DE502008002340D1 - Plunger zum halten und bewegen von elektronischen bauelementen, insbesondere ic's mit wärmeleitkörper - Google Patents
Plunger zum halten und bewegen von elektronischen bauelementen, insbesondere ic's mit wärmeleitkörperInfo
- Publication number
- DE502008002340D1 DE502008002340D1 DE502008002340T DE502008002340T DE502008002340D1 DE 502008002340 D1 DE502008002340 D1 DE 502008002340D1 DE 502008002340 T DE502008002340 T DE 502008002340T DE 502008002340 T DE502008002340 T DE 502008002340T DE 502008002340 D1 DE502008002340 D1 DE 502008002340D1
- Authority
- DE
- Germany
- Prior art keywords
- plunger
- holding
- electronic components
- heat temperature
- moving electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007047679A DE102007047679B4 (de) | 2007-10-05 | 2007-10-05 | Plunger zum Bewegen elektronischer Bauelemente, insbesondere IC's, mit Wärmeleitkörper |
PCT/EP2008/008390 WO2009046946A1 (de) | 2007-10-05 | 2008-10-02 | Plunger zum halten und bewegen von elektronischen bauelementen, insbesondere ic's mit wärmeleitkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
DE502008002340D1 true DE502008002340D1 (de) | 2011-02-24 |
Family
ID=40433719
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102007047679A Expired - Fee Related DE102007047679B4 (de) | 2007-10-05 | 2007-10-05 | Plunger zum Bewegen elektronischer Bauelemente, insbesondere IC's, mit Wärmeleitkörper |
DE502008002340T Active DE502008002340D1 (de) | 2007-10-05 | 2008-10-02 | Plunger zum halten und bewegen von elektronischen bauelementen, insbesondere ic's mit wärmeleitkörper |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102007047679A Expired - Fee Related DE102007047679B4 (de) | 2007-10-05 | 2007-10-05 | Plunger zum Bewegen elektronischer Bauelemente, insbesondere IC's, mit Wärmeleitkörper |
Country Status (9)
Country | Link |
---|---|
US (1) | US8303008B2 (de) |
EP (1) | EP2195669B1 (de) |
JP (1) | JP2010534844A (de) |
KR (1) | KR101086934B1 (de) |
CN (1) | CN101680930B (de) |
AT (1) | ATE495456T1 (de) |
DE (2) | DE102007047679B4 (de) |
MY (1) | MY145021A (de) |
WO (1) | WO2009046946A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008020585B4 (de) * | 2008-04-24 | 2011-03-24 | Multitest Elektronische Systeme Gmbh | Plunger mit Schnellverriegelungssystem |
DE102012219874A1 (de) * | 2012-10-30 | 2014-04-30 | Thyssenkrupp Steel Europe Ag | Vorrichtung und Verfahren zur Handhabung von Werkstücken |
US9035669B2 (en) * | 2013-02-20 | 2015-05-19 | Multitest Elektronische Systeme Gmbh | Apparatus and method for testing electronic devices |
JP6777688B2 (ja) * | 2018-06-15 | 2020-10-28 | ファナック株式会社 | コネクタ接続用ハンドおよびハンドシステム |
KR102239739B1 (ko) * | 2019-04-15 | 2021-04-13 | 주식회사 아테코 | 전자부품 테스트 핸들러 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2963706B2 (ja) * | 1989-10-24 | 1999-10-18 | 株式会社日本マイクロニクス | Icハンドラ |
US5147821A (en) * | 1990-09-28 | 1992-09-15 | Motorola, Inc. | Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation |
JPH06297371A (ja) * | 1993-04-16 | 1994-10-25 | Hagiwara Eng Kk | 吸着機構 |
JPH0794034A (ja) * | 1993-09-22 | 1995-04-07 | Fujitsu Ltd | フラットケーブル及びこれを用いたコネクタ付ケーブル |
JPH07202095A (ja) * | 1994-01-04 | 1995-08-04 | Hitachi Ltd | 電子デバイスの冷却装置 |
EP0857304A2 (de) * | 1995-10-23 | 1998-08-12 | Aetrium Incorporated | Flexibel aufgehängter wärmetauscher für prüfling |
US5977785A (en) * | 1996-05-28 | 1999-11-02 | Burward-Hoy; Trevor | Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment |
US5847366A (en) * | 1996-06-18 | 1998-12-08 | Intel Corporation | Apparatus and method for controlling the temperature of an integrated circuit under test |
US6069483A (en) * | 1997-12-16 | 2000-05-30 | Intel Corporation | Pickup chuck for multichip modules |
US6019166A (en) * | 1997-12-30 | 2000-02-01 | Intel Corporation | Pickup chuck with an integral heatsink |
SG77182A1 (en) * | 1998-05-29 | 2000-12-19 | Advanced Systems Automation Ltd | Temperature control system for test heads |
JP5000803B2 (ja) * | 1998-07-14 | 2012-08-15 | デルタ・デザイン・インコーポレイテッド | 電子デバイスの速応温度反復制御を液体を利用して広範囲に行うための装置、方法 |
JP2000329821A (ja) * | 1999-05-24 | 2000-11-30 | Advantest Corp | 半導体試験装置のハンドラ |
KR100392229B1 (ko) * | 2001-01-09 | 2003-07-22 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 인덱스헤드 |
US6861859B1 (en) * | 2001-10-22 | 2005-03-01 | Electroglas, Inc. | Testing circuits on substrates |
US6891385B2 (en) * | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
US6978541B1 (en) * | 2002-10-01 | 2005-12-27 | Xilinx, Inc. | Apparatus and methods to enhance thermal energy transfer in IC handler systems |
JP4044063B2 (ja) * | 2004-03-15 | 2008-02-06 | ミレ株式会社 | 半導体素子テストハンドラ用キャリアモジュール |
CN2736833Y (zh) * | 2004-09-06 | 2005-10-26 | 鸿富锦精密工业(深圳)有限公司 | 中央处理器拆装治具 |
JP2006125864A (ja) * | 2004-10-26 | 2006-05-18 | Yokogawa Electric Corp | デバイスハンドラー装置 |
JP4490332B2 (ja) * | 2005-05-31 | 2010-06-23 | ヤマハ発動機株式会社 | Icハンドラー |
JP4546335B2 (ja) * | 2005-06-27 | 2010-09-15 | 富士通株式会社 | パッケージ冷却装置 |
JP2007003152A (ja) * | 2005-06-27 | 2007-01-11 | Seiko Epson Corp | 冷却装置及びそれを備えた電子部品ハンドラ |
JP4315141B2 (ja) * | 2005-09-09 | 2009-08-19 | セイコーエプソン株式会社 | 電子部品の温度制御装置並びにハンドラ装置 |
JP4179478B2 (ja) | 2005-09-29 | 2008-11-12 | 富士フイルム株式会社 | 描画データ取得方法および装置並びに描画方法および装置 |
-
2007
- 2007-10-05 DE DE102007047679A patent/DE102007047679B4/de not_active Expired - Fee Related
-
2008
- 2008-10-02 KR KR1020097022194A patent/KR101086934B1/ko active IP Right Grant
- 2008-10-02 CN CN2008800171474A patent/CN101680930B/zh not_active Expired - Fee Related
- 2008-10-02 DE DE502008002340T patent/DE502008002340D1/de active Active
- 2008-10-02 EP EP08802776A patent/EP2195669B1/de not_active Not-in-force
- 2008-10-02 AT AT08802776T patent/ATE495456T1/de active
- 2008-10-02 MY MYPI20094228A patent/MY145021A/en unknown
- 2008-10-02 WO PCT/EP2008/008390 patent/WO2009046946A1/de active Application Filing
- 2008-10-02 JP JP2010518574A patent/JP2010534844A/ja active Pending
- 2008-10-02 US US12/671,118 patent/US8303008B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2009046946A1 (de) | 2009-04-16 |
ATE495456T1 (de) | 2011-01-15 |
KR101086934B1 (ko) | 2011-11-29 |
EP2195669B1 (de) | 2011-01-12 |
DE102007047679A1 (de) | 2009-04-23 |
EP2195669A1 (de) | 2010-06-16 |
CN101680930B (zh) | 2012-05-23 |
CN101680930A (zh) | 2010-03-24 |
US8303008B2 (en) | 2012-11-06 |
DE102007047679B4 (de) | 2011-03-10 |
US20100196125A1 (en) | 2010-08-05 |
MY145021A (en) | 2011-12-15 |
KR20100029073A (ko) | 2010-03-15 |
JP2010534844A (ja) | 2010-11-11 |
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