DE50014121D1 - Elektrochemische ätzanlage und verfahren zur ätzung eines ätzkörpers - Google Patents

Elektrochemische ätzanlage und verfahren zur ätzung eines ätzkörpers

Info

Publication number
DE50014121D1
DE50014121D1 DE50014121T DE50014121T DE50014121D1 DE 50014121 D1 DE50014121 D1 DE 50014121D1 DE 50014121 T DE50014121 T DE 50014121T DE 50014121 T DE50014121 T DE 50014121T DE 50014121 D1 DE50014121 D1 DE 50014121D1
Authority
DE
Germany
Prior art keywords
steaming
absorbent
electrochemical equipment
electrochemical
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50014121T
Other languages
English (en)
Inventor
Hans Artman
Wilhelm Frey
Franz Laermer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Application granted granted Critical
Publication of DE50014121D1 publication Critical patent/DE50014121D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/12—Electrochemical machining
DE50014121T 1999-04-01 2000-03-17 Elektrochemische ätzanlage und verfahren zur ätzung eines ätzkörpers Expired - Lifetime DE50014121D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19914905A DE19914905A1 (de) 1999-04-01 1999-04-01 Elektrochemische Ätzanlage und Verfahren zur Ätzung eines Ätzkörpers
PCT/DE2000/000857 WO2000060143A1 (de) 1999-04-01 2000-03-17 Elektrochemische ätzanlage und verfahren zur ätzung eines ätzkörpers

Publications (1)

Publication Number Publication Date
DE50014121D1 true DE50014121D1 (de) 2007-04-12

Family

ID=7903273

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19914905A Ceased DE19914905A1 (de) 1999-04-01 1999-04-01 Elektrochemische Ätzanlage und Verfahren zur Ätzung eines Ätzkörpers
DE50014121T Expired - Lifetime DE50014121D1 (de) 1999-04-01 2000-03-17 Elektrochemische ätzanlage und verfahren zur ätzung eines ätzkörpers

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19914905A Ceased DE19914905A1 (de) 1999-04-01 1999-04-01 Elektrochemische Ätzanlage und Verfahren zur Ätzung eines Ätzkörpers

Country Status (7)

Country Link
US (1) US6726815B1 (de)
EP (1) EP1181400B1 (de)
JP (1) JP4511741B2 (de)
KR (1) KR100698798B1 (de)
DE (2) DE19914905A1 (de)
ES (1) ES2282103T3 (de)
WO (1) WO2000060143A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100451132B1 (ko) * 2001-11-08 2004-10-02 홍석인 다공성 실리콘을 이용한 효소고정화 전극 제작 방법
US7998335B2 (en) * 2005-06-13 2011-08-16 Cabot Microelectronics Corporation Controlled electrochemical polishing method
US7909967B2 (en) * 2006-07-13 2011-03-22 Semitool, Inc. Electro-chemical processor
US7935230B2 (en) * 2006-06-29 2011-05-03 Semitool, Inc. Electro-chemical processor
US7927469B2 (en) * 2006-08-25 2011-04-19 Semitool, Inc. Electro-chemical processor
DE102007024199B4 (de) 2007-05-24 2015-06-25 Robert Bosch Gmbh Herstellungsverfahren eines mikromechanischen Bauelements mit porösifizierter Membran
KR101374932B1 (ko) * 2007-09-28 2014-03-17 재단법인서울대학교산학협력재단 확산 제한 식각과정에 의한 수평 변환 다공성 실리콘 광학필터의 제조방법 및 그에 의한 필터구조
US9076642B2 (en) 2009-01-15 2015-07-07 Solexel, Inc. High-Throughput batch porous silicon manufacturing equipment design and processing methods
US8906218B2 (en) 2010-05-05 2014-12-09 Solexel, Inc. Apparatus and methods for uniformly forming porous semiconductor on a substrate
JP5333582B2 (ja) * 2009-05-12 2013-11-06 日本軽金属株式会社 電解コンデンサ用アルミニウム電極板の製造方法
JP2011026638A (ja) * 2009-07-22 2011-02-10 Shin Etsu Handotai Co Ltd 陽極酸化装置
US8241940B2 (en) 2010-02-12 2012-08-14 Solexel, Inc. Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing
WO2012040688A2 (en) * 2010-09-24 2012-03-29 Solexel, Inc. High-throughput batch porous silicon manufacturing equipment design and processing methods
KR20140061287A (ko) * 2010-11-03 2014-05-21 솔렉셀, 인크. 기판 상에 다공성 반도체를 균일하게 형성하기 위한 장치 및 방법
JP6009268B2 (ja) * 2012-08-09 2016-10-19 芝浦メカトロニクス株式会社 洗浄液生成装置、洗浄液生成方法、基板洗浄装置及び基板洗浄方法
RU2537488C2 (ru) * 2012-08-22 2015-01-10 Закрытое акционерное общество "Инструменты нанотехнологии" Устройство травления поверхности для металлографического анализа
US9217206B2 (en) * 2013-09-27 2015-12-22 Sunpower Corporation Enhanced porosification
CN112820828B (zh) * 2019-11-15 2023-08-04 夏泰鑫半导体(青岛)有限公司 半导体装置及其制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5462929A (en) * 1977-10-28 1979-05-21 Sumitomo Electric Ind Ltd Surface treating method for aluminum and aluminum alloy
JP3149060B2 (ja) * 1992-01-23 2001-03-26 キヤノン株式会社 陽極化成装置、陽極化成方法及びシリコン基板の製造方法
JP3416190B2 (ja) * 1993-03-23 2003-06-16 キヤノン株式会社 陽極化成装置及び陽極化成方法
US5458755A (en) * 1992-11-09 1995-10-17 Canon Kabushiki Kaisha Anodization apparatus with supporting device for substrate to be treated
SE9300881L (sv) * 1993-03-17 1994-06-06 Herman Georg Grimmeiss Anordning för elektrolytisk oxidation av kiselskivor
CA2264908C (en) * 1996-09-06 2006-04-25 Obducat Ab Method for anisotropic etching of structures in conducting materials
JPH11243076A (ja) * 1998-02-26 1999-09-07 Canon Inc 陽極化成方法及び陽極化成装置並びに半導体基板の製造方法

Also Published As

Publication number Publication date
EP1181400A1 (de) 2002-02-27
ES2282103T3 (es) 2007-10-16
WO2000060143A1 (de) 2000-10-12
US6726815B1 (en) 2004-04-27
DE19914905A1 (de) 2000-10-05
JP2002541324A (ja) 2002-12-03
KR20010112373A (ko) 2001-12-20
EP1181400B1 (de) 2007-02-28
JP4511741B2 (ja) 2010-07-28
KR100698798B1 (ko) 2007-03-26

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