DE502004007245D1 - Bauelement und verfahren zu dessen herstellung - Google Patents

Bauelement und verfahren zu dessen herstellung

Info

Publication number
DE502004007245D1
DE502004007245D1 DE502004007245T DE502004007245T DE502004007245D1 DE 502004007245 D1 DE502004007245 D1 DE 502004007245D1 DE 502004007245 T DE502004007245 T DE 502004007245T DE 502004007245 T DE502004007245 T DE 502004007245T DE 502004007245 D1 DE502004007245 D1 DE 502004007245D1
Authority
DE
Germany
Prior art keywords
production
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502004007245T
Other languages
English (en)
Inventor
Georg Bernitz
Heinrich Zitzmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE502004007245D1 publication Critical patent/DE502004007245D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/001—Mass resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Thermistors And Varistors (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE502004007245T 2003-11-28 2004-11-25 Bauelement und verfahren zu dessen herstellung Active DE502004007245D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10356367A DE10356367B4 (de) 2003-11-28 2003-11-28 Verfahren zur Herstellung eines Bauelements und Bauelement
PCT/EP2004/013384 WO2005052527A1 (de) 2003-11-28 2004-11-25 Bauelement und verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
DE502004007245D1 true DE502004007245D1 (de) 2008-07-03

Family

ID=34625502

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10356367A Expired - Fee Related DE10356367B4 (de) 2003-11-28 2003-11-28 Verfahren zur Herstellung eines Bauelements und Bauelement
DE502004007245T Active DE502004007245D1 (de) 2003-11-28 2004-11-25 Bauelement und verfahren zu dessen herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10356367A Expired - Fee Related DE10356367B4 (de) 2003-11-28 2003-11-28 Verfahren zur Herstellung eines Bauelements und Bauelement

Country Status (6)

Country Link
US (1) US7537963B2 (de)
EP (1) EP1664698B1 (de)
JP (1) JP4260843B2 (de)
DE (2) DE10356367B4 (de)
TW (1) TWI246374B (de)
WO (1) WO2005052527A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012111458B4 (de) * 2012-11-27 2022-12-08 Tdk Electronics Ag Halbleitervorrichtung
WO2020241517A1 (ja) * 2019-05-29 2020-12-03 三菱電機株式会社 分圧装置
DE102022110381A1 (de) 2022-04-28 2023-11-02 Schunk Carbon Technology Gmbh Verfahren und Vorrichtung zur Wärmebehandlung

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3276965D1 (en) 1981-03-16 1987-09-17 Schaumburg Hanno Sensor device for the measurement of physical quantities, as well as a process for its manufacture, and its application
US4481404A (en) * 1982-12-22 1984-11-06 General Electric Company Turn-off control circuit for self-cleaning ovens
JPS59229686A (ja) * 1983-06-09 1984-12-24 Toshiba Corp Ｉｃカ−ド
EP0569417B1 (de) * 1991-01-28 1995-07-05 Siemens Aktiengesellschaft Verfahren zur herstellung einer tragbaren datenträgeranordnung
US5425647A (en) * 1992-04-29 1995-06-20 Alliedsignal Inc. Split conductive pad for mounting components to a circuit board
US6248978B1 (en) * 1992-11-13 2001-06-19 Canon Kabushiki Kaisha Heater comprising temperature sensing element positioned on electrode
JPH06231906A (ja) * 1993-01-28 1994-08-19 Mitsubishi Materials Corp サーミスタ
US5929746A (en) 1995-10-13 1999-07-27 International Resistive Company, Inc. Surface mounted thin film voltage divider
DE19621001A1 (de) 1996-05-24 1997-11-27 Heraeus Sensor Nite Gmbh Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung
JPH10270496A (ja) * 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
DE19736855A1 (de) * 1997-08-23 1999-02-25 Philips Patentverwaltung Schaltungsanordnung mit einem SMD-Bauelement, insbesondere Temperatursensor und Verfahren zur Herstellung eines Temperatursensors
DE19840248A1 (de) 1998-09-03 2000-03-16 Fraunhofer Ges Forschung Schaltungschip mit spezifischer Anschlußflächenanordnung
DE19936924C1 (de) 1999-08-05 2001-06-13 Georg Bernitz Vorrichtung zur Hochtemperaturerfassung und Verfahren zur Herstellung derselben
US6243517B1 (en) * 1999-11-04 2001-06-05 Sparkolor Corporation Channel-switched cross-connect
DE10020932C5 (de) * 2000-04-28 2004-12-30 Zitzmann, Heinrich, Dr. Temperaturmessfühler und Verfahren zur Herstellung desselben
US7255451B2 (en) * 2002-09-20 2007-08-14 Donnelly Corporation Electro-optic mirror cell
DE10214953A1 (de) * 2002-04-04 2003-10-30 Infineon Technologies Ag Leistungsmodul mit mindestens zwei Substraten und Verfahren zu seiner Herstellung
US7049602B2 (en) * 2002-07-31 2006-05-23 Eugene Tokhtuev Radiation sensor
US7335971B2 (en) * 2003-03-31 2008-02-26 Robert Bosch Gmbh Method for protecting encapsulated sensor structures using stack packaging
US6683370B1 (en) * 2003-04-15 2004-01-27 Motorola, Inc. Semiconductor component and method of manufacturing same
US20070211183A1 (en) * 2006-03-10 2007-09-13 Luminus Devices, Inc. LCD thermal management methods and systems
US20070211184A1 (en) * 2006-03-10 2007-09-13 Luminus Devices, Inc. Liquid crystal display systems including LEDs

Also Published As

Publication number Publication date
DE10356367B4 (de) 2009-06-10
JP2007512695A (ja) 2007-05-17
US7537963B2 (en) 2009-05-26
EP1664698A1 (de) 2006-06-07
EP1664698B1 (de) 2008-05-21
TW200518651A (en) 2005-06-01
JP4260843B2 (ja) 2009-04-30
US20060214267A1 (en) 2006-09-28
WO2005052527A1 (de) 2005-06-09
TWI246374B (en) 2005-12-21
DE10356367A1 (de) 2005-07-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition