DE3686092D1 - Verfahren zur in-situ-herstellung einer schutzschicht auf photolack fuer plasmaaetzen. - Google Patents

Verfahren zur in-situ-herstellung einer schutzschicht auf photolack fuer plasmaaetzen.

Info

Publication number
DE3686092D1
DE3686092D1 DE8686303796T DE3686092T DE3686092D1 DE 3686092 D1 DE3686092 D1 DE 3686092D1 DE 8686303796 T DE8686303796 T DE 8686303796T DE 3686092 T DE3686092 T DE 3686092T DE 3686092 D1 DE3686092 D1 DE 3686092D1
Authority
DE
Germany
Prior art keywords
photolack
plasma
protective layer
situ production
situ
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686303796T
Other languages
English (en)
Other versions
DE3686092T2 (de
Inventor
Simon Wood Tam
Jerry Yuen Kui Wong
Ronald Paul Reade
David Nin-Kou Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE3686092D1 publication Critical patent/DE3686092D1/de
Publication of DE3686092T2 publication Critical patent/DE3686092T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/3086—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31058—After-treatment of organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
DE8686303796T 1985-05-20 1986-05-19 Verfahren zur in-situ-herstellung einer schutzschicht auf photolack fuer plasmaaetzen. Expired - Fee Related DE3686092T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/736,435 US4613400A (en) 1985-05-20 1985-05-20 In-situ photoresist capping process for plasma etching

Publications (2)

Publication Number Publication Date
DE3686092D1 true DE3686092D1 (de) 1992-08-27
DE3686092T2 DE3686092T2 (de) 1993-01-07

Family

ID=24959844

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686303796T Expired - Fee Related DE3686092T2 (de) 1985-05-20 1986-05-19 Verfahren zur in-situ-herstellung einer schutzschicht auf photolack fuer plasmaaetzen.

Country Status (5)

Country Link
US (1) US4613400A (de)
EP (1) EP0202907B1 (de)
JP (1) JP2553513B2 (de)
KR (1) KR940000913B1 (de)
DE (1) DE3686092T2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6784033B1 (en) 1984-02-15 2004-08-31 Semiconductor Energy Laboratory Co., Ltd. Method for the manufacture of an insulated gate field effect semiconductor device
US6113701A (en) * 1985-02-14 2000-09-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method, and system
DE3514094A1 (de) * 1985-04-16 1986-10-23 Schering AG, Berlin und Bergkamen, 1000 Berlin Herstellung metallischer strukturen auf anorganischen nichtleitern
US6230650B1 (en) 1985-10-14 2001-05-15 Semiconductor Energy Laboratory Co., Ltd. Microwave enhanced CVD system under magnetic field
US6673722B1 (en) 1985-10-14 2004-01-06 Semiconductor Energy Laboratory Co., Ltd. Microwave enhanced CVD system under magnetic field
FR2604188B1 (fr) * 1986-09-18 1992-11-27 Framatome Sa Element tubulaire en acier inoxydable presentant une resistance a l'usure amelioree
US4717448A (en) * 1986-10-09 1988-01-05 International Business Machines Corporation Reactive ion etch chemistry for providing deep vertical trenches in semiconductor substrates
US4750980A (en) * 1986-11-07 1988-06-14 Texas Instruments Incorporated Process for etching tin oxide
EP0272143B1 (de) * 1986-12-19 1999-03-17 Applied Materials, Inc. Bromine-Ätzverfahren für Silizium
US4778563A (en) * 1987-03-26 1988-10-18 Applied Materials, Inc. Materials and methods for etching tungsten polycides using silicide as a mask
DE3873848T2 (de) * 1987-07-16 1993-03-11 Texas Instruments Inc Behandlungsapparat und -verfahren.
JP2947818B2 (ja) * 1988-07-27 1999-09-13 株式会社日立製作所 微細孔への金属穴埋め方法
US4978594A (en) * 1988-10-17 1990-12-18 International Business Machines Corporation Fluorine-containing base layer for multi-layer resist processes
DE68923247T2 (de) * 1988-11-04 1995-10-26 Fujitsu Ltd Verfahren zum Erzeugen eines Fotolackmusters.
US6008133A (en) * 1991-04-04 1999-12-28 Hitachi, Ltd. Method and apparatus for dry etching
US5610753A (en) * 1991-12-12 1997-03-11 Eastman Kodak Company Optical design of laser scanner to reduce thermal sensitivity
FR2695410B1 (fr) * 1992-09-04 1994-11-18 France Telecom Procédé de prétraitement d'un substrat pour le dépôt sélectif de tungstène.
JPH09501612A (ja) * 1994-04-08 1997-02-18 マーク エー． レイ， 選択的プラズマ成長
US6139647A (en) * 1995-12-21 2000-10-31 International Business Machines Corporation Selective removal of vertical portions of a film
US5767017A (en) * 1995-12-21 1998-06-16 International Business Machines Corporation Selective removal of vertical portions of a film
US6025268A (en) * 1996-06-26 2000-02-15 Advanced Micro Devices, Inc. Method of etching conductive lines through an etch resistant photoresist mask
US5942446A (en) * 1997-09-12 1999-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Fluorocarbon polymer layer deposition predominant pre-etch plasma etch method for forming patterned silicon containing dielectric layer
US5801083A (en) * 1997-10-20 1998-09-01 Chartered Semiconductor Manufacturing, Ltd. Use of polymer spacers for the fabrication of shallow trench isolation regions with rounded top corners
US6121154A (en) * 1997-12-23 2000-09-19 Lam Research Corporation Techniques for etching with a photoresist mask
US6103596A (en) * 1998-02-19 2000-08-15 Taiwan Semiconductor Manufacturing Company Process for etching a silicon nitride hardmask mask with zero etch bias
KR20010042419A (ko) 1998-04-02 2001-05-25 조셉 제이. 스위니 낮은 ｋ 유전체를 에칭하는 방법
US6291357B1 (en) 1999-10-06 2001-09-18 Applied Materials, Inc. Method and apparatus for etching a substrate with reduced microloading
TW200409230A (en) * 2002-11-28 2004-06-01 Au Optronics Corp Method for avoiding non-uniform etching of silicon layer
US20040224524A1 (en) * 2003-05-09 2004-11-11 Applied Materials, Inc. Maintaining the dimensions of features being etched on a lithographic mask
KR100510558B1 (ko) * 2003-12-13 2005-08-26 삼성전자주식회사 패턴 형성 방법
US20060000796A1 (en) * 2004-06-30 2006-01-05 Elliot Tan Method for controlling critical dimensions and etch bias
US7709391B2 (en) * 2006-01-20 2010-05-04 Applied Materials, Inc. Methods for in-situ generation of reactive etch and growth specie in film formation processes
CN104465386A (zh) * 2013-09-24 2015-03-25 中芯国际集成电路制造(北京)有限公司 半导体结构的形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4255230A (en) * 1980-02-22 1981-03-10 Eaton Corporation Plasma etching process
NL8004007A (nl) * 1980-07-11 1982-02-01 Philips Nv Werkwijze voor het vervaardigen van een halfgeleider- inrichting.
US4333793A (en) * 1980-10-20 1982-06-08 Bell Telephone Laboratories, Incorporated High-selectivity plasma-assisted etching of resist-masked layer
JPS6059302B2 (ja) * 1981-05-26 1985-12-24 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 多量の酸素を用いた反応性イオン食刻法
US4450042A (en) * 1982-07-06 1984-05-22 Texas Instruments Incorporated Plasma etch chemistry for anisotropic etching of silicon
JPS59141228A (ja) * 1983-02-01 1984-08-13 Mitsubishi Electric Corp 微細パタ−ン形成方法
US4468285A (en) * 1983-12-22 1984-08-28 Advanced Micro Devices, Inc. Plasma etch process for single-crystal silicon with improved selectivity to silicon dioxide

Also Published As

Publication number Publication date
JPS6230890A (ja) 1987-02-09
EP0202907A2 (de) 1986-11-26
JP2553513B2 (ja) 1996-11-13
KR860009475A (ko) 1986-12-23
KR940000913B1 (ko) 1994-02-04
US4613400A (en) 1986-09-23
DE3686092T2 (de) 1993-01-07
EP0202907B1 (de) 1992-07-22
EP0202907A3 (en) 1988-07-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee