DE3881973D1 - Mehrschichtschaltungsplatte. - Google Patents

Mehrschichtschaltungsplatte.

Info

Publication number: DE3881973D1
Authority: DE; Germany
Prior art keywords: layer board; board; layer
Prior art date: 1987-07-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE8888303715T

Other languages

English (en)

Other versions

DE3881973T2 (de

Inventor

Satoru Kobayashi

Masahiro Suzuki

Tetsuya Hirose

Satoshi Tanaka

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Junkosha Co Ltd

Original Assignee

Junkosha Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-07-17

Filing date

1988-04-25

Publication date

1993-07-29

1987-07-17 Priority claimed from JP1987109602U external-priority patent/JPH0316299Y2/ja

1987-07-17 Priority claimed from JP10960187U external-priority patent/JPS6413765U/ja

1988-04-25 Application filed by Junkosha Co Ltd filed Critical Junkosha Co Ltd

1993-07-29 Publication of DE3881973D1 publication Critical patent/DE3881973D1/de

1993-10-14 Application granted granted Critical

1993-10-14 Publication of DE3881973T2 publication Critical patent/DE3881973T2/de

2008-04-26 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

DE88303715T 1987-07-17 1988-04-25 Mehrschichtschaltungsplatte. Expired - Fee Related DE3881973T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP1987109602U JPH0316299Y2 (de)	1987-07-17	1987-07-17
JP10960187U JPS6413765U (de)	1987-07-17	1987-07-17

Publications (2)

Publication Number	Publication Date
DE3881973D1 true DE3881973D1 (de)	1993-07-29
DE3881973T2 DE3881973T2 (de)	1993-10-14

Family

ID=26449334

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE88303715T Expired - Fee Related DE3881973T2 (de)	1987-07-17	1988-04-25	Mehrschichtschaltungsplatte.

Country Status (4)

Country	Link
US (1)	US5136123A (de)
EP (1)	EP0299595B1 (de)
DE (1)	DE3881973T2 (de)
GB (1)	GB2207287B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02296389A (ja) *	1989-05-11	1990-12-06	Japan Gore Tex Inc	印刷回路基板
JP3061059B2 (ja) *	1989-08-07	2000-07-10	ジャパンゴアテックス株式会社	Ｉｃパッケージ
US5311406A (en) *	1991-10-30	1994-05-10	Honeywell Inc.	Microstrip printed wiring board and a method for making same
US5235132A (en) *	1992-01-29	1993-08-10	W. L. Gore & Associates, Inc.	Externally and internally shielded double-layered flat cable assembly
JPH05327192A (ja) *	1992-05-15	1993-12-10	Cmk Corp	フレキシブルプリント配線板の製造方法
JP3113153B2 (ja) *	1994-07-26	2000-11-27	株式会社東芝	多層配線構造の半導体装置
US5847324A (en) *	1996-04-01	1998-12-08	International Business Machines Corporation	High performance electrical cable
US6492595B2 (en)	1997-10-01	2002-12-10	Decorp Americas, Inc.	Flat surface-mounted multi-purpose wire
US6110576A (en) *	1998-10-16	2000-08-29	Lucent Technologies Inc.	Article comprising molded circuit
US6310398B1 (en)	1998-12-03	2001-10-30	Walter M. Katz	Routable high-density interfaces for integrated circuit devices
JP3973340B2 (ja) *	1999-10-05	2007-09-12	Ｎｅｃエレクトロニクス株式会社	半導体装置、配線基板、及び、それらの製造方法
JP3617388B2 (ja) *	1999-10-20	2005-02-02	日本電気株式会社	プリント配線板及びその製造方法
JP2003078244A (ja) *	2001-06-18	2003-03-14	Nitto Denko Corp	多層配線基板及びその製造方法
JP4063533B2 (ja) *	2001-12-10	2008-03-19	日本碍子株式会社	フレキシブル配線板
US7750446B2 (en)	2002-04-29	2010-07-06	Interconnect Portfolio Llc	IC package structures having separate circuit interconnection structures and assemblies constructed thereof
AU2003223783A1 (en) *	2002-04-29	2003-11-17	Silicon Pipe, Inc.	Direct-connect signaling system
JP3876770B2 (ja) *	2002-06-07	2007-02-07	日産自動車株式会社	配線構造
US6891272B1 (en)	2002-07-31	2005-05-10	Silicon Pipe, Inc.	Multi-path via interconnection structures and methods for manufacturing the same
US7014472B2 (en) *	2003-01-13	2006-03-21	Siliconpipe, Inc.	System for making high-speed connections to board-mounted modules
US7145073B2 (en) *	2003-09-05	2006-12-05	Southwire Company	Electrical wire and method of fabricating the electrical wire
US8237051B2 (en) *	2003-09-05	2012-08-07	Newire, Inc.	Flat wire extension cords and extension cord devices
US7217884B2 (en) *	2004-03-02	2007-05-15	Southwire Company	Electrical wire and method of fabricating the electrical wire
US7737359B2 (en) *	2003-09-05	2010-06-15	Newire Inc.	Electrical wire and method of fabricating the electrical wire
US7378598B2 (en) *	2004-02-19	2008-05-27	Hewlett-Packard Development Company, L.P.	Printed circuit board substrate and method for constructing same
WO2006060502A1 (en) *	2004-12-01	2006-06-08	Molex Incorporated	Flexible flat circuitry
TWI445463B (zh) *	2011-03-10	2014-07-11	Hon Hai Prec Ind Co Ltd	電路板及使用該電路板的電子裝置
CN102686010B (zh) *	2011-03-11	2015-12-16	鸿富锦精密工业（深圳）有限公司	电路板及使用该电路板的电子装置
DE102017210704A1 (de) *	2017-06-26	2018-12-27	Siemens Aktiengesellschaft	Elektrische Baugruppe und Verfahren zu deren Herstellung

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3740678A (en) *	1971-03-19	1973-06-19	Ibm	Strip transmission line structures
US3777221A (en) *	1972-12-18	1973-12-04	Ibm	Multi-layer circuit package
DE2644252A1 (de) *	1976-09-28	1978-03-30	Siemens Ag	Flachbandleitung mit folienfoermigen durchbrochenen metallischen einlagen
JPS5831753B2 (ja) *	1979-02-02	1983-07-08	鐘淵化学工業株式会社	電気用絶縁積層板及び印刷回路用金属箔張り積層板
JPS56158502A (en) *	1980-05-12	1981-12-07	Junkosha Co Ltd	Strip line
JPS56161701A (en) *	1980-05-16	1981-12-12	Hirokatsu Tsukidate	Thin and flexible microstrip line
US4423282A (en) *	1981-06-29	1983-12-27	Hirosuke Suzuki	Flat cable
US4490690A (en) *	1982-04-22	1984-12-25	Junkosha Company, Ltd.	Strip line cable
US4560962A (en) *	1983-08-30	1985-12-24	Burroughs Corporation	Multilayered printed circuit board with controlled 100 ohm impedance
JPS6050425U (ja) *	1983-09-14	1985-04-09	株式会社　潤工社	フラツトケ−ブル
JPS60214941A (ja) *	1984-04-10	1985-10-28	株式会社　潤工社	プリント基板
JPS60169904U (ja) *	1984-04-20	1985-11-11	株式会社　潤工社	ストリップラインケーブル
JPS60225750A (ja) *	1984-04-24	1985-11-11	株式会社　潤工社	プリント基板
JPH023631Y2 (de) *	1984-12-28	1990-01-29
JPS61220499A (ja) *	1985-03-27	1986-09-30	株式会社日立製作所	混成多層配線基板
US4707671A (en) *	1985-05-31	1987-11-17	Junkosha Co., Ltd.	Electrical transmission line
JPS61281406A (ja) *	1985-06-06	1986-12-11	株式会社　潤工社	伝送線路
US4770922A (en) *	1987-04-13	1988-09-13	Japan Gore-Tex, Inc.	Printed circuit board base material
US4755911A (en) *	1987-04-28	1988-07-05	Junkosha Co., Ltd.	Multilayer printed circuit board

1988
- 1988-03-23 US US07/172,256 patent/US5136123A/en not_active Expired - Lifetime
- 1988-04-25 EP EP88303715A patent/EP0299595B1/de not_active Expired - Lifetime
- 1988-04-25 DE DE88303715T patent/DE3881973T2/de not_active Expired - Fee Related
- 1988-04-25 GB GB8809737A patent/GB2207287B/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
EP0299595B1 (de)	1993-06-23
US5136123A (en)	1992-08-04
EP0299595A3 (en)	1989-08-16
GB8809737D0 (en)	1988-06-02
EP0299595A2 (de)	1989-01-18
DE3881973T2 (de)	1993-10-14
GB2207287B (en)	1990-11-21
GB2207287A (en)	1989-01-25

Legal Events

Date	Code	Title	Description
1994-07-21	8364	No opposition during term of opposition
2003-02-13	8339	Ceased/non-payment of the annual fee

Publication	Publication Date	Title
DE3881973D1 (de)	1993-07-29	Mehrschichtschaltungsplatte.
DE69015878T2 (de)	1995-07-13	Mehrschichtleiterplattenstruktur.
DE69007452D1 (de)	1994-04-21	Mehrlagenschaltungsstruktur.
IT1229936B (it)	1991-09-16	Emporio elettronico.
DE3880385D1 (de)	1993-05-27	Gedruckte leiterplatte.
DE3787896T2 (de)	1994-02-24	Elektronisches parkometersystem.
DE68922118D1 (de)	1995-05-18	Schaltungsplatte.
DE3863155D1 (de)	1991-07-11	Aus mehrlagengewebe bestehender vor-formling.
DE3850629D1 (de)	1994-08-18	Adaptierbarer Schaltkreis.
DE69103999T2 (de)	1995-01-19	Mehrlagige Leiterplatte.
DE3787620D1 (de)	1993-11-04	Mehrschichtstrukturen.
ES2025121B3 (es)	1992-03-16	Tablero de conexion impreso.
DE3851118D1 (de)	1994-09-22	Leiterplatte.
DE3850626D1 (de)	1994-08-18	Leiterplatte.
DE3872865D1 (de)	1992-08-20	Gedruckte leiterkarte.
NO861792L (no)	1986-11-07	Styrekrets.
NO892816L (no)	1990-01-15	Flerlagstruktur.
DE68900809D1 (de)	1992-03-19	Kaesebrett.
FI885753A (fi)	1988-12-12	Identitetstickpropp foer elektroniska moduler.
FI882877A (fi)	1988-12-19	Elektronisk tidsstyrning foer motor-oavhaengiga fordonsvaermare.
DE68919750T2 (de)	1995-04-20	Leiterplattenverbindung.
FI882990A0 (fi)	1988-06-22	Ljustavla.
NO873229D0 (no)	1987-08-03	Figurtavle.
ATE91058T1 (de)	1993-07-15	Mehrschichtschaltungsplatte.
KR880021992U (ko)	1988-12-26	다층