DE3780025T2 - Doppelloetverfahren zur verbindung der anschlusskontakte von elektrischen bauelementen mit den leitern von gedruckten schaltungen. - Google Patents
Doppelloetverfahren zur verbindung der anschlusskontakte von elektrischen bauelementen mit den leitern von gedruckten schaltungen.Info
- Publication number
- DE3780025T2 DE3780025T2 DE8787311538T DE3780025T DE3780025T2 DE 3780025 T2 DE3780025 T2 DE 3780025T2 DE 8787311538 T DE8787311538 T DE 8787311538T DE 3780025 T DE3780025 T DE 3780025T DE 3780025 T2 DE3780025 T2 DE 3780025T2
- Authority
- DE
- Germany
- Prior art keywords
- ladders
- electrical components
- printed circuits
- connection contacts
- soldering method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/002,486 US4739917A (en) | 1987-01-12 | 1987-01-12 | Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3780025D1 DE3780025D1 (de) | 1992-07-30 |
DE3780025T2 true DE3780025T2 (de) | 1993-02-11 |
Family
ID=21701006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787311538T Expired - Lifetime DE3780025T2 (de) | 1987-01-12 | 1987-12-31 | Doppelloetverfahren zur verbindung der anschlusskontakte von elektrischen bauelementen mit den leitern von gedruckten schaltungen. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4739917A (de) |
EP (1) | EP0274915B1 (de) |
JP (1) | JPS63182891A (de) |
CA (1) | CA1284190C (de) |
DE (1) | DE3780025T2 (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0241794A (ja) * | 1988-07-29 | 1990-02-09 | Hitachi Ltd | はんだ合金およびこれを用いた電子回路装置 |
US4907734A (en) * | 1988-10-28 | 1990-03-13 | International Business Machines Corporation | Method of bonding gold or gold alloy wire to lead tin solder |
WO1990007792A1 (en) * | 1989-01-03 | 1990-07-12 | Motorola, Inc. | Method of making high density solder bumps and a substrate socket for high density solder bumps |
US5024372A (en) * | 1989-01-03 | 1991-06-18 | Motorola, Inc. | Method of making high density solder bumps and a substrate socket for high density solder bumps |
DE3921444A1 (de) * | 1989-06-30 | 1991-01-03 | Bosch Gmbh Robert | Verfahren zum aufbringen einer lotschicht |
US5130779A (en) * | 1990-06-19 | 1992-07-14 | International Business Machines Corporation | Solder mass having conductive encapsulating arrangement |
US5251806A (en) * | 1990-06-19 | 1993-10-12 | International Business Machines Corporation | Method of forming dual height solder interconnections |
US5233504A (en) * | 1990-12-06 | 1993-08-03 | Motorola, Inc. | Noncollapsing multisolder interconnection |
US5154341A (en) * | 1990-12-06 | 1992-10-13 | Motorola Inc. | Noncollapsing multisolder interconnection |
US5118027A (en) * | 1991-04-24 | 1992-06-02 | International Business Machines Corporation | Method of aligning and mounting solder balls to a substrate |
JPH07500692A (ja) * | 1991-07-16 | 1995-01-19 | バーグ・テクノロジー・インコーポレーテッド | リフローが出来て半田付け可能な材料の塊をその上に有するコンタクト |
US5203075A (en) * | 1991-08-12 | 1993-04-20 | Inernational Business Machines | Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders |
US5133495A (en) * | 1991-08-12 | 1992-07-28 | International Business Machines Corporation | Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween |
ES2128989B1 (es) * | 1992-01-29 | 2000-02-16 | Mecanismos Aux Ind | Mejoras introducidas en la patente de invencion n-9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes. |
JPH06177526A (ja) * | 1992-12-09 | 1994-06-24 | Toyota Autom Loom Works Ltd | 接合剤の印刷方法 |
KR0179709B1 (ko) * | 1994-08-02 | 1999-04-15 | 마꼬또 무라따 | 볼 그리드 어레이용 땜납 페이스트 및 이를 이용한 볼 그리드 어레이 |
US6344234B1 (en) * | 1995-06-07 | 2002-02-05 | International Business Machines Corportion | Method for forming reflowed solder ball with low melting point metal cap |
US5803343A (en) * | 1995-10-30 | 1998-09-08 | Delco Electronics Corp. | Solder process for enhancing reliability of multilayer hybrid circuits |
US5667132A (en) * | 1996-04-19 | 1997-09-16 | Lucent Technologies Inc. | Method for solder-bonding contact pad arrays |
US5803344A (en) * | 1996-09-09 | 1998-09-08 | Delco Electronics Corp. | Dual-solder process for enhancing reliability of thick-film hybrid circuits |
US6090643A (en) * | 1998-08-17 | 2000-07-18 | Teccor Electronics, L.P. | Semiconductor chip-substrate attachment structure |
US6144104A (en) | 1999-03-24 | 2000-11-07 | Visteon Corporation | High-operating-temperature electronic component |
US6303400B1 (en) | 1999-09-23 | 2001-10-16 | International Business Machines Corporation | Temporary attach article and method for temporary attach of devices to a substrate |
US6164520A (en) * | 1999-11-11 | 2000-12-26 | Visteon Global Technologies, Inc. | Robust thick film conductors |
US6543674B2 (en) | 2001-02-06 | 2003-04-08 | Fujitsu Limited | Multilayer interconnection and method |
US7768131B1 (en) * | 2009-06-27 | 2010-08-03 | Kinsus Interconnect Technology Corp. | Package structure preventing solder overflow on substrate solder pads |
KR102192195B1 (ko) * | 2014-07-28 | 2020-12-17 | 삼성전자주식회사 | 솔더 조인트를 갖는 반도체 소자 및 그 형성 방법 |
US9330874B2 (en) * | 2014-08-11 | 2016-05-03 | Innovative Micro Technology | Solder bump sealing method and device |
CN108015373B (zh) * | 2017-12-21 | 2020-04-14 | 哈尔滨工业大学 | 一种扩展服役工作温度范围的组合合金软钎焊焊接结构的制备方法 |
US11033990B2 (en) * | 2018-11-29 | 2021-06-15 | Raytheon Company | Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3381081A (en) * | 1965-04-16 | 1968-04-30 | Cts Corp | Electrical connection and method of making the same |
FR1483574A (de) * | 1965-06-24 | 1967-09-06 | ||
JPS557022B1 (de) * | 1968-05-10 | 1980-02-21 | ||
FR2052245A5 (de) * | 1969-07-31 | 1971-04-09 | Cit Alcatel | |
JPS5113961A (en) * | 1974-07-24 | 1976-02-03 | Tokyo Shibaura Electric Co | Kairokibanno seizohoho |
US4000842A (en) * | 1975-06-02 | 1977-01-04 | National Semiconductor Corporation | Copper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devices |
US4164778A (en) * | 1976-07-20 | 1979-08-14 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board |
JPS5376372A (en) * | 1976-12-17 | 1978-07-06 | Matsushita Electric Ind Co Ltd | Device for attaching chip circuit parts |
JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
US4311267A (en) * | 1979-05-04 | 1982-01-19 | Gte Automatic Electric Laboratories, Inc. | Method of screening paste solder onto leaded hybrid substrates |
JPS5678189A (en) * | 1979-11-30 | 1981-06-26 | Matsushita Electric Works Ltd | Electric circuit block |
JPS5724775U (de) * | 1980-07-17 | 1982-02-08 | ||
US4376505A (en) * | 1981-01-05 | 1983-03-15 | Western Electric Co., Inc. | Methods for applying solder to an article |
JPS57152147A (en) * | 1981-03-16 | 1982-09-20 | Matsushita Electric Ind Co Ltd | Formation of metal projection on metal lead |
US4402450A (en) * | 1981-08-21 | 1983-09-06 | Western Electric Company, Inc. | Adapting contacts for connection thereto |
JPS58131654U (ja) * | 1982-03-01 | 1983-09-05 | 三洋電機株式会社 | 厚膜電極構造 |
US4412642A (en) * | 1982-03-15 | 1983-11-01 | Western Electric Co., Inc. | Cast solder leads for leadless semiconductor circuits |
GB2134026B (en) * | 1983-01-27 | 1985-11-20 | Allen Bradley Int | A method of joining a component part to an integrated circuit |
US4607782A (en) * | 1985-05-24 | 1986-08-26 | Contact Systems, Inc. | Method and apparatus for soldering electrical components to circuit boards |
US4605153A (en) * | 1985-06-17 | 1986-08-12 | Northern Telecom Limited | Shaped solder pad for reflow soldering of surface mounting cylindrical devices on a circuit board |
-
1987
- 1987-01-12 US US07/002,486 patent/US4739917A/en not_active Expired - Fee Related
- 1987-12-31 DE DE8787311538T patent/DE3780025T2/de not_active Expired - Lifetime
- 1987-12-31 EP EP87311538A patent/EP0274915B1/de not_active Expired - Lifetime
-
1988
- 1988-01-11 CA CA000556244A patent/CA1284190C/en not_active Expired - Lifetime
- 1988-01-11 JP JP63002665A patent/JPS63182891A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63182891A (ja) | 1988-07-28 |
EP0274915A1 (de) | 1988-07-20 |
JPH0426797B2 (de) | 1992-05-08 |
CA1284190C (en) | 1991-05-14 |
US4739917A (en) | 1988-04-26 |
EP0274915B1 (de) | 1992-06-24 |
DE3780025D1 (de) | 1992-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8364 | No opposition during term of opposition | ||
8330 | Complete disclaimer |