DE3871297D1 - Zusammensetzung sowie verfahren zum niederschlagen von loetmittel. - Google Patents

Zusammensetzung sowie verfahren zum niederschlagen von loetmittel.

Info

Publication number
DE3871297D1
DE3871297D1 DE8888115029T DE3871297T DE3871297D1 DE 3871297 D1 DE3871297 D1 DE 3871297D1 DE 8888115029 T DE8888115029 T DE 8888115029T DE 3871297 T DE3871297 T DE 3871297T DE 3871297 D1 DE3871297 D1 DE 3871297D1
Authority
DE
Germany
Prior art keywords
composition
depositing solvent
depositing
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888115029T
Other languages
English (en)
Inventor
Takao Fukunaga
Hisao Nakajima
Kenzo Kobayashi
Masanao Kono
Hisao Irie
Ryo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Harima Chemical Inc
Original Assignee
Furukawa Electric Co Ltd
Harima Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Harima Chemical Inc filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of DE3871297D1 publication Critical patent/DE3871297D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Arc Welding In General (AREA)
DE8888115029T 1987-09-14 1988-09-14 Zusammensetzung sowie verfahren zum niederschlagen von loetmittel. Expired - Fee Related DE3871297D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22829887 1987-09-14
JP63156688A JPH0747233B2 (ja) 1987-09-14 1988-06-27 半田析出用組成物および半田析出方法

Publications (1)

Publication Number Publication Date
DE3871297D1 true DE3871297D1 (de) 1992-06-25

Family

ID=26484372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888115029T Expired - Fee Related DE3871297D1 (de) 1987-09-14 1988-09-14 Zusammensetzung sowie verfahren zum niederschlagen von loetmittel.

Country Status (10)

Country Link
US (1) US5145532A (de)
EP (1) EP0307888B1 (de)
JP (1) JPH0747233B2 (de)
KR (1) KR920009987B1 (de)
CN (1) CN1030695C (de)
BR (1) BR8804731A (de)
DE (1) DE3871297D1 (de)
ES (1) ES2032915T3 (de)
MY (1) MY104328A (de)
SG (1) SG35293G (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2030865C (en) * 1989-11-30 1993-01-12 Kenichi Fuse Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
US5296649A (en) * 1991-03-26 1994-03-22 The Furukawa Electric Co., Ltd. Solder-coated printed circuit board and method of manufacturing the same
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판
JP3390245B2 (ja) * 1993-06-01 2003-03-24 富士通株式会社 洗浄液及び洗浄方法
EP0683008A4 (de) * 1993-12-06 1997-10-08 Furukawa Electric Co Ltd Lotschichtzusammensetzung und packungsverfahren unter benutzung desselben.
US5565261A (en) * 1994-10-31 1996-10-15 Motorola, Inc. Selective call radio having a ceramic substrate for circuit device interconnection
ATE353536T1 (de) * 1997-02-20 2007-02-15 Partnerships Ltd Inc Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter
US6752309B1 (en) * 1999-07-22 2004-06-22 Oatey Co. Water soluble fluxes and methods of using the same
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
US7115218B2 (en) 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
JP4142312B2 (ja) * 2002-02-28 2008-09-03 ハリマ化成株式会社 析出型はんだ組成物及びはんだ析出方法
JP4094982B2 (ja) 2003-04-15 2008-06-04 ハリマ化成株式会社 はんだ析出方法およびはんだバンプ形成方法
US8042727B2 (en) 2004-03-30 2011-10-25 Tamura Corporation Heater, reflow apparatus, and solder bump forming method and apparatus
JP3964911B2 (ja) 2004-09-03 2007-08-22 松下電器産業株式会社 バンプ付き基板の製造方法
JP3955302B2 (ja) 2004-09-15 2007-08-08 松下電器産業株式会社 フリップチップ実装体の製造方法
KR101215243B1 (ko) 2004-12-17 2012-12-24 파나소닉 주식회사 플립 칩 실장용 수지 조성물 및 범프 형성용 수지 조성물
JP4399005B2 (ja) 2005-02-03 2010-01-13 パナソニック株式会社 フリップチップ実装方法及びバンプ形成方法
JP4402716B2 (ja) 2005-03-09 2010-01-20 パナソニック株式会社 金属粒子分散組成物を用いたフリップチップ実装方法およびバンプ形成方法
WO2006098187A1 (ja) 2005-03-15 2006-09-21 Matsushita Electric Industrial Co., Ltd. フリップチップ実装方法およびバンプ形成方法
JP4402717B2 (ja) * 2005-03-16 2010-01-20 パナソニック株式会社 導電性粒子を用いたフリップチップ実装方法およびバンプ形成方法
WO2006098196A1 (ja) 2005-03-17 2006-09-21 Matsushita Electric Industrial Co., Ltd. 半導体チップを備えた実装体およびその製造方法
WO2006101155A1 (ja) 2005-03-24 2006-09-28 Matsushita Electric Industrial Co., Ltd. 電子部品の実装方法および電子回路装置
WO2006103918A1 (ja) 2005-03-28 2006-10-05 Matsushita Electric Industrial Co., Ltd. フリップチップ実装体とフリップチップ実装方法及びフリップチップ実装装置
WO2006103949A1 (ja) 2005-03-29 2006-10-05 Matsushita Electric Industrial Co., Ltd. フリップチップ実装方法および基板間接続方法
WO2006103948A1 (ja) 2005-03-29 2006-10-05 Matsushita Electric Industrial Co., Ltd. フリップチップ実装方法およびバンプ形成方法
KR101175482B1 (ko) 2005-04-06 2012-08-20 파나소닉 주식회사 플립 칩 실장 방법 및 범프 형성 방법
JP4402718B2 (ja) * 2005-05-17 2010-01-20 パナソニック株式会社 フリップチップ実装方法
US7875496B2 (en) 2005-05-17 2011-01-25 Panasonic Corporation Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
WO2007108290A1 (ja) 2006-03-16 2007-09-27 Matsushita Electric Industrial Co., Ltd. バンプ形成方法およびバンプ形成装置
US7537961B2 (en) 2006-03-17 2009-05-26 Panasonic Corporation Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
US8297488B2 (en) 2006-03-28 2012-10-30 Panasonic Corporation Bump forming method using self-assembling resin and a wall surface
CN100390050C (zh) * 2006-03-30 2008-05-28 云南省化工研究院 一种连续式制备磷酸二氢钾的方法
US8097958B2 (en) 2006-04-27 2012-01-17 Panasonic Corporation Flip chip connection structure having powder-like conductive substance and method of producing the same
WO2008078478A1 (ja) 2006-12-27 2008-07-03 Panasonic Corporation 導電性バンプとその形成方法および半導体装置とその製造方法
US7569164B2 (en) * 2007-01-29 2009-08-04 Harima Chemicals, Inc. Solder precoating method
US9426899B2 (en) 2007-04-27 2016-08-23 Panasonic Intellectual Property Management Co., Ltd. Electronic component assembly
US9877399B2 (en) * 2015-09-11 2018-01-23 Nec Space Technologies, Ltd. Lead solder joint structure and manufacturing method thereof
GB201812664D0 (en) * 2018-08-03 2018-09-19 Imperial Innovations Ltd Recycling of lead-and tin-based materials
CN113748221A (zh) * 2019-04-09 2021-12-03 石川技研株式会社 焊料产品的制造方法、焊料、焊接部件、焊料产品、印刷布线板、印刷电路板、线材、焊接产品、柔性印刷基板、电子部件、锡成型品的制造方法、锡中间产品的制造方法、锡成型品、锡中间产品和导电部件
CN110634593B (zh) * 2019-10-30 2021-05-25 合肥微晶材料科技有限公司 一种具有低方阻及优异耐弯折性能的纳米银线柔性透明导电膜及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1508343A1 (de) * 1966-05-21 1969-10-30 Siemens Ag Loetpaste zur Herstellung von Loetverbindungen metallischer Teile
US3978378A (en) * 1973-02-12 1976-08-31 The Dow Chemical Company Articles having electroconductive components of highly electroconductive resinous compositions
DE3010610A1 (de) * 1980-03-20 1981-10-01 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur selektiven verzinnung der loetaugen von gedruckten schaltungen
HU181746B (en) * 1980-10-22 1983-11-28 Richter Gedeon Vegyeszet Process for preparing vinblastine and leurosidine derivatives
US4373974A (en) * 1981-04-02 1983-02-15 Mcdonnell Douglas Corporation Solder composition
SE8403074D0 (sv) * 1984-06-07 1984-06-07 Granstroem Ab E Ljusspridande lins
DE3510000A1 (de) * 1985-03-20 1986-10-02 Ka We electronic GmbH & Co KG, 4796 Salzkotten Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung
JPS62227593A (ja) * 1986-03-28 1987-10-06 Harima Chem Inc 有機半田
JP2604593B2 (ja) * 1986-05-19 1997-04-30 ハリマ化成 株式会社 金属表面に半田被膜を形成する方法
JPS63113073A (ja) * 1986-05-19 1988-05-18 Harima Chem Inc 電子回路部材を接着し且つその端子間に選択的に電気的導通を得る方法
US4661173A (en) * 1986-07-25 1987-04-28 Mcdonnell Douglas Corporation Alloy-enriched solder cream

Also Published As

Publication number Publication date
EP0307888A2 (de) 1989-03-22
BR8804731A (pt) 1989-04-18
JPH01157796A (ja) 1989-06-21
CN1044428A (zh) 1990-08-08
KR890004816A (ko) 1989-05-10
JPH0747233B2 (ja) 1995-05-24
ES2032915T3 (es) 1993-03-01
MY104328A (en) 1994-03-31
EP0307888B1 (de) 1992-05-20
KR920009987B1 (ko) 1992-11-10
EP0307888A3 (en) 1989-09-06
US5145532A (en) 1992-09-08
CN1030695C (zh) 1996-01-17
SG35293G (en) 1993-06-11

Similar Documents

Publication Publication Date Title
DE3871297D1 (de) Zusammensetzung sowie verfahren zum niederschlagen von loetmittel.
DE3580060D1 (de) Verfahren und vorrichtung zum auflegen von baendern.
DE3581428D1 (de) Verfahren zum ueberziehen von arzneiformen.
DE69010893T2 (de) Verfahren zur behandlung von koks sowie löschen desselben.
DE69107949D1 (de) MOS-gesteuerter Thyristor und Verfahren zu dessen Herstellung.
DE3876744D1 (de) Verfahren zum aufbringen von konversionsueberzuegen.
DE59005612D1 (de) Verfahren zur reduktion von farbstoffen.
DE3882862D1 (de) Verfahren zum extrahieren von atp.
DE69425497T2 (de) Verfahren zum anreichern von löslichen ballaststoffen
DE3771670D1 (de) Verfahren zum entschleimen von triglyceridoelen.
DE59102282D1 (de) Verfahren zum dünnätzen von substraten.
DE3767747D1 (de) Verfahren zum bestimmen von abmessungen.
DE3578942D1 (de) Verfahren zum haerten von gelatine.
DE3765596D1 (de) Verfahren zum sprengplattieren.
DE58902702D1 (de) Verfahren zum aufbringen von phosphatueberzuegen.
DE3583843D1 (de) Verfahren zum zementieren von bohrloechern und zusammensetzungen.
DE3780052D1 (de) Verfahren zum aufbringen von schutzschichten.
DE58900881D1 (de) Verfahren zum aufbringen von konversionsueberzuegen.
DE3764554D1 (de) Verfahren zum niederschlagen von phosphorsilikatglasschichten.
DE3777149D1 (de) Verfahren zum vermehren von pflanzensetzlingen.
DE69019744D1 (de) Segment und Verfahren zum Vorfertigen von Brücken und ähnlichen Bauwerken.
DE58901845D1 (de) Verfahren zum festlegen.
DE3778426D1 (de) Verfahren zum verkleben von substraten.
DE3766635D1 (de) Verfahren zum praegen von filmen.
DE3881797T2 (de) Verfahren zum hydrophobieren von kieselerde.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee