DE3685749T2 - Tastungsempfindliche anzeigeleuchte. - Google Patents
Tastungsempfindliche anzeigeleuchte.Info
- Publication number
- DE3685749T2 DE3685749T2 DE19863685749 DE3685749T DE3685749T2 DE 3685749 T2 DE3685749 T2 DE 3685749T2 DE 19863685749 DE19863685749 DE 19863685749 DE 3685749 T DE3685749 T DE 3685749T DE 3685749 T2 DE3685749 T2 DE 3685749T2
- Authority
- DE
- Germany
- Prior art keywords
- key
- indicator light
- sensitive indicator
- sensitive
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/941—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/964—Piezo-electric touch switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/9645—Resistive touch switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPH315185 | 1985-10-29 | ||
AUPH790986 | 1986-09-09 | ||
PCT/AU1986/000324 WO1987002846A1 (en) | 1985-10-29 | 1986-10-29 | Touch sensitive indicating light |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3685749D1 DE3685749D1 (de) | 1992-07-23 |
DE3685749T2 true DE3685749T2 (de) | 1993-01-21 |
Family
ID=25643008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19863685749 Expired - Fee Related DE3685749T2 (de) | 1985-10-29 | 1986-10-29 | Tastungsempfindliche anzeigeleuchte. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4878107A (de) |
EP (1) | EP0243411B1 (de) |
AU (1) | AU594397B2 (de) |
DE (1) | DE3685749T2 (de) |
WO (1) | WO1987002846A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10146996A1 (de) * | 2001-09-25 | 2003-04-30 | Gerd Reime | Schaltung mit einer optoeleketronischen Anzeigeeinhalt |
DE102014106496A1 (de) * | 2014-05-08 | 2015-11-12 | Toni Begle | Annäherungssensitives Leuchtmittel |
DE10225778B4 (de) | 2001-06-11 | 2020-06-18 | Lumileds Holding B.V. | Leuchtstoff umgewandelte, Licht emittierende Anordnung |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4805739A (en) * | 1988-01-14 | 1989-02-21 | U.S. Elevator Corporation | Elevator control switch and position indicator assembly |
JPH071804B2 (ja) * | 1989-02-15 | 1995-01-11 | シャープ株式会社 | 発光素子アレイ光源 |
US5500635A (en) * | 1990-02-20 | 1996-03-19 | Mott; Jonathan C. | Products incorporating piezoelectric material |
WO1991013288A1 (en) * | 1990-02-20 | 1991-09-05 | Jonathan Christopher Mott | Products incorporating piezoelectric material |
JP2871802B2 (ja) * | 1990-04-19 | 1999-03-17 | アルプス電気株式会社 | 照光式キートツプ |
JP2535651B2 (ja) * | 1990-07-24 | 1996-09-18 | 株式会社東芝 | 半導体装置 |
GB2260195A (en) * | 1991-09-27 | 1993-04-07 | Carters | Capacitative proximity switch controlled apparatus |
GB2258922A (en) * | 1991-10-17 | 1993-02-24 | Philips Nv | Power supply circuit for personal-care apparatus. |
US5188447A (en) * | 1992-01-21 | 1993-02-23 | Marpole International Inc. | Illuminating system |
US5266817A (en) * | 1992-05-18 | 1993-11-30 | Lin Paul Y S | Package structure of multi-chip light emitting diode |
DE4311530A1 (de) * | 1992-10-02 | 1994-04-07 | Telefunken Microelectron | Optoelektronisches Bauelement mit engem Öffnungswinkel |
FR2701792B1 (fr) * | 1993-02-18 | 1996-05-15 | Daniel Ansel | Installation pour l'alimentation d'un organe électrique permettant une commande au toucher, procédé de réalisation et applications. |
US5316035A (en) * | 1993-02-19 | 1994-05-31 | Fluoroware, Inc. | Capacitive proximity monitoring device for corrosive atmosphere environment |
US5410148A (en) * | 1993-05-14 | 1995-04-25 | Kes Corporation | Safety switch system with photooptical and capacitance detection |
US5387803A (en) * | 1993-06-16 | 1995-02-07 | Kulite Semiconductor Products, Inc. | Piezo-optical pressure sensitive switch with porous material |
US5594238A (en) * | 1995-02-17 | 1997-01-14 | Albert J. Endruschat | Touchless switch which discriminates between motion intended to toggle the switch and other forms of motion |
AU7478096A (en) * | 1995-11-01 | 1997-05-22 | Gre, Incorporated | Piezoluminescent sensor sheet with a piezoresistive layer |
US6020632A (en) * | 1997-02-26 | 2000-02-01 | Motorola, Inc. | Electronic component including an adjustable cap |
US6149304A (en) * | 1997-05-09 | 2000-11-21 | The Procter & Gamble Company | Flexible storage bag with selectively-activatible closure |
US5973623A (en) * | 1997-10-21 | 1999-10-26 | Stmicroelectronics, Inc. | Solid state capacitive switch |
US7528508B2 (en) | 1998-10-09 | 2009-05-05 | Azoteq Pty Ltd. | Touch sensor user interface with compressible material construction |
US7265494B2 (en) | 1998-10-09 | 2007-09-04 | Azoteq Pty Ltd. | Intelligent user interface with touch sensor technology |
DE19855220A1 (de) * | 1998-11-30 | 2000-05-31 | Sick Ag | Opto-elektronischer Sensor und Verfahren zu dessen Herstellung |
US6388390B2 (en) | 1999-04-06 | 2002-05-14 | Erwin J. Rachwal | Flashlight |
AUPQ286199A0 (en) * | 1999-09-15 | 1999-10-07 | Eveready Battery Company Inc. | Portable light |
US6343498B1 (en) * | 1999-10-29 | 2002-02-05 | Denso Corporation | Physical quantity sensor having fault detection function |
US7320632B2 (en) * | 2000-06-15 | 2008-01-22 | Lednium Pty Limited | Method of producing a lamp |
AUPQ818100A0 (en) * | 2000-06-15 | 2000-07-06 | Arlec Australia Limited | Led lamp |
DE10043483A1 (de) * | 2000-09-04 | 2002-07-25 | Infineon Technologies Ag | Optisches Sendemodul |
US7361860B2 (en) * | 2001-11-20 | 2008-04-22 | Touchsensor Technologies, Llc | Integrated touch sensor and light apparatus |
KR100459252B1 (ko) * | 2001-12-12 | 2004-12-03 | 김진락 | 광전소자를 이용한 도어로크 제어장치 |
GB2388904A (en) * | 2002-01-26 | 2003-11-26 | Audix Broadcast Ltd | Touch-sensitive illuminated control element |
DE10214198B4 (de) * | 2002-03-29 | 2005-07-07 | Münchner Hybrid Systemtechnik GmbH | Schaltbares Leuchtmittel mit automatischer Notbeleuchtung |
DE10214199B4 (de) * | 2002-03-29 | 2005-07-14 | Münchner Hybrid Systemtechnik GmbH | Beleuchtbarer sensitiver Schalter |
DE10214197B4 (de) * | 2002-03-29 | 2005-07-07 | Münchner Hybrid Systemtechnik GmbH | Optoelektronische Sensoranordnung |
CA2488904A1 (en) * | 2002-06-14 | 2003-12-24 | Lednium Pty Ltd | A lamp and method of producing a lamp |
US6634031B1 (en) | 2002-06-17 | 2003-10-21 | Thomas P. Schlapkohl | Cap mounted light |
DE10233139B4 (de) * | 2002-07-20 | 2005-07-07 | Münchner Hybrid Systemtechnik GmbH | Leuchtmittel mit einem sensitiven Schalter |
ES2229853B1 (es) * | 2002-08-06 | 2006-07-01 | Manuel Vicente Fernandez Castello | Pomo de cambio de automovil con efectos luminosos de colores y sensor tactil. |
KR20040032344A (ko) * | 2002-10-09 | 2004-04-17 | 진일권 | 터치스위치/터치디머 내장형 전구 |
JP4745667B2 (ja) * | 2002-12-20 | 2011-08-10 | アイタック システムズ,インコーポレイティド | カーソル制御デバイス |
EP1604402A1 (de) * | 2003-03-12 | 2005-12-14 | Lednium Pty Limited | Lampe und verfahren zur herstellung einer lampe |
CN100381083C (zh) | 2003-04-29 | 2008-04-16 | 韩力 | 一种非可燃性电子喷雾香烟 |
JP2005005058A (ja) * | 2003-06-10 | 2005-01-06 | Omron Corp | 導電体検出スイッチ |
US10499465B2 (en) | 2004-02-25 | 2019-12-03 | Lynk Labs, Inc. | High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same |
US10575376B2 (en) | 2004-02-25 | 2020-02-25 | Lynk Labs, Inc. | AC light emitting diode and AC LED drive methods and apparatus |
US20050200184A1 (en) * | 2004-02-25 | 2005-09-15 | Johnson Controls Technology Company | Mechanically locked recliners |
GB2412720A (en) * | 2004-04-02 | 2005-10-05 | Henry Oliver Theobald | An electrical light source sensitive to changes in air pressure |
JP5101497B2 (ja) * | 2005-06-10 | 2012-12-19 | コンパニー ゼネラール デ エタブリッスマン ミシュラン | 電子装置パッケージ・ハウジングに取り付けられている圧電センサの使用 |
WO2007047762A2 (en) * | 2005-10-14 | 2007-04-26 | P-Inc. Holdings, Llc | Pressure responsive sensor |
DE102005049446A1 (de) * | 2005-10-15 | 2007-04-26 | Bayer Materialscience Ag | Berührungsgeschaltete Kunststoff-Leucht-Pinzette |
US20090073700A1 (en) * | 2007-09-13 | 2009-03-19 | Cruickshank William T | Light Emitting Diode Package Assembly |
ES2379600T3 (es) * | 2007-10-08 | 2012-04-27 | Whirlpool Corporation | Conmutador táctil capacitativo y aparato doméstico provisto con dicho conmutador |
ES2379890T3 (es) * | 2007-10-08 | 2012-05-04 | Whirlpool Corporation | Interruptor táctil capacitivo y electrodoméstico provisto con tal interruptor |
US8723807B2 (en) * | 2008-01-09 | 2014-05-13 | Integrated Device Technology, Inc. | Combined touch sensor and LED driver with n-type MOSFET protecting touch sensor |
EP2230765B1 (de) | 2009-03-16 | 2012-05-02 | Siemens Aktiengesellschaft | Sensorvorrichtung, Verfahren zum Erfassen einer Bedienhandlung und Bedienvorrichtung |
US8629364B2 (en) | 2010-03-01 | 2014-01-14 | Visteon Global Technologies, Inc. | Method for implementing capacitive sensing in the presence of conductive decorative materials |
DE102010036645B4 (de) * | 2010-07-27 | 2016-12-01 | Krauss-Maffei Wegmann Gmbh & Co. Kg | Kapazitive Messvorrichtung und Messverfahren |
US8866708B2 (en) * | 2011-01-21 | 2014-10-21 | Peter Sui Lun Fong | Light emitting diode switch device and array |
US8873343B2 (en) | 2011-05-13 | 2014-10-28 | Edward Jay Higgins | Signaling device and method of use in caring for pets |
US8547017B2 (en) | 2011-05-13 | 2013-10-01 | Ford Global Technologies, Llc | Vehicle dome and reading light |
TWI515632B (zh) | 2012-06-26 | 2016-01-01 | 緯創資通股份有限公司 | 隨觸即用輸入裝置以及操作方法 |
EP2717474A1 (de) * | 2012-10-02 | 2014-04-09 | Thomson Licensing | Anordnung mit mehreren Funktionen für elektronische Vorrichtung und Verfahren dafür |
US20140099894A1 (en) * | 2012-10-09 | 2014-04-10 | Research In Motion Limited | Apparatus and method pertaining to testing a stylus communication path for interference |
US20140269226A1 (en) * | 2013-03-15 | 2014-09-18 | Arlen J. Lowrance | Pressure actuated timing apparatus for use with games and the like |
US20150331393A1 (en) * | 2013-03-15 | 2015-11-19 | Arlen J. Lowrance | Pressure actuated timing apparatus for use with games and the like |
CN104168009B (zh) * | 2013-05-17 | 2018-03-23 | 光宝电子(广州)有限公司 | 发光型触控开关装置及发光型触控开关模组 |
CN104992635B (zh) * | 2015-07-03 | 2018-05-08 | 江门吉华光电精密有限公司 | 一种触控式数码管 |
USD877707S1 (en) * | 2017-03-30 | 2020-03-10 | Mitsubishi Electric Corporation | Semiconductor package |
US11248769B2 (en) | 2019-04-10 | 2022-02-15 | Peter Sui Lun Fong | Optic for touch-sensitive light emitting diode switch |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1231757B (de) * | 1966-01-29 | 1967-01-05 | Zeiss Ikon Ag | Tastatur mit unbeweglichen Tastschaltern |
US3805347A (en) * | 1969-12-29 | 1974-04-23 | Gen Electric | Solid state lamp construction |
US3855606A (en) * | 1971-12-23 | 1974-12-17 | Licentia Gmbh | Semiconductor arrangement |
US3732389A (en) * | 1972-02-14 | 1973-05-08 | Litton Systems Inc | Touch entry switch array |
US3777222A (en) * | 1972-05-12 | 1973-12-04 | Ibm | Modular touch sensitive indicating panels with touch and light transmissive overlay cover membrane containing visible printed indicia |
CH563690A5 (de) * | 1973-03-09 | 1975-06-30 | Radioelectrique Comp Ind | |
US3922563A (en) * | 1974-08-28 | 1975-11-25 | Richard E Penman | Solid state touch operated switch |
US4032963A (en) * | 1974-09-03 | 1977-06-28 | Motorola, Inc. | Package and method for a semiconductor radiant energy emitting device |
DE2509047C3 (de) * | 1975-03-01 | 1980-07-10 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kunststoffgehäuse für eine Lumineszenzdiode |
US4016453A (en) * | 1976-03-15 | 1977-04-05 | Herald Richard Moennig | Proximity pad with controlled illumination |
GB1583851A (en) * | 1977-03-26 | 1981-02-04 | Omron Tateisi Electronics Co | Device for use in a switching system |
US4152629A (en) * | 1977-06-15 | 1979-05-01 | Raupp Harry F | Lamp responsive to the human touch upon a living plant and control system therefor |
US4414478A (en) * | 1980-03-03 | 1983-11-08 | Omron Tateisi Electronics Co. | Electronic switching device |
EP0041830A1 (de) * | 1980-06-10 | 1981-12-16 | Kenwood Manufacturing Company Limited | Berührungsschalter |
JPS5944809B2 (ja) * | 1980-06-16 | 1984-11-01 | オムロン株式会社 | 光電スイッチ |
DE3029595C1 (de) * | 1980-08-05 | 1981-10-01 | Ifm Electronic Gmbh, 4300 Essen | Schaltzustandsanzeige fuer ein elektrisches,insbesondere elektronisches,beruehrungslos arbeitendes Schaltgeraet |
WO1982001630A1 (en) * | 1980-10-29 | 1982-05-13 | Harris Geoffrey J | Proximity switch |
US4550310A (en) * | 1981-10-29 | 1985-10-29 | Fujitsu Limited | Touch sensing device |
GB2111215A (en) * | 1981-10-31 | 1983-06-29 | Alastair Sibbald | Electrochemical sensor assembly |
DE3146328A1 (de) * | 1981-11-23 | 1983-06-01 | Siemens AG, 1000 Berlin und 8000 München | Leuchtdiodenvorrichtung mit schutzeinrichtung zur begrenzung des durchlassstroms |
US4593191A (en) * | 1982-12-29 | 1986-06-03 | At&T Bell Laboratories | Pressure and optical sensitive device with deformable protrusions |
GB8302997D0 (en) * | 1983-02-03 | 1983-03-09 | Bergstrom A | Electromagnetic radiation circuit element |
US4591710A (en) * | 1983-07-11 | 1986-05-27 | Electro Mechanical Systems, Inc. | Ambient light and electromagnetic noise reduction circuit |
JPS6084631A (ja) * | 1983-09-16 | 1985-05-14 | Yokogawa Hewlett Packard Ltd | 表示面上入力装置 |
US4761637A (en) * | 1984-06-18 | 1988-08-02 | Carroll Touch Inc. | Touch input device |
US4668876A (en) * | 1984-06-28 | 1987-05-26 | Skarman John S | Touch control switch and lamp system |
JPH0325219Y2 (de) * | 1985-02-15 | 1991-05-31 |
-
1986
- 1986-10-29 WO PCT/AU1986/000324 patent/WO1987002846A1/en active IP Right Grant
- 1986-10-29 US US07/084,795 patent/US4878107A/en not_active Expired - Fee Related
- 1986-10-29 AU AU65906/86A patent/AU594397B2/en not_active Ceased
- 1986-10-29 DE DE19863685749 patent/DE3685749T2/de not_active Expired - Fee Related
- 1986-10-29 EP EP19860906240 patent/EP0243411B1/de not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10225778B4 (de) | 2001-06-11 | 2020-06-18 | Lumileds Holding B.V. | Leuchtstoff umgewandelte, Licht emittierende Anordnung |
DE10146996A1 (de) * | 2001-09-25 | 2003-04-30 | Gerd Reime | Schaltung mit einer optoeleketronischen Anzeigeeinhalt |
DE102014106496A1 (de) * | 2014-05-08 | 2015-11-12 | Toni Begle | Annäherungssensitives Leuchtmittel |
DE102014106496B4 (de) * | 2014-05-08 | 2017-05-18 | Toni Begle | Annäherungssensitive Lichtquelle und Bedieneinheit mit einer derartigen Lichtquelle |
Also Published As
Publication number | Publication date |
---|---|
AU6590686A (en) | 1987-05-19 |
EP0243411A4 (de) | 1989-06-26 |
AU594397B2 (en) | 1990-03-08 |
US4878107A (en) | 1989-10-31 |
EP0243411B1 (de) | 1992-06-17 |
DE3685749D1 (de) | 1992-07-23 |
EP0243411A1 (de) | 1987-11-04 |
WO1987002846A1 (en) | 1987-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3685749T2 (de) | Tastungsempfindliche anzeigeleuchte. | |
NO863995L (no) | Gjennomsiktig gjenstand. | |
ES2019877B3 (es) | Estrangulador de medida. | |
FI864371A (fi) | Tvaolkomposition. | |
ATE55980T1 (de) | 2-hydroxy-3-phenoxypropylamine. | |
NO861617L (no) | Imidazokinolinonderivater. | |
NO863626L (no) | Vann-i-olje-emulsjoner. | |
NO863645D0 (no) | Glykosidforbindelser. | |
FI862430A (fi) | Polymerkomposition. | |
FI864633A (fi) | Flytande tvaettmedelskomposition. | |
DE3676008D1 (de) | Substituierte di-t-butylphenole. | |
ATE50243T1 (de) | Fluorbenzylester. | |
DE3481097D1 (de) | Leuchtanzeige. | |
DE3751911D1 (de) | Lichtanzeige | |
FI862399A (fi) | Antibakteriskt verkande kinolonkarboxylsyraestrar. | |
FI873023A (fi) | Ledande flaensar foer roerfoerbindning. | |
FI860519A (fi) | Cigarrettfilter. | |
FI860090A0 (fi) | Skida. | |
FI861496A (fi) | Dubbelvals-gatsopningsmaskin. | |
FI861980A0 (fi) | Kyldisk med transparent framvaegg. | |
DE3676586D1 (de) | Substituierte di-t-butylphenole. | |
FI863783A (fi) | Nytt framstaellningsfoerfarande foer vaermebestaendig transglukosidas. | |
FI860621A (fi) | Alkanolaminderivat. | |
FI865076A0 (fi) | Tandkraemsfoerpackning. | |
FI862205A (fi) | Avgasroer foer foerbraenningsmotor. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |