DE3781664T2 - Oberflaecheninspektion. - Google Patents

Oberflaecheninspektion.

Info

Publication number
DE3781664T2
DE3781664T2 DE8787118384T DE3781664T DE3781664T2 DE 3781664 T2 DE3781664 T2 DE 3781664T2 DE 8787118384 T DE8787118384 T DE 8787118384T DE 3781664 T DE3781664 T DE 3781664T DE 3781664 T2 DE3781664 T2 DE 3781664T2
Authority
DE
Germany
Prior art keywords
surface inspection
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787118384T
Other languages
English (en)
Other versions
DE3781664D1 (de
Inventor
John Samuel Batchelder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3781664D1 publication Critical patent/DE3781664D1/de
Publication of DE3781664T2 publication Critical patent/DE3781664T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/065—Integrating spheres
    • G01N2201/0655—Hemispheres

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE8787118384T 1987-01-06 1987-12-11 Oberflaecheninspektion. Expired - Fee Related DE3781664T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/000,719 US4740708A (en) 1987-01-06 1987-01-06 Semiconductor wafer surface inspection apparatus and method

Publications (2)

Publication Number Publication Date
DE3781664D1 DE3781664D1 (de) 1992-10-15
DE3781664T2 true DE3781664T2 (de) 1993-04-08

Family

ID=21692727

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787118384T Expired - Fee Related DE3781664T2 (de) 1987-01-06 1987-12-11 Oberflaecheninspektion.

Country Status (4)

Country Link
US (1) US4740708A (de)
EP (1) EP0275469B1 (de)
JP (1) JPS63175751A (de)
DE (1) DE3781664T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013105961A1 (de) * 2013-06-07 2014-12-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Oberflächeninspektion von Bahnwaren

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US4965454A (en) * 1988-01-21 1990-10-23 Hitachi, Ltd. Method and apparatus for detecting foreign particle
US5027418A (en) * 1989-02-13 1991-06-25 Matsushita Electric Industrial Co., Ltd. Electro-optical inspection apparatus for printed-circuit boards with components mounted thereon
US4967095A (en) * 1989-06-28 1990-10-30 Tencor Instruments Method and apparatus for detecting and sizing particles on surfaces
US5008542A (en) * 1989-12-20 1991-04-16 The United States Of America As Represented By The Secretary Of The Air Force Method and system for automated measurement of whole-wafer etch pit density in GaAs
US5076692A (en) * 1990-05-31 1991-12-31 Tencor Instruments Particle detection on a patterned or bare wafer surface
US5243406A (en) * 1990-07-04 1993-09-07 Fujitsu Limited Method and apparatus for measuring three-dimensional configuration of wire-shaped object in a short time
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
HUT63497A (en) * 1990-12-17 1993-08-30 Semilab Felvezetoe Fiz Lab Rt Method and apparatus for measuring minority charge carrier in semiconductor material
JPH0499838U (de) * 1991-02-08 1992-08-28
US5256886A (en) * 1991-04-30 1993-10-26 E. I. Du Pont De Nemours And Company Apparatus for optically detecting contamination in particles of low optical-loss material
US5189481A (en) * 1991-07-26 1993-02-23 Tencor Instruments Particle detector for rough surfaces
US5343290A (en) * 1992-06-11 1994-08-30 International Business Machines Corporation Surface particle detection using heterodyne interferometer
JP2800587B2 (ja) * 1992-10-05 1998-09-21 松下電器産業株式会社 異物検査装置および異物検査方法
US5329351A (en) * 1992-11-24 1994-07-12 Estek Corporation Particle detection system with coincident detection
US5680207A (en) * 1992-12-14 1997-10-21 Nikon Corporation Defect inspecting apparatus and defect inspecting method
US5444265A (en) * 1993-02-23 1995-08-22 Lsi Logic Corporation Method and apparatus for detecting defective semiconductor wafers during fabrication thereof
US5416594A (en) * 1993-07-20 1995-05-16 Tencor Instruments Surface scanner with thin film gauge
DE4413831C2 (de) * 1994-04-20 2000-05-31 Siemens Ag Verfahren zur Kontrolle von Halbleiterscheiben
US5883710A (en) * 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US20040057044A1 (en) * 1994-12-08 2004-03-25 Mehrdad Nikoonahad Scanning system for inspecting anamolies on surfaces
US6118525A (en) * 1995-03-06 2000-09-12 Ade Optical Systems Corporation Wafer inspection system for distinguishing pits and particles
US5712701A (en) * 1995-03-06 1998-01-27 Ade Optical Systems Corporation Surface inspection system and method of inspecting surface of workpiece
US5699164A (en) * 1996-04-04 1997-12-16 The Boc Group, Inc. Telecentric reflection head for optical monitor
US5942443A (en) * 1996-06-28 1999-08-24 Caliper Technologies Corporation High throughput screening assay systems in microscale fluidic devices
US6081325A (en) * 1996-06-04 2000-06-27 Kla-Tencor Corporation Optical scanning system for surface inspection
NZ333346A (en) * 1996-06-28 2000-03-27 Caliper Techn Corp High-throughput screening assay systems in microscale fluidic devices
US5859924A (en) * 1996-07-12 1999-01-12 Robotic Vision Systems, Inc. Method and system for measuring object features
US6075883A (en) * 1996-11-12 2000-06-13 Robotic Vision Systems, Inc. Method and system for imaging an object or pattern
CA2279934A1 (en) * 1997-02-11 1998-08-13 Scientific Generics Limited Signalling system
JP3264634B2 (ja) * 1997-02-18 2002-03-11 松下電器産業株式会社 表面検査装置及び方法
US6034776A (en) * 1997-04-16 2000-03-07 The United States Of America As Represented By The Secretary Of Commerce Microroughness-blind optical scattering instrument
US6330354B1 (en) * 1997-05-01 2001-12-11 International Business Machines Corporation Method of analyzing visual inspection image data to find defects on a device
US6169601B1 (en) 1998-06-23 2001-01-02 Ade Optical Systems Method and apparatus for distinguishing particles from subsurface defects on a substrate using polarized light
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6356653B2 (en) 1998-07-16 2002-03-12 International Business Machines Corporation Method and apparatus for combined particle location and removal
US6184528B1 (en) 1998-08-27 2001-02-06 Vought Aircraft Industries, Inc. Method of spectral nondestructive evaluation
US6122046A (en) * 1998-10-02 2000-09-19 Applied Materials, Inc. Dual resolution combined laser spot scanning and area imaging inspection
US7006682B1 (en) * 1999-09-09 2006-02-28 Nec Corporation Apparatus for monitoring particles and method of doing the same
US6611325B1 (en) 2000-03-15 2003-08-26 Seh-America, Inc. Enhanced defect detection using surface scanning inspection tools
DE10157244B4 (de) * 2001-11-22 2006-05-04 Leica Microsystems Semiconductor Gmbh Verfahren und Vorrichtung zur Defektanalyse von Wafern
US6930274B2 (en) * 2003-03-26 2005-08-16 Siemens Vdo Automotive Corporation Apparatus and method of maintaining a generally constant focusing spot size at different average laser power densities
US7200257B2 (en) * 2005-05-05 2007-04-03 International Business Machines Corporation Structure and methodology for fabrication and inspection of photomasks
CN101287974B (zh) * 2006-04-12 2010-09-22 大塚电子株式会社 总光通量测量装置
JP5305641B2 (ja) * 2007-11-21 2013-10-02 株式会社ニューフレアテクノロジー パターン検査装置及びパターン検査方法
AU2010257118B2 (en) 2009-06-04 2014-08-28 Lockheed Martin Corporation Multiple-sample microfluidic chip for DNA analysis
MX2013004184A (es) 2010-10-15 2013-07-29 Lockheed Corp Diseño optico microfluidico.
CN103033129B (zh) * 2011-10-07 2015-10-21 财团法人工业技术研究院 光学设备及光学定址方法
FR2981161B1 (fr) * 2011-10-10 2014-06-13 Altatech Semiconductor Dispositif d'inspection de plaquettes semi-conductrices a champ noir.
US9322054B2 (en) 2012-02-22 2016-04-26 Lockheed Martin Corporation Microfluidic cartridge
FR2991083A1 (fr) * 2012-05-24 2013-11-29 St Microelectronics Grenoble 2 Procede et dispositif de protection d'un circuit integre contre des attaques par sa face arriere
US9841512B2 (en) * 2015-05-14 2017-12-12 Kla-Tencor Corporation System and method for reducing radiation-induced false counts in an inspection system
US9874526B2 (en) 2016-03-28 2018-01-23 Kla-Tencor Corporation Methods and apparatus for polarized wafer inspection
CN107664476B (zh) * 2016-07-28 2020-06-05 中微半导体设备(上海)股份有限公司 一种用于半导体设备的光学检测装置和检测方法
CN112030099B (zh) * 2020-08-19 2022-12-20 安徽长安设备涂装有限公司 一种零部件加工用均匀镀膜设备及其使用方法
CN116539525A (zh) * 2022-11-18 2023-08-04 苏州正齐半导体设备有限公司 检查电子元件内部缺陷的装置及方法

Family Cites Families (12)

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DE2433682C3 (de) * 1974-07-12 1979-02-15 Erwin Sick Gmbh Optik-Elektronik, 7808 Waldkirch Vorrichtung zur Überwachung einer Materialbahn oder einer sonstigen Abtastebene
US4265545A (en) * 1979-07-27 1981-05-05 Intec Corporation Multiple source laser scanning inspection system
US4468120A (en) * 1981-02-04 1984-08-28 Nippon Kogaku K.K. Foreign substance inspecting apparatus
JPS57132044A (en) * 1981-02-10 1982-08-16 Hitachi Metals Ltd Discriminating method of surface defect
US4376583A (en) * 1981-05-12 1983-03-15 Aeronca Electronics, Inc. Surface inspection scanning system
US4441124A (en) * 1981-11-05 1984-04-03 Western Electric Company, Inc. Technique for inspecting semiconductor wafers for particulate contamination
DE3484982D1 (de) * 1983-11-26 1991-10-02 Toshiba Kawasaki Kk Apparat zum nachweis von oberflaechenfehlern.
US4601576A (en) * 1983-12-09 1986-07-22 Tencor Instruments Light collector for optical contaminant and flaw detector
US4630276A (en) * 1984-10-09 1986-12-16 Aeronca Electronics, Inc. Compact laser scanning system
KR910000794B1 (ko) * 1985-03-28 1991-02-08 가부시끼가이샤 도오시바 기판의 표면검사방법 및 장치
JPS61292931A (ja) * 1985-06-21 1986-12-23 Hitachi Ltd 欠陥検査方法及び装置
JPH0781956B2 (ja) * 1985-10-16 1995-09-06 株式会社日立製作所 半導体用基板上の異物検出装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013105961A1 (de) * 2013-06-07 2014-12-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Oberflächeninspektion von Bahnwaren
DE102013105961B4 (de) * 2013-06-07 2016-07-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Oberflächeninspektion von Bahnwaren

Also Published As

Publication number Publication date
US4740708A (en) 1988-04-26
EP0275469B1 (de) 1992-09-09
EP0275469A3 (en) 1990-01-24
DE3781664D1 (de) 1992-10-15
JPH0474662B2 (de) 1992-11-26
JPS63175751A (ja) 1988-07-20
EP0275469A2 (de) 1988-07-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee