DE502004001703D1 - Elektrisches Kontaktierungsverfahren - Google Patents
Elektrisches KontaktierungsverfahrenInfo
- Publication number
- DE502004001703D1 DE502004001703D1 DE502004001703T DE502004001703T DE502004001703D1 DE 502004001703 D1 DE502004001703 D1 DE 502004001703D1 DE 502004001703 T DE502004001703 T DE 502004001703T DE 502004001703 T DE502004001703 T DE 502004001703T DE 502004001703 D1 DE502004001703 D1 DE 502004001703D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- tracks
- bores
- former
- separating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10325550A DE10325550B4 (de) | 2003-06-05 | 2003-06-05 | Elektrisches Kontaktierungsverfahren |
Publications (1)
Publication Number | Publication Date |
---|---|
DE502004001703D1 true DE502004001703D1 (de) | 2006-11-23 |
Family
ID=33154566
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10325550A Expired - Fee Related DE10325550B4 (de) | 2003-06-05 | 2003-06-05 | Elektrisches Kontaktierungsverfahren |
DE502004001703T Expired - Lifetime DE502004001703D1 (de) | 2003-06-05 | 2004-04-01 | Elektrisches Kontaktierungsverfahren |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10325550A Expired - Fee Related DE10325550B4 (de) | 2003-06-05 | 2003-06-05 | Elektrisches Kontaktierungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US7155815B2 (de) |
EP (1) | EP1484950B1 (de) |
CN (1) | CN100536637C (de) |
AT (1) | ATE342649T1 (de) |
DE (2) | DE10325550B4 (de) |
ES (1) | ES2274338T3 (de) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7612296B2 (en) * | 2004-08-31 | 2009-11-03 | Synergy Microwave Corporation | Visually inspectable surface mount device pad |
JP4455301B2 (ja) * | 2004-12-07 | 2010-04-21 | 日東電工株式会社 | 配線回路基板およびその接続構造 |
TW200742511A (en) * | 2006-04-21 | 2007-11-01 | Innolux Display Corp | Printed circuit board |
US9867530B2 (en) | 2006-08-14 | 2018-01-16 | Volcano Corporation | Telescopic side port catheter device with imaging system and method for accessing side branch occlusions |
US9596993B2 (en) | 2007-07-12 | 2017-03-21 | Volcano Corporation | Automatic calibration systems and methods of use |
WO2009009799A1 (en) | 2007-07-12 | 2009-01-15 | Volcano Corporation | Catheter for in vivo imaging |
WO2009009802A1 (en) | 2007-07-12 | 2009-01-15 | Volcano Corporation | Oct-ivus catheter for concurrent luminal imaging |
KR101545019B1 (ko) * | 2007-09-05 | 2015-08-18 | 삼성전자주식회사 | Lds를 이용한 전자 기기의 제조방법 및 그에 의해 제조된 전자 기기 |
US8393918B2 (en) * | 2008-06-11 | 2013-03-12 | Pulse Electronics, Inc. | Miniaturized connectors and methods |
US7863722B2 (en) * | 2008-10-20 | 2011-01-04 | Micron Technology, Inc. | Stackable semiconductor assemblies and methods of manufacturing such assemblies |
JP5087642B2 (ja) * | 2010-01-14 | 2012-12-05 | Tdkラムダ株式会社 | 基板 |
DE102010010331A1 (de) * | 2010-03-04 | 2011-09-08 | Phoenix Contact Gmbh & Co. Kg | Elektrische Kontaktanordnung |
US11141063B2 (en) | 2010-12-23 | 2021-10-12 | Philips Image Guided Therapy Corporation | Integrated system architectures and methods of use |
US8472205B2 (en) * | 2010-12-30 | 2013-06-25 | Research In Motion Limited | Adaptive printed circuit board connector |
US11040140B2 (en) | 2010-12-31 | 2021-06-22 | Philips Image Guided Therapy Corporation | Deep vein thrombosis therapeutic methods |
US8897032B2 (en) * | 2011-05-24 | 2014-11-25 | Xirrus, Inc. | Surface mount antenna contacts |
US9360630B2 (en) | 2011-08-31 | 2016-06-07 | Volcano Corporation | Optical-electrical rotary joint and methods of use |
US20130335931A1 (en) * | 2012-06-15 | 2013-12-19 | Delphi Technologies, Inc. | Surface mount interconnection system for modular circuit board and method |
JP5484529B2 (ja) * | 2012-08-07 | 2014-05-07 | ホシデン株式会社 | 部品モジュール及び部品モジュールの製造方法 |
JP5525574B2 (ja) * | 2012-08-07 | 2014-06-18 | ホシデン株式会社 | 部品モジュール及び部品モジュールの製造方法 |
US9307926B2 (en) | 2012-10-05 | 2016-04-12 | Volcano Corporation | Automatic stent detection |
US9286673B2 (en) | 2012-10-05 | 2016-03-15 | Volcano Corporation | Systems for correcting distortions in a medical image and methods of use thereof |
US9292918B2 (en) | 2012-10-05 | 2016-03-22 | Volcano Corporation | Methods and systems for transforming luminal images |
US9324141B2 (en) | 2012-10-05 | 2016-04-26 | Volcano Corporation | Removal of A-scan streaking artifact |
US10070827B2 (en) | 2012-10-05 | 2018-09-11 | Volcano Corporation | Automatic image playback |
US9858668B2 (en) | 2012-10-05 | 2018-01-02 | Volcano Corporation | Guidewire artifact removal in images |
US9367965B2 (en) | 2012-10-05 | 2016-06-14 | Volcano Corporation | Systems and methods for generating images of tissue |
JP2015532536A (ja) | 2012-10-05 | 2015-11-09 | デイビッド ウェルフォード, | 光を増幅するためのシステムおよび方法 |
US10568586B2 (en) | 2012-10-05 | 2020-02-25 | Volcano Corporation | Systems for indicating parameters in an imaging data set and methods of use |
US11272845B2 (en) | 2012-10-05 | 2022-03-15 | Philips Image Guided Therapy Corporation | System and method for instant and automatic border detection |
US9840734B2 (en) | 2012-10-22 | 2017-12-12 | Raindance Technologies, Inc. | Methods for analyzing DNA |
EP2931132B1 (de) | 2012-12-13 | 2023-07-05 | Philips Image Guided Therapy Corporation | Vorrichtung zur gezielten kanülierung |
WO2014099899A1 (en) | 2012-12-20 | 2014-06-26 | Jeremy Stigall | Smooth transition catheters |
US11406498B2 (en) | 2012-12-20 | 2022-08-09 | Philips Image Guided Therapy Corporation | Implant delivery system and implants |
US10939826B2 (en) | 2012-12-20 | 2021-03-09 | Philips Image Guided Therapy Corporation | Aspirating and removing biological material |
CA2895770A1 (en) | 2012-12-20 | 2014-07-24 | Jeremy Stigall | Locating intravascular images |
US10942022B2 (en) | 2012-12-20 | 2021-03-09 | Philips Image Guided Therapy Corporation | Manual calibration of imaging system |
EP2934310A4 (de) | 2012-12-20 | 2016-10-12 | Nathaniel J Kemp | Optisches kohärenztomografiesystem zwischen verschiedenen rekonfigurierbaren bildgebungsmodi |
EP2936426B1 (de) | 2012-12-21 | 2021-10-13 | Jason Spencer | System und verfahren zur grafischen verarbeitung medizinischer daten |
US10413317B2 (en) | 2012-12-21 | 2019-09-17 | Volcano Corporation | System and method for catheter steering and operation |
US9226711B2 (en) | 2012-12-21 | 2016-01-05 | Volcano Corporation | Laser direct structured catheter connection for intravascular device |
US9612105B2 (en) | 2012-12-21 | 2017-04-04 | Volcano Corporation | Polarization sensitive optical coherence tomography system |
EP2934280B1 (de) | 2012-12-21 | 2022-10-19 | Mai, Jerome | Ultraschallbildgebung mit variabler liniendichte |
WO2014100162A1 (en) | 2012-12-21 | 2014-06-26 | Kemp Nathaniel J | Power-efficient optical buffering using optical switch |
EP2934323A4 (de) | 2012-12-21 | 2016-08-17 | Andrew Hancock | System und verfahren zur mehrpfad-verarbeitung von bildsignalen |
CA2896006A1 (en) | 2012-12-21 | 2014-06-26 | David Welford | Systems and methods for narrowing a wavelength emission of light |
WO2014100606A1 (en) | 2012-12-21 | 2014-06-26 | Meyer, Douglas | Rotational ultrasound imaging catheter with extended catheter body telescope |
US10058284B2 (en) | 2012-12-21 | 2018-08-28 | Volcano Corporation | Simultaneous imaging, monitoring, and therapy |
US9486143B2 (en) | 2012-12-21 | 2016-11-08 | Volcano Corporation | Intravascular forward imaging device |
US9770172B2 (en) | 2013-03-07 | 2017-09-26 | Volcano Corporation | Multimodal segmentation in intravascular images |
US10226597B2 (en) | 2013-03-07 | 2019-03-12 | Volcano Corporation | Guidewire with centering mechanism |
US11154313B2 (en) | 2013-03-12 | 2021-10-26 | The Volcano Corporation | Vibrating guidewire torquer and methods of use |
EP2967391A4 (de) | 2013-03-12 | 2016-11-02 | Donna Collins | Systeme und verfahren zur diagnose koronarer mikrovaskulärer erkrankungen |
US9301687B2 (en) | 2013-03-13 | 2016-04-05 | Volcano Corporation | System and method for OCT depth calibration |
US10758207B2 (en) | 2013-03-13 | 2020-09-01 | Philips Image Guided Therapy Corporation | Systems and methods for producing an image from a rotational intravascular ultrasound device |
US11026591B2 (en) | 2013-03-13 | 2021-06-08 | Philips Image Guided Therapy Corporation | Intravascular pressure sensor calibration |
US20160030151A1 (en) | 2013-03-14 | 2016-02-04 | Volcano Corporation | Filters with echogenic characteristics |
US10292677B2 (en) | 2013-03-14 | 2019-05-21 | Volcano Corporation | Endoluminal filter having enhanced echogenic properties |
US10219887B2 (en) | 2013-03-14 | 2019-03-05 | Volcano Corporation | Filters with echogenic characteristics |
US10514134B2 (en) | 2014-12-05 | 2019-12-24 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
CN106704993A (zh) * | 2017-01-09 | 2017-05-24 | 宁波亚茂光电股份有限公司 | 一种插卡式电源与光源板的连接结构 |
US10498085B2 (en) | 2018-03-01 | 2019-12-03 | Te Connectivity Corporation | Molded interconnect substrate for a cable assembly |
US11764503B2 (en) * | 2020-09-23 | 2023-09-19 | Victor Tikhonov | PCB external device connector |
CN113394208B (zh) * | 2021-05-25 | 2023-05-05 | 武汉光迅科技股份有限公司 | 一种光电探测器 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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DE3522647A1 (de) * | 1985-06-25 | 1987-01-08 | Merten Kg Pulsotronic | Schaltungsmodul-traegerplatte |
US4821007A (en) * | 1987-02-06 | 1989-04-11 | Tektronix, Inc. | Strip line circuit component and method of manufacture |
US4790894A (en) * | 1987-02-19 | 1988-12-13 | Hitachi Condenser Co., Ltd. | Process for producing printed wiring board |
US5140745A (en) * | 1990-07-23 | 1992-08-25 | Mckenzie Jr Joseph A | Method for forming traces on side edges of printed circuit boards and devices formed thereby |
JP2936833B2 (ja) * | 1991-10-02 | 1999-08-23 | 株式会社村田製作所 | 表面実装型電子部品 |
GB2283863A (en) * | 1993-11-16 | 1995-05-17 | Ibm | Direct chip attach module |
US6518088B1 (en) * | 1994-09-23 | 2003-02-11 | Siemens N.V. And Interuniversitair Micro-Electronica Centrum Vzw | Polymer stud grid array |
US5938455A (en) * | 1996-05-15 | 1999-08-17 | Ford Motor Company | Three-dimensional molded circuit board having interlocking connections |
JPH10247766A (ja) * | 1997-03-03 | 1998-09-14 | Alps Electric Co Ltd | 回路基板 |
JPH10313157A (ja) * | 1997-05-12 | 1998-11-24 | Alps Electric Co Ltd | プリント基板 |
JP3664001B2 (ja) * | 1999-10-25 | 2005-06-22 | 株式会社村田製作所 | モジュール基板の製造方法 |
US6496384B1 (en) * | 2001-09-21 | 2002-12-17 | Visteon Global Technologies, Inc. | Circuit board assembly and method of fabricating same |
SG111069A1 (en) * | 2002-06-18 | 2005-05-30 | Micron Technology Inc | Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods |
-
2003
- 2003-06-05 DE DE10325550A patent/DE10325550B4/de not_active Expired - Fee Related
-
2004
- 2004-04-01 DE DE502004001703T patent/DE502004001703D1/de not_active Expired - Lifetime
- 2004-04-01 AT AT04008025T patent/ATE342649T1/de active
- 2004-04-01 ES ES04008025T patent/ES2274338T3/es not_active Expired - Lifetime
- 2004-04-01 EP EP04008025A patent/EP1484950B1/de not_active Expired - Lifetime
- 2004-06-03 US US10/859,114 patent/US7155815B2/en active Active
- 2004-06-04 CN CNB2004100429526A patent/CN100536637C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE10325550A1 (de) | 2005-01-05 |
DE10325550B4 (de) | 2007-02-01 |
US20040248439A1 (en) | 2004-12-09 |
CN100536637C (zh) | 2009-09-02 |
US7155815B2 (en) | 2007-01-02 |
EP1484950A2 (de) | 2004-12-08 |
EP1484950A3 (de) | 2005-05-25 |
ES2274338T3 (es) | 2007-05-16 |
CN1575107A (zh) | 2005-02-02 |
ATE342649T1 (de) | 2006-11-15 |
EP1484950B1 (de) | 2006-10-11 |
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