * 1991-05-11 2000-03-21 富士機械製造株式会社 ラチェット装置およびテーピング電子部品送り装置
ATE135524T1 (de) * 1992-09-21 1996-03-15 Siemens Ag Zuführeinrichtung für gegurtete smd-bauelemente
JPH077292A (ja) * 1993-06-18 1995-01-10 Toshiba Corp 部品供給装置
US5381508A (en) * 1993-08-25 1995-01-10 Krumenacher; Paul F. Suction and light guide assembly
US5440799A (en) * 1993-12-08 1995-08-15 Molex Incorporated Electrical terminal applicator with improved terminal tape feed means
US5605430A (en) * 1994-02-15 1997-02-25 Zierick Manufacturing Corporation Feeder and method of supplying a continuous strip of surface mount contacts to surface mounting equipment
US5449265A (en) * 1994-02-15 1995-09-12 Zierick Manufacturing Corporation Feeder and method of supplying a continuous strip of surface mount contacts to pick-and-place machine
JP3404431B2 (ja) * 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
JP2666788B2 (ja) * 1995-10-19 1997-10-22 日本電気株式会社 チップサイズ半導体装置の製造方法
US5725140A (en) * 1996-09-09 1998-03-10 Amistar Corporation Tape feeder for a surface mount placement system
CN1130965C (zh) * 1997-01-20 2003-12-10 松下电器产业株式会社 元件供给方法及装置
US6082954A (en) * 1997-02-21 2000-07-04 Summit Holding Two, Inc. Tape feeders and systems using the same
JP3935579B2 (ja) * 1997-10-29 2007-06-27 富士機械製造株式会社 カバーテープ送り装置，カバーテープ処理装置およびフィーダユニット
JP4117859B2 (ja) * 1998-06-24 2008-07-16 富士機械製造株式会社 部品供給ユニット
US6162007A (en) * 1999-01-14 2000-12-19 Witte; Stefan Apparatus for feeding electronic component tape
DE60037945D1 (de) * 1999-11-05 2008-03-20 Matsushita Electric Ind Co Ltd Teilezuführmethode und vorrichtung und damit ausgerüstete bestückungseinrichtung
JP2003341782A (ja) * 2002-05-27 2003-12-03 Oki Electric Ind Co Ltd 電子デバイス収容体、電子デバイスの搬送方法、電子デバイスの実装方法、電子デバイスの収容方法
US20080113532A1 (en) * 2006-11-13 2008-05-15 David Christopher Smeltz Pick-and-place card guide clip-on grounding members
EP1956879A1 (de) * 2007-02-09 2008-08-13 ASUSTeK Computer Inc. Abdeckung für Zufuhrvorrichtung
WO2008152701A1 (ja) * 2007-06-13 2008-12-18 Fujitsu Limited キャリアテープから電子部品を取り出す方法
US8337219B2 (en) 2011-02-19 2012-12-25 Laird Technologies, Inc. Card guide grounding strips
US9642294B2 (en) * 2011-04-08 2017-05-02 Micronic My Data AB Tape feeder and method for moving a carrier tape towards a picking position in a component mounting machine
NL2012876B1 (en) * 2014-05-23 2016-03-15 Ics Solutions B V Apparatus for thermally processing food packages comprising product carriers with positive package handling.
JP6571184B2 (ja) * 2015-06-18 2019-09-04 株式会社Ｆｕｊｉ テープ切断処理装置および処理方法
WO2017154109A1 (ja) * 2016-03-08 2017-09-14 富士機械製造株式会社 部品取出方法
CN109514761B (zh) * 2019-01-09 2023-10-13 上汽大众汽车有限公司 防漏投料器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH318102A (fr) * 1954-06-08 1956-12-15 Sapal Plieuses Automatiques Procédé pour l'emballage d'articles, notamment d'articles alimentaires
US3906614A (en) * 1974-07-18 1975-09-23 Illinois Tool Works Method of loading radial lead components on plastic carrier
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS57140000A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Electronic part supplying device
JPS57148875A (en) * 1981-03-11 1982-09-14 Shin Kobe Electric Mach Co Ltd Production of lattice for plate of lead storage battery
NL8103573A (nl) * 1981-07-29 1983-02-16 Philips Nv Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
JPS60152100A (ja) * 1984-01-20 1985-08-10 松下電器産業株式会社 電子部品供給装置
JPS6189435A (ja) * 1984-10-05 1986-05-07 Tooshin Reinetsu:Kk 厨房用油除去装置

Also Published As

Publication number Publication date
EP0223505A3 (en) 1989-04-26
EP0223505A2 (de) 1987-05-27
US4740136A (en) 1988-04-26
JPH0250640B2 (de) 1990-11-02
JPS62111825A (ja) 1987-05-22
EP0223505B1 (de) 1995-10-18
DE3650421T2 (de) 1996-04-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee