DE50014121D1 - Elektrochemische ätzanlage und verfahren zur ätzung eines ätzkörpers - Google Patents
Elektrochemische ätzanlage und verfahren zur ätzung eines ätzkörpersInfo
- Publication number
- DE50014121D1 DE50014121D1 DE50014121T DE50014121T DE50014121D1 DE 50014121 D1 DE50014121 D1 DE 50014121D1 DE 50014121 T DE50014121 T DE 50014121T DE 50014121 T DE50014121 T DE 50014121T DE 50014121 D1 DE50014121 D1 DE 50014121D1
- Authority
- DE
- Germany
- Prior art keywords
- steaming
- absorbent
- electrochemical equipment
- electrochemical
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/12—Electrochemical machining
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19914905A DE19914905A1 (de) | 1999-04-01 | 1999-04-01 | Elektrochemische Ätzanlage und Verfahren zur Ätzung eines Ätzkörpers |
PCT/DE2000/000857 WO2000060143A1 (de) | 1999-04-01 | 2000-03-17 | Elektrochemische ätzanlage und verfahren zur ätzung eines ätzkörpers |
Publications (1)
Publication Number | Publication Date |
---|---|
DE50014121D1 true DE50014121D1 (de) | 2007-04-12 |
Family
ID=7903273
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19914905A Ceased DE19914905A1 (de) | 1999-04-01 | 1999-04-01 | Elektrochemische Ätzanlage und Verfahren zur Ätzung eines Ätzkörpers |
DE50014121T Expired - Lifetime DE50014121D1 (de) | 1999-04-01 | 2000-03-17 | Elektrochemische ätzanlage und verfahren zur ätzung eines ätzkörpers |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19914905A Ceased DE19914905A1 (de) | 1999-04-01 | 1999-04-01 | Elektrochemische Ätzanlage und Verfahren zur Ätzung eines Ätzkörpers |
Country Status (7)
Country | Link |
---|---|
US (1) | US6726815B1 (de) |
EP (1) | EP1181400B1 (de) |
JP (1) | JP4511741B2 (de) |
KR (1) | KR100698798B1 (de) |
DE (2) | DE19914905A1 (de) |
ES (1) | ES2282103T3 (de) |
WO (1) | WO2000060143A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100451132B1 (ko) * | 2001-11-08 | 2004-10-02 | 홍석인 | 다공성 실리콘을 이용한 효소고정화 전극 제작 방법 |
US7998335B2 (en) * | 2005-06-13 | 2011-08-16 | Cabot Microelectronics Corporation | Controlled electrochemical polishing method |
US7909967B2 (en) * | 2006-07-13 | 2011-03-22 | Semitool, Inc. | Electro-chemical processor |
US7935230B2 (en) * | 2006-06-29 | 2011-05-03 | Semitool, Inc. | Electro-chemical processor |
US7927469B2 (en) * | 2006-08-25 | 2011-04-19 | Semitool, Inc. | Electro-chemical processor |
DE102007024199B4 (de) | 2007-05-24 | 2015-06-25 | Robert Bosch Gmbh | Herstellungsverfahren eines mikromechanischen Bauelements mit porösifizierter Membran |
KR101374932B1 (ko) * | 2007-09-28 | 2014-03-17 | 재단법인서울대학교산학협력재단 | 확산 제한 식각과정에 의한 수평 변환 다공성 실리콘 광학필터의 제조방법 및 그에 의한 필터구조 |
US9076642B2 (en) | 2009-01-15 | 2015-07-07 | Solexel, Inc. | High-Throughput batch porous silicon manufacturing equipment design and processing methods |
US8906218B2 (en) | 2010-05-05 | 2014-12-09 | Solexel, Inc. | Apparatus and methods for uniformly forming porous semiconductor on a substrate |
JP5333582B2 (ja) * | 2009-05-12 | 2013-11-06 | 日本軽金属株式会社 | 電解コンデンサ用アルミニウム電極板の製造方法 |
JP2011026638A (ja) * | 2009-07-22 | 2011-02-10 | Shin Etsu Handotai Co Ltd | 陽極酸化装置 |
US8241940B2 (en) | 2010-02-12 | 2012-08-14 | Solexel, Inc. | Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing |
WO2012040688A2 (en) * | 2010-09-24 | 2012-03-29 | Solexel, Inc. | High-throughput batch porous silicon manufacturing equipment design and processing methods |
KR20140061287A (ko) * | 2010-11-03 | 2014-05-21 | 솔렉셀, 인크. | 기판 상에 다공성 반도체를 균일하게 형성하기 위한 장치 및 방법 |
JP6009268B2 (ja) * | 2012-08-09 | 2016-10-19 | 芝浦メカトロニクス株式会社 | 洗浄液生成装置、洗浄液生成方法、基板洗浄装置及び基板洗浄方法 |
RU2537488C2 (ru) * | 2012-08-22 | 2015-01-10 | Закрытое акционерное общество "Инструменты нанотехнологии" | Устройство травления поверхности для металлографического анализа |
US9217206B2 (en) * | 2013-09-27 | 2015-12-22 | Sunpower Corporation | Enhanced porosification |
CN112820828B (zh) * | 2019-11-15 | 2023-08-04 | 夏泰鑫半导体(青岛)有限公司 | 半导体装置及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5462929A (en) * | 1977-10-28 | 1979-05-21 | Sumitomo Electric Ind Ltd | Surface treating method for aluminum and aluminum alloy |
JP3149060B2 (ja) * | 1992-01-23 | 2001-03-26 | キヤノン株式会社 | 陽極化成装置、陽極化成方法及びシリコン基板の製造方法 |
JP3416190B2 (ja) * | 1993-03-23 | 2003-06-16 | キヤノン株式会社 | 陽極化成装置及び陽極化成方法 |
US5458755A (en) * | 1992-11-09 | 1995-10-17 | Canon Kabushiki Kaisha | Anodization apparatus with supporting device for substrate to be treated |
SE9300881L (sv) * | 1993-03-17 | 1994-06-06 | Herman Georg Grimmeiss | Anordning för elektrolytisk oxidation av kiselskivor |
CA2264908C (en) * | 1996-09-06 | 2006-04-25 | Obducat Ab | Method for anisotropic etching of structures in conducting materials |
JPH11243076A (ja) * | 1998-02-26 | 1999-09-07 | Canon Inc | 陽極化成方法及び陽極化成装置並びに半導体基板の製造方法 |
-
1999
- 1999-04-01 DE DE19914905A patent/DE19914905A1/de not_active Ceased
-
2000
- 2000-03-17 EP EP00922440A patent/EP1181400B1/de not_active Expired - Lifetime
- 2000-03-17 ES ES00922440T patent/ES2282103T3/es not_active Expired - Lifetime
- 2000-03-17 JP JP2000609630A patent/JP4511741B2/ja not_active Expired - Lifetime
- 2000-03-17 KR KR1020017012317A patent/KR100698798B1/ko active IP Right Grant
- 2000-03-17 US US09/937,926 patent/US6726815B1/en not_active Expired - Lifetime
- 2000-03-17 DE DE50014121T patent/DE50014121D1/de not_active Expired - Lifetime
- 2000-03-17 WO PCT/DE2000/000857 patent/WO2000060143A1/de active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1181400A1 (de) | 2002-02-27 |
ES2282103T3 (es) | 2007-10-16 |
WO2000060143A1 (de) | 2000-10-12 |
US6726815B1 (en) | 2004-04-27 |
DE19914905A1 (de) | 2000-10-05 |
JP2002541324A (ja) | 2002-12-03 |
KR20010112373A (ko) | 2001-12-20 |
EP1181400B1 (de) | 2007-02-28 |
JP4511741B2 (ja) | 2010-07-28 |
KR100698798B1 (ko) | 2007-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |