DE3650421D1 - Verfahren und Gerät zum Entfernen elektronischer Bauelemente von einem Trägerband. - Google Patents
Verfahren und Gerät zum Entfernen elektronischer Bauelemente von einem Trägerband.Info
- Publication number
- DE3650421D1 DE3650421D1 DE3650421T DE3650421T DE3650421D1 DE 3650421 D1 DE3650421 D1 DE 3650421D1 DE 3650421 T DE3650421 T DE 3650421T DE 3650421 T DE3650421 T DE 3650421T DE 3650421 D1 DE3650421 D1 DE 3650421D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- carrier tape
- removing electronic
- tape
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/003—Placing of components on belts holding the terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49819—Disassembling with conveying of work or disassembled work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49821—Disassembling by altering or destroying work part or connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53539—Means to assemble or disassemble including work conveyor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60249869A JPS62111825A (ja) | 1985-11-06 | 1985-11-06 | キヤリヤテ−プから電子部品を取り出す方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3650421D1 true DE3650421D1 (de) | 1995-11-23 |
DE3650421T2 DE3650421T2 (de) | 1996-04-04 |
Family
ID=17199398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3650421T Expired - Fee Related DE3650421T2 (de) | 1985-11-06 | 1986-11-05 | Verfahren und Gerät zum Entfernen elektronischer Bauelemente von einem Trägerband. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4740136A (de) |
EP (1) | EP0223505B1 (de) |
JP (1) | JPS62111825A (de) |
DE (1) | DE3650421T2 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5036571A (en) * | 1986-09-25 | 1991-08-06 | Illinois Tool Works, Inc. | Carrier tape and cover applying and removal devices for same |
JPH0770858B2 (ja) * | 1987-01-19 | 1995-07-31 | 三洋電機株式会社 | 部品供給装置 |
JPS63277166A (ja) * | 1987-05-09 | 1988-11-15 | Hitachi Ltd | チツプ電子部品供給装置 |
US4838452A (en) * | 1987-11-27 | 1989-06-13 | Universal Instruments Corporation | Shutter system for electrical component supply tape feeder |
JPH01145898A (ja) * | 1987-12-02 | 1989-06-07 | Matsushita Electric Ind Co Ltd | 部品供給装置 |
JPH01182742A (ja) * | 1988-01-13 | 1989-07-20 | Mitsubishi Electric Corp | 半導体装置の外観検査機 |
US5044875A (en) * | 1988-02-16 | 1991-09-03 | International Business Machines Corporation | Method and apparatus for positioning components |
EP0355836A3 (de) * | 1988-08-24 | 1991-05-02 | TDK Corporation | Vorrichtung und Verfahren zur automatischen Montage von elektronischen Bauteilen auf einer Leiterplatte |
US4883300A (en) * | 1988-10-13 | 1989-11-28 | Intelmatec Corporation | End effector for IC chip handling |
US5289625A (en) * | 1989-04-05 | 1994-03-01 | Canon Kabushiki Kaisha | Method for supplying articles and apparatus therefor |
CA2014450A1 (en) * | 1989-04-14 | 1990-10-14 | Henry J. Soth | Adjustable shutter for containment of small electronics components in tape feeders |
US5020959A (en) * | 1989-04-14 | 1991-06-04 | Universal Instruments Corporation | Adjustable shutter for containment of electrical components in tape feeders |
US5191693A (en) * | 1989-12-29 | 1993-03-09 | Canon Kabushiki Kaisha | Tape type work conveying method and conveying apparatus |
US5035316A (en) * | 1990-01-22 | 1991-07-30 | Universal Instruments Corporation | Isolating a first component to be pickup from other components on a vibratory feeder |
US5017078A (en) * | 1990-01-24 | 1991-05-21 | Molex Incorporated | Method and apparatus for unloading components from tape carrier packaging |
US5046610A (en) * | 1990-01-29 | 1991-09-10 | Christianson Systems, Inc. | Electronic component carrier |
WO1991011898A1 (en) * | 1990-01-29 | 1991-08-08 | Novapak, Inc. | Electronic component carrier |
US5101975A (en) * | 1990-10-31 | 1992-04-07 | Novapak, Inc. | Electronic component carrier |
SK280967B6 (sk) | 1990-03-02 | 2000-10-09 | Glaxo Group Limited | Inhalačný prístroj |
US6536427B2 (en) | 1990-03-02 | 2003-03-25 | Glaxo Group Limited | Inhalation device |
GB9004781D0 (en) * | 1990-03-02 | 1990-04-25 | Glaxo Group Ltd | Device |
YU48707B (sh) * | 1990-03-02 | 1999-07-28 | Glaxo Group Limited | Aparat za inhaliranje - inhalator |
JP2767976B2 (ja) * | 1990-05-25 | 1998-06-25 | ソニー株式会社 | 電子部品取出装置 |
JPH07114319B2 (ja) * | 1991-01-22 | 1995-12-06 | 松下電器産業株式会社 | チップ形電子部品の供給装置 |
JP3023207B2 (ja) * | 1991-05-11 | 2000-03-21 | 富士機械製造株式会社 | ラチェット装置およびテーピング電子部品送り装置 |
DE59301873D1 (de) * | 1992-09-21 | 1996-04-18 | Siemens Ag | Zuführeinrichtung für gegurtete SMD-Bauelemente |
JPH077292A (ja) * | 1993-06-18 | 1995-01-10 | Toshiba Corp | 部品供給装置 |
US5381508A (en) * | 1993-08-25 | 1995-01-10 | Krumenacher; Paul F. | Suction and light guide assembly |
US5440799A (en) * | 1993-12-08 | 1995-08-15 | Molex Incorporated | Electrical terminal applicator with improved terminal tape feed means |
US5605430A (en) * | 1994-02-15 | 1997-02-25 | Zierick Manufacturing Corporation | Feeder and method of supplying a continuous strip of surface mount contacts to surface mounting equipment |
US5449265A (en) * | 1994-02-15 | 1995-09-12 | Zierick Manufacturing Corporation | Feeder and method of supplying a continuous strip of surface mount contacts to pick-and-place machine |
JP3404431B2 (ja) * | 1994-07-04 | 2003-05-06 | 富士機械製造株式会社 | 電子部品供給カートリッジおよび電子部品供給取出装置 |
JP2666788B2 (ja) * | 1995-10-19 | 1997-10-22 | 日本電気株式会社 | チップサイズ半導体装置の製造方法 |
US5725140A (en) * | 1996-09-09 | 1998-03-10 | Amistar Corporation | Tape feeder for a surface mount placement system |
WO1998032316A1 (fr) * | 1997-01-20 | 1998-07-23 | Matsushita Electric Industrial Co., Ltd. | Procede et appareil d'alimentation en composants |
US6082954A (en) | 1997-02-21 | 2000-07-04 | Summit Holding Two, Inc. | Tape feeders and systems using the same |
JP3935579B2 (ja) * | 1997-10-29 | 2007-06-27 | 富士機械製造株式会社 | カバーテープ送り装置,カバーテープ処理装置およびフィーダユニット |
JP4117859B2 (ja) * | 1998-06-24 | 2008-07-16 | 富士機械製造株式会社 | 部品供給ユニット |
US6162007A (en) * | 1999-01-14 | 2000-12-19 | Witte; Stefan | Apparatus for feeding electronic component tape |
DE60037945D1 (de) * | 1999-11-05 | 2008-03-20 | Matsushita Electric Ind Co Ltd | Teilezuführmethode und vorrichtung und damit ausgerüstete bestückungseinrichtung |
JP2003341782A (ja) * | 2002-05-27 | 2003-12-03 | Oki Electric Ind Co Ltd | 電子デバイス収容体、電子デバイスの搬送方法、電子デバイスの実装方法、電子デバイスの収容方法 |
US20080113532A1 (en) * | 2006-11-13 | 2008-05-15 | David Christopher Smeltz | Pick-and-place card guide clip-on grounding members |
EP1956879A1 (de) * | 2007-02-09 | 2008-08-13 | ASUSTeK Computer Inc. | Abdeckung für Zufuhrvorrichtung |
JP5136552B2 (ja) * | 2007-06-13 | 2013-02-06 | 富士通株式会社 | キャリアテープから電子部品を取り出す方法 |
US8337219B2 (en) | 2011-02-19 | 2012-12-25 | Laird Technologies, Inc. | Card guide grounding strips |
JP6321538B2 (ja) * | 2011-04-08 | 2018-05-09 | マイクロニック マイデータ アクティエボラーグ | 部品取り付け機においてピックアップ位置に向けて搬送テープを動かすテープフィーダー及び方法 |
NL2012876B1 (en) * | 2014-05-23 | 2016-03-15 | Ics Solutions B V | Apparatus for thermally processing food packages comprising product carriers with positive package handling. |
CN107710905B (zh) * | 2015-06-18 | 2019-11-15 | 株式会社富士 | 带切断处理装置及处理方法 |
JP6684893B2 (ja) * | 2016-03-08 | 2020-04-22 | 株式会社Fuji | 部品取出方法 |
CN109514761B (zh) * | 2019-01-09 | 2023-10-13 | 上汽大众汽车有限公司 | 防漏投料器 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH318102A (fr) * | 1954-06-08 | 1956-12-15 | Sapal Plieuses Automatiques | Procédé pour l'emballage d'articles, notamment d'articles alimentaires |
US3906614A (en) * | 1974-07-18 | 1975-09-23 | Illinois Tool Works | Method of loading radial lead components on plastic carrier |
JPS5599795A (en) * | 1979-01-25 | 1980-07-30 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
JPS57140000A (en) * | 1981-02-23 | 1982-08-30 | Matsushita Electric Ind Co Ltd | Electronic part supplying device |
JPS57148875A (en) * | 1981-03-11 | 1982-09-14 | Shin Kobe Electric Mach Co Ltd | Production of lattice for plate of lead storage battery |
NL8103573A (nl) * | 1981-07-29 | 1983-02-16 | Philips Nv | Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie. |
JPS60152100A (ja) * | 1984-01-20 | 1985-08-10 | 松下電器産業株式会社 | 電子部品供給装置 |
JPS6189435A (ja) * | 1984-10-05 | 1986-05-07 | Tooshin Reinetsu:Kk | 厨房用油除去装置 |
-
1985
- 1985-11-06 JP JP60249869A patent/JPS62111825A/ja active Granted
-
1986
- 1986-10-31 US US06/925,790 patent/US4740136A/en not_active Expired - Lifetime
- 1986-11-05 DE DE3650421T patent/DE3650421T2/de not_active Expired - Fee Related
- 1986-11-05 EP EP86308620A patent/EP0223505B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0250640B2 (de) | 1990-11-02 |
JPS62111825A (ja) | 1987-05-22 |
US4740136A (en) | 1988-04-26 |
EP0223505A3 (en) | 1989-04-26 |
EP0223505A2 (de) | 1987-05-27 |
EP0223505B1 (de) | 1995-10-18 |
DE3650421T2 (de) | 1996-04-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |